Toray Polyimide Coating MaterialNon- photosensitive Polyimide

“Semicofine” SP-042

Toray Industries Inc.

Contents

1.Product Line up of Toray’s PI Coating Material2.Mechanical Properties3. Thermal Properties4. Electrical Properties5.Liquid Properties6.Process Conditions (for 10μm film thickness)7.Relationship Between Rotation Speed Film Thickness 8.Cure temperature dependency for film properties9.Weight Loss10.Handling

1. Product Line Up of Toray’s PI Coating Material

Photosensitive PIPhotoneece

UR-5100FXseries

BG-8000 Series

UR-3100seriesUR-2400

series

LOW CTE

EXCELLENT FILM PROPERTY

EXCELLENT RESOLUTION

G -LINE APPLIABLE

Photosensitive PositiveType

Non Photosensitive PI“Semicofine ”

SP-500series

SP-700series

SP-040series

LOW CTE

HIGH CHEMICAL RESISTANCE

I -LINE APPLIABLE

SP-300 series

GOOD ADHESION,HIGH CHEMICAL RESISTANCE

SP-400 series

GOOD ADHESION, EASY PROCESS

SP-800 series

GOOD ADHESION

BROAD BAND OR MIRROR PROJECTION

2. Mechanical Properties

Properties unit Value

Tensile Strength Mpa 230

Elongation % 55

Young’s Module Gpa 4.7

3. Thermal Properties

Properties unit Value

Coefficient of Thermal Properties ppm 17

5% Weight Loss Temperature (C) 600

Glass Transition Temperature (C) Not observed in DSC

Water Absorption % 0.8%

4. Electrical Properties

Properties unit Value

Dielectric Constant 3.3

Volume Reisistivity Ω/cm ＞1.0E＋16

Surface Resistivity Ω ＞1.0E＋16

Dielectric Strength KV/mm ＞300

5. Liquid Properties

Properties unit Value

Solid Content % 19%

Viscosity Mpa/s(25degree) 5500 Na ＜0.1 K ＜0.1 Ca ＜0.1 Cu ＜0.1 Cr ＜0.1 Fe ＜0.1

Inpurity ppm

Cl ＜2

Solvent N-Methyl-Pyrrolidone

Filtration ｍicrometer 1

Density 1.1

6. Process Condition (film thickness 10μm)

Process Conditions1. Coating (4"wafer) 700rpmx 10sec + slope 3sec +1400rpmx 30sec

Hot Plate with Cup, Proximity gap=150um95C for 2.5min+ramp up at 5C+125C for 2.5min

3. Positive resist coating (ex) OFPR-800-60(viscosity=60cp)500rpm x 2sec + 3600rpm x 30sec

4. Positive resist bakingHot Plate with Cup, Proximity gap=150um110Cx120secFilm thickness =2.0um(after prebaking)

5. Exposure Mask Aligner : broad band wave length 100mJ/cm2at 365nm

6. Development(atomosphere 23C,

45%RH)

Dip developmentdeveloper : NMD-3development time : 100sec without ultrasonic20sec with ultrasonic

7.Rinse and Dry

Dip rinsingRinser: Water120sec dipping in water bath120sec drying with Nitrogen blow

8.Resist Stripping N-Butyl Acetate& Nitrogen blow

9.Post cureConvection Oven (N2 purge at 20L/min)Ramping up at 5C/min140 C for 30min+200 C for 30min + 350C for 60min

2. Prebake

7. Relationship Between Coating Time & Film Thickness

S p in in gs p e e d ( r p m )

T h ic k n e s s a f t e rp r e b a k in g

T h ic k n e s s a f t e r f in a lc u r in g

1 0 0 0 2 0 1 2 .51 5 0 0 1 3 .5 8 .82 0 0 0 1 0 .5 6 .83 0 0 0 7 .2 4 .8

8. Cure temperature dependency for film properties

Cure temp. Elongation(%) Young Modulous(Gpa) Tensile Strength(Mpa)250C 24.4 4.77 183270C 44.6 4.75 225300C 50.3 4.77 226350C 55 4.76 226

Weight Loss% Temp.

0.01 537C0.03 560C0.05 600C

9. Weight loss

10. Storage & Handling

Store in -16C, avoid air contact.

Defrost to -3C day before usage. Keep at room temperature for about 2hours before usage.

Polyimide can easily absorb moisture. To avoid change in viscosity please close the bottle after usage.

Please wait about 30sec to spin after dropping the PI on the wafer.

Please leave the wafer still for about 30sec before precuring.

Please keep the wafer in horizontal position for curing.

Steep rise in temperature during curing may cause crack in the film layer.

Please read the MSDS for safety information regarding the product.