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Folder

Sample &Buy

Technical

Documents

Tools &

Software

Support &Community

TS3A4741, TS3A4742SCDS228F –AUGUST 2006–REVISED DECEMBER 2015

TS3A474x 0.9-Ω Low-Voltage Single-Supply 2-Channel SPST Analog Switches1 Features 3 Description

The TS3A4741 and TS3A4742 are bi-directional, 2-1• Low ON-State Resistance (Ron) channel single-pole/single-throw (SPST) analog– 0.9-Ω Max (3-V Supply) switches with low ON-state resistance (Ron), low-

– 1.5-Ω Max (1.8-V Supply) voltage, that operate from a single 1.6-V to 3.6-Vsupply. These devices have fast switching speeds,• 0.4-Ω Max Ron Flatness (3-V Supply)handle rail-to-rail analog signals, and consume very• 1.6-V to 3.6-V Single-Supply Operation low quiescent power.

• Available in SOT-23 and VSSOP PackagesThe digital logic input is 1.8-V CMOS compatible• High Current-Handling Capacity (100 mA when using a single 3-V supply.

Continuous)The TS3A4741 has two normally open (NO) switches,• 1.8-V CMOS Logic Compatible (3-V Supply)and the TS3A4742 has two normally closed (NC)

• Fast Switching: tON = 14 ns, tOFF = 9 ns switches.

2 Applications Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)• Power RoutingSOT (8) 2.90 mm × 1.63 mm• Battery-Powered Systems TS3A4741VSSOP (8) 3.00 mm × 3.00 mm• Audio and Video Signal RoutingSOT (8) 2.90 mm × 1.63 mm• Low-Voltage Data-Acquisition Systems TS3A4742VSSOP (8) 3.00 mm × 3.00 mm• Communications Circuits

(1) For all available packages, see the orderable addendum at• PCMCIA Cards the end of the datasheet.• Cellular Phones• Modems• Hard Drives

Ron vs VCOM (VCC = 2.7 V)

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTIONDATA.

TS3A4741, TS3A4742SCDS228F –AUGUST 2006–REVISED DECEMBER 2015 www.ti.com

Table of Contents8.2 Functional Block Diagram ....................................... 141 Features .................................................................. 18.3 Feature Description................................................. 142 Applications ........................................................... 18.4 Device Functional Modes........................................ 143 Description ............................................................. 1

9 Application and Implementation ........................ 154 Revision History..................................................... 29.1 Application Information............................................ 155 Pin Configuration and Functions ......................... 39.2 Typical Application .................................................. 156 Specifications......................................................... 4

10 Power Supply Recommendations ..................... 176.1 Absolute Maximum Ratings ..................................... 411 Layout................................................................... 176.2 ESD Ratings ............................................................ 4

11.1 Layout Guidelines ................................................. 176.3 Recommended Operating Conditions....................... 411.2 Layout Example .................................................... 176.4 Thermal Information .................................................. 4

12 Device and Documentation Support ................. 186.5 Electrical Characteristics (3-V Supply) ..................... 512.1 Related Links ........................................................ 186.6 Electrical Characteristics (1.8-V Supply) .................. 712.2 Trademarks ........................................................... 186.7 Typical Characteristics .............................................. 812.3 Electrostatic Discharge Caution............................ 187 Parameter Measurement Information ................ 1112.4 Glossary ................................................................ 188 Detailed Description ............................................ 14

13 Mechanical, Packaging, and Orderable8.1 Overview ................................................................. 14Information ........................................................... 18

4 Revision History

Changes from Revision E (December 2014) to Revision F Page

• Changed DCN package to clarify switch configuration. ........................................................................................................ 3• Changed the VIN MAX value in the Recommended Operating Conditions table from: 1.8 V to: VCC .................................... 4

Changes from Revision D (June 2014) to Revision E Page

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device FunctionalModes, Application and Implementation section, Power Supply Recommendations section, Layout section, Deviceand Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

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Product Folder Links: TS3A4741 TS3A4742

DGK PACKAGE . . .TS3A4741(TOP VIEW)

GND

IN2

COM1

NO1

NO2

COM2

VCC

IN1

5

6

7

81

2

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DCN PACKAGE . . .TS3A4741(TOP VIEW)

COM2

NO2

VCC

IN1

GND

IN2

NO1

COM1

5

6

7

81

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DGK PACKAGE . . .TS3A4742(TOP VIEW)

