Halogen Free, High Elastic Modulus and Low CTE … Specifications *1） Heating Rate:10 /min. *2）...
■Standard Specifications *1） Heating Rate:10℃/min. *2） Measured by Triplate-Line Resonator. 0.8mm thickness core is used depending on test item. Copperfoil Thickness 2μm 3μm 5μm 12μm （LP,PF） 2μm 3μm 5μm 12μm 18μm 35μm 70μm （STD,LP,PF） Code Name U0.03 U0.04 U0.05 T0.04 T0.05 T0.06 T0.07 M0.06 0.1 0.15 0.2 0.3 0.41 0.61 0.81 0.030±0.013mm 0.040±0.013mm 0.050±0.013mm 0.040±0.013mm 0.050±0.013mm 0.060±0.013mm 0.070±0.013mm 0.07±0.02mm 0.11±0.02mm 0.16±0.03mm 0.21±0.04mm 0.32±0.05mm 0.40±0.05mm 0.60±0.06mm 0.80±0.08mm Actual Thickness and Tolerance MCL-E-679FG MCL-E-679FGB （R） （S） （S） Part Number Type Halogen Free, High Elastic Modulus and Low CTE Multilayer Material MCL-E-679ＦG High Tg Glass Epoxy Multilayer Material （FR-4） MCL-E-679FGB〈Black Type〉 GEA-679ＦG〈Prepreg〉 ●Halogen free material for environmental concerns. ●CTE (Z-direction) is 50% lower than that of our standard FR-4. ●Elastic modulus is 20% higher than that of our standard FR-4. Even thin laminate has less warpage and deflection. ●Superior heat resistance for soldering(suitable for the lead free process). ●Surface roughness is 1/4 of our standard FR-4, and making fine pattern possible. ●Semiconductor packages. (FC-BGA, BGA, CSP) ●Core material for HDI. ■Features ■Applications Item X Y Z 1MHz 1GHz ＊2 1MHz 1GHz ＊2 18μm 35μm ℃ ppm/℃ sec. min. ℃ cycles kN/m μm GPa － － Ω･cm Ω Ω ％ － Unit ＞300 ＞60 ＞60 340～360 ＞10 2～3 4.6～4.8 0.0080～0.0100 0.0160～0.0180 1×10 15 ～1×10 16 1×10 13 ～1×10 15 1×10 14 ～1×10 16 1×10 13 ～1×10 15 Ｖ－0 165～175 200～220 13～15 13～15 23～33 140～170 0.9～1.1 1.1～1.2 23～28 5.2～5.4 0.4～0.6 175～185 210～230 12～14 12～14 20～30 130～160 1.1～1.2 1.2～1.3 24～29 5.0～5.2 0.3～0.5 Actual Value Condition Test Method （IPC-TM-650） TMA DMA （30～120℃） （＜Tg） （＞Tg） A TMA TGA 260℃ Reflow A A A C-96/20/65 C-96/20/65 C-96/35/90 C-96/20/65 C-96/20/65+D-2/100 E-24/50+D-24/23 A Tg CTE ＊1 Solder Heat Resistance（260℃） T-260（Without Copper） T-288（Without Copper） Decomposition Temperature（5% Weight Loss） Heat Resistance for HDI Process （Semi-Additive） Copper Peel Strength Surface Roughness （Ra） Flexural Modulus （Lengthwise） Dielectric Constant Dissipation Factor Volume Resistivity Surface Resistance Insulation Resistance Water Absorption Flammability （UL-94） MCL-E-679FG Type（R） MCL-E-679FG Type（S） 2.4.24 ー 2.4.24 ー 2.4.24.1 2.3.40 ー 2.4.8 2.2.17 2.4.4 2.5.5.1 2.5.5.5 2.5.5.1 2.5.5.5 2.5.17 ー ー 2.6.2.1 2.3.10 ■Characteristics ●Thin Laminate （t0.4mm） 2,3,5,12,18μm （STD,LP,PF） Note1） STD:Standard copper foil, LP:Low profile copper foil, PF:Hitachi profile-free copper foil. Note2) STD:12μm,18μm, 35μm, 70μm; LP:2μm, 3μm, 5μm, 12μm, 18μm; PF:2μm, 3μm, 5μm, 12μm. Please contact us for details. Note3) “U” for 1-ply; “T” for 2-ply. Note4) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one. Note5) The thickness means that of dielectric layer. 18
Transcript of Halogen Free, High Elastic Modulus and Low CTE … Specifications *1） Heating Rate:10 /min. *2）...
