3.5±0

.5

θ θ

PC824

PC824

Internal connection diagram

CTRrank mark

6.5±0

.5

1.2±0.3

0.9±0.2

2.54±0.25

θ=0 to 13˚

9.66±0.5

3.0±0

.5

0.5T

YP

.

0.5±0.1

0.26±0.1

7.62±0.3

Anode, CathodeAnode, Cathode

EmitterCollector

1 3

2 4

5 7

6 8

8 7 6 5 8 7 6 5

1 2 3 4 1 2 3 4

θθ

PC844

PC844

CTR rank mark

Internal connection diagram

Anode, CathodeAnode, CathodeEmitterCollector

6.5±0

.5

0.9±0.21.2±0.3

2.54±0.25

19.82±0.5

3.5±0

.53.

0±0.5

0.5±0.1

7.62±0.3

0.26±0.1

0.5T

YP

.

16 15 14 13 12 11 10 9

16 15 14 13 12 11 10 9

1 3 5 7

2 4 6 8

9 11 13 15

10 12 14 16

1 2 3 4 5 6 7 8

1 2 3 4 5 6 7 8

θ=0 to 13˚

PC824/PC844

PC824/PC844

Features

AC Input Photocoupler

1. AC input

2. High isolation voltage between input and

output (Viso (rms) :5kV)

3. Compact dual-in-line package

PC824 (2-channel type)

PC844 (4-channel type)

4. Current transfer ratio

CTR:MIN. 20% at IF=±1mA, VCE=5V

5. Recognized by UL, file No. E64380

Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/

Outline Dimensions (Unit : mm)

Lead forming type (I type) and taping reel type (P type) are also available.

Absolute Maximum Ratings (Ta=25˚C)

Parameter Symbol Unit

Inpu

t Forward current mA *1 Peak forward current A

Power dissipation mW

Out

put

Collector-emitter voltage V

Emitter-collector voltage V

Collector current mA

Collector power dissipation mW

Total power dissipation mW*2 Isolation voltage

Operating temperature ˚C

Storage temperature ˚C*3 Soldering temperature

IF

IFM

P

VCEO

VECO

IC

PC

Ptot

Viso (rms)

Topr

Tstg

Tsol ˚C*1 Pulse width≤100µs, Duty ratio:0.001*2 40 to 60%RH, AC for 1 minute*3 For 10s

Rating

±50

±1

70

35

6

50

150

200

−30 to +100

−55 to +125

260

5 kV

1. Programmable controllers

2. Telephones

3. Facsimiles

Applications

PC824/PC844

Electro-optical CharacteristicsParameter Conditions

Forward voltage

Peak forward voltage

Terminal capacitance

Collector dark current

Transfercharac-teristics

Collector current

Collector-emitter saturation voltage

Isolation resistance

Floating capacitance

Cut-off frequency

MIN.

−−−−

0.2

−5×1010

−15

−−

TYP.

1.2

−50

−−

0.1

1011

0.6

80

4

3

MAX.

1.4

3.0

250

100

3.0

0.2

−1.0

−18

18

Unit

V

V

pF

nA

mA

V

ΩpF

kHz

µs

µs

Symbol

VF

VFM

Ct

ICEO

IC

VCE (sat)

RISO

fc

tr

tf

Cf

Response timeRise time

Fall time

Input

Output

IF=±20mA

IFM=±0.5V

V=0, f=1kHz

VCE=20V, IF=0

IF=±1mA, VCE=5V

IF=±20mA, IC=1mA

V=0, f=1MHz

VCE=2V, IC=2mA, RL=100Ω

VCE=5V, IC=2mA, RL=100Ω, −3dB

DC500V, 40 to 60%RH

(Ta=25˚C)

Rank TableModel No. Rank mark

PC844A

A or no mark 0.2 to 3.0PC824PC844

PC824AA 0.5 to 1.5

IC (mA)

(IF=±1mA, VCE=5V, Ta=25˚C)

0−30

10

0 25 50 75 100 125

20

30

40

50

60

Forw

ard

curr

ent I

F (m

A)

Ambient temperature Ta (˚C)

00 125

100

200

50

150

25 50 75 100−30

Ambient temperature Ta (˚C)

Col

lect

or p

ower

dis

sipa

tion

P C (

mW

)

Fig.1 Forward Current vs. Ambient Temperature

Fig.2 Collector Power Dissipation vs. Ambient Temperature

PC824/PC844

Duty ratio

55

10

20

100

50

200

500

210−3 10−25 2 10−15 2 5

Peak

for

war

d cu

rren

t IFM

(m

A)