GND

IN2

COM1

NC1

NC2

COM2

VCC

IN1

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7

81

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DCN PACKAGE . . .TS3A4742(TOP VIEW)

COM2

NC2

VCC

IN1

GND

IN2

NC1

COM1

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6

7

81

2

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4

TS3A4741, TS3A4742www.ti.com SCDS228F –AUGUST 2006–REVISED DECEMBER 2015

5 Pin Configuration and Functions

Pin FunctionsPIN

NAME TS3A4741 TS3A4742 I/O DESCRIPTIONMSOP SOT MSOP SOT

COM1 2 7 2 7 I/O CommonCOM2 6 4 6 4 I/O CommonGND 4 5 4 5 — GroundIN1 7 1 7 1 I Digital control to connect COM to NO or NCIN2 3 6 3 6 I Digital control to connect COM to NO or NCNC1 — — 1 8 I/O Normally closedNC2 — — 5 3 I/O Normally closedNO1 1 8 — — I/O Normally openNO2 5 3 — — I/O Normally openVCC 8 2 8 2 I Power supply

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6 Specifications

6.1 Absolute Maximum Ratings (1)

over operating free-air temperature range (unless otherwise noted)MIN MAX UNIT

VCC Supply voltage reference to GND (2) –0.3 4VNO VVCOM Analog and digital voltage –0.3 VCC + 0.3VIN

INO On-state switch current VNO, VCOM = 0 to VCC –100 100ICOM

ICC mAContinuous current through VCC or GND ±100IGND

Peak current pulsed at 1 ms, 10% duty cycle COM, VNO, VCOM ±200TA Operating temperature –40 85TJ Junction temperature 150 °CTstg Storage temperature –65 150

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Signals on COM or NO exceeding VCC or GND are clamped by internal diodes. Limit forward diode current to maximum current rating.

6.2 ESD RatingsVALUE UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±4000V(ESD) Electrostatic discharge VCharged-device model (CDM), per JEDEC specification JESD22- ±1000C101 (2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)

MIN MAX UNITVCC Supply voltage reference to ground 1.6 3.6 VVNO Analog voltage 0 3.6VCOM

VIN Digital Voltage 0 VCC

6.4 Thermal InformationTS3A474x

THERMAL METRIC (1) DCN/DGK UNIT8 PINS

RθJA Junction-to-ambient thermal resistance 214.8RθJC(top) Junction-to-case (top) thermal resistance 191.0RθJB Junction-to-board thermal resistance 113.1 °C/WψJT Junction-to-top characterization parameter 52.4ψJB Junction-to-board characterization parameter 110.2

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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TS3A4741, TS3A4742www.ti.com SCDS228F –AUGUST 2006–REVISED DECEMBER 2015

6.5 Electrical Characteristics (3-V Supply) (1) (2)

VCC = 2.7 V to 3.6 V, TA = –40 to 85°C, VIH = 1.4 V, VIL = 0.5 V (unless otherwise noted)PARAMETER TEST CONDITIONS TA MIN TYP (3) MAX UNIT

ANALOG SWITCHVCOM, VNO, VNC Analog signal range 0 V+ V

25°C 0.7 0.9VCC = 2.7 V, ICOM = –100 mA,Ron ON-state resistance ΩVNO, VNC = 1.5 V Full 1.125°C 0.03 0.05ON-state resistance match between VCC = 2.7 V, ICOM = –100 mA,ΔRon Ωchannels (4) VNO, VNC = 1.5 V Full 0.1525°C 0.23 0.4VCC = 2.7 V, ICOM = –100 mA,Ron(flat) ON-state resistance flatness (5) ΩVNO, VNC = 1 V, 1.5 V, 2 V Full 0.525°C –2 1 2NO VCC = 3.6 V, VCOM = 0.3 V, 3 V,INO(OFF) nAOFF leakage current (6) VNO = 3 V, 0.3 V Full –18 1825°C –2 1 2COM VCC = 3.6 V, VCOM = 0.3 V, 3 V,ICOM(OFF) nAOFF leakage current (6) VNO = 3 V, 0.3 V Full –18 1825°C –2.5 0.01 2.5COM VCC = 3.6 V, VCOM = 0.3 V, 3 V,ICOM(ON) nAON leakage current (6) VNO = 0.3 V, 3 V, or floating Full –5 5