■Standard Specifications
*1） Heating Rate:10℃/min. *2） Measured by Triplate-Line Resonator.0.8mm thickness core is used depending on test item.
Copperfoil Thickness
2μm3μm5μm12μm
（LP,PF）
2μm3μm5μm12μm18μm35μm70μm
（STD,LP,PF）
Code NameU0.03U0.04U0.05T0.04T0.05T0.06T0.07M0.060.10.150.20.30.410.610.81
0.030±0.013mm0.040±0.013mm0.050±0.013mm0.040±0.013mm0.050±0.013mm0.060±0.013mm0.070±0.013mm0.07±0.02mm0.11±0.02mm0.16±0.03mm0.21±0.04mm0.32±0.05mm0.40±0.05mm0.60±0.06mm0.80±0.08mm
Actual Thickness and Tolerance
MCL-E-679FGMCL-E-679FGB
（R）（S）
（S）
Part Number Type
Halogen Free, High Elastic Modulus and Low CTE Multilayer Material
MCL-E-679ＦG
High Tg Glass Epoxy Multilayer Material（FR-4）
MCL-E-679FGB〈Black Type〉GEA-679ＦG〈Prepreg〉
●Halogen free material for environmental concerns. ●CTE (Z-direction) is 50% lower than that of our standard FR-4. ●Elastic modulus is 20% higher than that of our standard
FR-4. Even thin laminate has less warpage and deflection.●Superior heat resistance for soldering(suitable for the lead free
process).●Surface roughness is 1/4 of our standard FR-4, and making fine
pattern possible.
●Semiconductor packages. (FC-BGA, BGA, CSP)
●Core material for HDI.
■Features ■Applications
Item
XY
Z
1MHz 1GHz＊2
1MHz 1GHz＊2
18μm 35μm
℃
ppm/℃
sec.
min.
℃cycleskN/m
μmGPa
－
－Ω･cm
ΩΩ
％－
Unit
＞300＞60＞60
340～360＞10
2～3
4.6～4.80.0080～0.01000.0160～0.01801×1015～1×1016
1×1013～1×1015
1×1014～1×1016
1×1013～1×1015
Ｖ－0
165～175200～22013～1513～1523～33
140～170
0.9～1.11.1～1.2
23～285.2～5.4
0.4～0.6
175～185210～23012～1412～1420～30
130～160
1.1～1.21.2～1.3
24～295.0～5.2
0.3～0.5
Actual ValueCondition Test Method
（IPC-TM-650）TMADMA
（30～120℃）
（＜Tg）（＞Tg）A
TMA
TGA260℃ Reflow
A
AA
C-96/20/65
C-96/20/65
C-96/35/90
C-96/20/65C-96/20/65+D-2/100E-24/50+D-24/23A
Tg
CTE ＊1
Solder Heat Resistance（260℃）T-260（Without Copper）T-288（Without Copper）Decomposition Temperature（5% Weight Loss）Heat Resistance for HDI Process（Semi-Additive）Copper Peel Strength
Surface Roughness（Ra）Flexural Modulus（Lengthwise）
Dielectric Constant
Dissipation Factor
Volume ResistivitySurface ResistanceInsulation Resistance
Water AbsorptionFlammability（UL-94）
MCL-E-679FG Type（R） MCL-E-679FG Type（S）2.4.24
ー
2.4.24
ー
2.4.24.12.3.40
ー
2.4.8
2.2.172.4.4
2.5.5.12.5.5.52.5.5.12.5.5.5
2.5.17
ーー
2.6.2.12.3.10
■Characteristics ●Thin Laminate （t0.4mm）
2,3,5,12,18μm（STD,LP,PF）
Note1） STD:Standard copper foil, LP:Low profile copper foil, PF:Hitachi profile-free copper foil.Note2) STD:12μm,18μm, 35μm, 70μm; LP:2μm, 3μm, 5μm, 12μm, 18μm; PF:2μm, 3μm, 5μm, 12μm. Please contact us for details. Note3) “U” for 1-ply; “T” for 2-ply.Note4) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one.Note5) The thickness means that of dielectric layer.