1

10 000

5 000

2 000

1 000

Pulse width≤100µsTa=25˚C

Fig.3 Peak Forward Current vs. Duty Ratio

25˚C

0˚C

01

2

0.5 1.0 1.5 2.0 2.5 3.0

5

10

20

50

100

200

500

50˚C

−25˚C

Forward voltage VF (V)

Forw

ard

curr

ent I

F (m

A)

Ta=75˚C

Fig.4 Forward Current vs. Forward Voltage

0.1 0.50.2 1 2 5 100

20 50

60

80

100

120

140

20

40

Forward current IF (mA)

Cur

rent

tran

sfer

rat

io C

TR

(%

)

VCE=5VTa=25˚C

Fig.5 Current Transfer Ratio vs. Forward Current

00

Collector-emitter voltage VCE (V)

10

2

20

30

4 6 8 10

20mA

10mA

5mA

1mA

Col

lect

or C

urre

nt I

C (

mA

)

Ta=25˚C

PC (MAX.)

IF=30mA

Fig.6 Collector Current vs. Collector-emitter Voltage

50

0

100

150

Rel

ativ

e cu

rren

t tra

nsfe

r ra

tio (

%)

Ambient temperature Ta (˚C)

IF=1mAVCE=5V

0 25 50 75 100−30

Ambient temperature Ta (˚C)

Col

lect

or e

mitt

er s

atur

atio

n vo

ltage

VC

E (

sat)

(V)

0−30

0.01

0 20 40 60 80 100

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.09

0.1

IF=20mAIC=1mA

Fig.7 Relative Current Transfer Ratio vs. Ambient Temperature

Fig.8 Collector-emitter Saturation Voltage vs. Ambient Temperature

PC824/PC844

250 50 75 100

Col

lect

or d

ark

curr

ent I

CE

O (

A)

Ambient temperature Ta (˚C)

VCE=20V

−3010−12

10−11

10−10

10−9

10−8

10−7

10−6

Fig.9 Collector Dark Current vs. Ambient Temperature

Frequency f (kHz)

0.2 202 200 1 000

0

100Ω1kΩ

0.5 1 5 10 50 100 500

Vol

tage

gai

n A

v (d

B)

−20

−15

−10

−5

VCE=5VIC=2mATa=25˚C

RL=10kΩ

Fig.12 Frequency Response

VCC

tftr

ts90%

10%

td

Output

Input

RLInput OutputRD

Test Circuit for Response Time

Col

lect

or-e

mitt

er s

atur

atio

n vo

ltage

VC

E (

sat)

(V)

Forward current IF (mA)

00

2

4

6

2 4 6 8 10

1mA

3mA

5

3

1

97531

5mA

7mA

11 12 13 14 15

Ta=25˚C

IC=0.5mA

VCC

RL

OutputRD

Fig.10 Collector-emitter Saturation Voltage vs. Forward Current

Test Circuit for Frequency Response

100

5

2

1Res

pons

e tim

e (µ

s)

0.5

0.10.2

0.03 0.1 1 100.2 0.5 2 5

50

20

10

tr

tf

td

ts

VCE=2VIC=2mATa=25˚C

Load resistance RL (kΩ)

Fig.11 Response Time vs. Load Resistance

NOTICE

The circuit application examples in this publication are provided to explain representative applications of SHARPdevices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takesno responsibility for any problems related to any intellectual property right of a third party resulting from the use ofSHARP's devices.

Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARPreserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contentsdescribed herein at any time without notice in order to improve design or reliability. Manufacturing locations arealso subject to change without notice.

Observe the following points when using any devices in this publication. SHARP takes no responsibility for damagecaused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be usedspecified in the relevant specification sheet nor meet the following conditions:

(i) The devices in this publication are designed for use in general electronic equipment designs such as:- - - Personal computers- - - Office automation equipment- - - Telecommunication equipment [terminal]- - - Test and measurement equipment- - - Industrial control- - - Audio visual equipment- - - Consumer electronics

(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety whenSHARP devices are used for or in connection with equipment that requires higher reliability such as:- - - Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)- - - Traffic signals- - - Gas leakage sensor breakers- - - Alarm equipment- - - Various safety devices, etc.

(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level ofreliability and safety such as:- - - Space applications- - - Telecommunication equipment [trunk lines]- - - Nuclear power control equipment- - - Medical and other life support equipment (e.g., scuba).

If the SHARP devices listed in this publication fall within the scope of strategic products described in the ForeignExchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.

This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyrightlaws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic ormechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express writtenpermission is also required before any use of this publication may be made by a third party.

Contact and consult with a SHARP representative if there are any questions about the contents of this publication.