DYNAMIC25°C 5 14VNO, VNC = 1.5 V, RL = 50 Ω,tON Turn-on time nsCL = 35 pF, See Figure 14 Full 1525°C 4 9VNO, VNC = 1.5 V, RL = 50 Ω,tOFF Turn-off time nsCL = 35 pF, See Figure 14 Full 10

VGEN = 0, RGEN = 0, CL = 1 nF,QC Charge injection 25°C 3 pCSee Figure 15CNO(OFF) NO OFF capacitance f = 1 MHz, See Figure 16 25°C 23CCOM(OFF) COM OFF capacitance f = 1 MHz, See Figure 16 25°C 20 pFCCOM(ON) COM ON capacitance f = 1 MHz, See Figure 16 25°C 43BW Bandwidth RL = 50 Ω, Switch ON 25°C 125 MHz

f = 10 –40MHzRL = 50 Ω, CL = 5 pF,OISO OFF isolation (7) 25°C dBSee Figure 17 f = 1 –62MHzf = 10 –73MHzRL = 50 Ω, CL = 5 pF,XTALK Crosstalk 25°C dBSee Figure 17 f = 1 –95MHzRL = 32 0.04%Ωf = 20 Hz to 20 kHz,THD Total harmonic distortion 25°CVCOM = 2 VP-P RL = 600 0.003%Ω

DIGITAL CONTROL INPUTS (IN1, IN2)VIH Input logic high Full 1.4

VVIL Input logic low Full 0.5

25°C 0.5 1IIN Input leakage current VI = 0 or VCC nA

Full –20 20SUPPLY

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.(2) Parts are tested at 85°C and specified by design and correlation over the full temperature range.(3) Typical values are at VCC = 3 V, TA = 25°C.(4) ΔRon = Ron(max) – Ron(min)(5) Flatness is defined as the difference between the maximum and minimum value of ron as measured over the specified analog signal

ranges.(6) Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at TA = 25°C.(7) OFF isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to OFF switch

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Electrical Characteristics (3-V Supply)(1)(2) (continued)VCC = 2.7 V to 3.6 V, TA = –40 to 85°C, VIH = 1.4 V, VIL = 0.5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS TA MIN TYP (3) MAX UNITVCC Power-supply range 2.7 3.6 V

25°C 0.075ICC Positive-supply current VCC = 3.6 V, VIN = 0 or VCC μA

Full 0.75

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6.6 Electrical Characteristics (1.8-V Supply) (1) (2)

VCC = 1.65 V to 1.95 V, TA = –40 to 85°C, VIH = 1 V, VIL = 0.4 V (unless otherwise noted)PARAMETER TEST CONDITIONS TA MIN TYP (2) MAX UNIT

ANALOG SWITCHVCOM, VNO, Analog signal range 0 V+ VVNC

25 °C 1 1.5VCC = 1.8 V, ICOM = –10 mA,Ron ON-state resistance ΩVNO, VNC = 0.9 V Full 225 °C 0.09 0.15ON-state resistance match between VCC = 1.8 V, ICOM = –10 mA,ΔRon Ωchannels (1) VNO, VNC = 0.9 V Full 0.2525 °C 0.7 0.9VCC = 1.8 V, ICOM = –10 mA,Ron(flat) ON-state resistance flatness (3) Ω0 ≤ VNO, VNC ≤ VCC Full 1.525 °C –1 0.5 1NO VCC = 1.95 V, VCOM = 0.15 V, 1.65 V,INO(OFF) nAOFF leakage current (4) VNO = 1.8 V, 0.15 V Full –10 1025 °C –1 0.5 1COM VCC = 1.95 V, VCOM = 0.15 V, 1.65 V,ICOM(OFF) nAOFF leakage current (4) VNO, = 1.8 V, 0.15 V Full –10 1025 °C –1 0.01 1COM VCC = 1.95 V, VCOM = 0.15 V, 1.65 V,ICOM(ON) nAON leakage current (4) VNO = 0.15 V, 1.65 V, or floating Full –3 3

DYNAMIC25 °C 6 18VNO, VNC = 1.5 V, RL = 50 Ω,tON Turn-on time nsCL = 35 pF, See Figure 14 Full 2025 °C 5 10VNO, VNC = 1.5 V, RL = 50 Ω,tOFF Turn-off time nsCL = 35 pF, See Figure 14 Full 12

VGEN = 0, RGEN = 0, CL = 1 nF,QC Charge injection 25 °C 3.2 pCSee Figure 15CNO(OFF) NO OFF capacitance f = 1 MHz, See Figure 16 25 °C 23CCOM(OFF) COM OFF capacitance f = 1 MHz, See Figure 16 25 °C 20 pFCCOM(ON) COM ON capacitance f = 1 MHz, See Figure 16 25 °C 43BW Bandwidth RL = 50 Ω, Switch ON 25 °C 123 MHz

f = 10 MHz –61RL = 50 Ω, CL = 5 pF,OISO OFF isolation (5) 25 °C dBSee Figure 17 f = 100 MHz –36f = 10 MHz –95RL = 50 Ω, CL = 5 pF,XTALK Crosstalk 25 °C dBSee Figure 17 f = 100 MHz –73RL = 32 Ω 0.14%f = 20 Hz to 20 kHz,THD Total harmonic distortion 25 °CVCOM = 2 VP-P RL = 600 Ω 0.013%

DIGITAL CONTROL INPUTS (IN1, IN2)VIH Input logic high Full 1

VVIL Input logic low Full 0.4

25 °C 0.1 5IIN Input leakage current VI = 0 or VCC nA

Full –10 10SUPPLYVCC Power-supply range 1.65 1.95 V

25 °C 0.05ICC Positive-supply current VI = 0 or VCC μA

Full 0.5

(1) ΔRon = Ron(max) – Ron(min)(2) Typical values are at TA = 25°C.(3) Flatness is defined as the difference between the maximum and minimum value of ron as measured over the specified analog signal

ranges.(4) Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at TA = 25°C.(5) OFF isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to OFF switch

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0

1

2

3

4

5

6

7

8

1.6 2.0 2.4 2.8 3.2 3.6 4.0

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/tO

FF

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tOFF

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15

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25

30

35

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QC

(pC

)

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VCC = 3 V

1.00

10.00

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/IC

OM

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Ro

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VCOM (V)

Ro

nW

VCC = 2.7 V

VCC = 1.8 V

TS3A4741, TS3A4742SCDS228F –AUGUST 2006–REVISED DECEMBER 2015 www.ti.com

6.7 Typical Characteristics

Figure 1. Ron vs VCOM Figure 2. Ron vs VCOM (VCC = 1.8 V)

Figure 3. Ron vs VCOM (VCC = 2.7 V) Figure 4. ION and IOFF vs Temperature(VCC = 3.6 V)

Figure 5. QC vs VCOM Figure 6. tON and tOFF vs Supply Voltage

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0.036

0.037

0.038

0.039

0.040

0.041

0.042

0

TH

D (%

)

Frequency (kHz)

10 100 100K1K 10K

0.036

0.037

0.038

0.039

0.040

0.041

0.042

0

TH

D (%

)

Frequency (kHz)

10 100 100K1K 10K

−14

−12

−10

−8

−6

−4

−2

0

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(d

B)

Frequency (MHz)

0.1 1 100010 100

−90

−80

−70

−60

−50

−40

−30

−20

−10

0

Att

en

uati

on

(d

B)

Frequency (MHz)

0.1 1 100010 100

0

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2

3

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7

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t ON

/tO

FF

(ns)

−40 C 25C 85C° ° °

TON = 1.8 V

TOFF = 1.8 V

TON = 3 V

TOFF = 3 V

0.001

0.010

0.100

1.000

10.000

100.000

1000.000

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

I CC

(nA

)

VCC(V)

85C

25C

–40C

TS3A4741, TS3A4742www.ti.com SCDS228F –AUGUST 2006–REVISED DECEMBER 2015

Typical Characteristics (continued)

Figure 8. ICC vs VCCFigure 7. tON and tOFF vs Temperature

Figure 9. Gain vs Frequency (VCC = 3 V) Figure 10. OFF Isolation vs Frequency(VCC = 3 V)

Figure 11. Total Harmonic Distortion vs Frequency Figure 12. Total Harmonic Distortion vs Frequency(RL = 32 Ω) (RL = 600 Ω)

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−120

−100

−80

−60

−40

−20

0

0

Cro

ssta

lk (

dB

)

Frequency (MHz)

0.1 1 100010 100

TS3A4741, TS3A4742SCDS228F –AUGUST 2006–REVISED DECEMBER 2015 www.ti.com

Typical Characteristics (continued)

Figure 13. Crosstalk vs Frequency(VCC = 3 V)

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VCC

RGEN

NO

VCC

GND

COMIN VO

C

1000 pFLa

VI

VGEN

0

VCC

VI

VO DVO

VCC

VNONO

GND

COMIN VCOM

50 W 35 pF

a

35 pF

50%

90%

50%

90%

tOFFtON

t < 5 ns

tR

F < 5 ns

0

0

VNO

VCOM

VIH + 0.5 V

IN

VCC

TS3A4741, TS3A4742www.ti.com SCDS228F –AUGUST 2006–REVISED DECEMBER 2015

7 Parameter Measurement Information

Figure 14. Switching Times

Figure 15. Charge Injection (QC)

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VCC

NO

VCC

GND

COMIN

NetworkAnalyzer

Measurements are standardized againstshort at socket terminals. OFF isolation ismeasured between COM and OFF terminalson each switch. Bandwidth is measured betweenCOM and ON terminals on each switch. Signaldirection through switch is reversed; worstvalues are recorded.

OFF isolation = 20 log

Add 50- termination forOFF isolation

V /VO I

(1)W

50 W 50 W

50 W 50 W

VI

VO

0.1 Fm

Meas Ref

VCC

(1)

VCC

NO

VCC

GND

COMINAsRequired

1-MHzCapacitance

Analyzer

TS3A4741, TS3A4742SCDS228F –AUGUST 2006–REVISED DECEMBER 2015 www.ti.com

Parameter Measurement Information (continued)

Figure 16. NO and COM Capacitance

Figure 17. OFF Isolation, Bandwidth, and Crosstalk

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NO

COM

Vcc/2

IN

600 W

Audio Analyzer

SignalSource

CL = 50 pFRL = 600 W

Channel ON: COM to NOVSOURCE = Vcc P-P

VI = Vcc/2fSOURCE = 20 Hz to 20 kHz

- /2Vcc

CL(A)

600 W

TS3A4741, TS3A4742www.ti.com SCDS228F –AUGUST 2006–REVISED DECEMBER 2015

Parameter Measurement Information (continued)

A. CL includes probe and jig capacitance.

Figure 18. Total Harmonic Distortion (THD)

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SPST

IN1

NO1 COM1

SPST

IN2

NO2 COM2

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8 Detailed Description

8.1 OverviewThe TS3A4741 and TS3A4742 are bi-directional, 2-channel single-pole/single-throw (SPST) analog switches withlow ON-state resistance (Ron), low-voltage, that operate from a single 1.6-V to 3.6-V supply. These devices havefast switching speeds, handle rail-to-rail analog signals, and consume very low quiescent power.

The digital logic input is 1.8-V CMOS compatible when using a single 3-V supply.

The TS3A4741 has two normally open (NO) switches, and the TS3A4742 has two normally closed (NC)switches.

8.2 Functional Block Diagram

8.3 Feature DescriptionThe TS3A4741 and TS3A4742 has a low on resistance and high current handling capability up to 100 mAcontinuous current so it can be used for power sequencing and routing with minimal losses. The switch is also bi-directional with fast switching times in the 10 ns range which allows data acquisition and communication betweenmultiple devices.

With a 3-V supply these devices are compatible with standard 1.8-V CMOS logic.

8.4 Device Functional Modes

Table 1. Function TableNO to COM, COM to NO NC to COM, COM to NCIN (TS3A4741) (TS3A4742)

L OFF ONH ON OFF

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SPST switch Device 1

System

Controller

COM1

COM2

NO1

Data

IN1

VCC

3.3V 3.3V

GND

0.1 PF 0.1 PF0.1 PF

IN2

Device 2NO2

3.3V

0.1 PF

TS3A4741, TS3A4742www.ti.com SCDS228F –AUGUST 2006–REVISED DECEMBER 2015

9 Application and Implementation

NOTEInformation in the following applications sections is not part of the TI componentspecification, and TI does not warrant its accuracy or completeness. TI’s customers areresponsible for determining suitability of components for their purposes. Customers shouldvalidate and test their design implementation to confirm system functionality.

9.1 Application InformationAnalog signals that range over the entire supply voltage (VCC to GND) of the TS3A4741 and TS3A4742 can bepassed with very little change in Ron (see Typical Characteristics). The switches are bidirectional, so the NO, NC,and COM pins can be used as either inputs or outputs.

9.2 Typical Application

Figure 19. Typical Application Schematic

9.2.1 Design RequirementsEnsure that all of the signals passing through the switch are within the specified ranges to ensure properperformance.

9.2.2 Detailed Design ProcedureThe TS3A474x can be properly operated without any external components. However, TI recommends thatunused pins should be connected to ground through a 50-Ω resistor to prevent signal reflections back into thedevice. TI also recommends that the digital control pins (INx) be pulled up to VCC or down to GND to avoidundesired switch positions that could result from the floating pin.

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0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0

VCOM (V)

Ro

n(Ω

)

85C

25C

–40C

TS3A4741, TS3A4742SCDS228F –AUGUST 2006–REVISED DECEMBER 2015 www.ti.com

Typical Application (continued)9.2.3 Application Curve

Figure 20. Ron vs VCOM (VCC = 2.7 V)

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1

2

3

4

8

NO2GND

COM1

COM2

NO1 VCC

IN1

IN2

LEGEND

VIA to Power Plane

VIA to GND Plane (Inner Layer)

Polygonal Copper Pour

To System

To System

To System

7

6

5

Bypass Capacitor

Vcc

To System To System

To System

TS3A4741, TS3A4742www.ti.com SCDS228F –AUGUST 2006–REVISED DECEMBER 2015

10 Power Supply Recommendations

Proper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maximumratings, because stresses beyond the listed ratings can cause permanent damage to the device. Alwayssequence VCC on first, followed by NO, NC, or COM.

Although it is not required, power-supply bypassing improves noise margin and prevents switching noisepropagation from the VCC supply to other components. A 0.1-μF capacitor, connected from VCC to GND, isadequate for most applications.

11 Layout

11.1 Layout GuidelinesHigh-speed switches require proper layout and design procedures for optimum performance. Reduce strayinductance and capacitance by keeping traces short and wide. Ensure that bypass capacitors are as close to thedevice as possible. Use large ground planes where possible.

11.2 Layout Example

Figure 21. PCB Layout Example

Copyright © 2006–2015, Texas Instruments Incorporated Submit Documentation Feedback 17

Product Folder Links: TS3A4741 TS3A4742

TS3A4741, TS3A4742SCDS228F –AUGUST 2006–REVISED DECEMBER 2015 www.ti.com

12 Device and Documentation Support

12.1 Related LinksThe table below lists quick access links. Categories include technical documents, support and communityresources, tools and software, and quick access to sample or buy.

Table 2. Related LinksTECHNICAL TOOLS & SUPPORT &PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY

TS3A4741 Click here Click here Click here Click here Click hereTS3A4742 Click here Click here Click here Click here Click here

12.2 TrademarksAll trademarks are the property of their respective owners.

12.3 Electrostatic Discharge CautionThese devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foamduring storage or handling to prevent electrostatic damage to the MOS gates.

12.4 GlossarySLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable InformationThe following pages include mechanical, packaging, and orderable information. This information is the mostcurrent data available for the designated devices. This data is subject to change without notice and revision ofthis document. For browser-based versions of this data sheet, refer to the left-hand navigation.

18 Submit Documentation Feedback Copyright © 2006–2015, Texas Instruments Incorporated

Product Folder Links: TS3A4741 TS3A4742

PACKAGE OPTION ADDENDUM

www.ti.com 5-Jun-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

TS3A4741DCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 (8BLO ~ 8BLR)

TS3A4741DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 JYR

TS3A4742DCNR ACTIVE SOT-23 DCN 8 3000 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 (8BPO ~ 8BPR)

TS3A4742DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM -40 to 85 L7R

(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

PACKAGE OPTION ADDENDUM

www.ti.com 5-Jun-2017

Addendum-Page 2

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

TS3A4741DCNR SOT-23 DCN 8 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3

TS3A4741DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

TS3A4742DCNR SOT-23 DCN 8 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3

TS3A4742DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

TS3A4741DCNR SOT-23 DCN 8 3000 202.0 201.0 28.0

TS3A4741DGKR VSSOP DGK 8 2500 358.0 335.0 35.0

TS3A4742DCNR SOT-23 DCN 8 3000 202.0 201.0 28.0

TS3A4742DGKR VSSOP DGK 8 2500 358.0 335.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 3-Aug-2017

Pack Materials-Page 2

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