●Prepreg
Span : 10mmSpan : 15mmSpan : 20mmSpan : 25mmSpan : 30mmSpan : 35mmSpan : 40mm
0.030.040.060.10.030.030.030.040.060.1
（R）
（S）
75×7569×7253×5360×5895×9575×7575×7569×7253×5360×58
73±273±268±258±278±273±278±273±268±258±2
≦1.5
≦1.0
≦1.5
≦1.0
175±30165±30
155±30
175±30
165±30
（ＧＢＰＥ）（ＧＲＺＰＥ）（ＧＲＲＯＥ）（ＧＲＳＫＥ）（ＧＳＡＰＥ）（ＧＳＢＰＥ）（ＧＳＢＳＥ）（ＧＳＺＰＥ）（ＧＳＲＯＥ）（ＧＳＳＫＥ）
0.0400.0480.0790.1270.0310.0400.0500.0480.0790.127
Type Yarn Content（warp×fill）
Resin Content（％）
Volation Content（％）
Gelation Time（sec.）
Dielectric Thickness（mm）＊1（）After pattern filling
PropertiesGlass Cloth
1027103710782116101710271027103710782116
StylePart Number
GEA-679FG
●Prepreg thickness after pattern filling（Inner layer copper 15μm）
T0.07
●Stiffness Properties
12
10
8
6
4
2
1
0U0.04 T0.04 U0.05 T0.06
Flex
ure（
mm
）
Thickness
Weight（1g）
Span
Flexure
*1）The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. This value changes depending on the press condition or inner layer pattern.
Test Method（IPC-TM-650） 2.3.16.1 2.3.19 2.3.18 －
Copper remain ratio（％）
prep
reg
thic
knes
s（μ
m）
60
50
40
30
20
10
0100 20 30 40 50 60 70 80 90 100
Prepreg Thickness
GSBSE
GSBPE
GSAPE
chan
ge ra
tio o
f con
duct
ive
resi
stan
ce（％
）
0 500 600 700 800 900 1000400300200100
Number of cycles
●Through-hole reliabilityTest condition:－55℃, 30min. ⇔150℃, 30min.Pattern:Wall to wall distance 0.3mm, Laminate thickness:t0.8mmPre-condition:260℃ reflow × 2times⇒Solder dipping（260℃ 10sec.）
20
15
10
5
0
－5
●：MCL-E-679FG Type（S）▲：MCL-E-679FG Type（R）
18
■Standard Specifications
*1） Heating Rate:10℃/min. *2） Measured by Triplate-Line Resonator.0.8mm thickness core is used depending on test item.
Copperfoil Thickness
2μm3μm5μm12μm
（LP,PF）
2μm3μm5μm12μm18μm35μm70μm
（STD,LP,PF）
Code NameU0.03U0.04U0.05T0.04T0.05T0.06T0.07M0.060.10.150.20.30.410.610.81
0.030±0.013mm0.040±0.013mm0.050±0.013mm0.040±0.013mm0.050±0.013mm0.060±0.013mm0.070±0.013mm0.07±0.02mm0.11±0.02mm0.16±0.03mm0.21±0.04mm0.32±0.05mm0.40±0.05mm0.60±0.06mm0.80±0.08mm
Actual Thickness and Tolerance
MCL-E-679FGMCL-E-679FGB
（R）（S）
（S）
Part Number Type
Halogen Free, High Elastic Modulus and Low CTE Multilayer Material
MCL-E-679ＦG
High Tg Glass Epoxy Multilayer Material（FR-4）
MCL-E-679FGB〈Black Type〉GEA-679ＦG〈Prepreg〉
●Halogen free material for environmental concerns. ●CTE (Z-direction) is 50% lower than that of our standard FR-4. ●Elastic modulus is 20% higher than that of our standard
FR-4. Even thin laminate has less warpage and deflection.●Superior heat resistance for soldering(suitable for the lead free
process).●Surface roughness is 1/4 of our standard FR-4, and making fine
pattern possible.
●Semiconductor packages. (FC-BGA, BGA, CSP)
●Core material for HDI.
■Features ■Applications
Item
XY
Z
1MHz 1GHz＊2
1MHz 1GHz＊2
18μm 35μm
℃
ppm/℃
sec.
min.
℃cycleskN/m
μmGPa
－
－Ω･cm
ΩΩ
％－
Unit
＞300＞60＞60
340～360＞10
2～3
4.6～4.80.0080～0.01000.0160～0.01801×1015～1×1016
1×1013～1×1015
1×1014～1×1016
1×1013～1×1015
Ｖ－0
165～175200～22013～1513～1523～33
140～170
0.9～1.11.1～1.2
23～285.2～5.4
0.4～0.6
175～185210～23012～1412～1420～30
130～160
1.1～1.21.2～1.3
24～295.0～5.2
0.3～0.5
Actual ValueCondition Test Method
（IPC-TM-650）TMADMA
（30～120℃）
（＜Tg）（＞Tg）A
TMA
TGA260℃ Reflow
A
AA
C-96/20/65
C-96/20/65
C-96/35/90
C-96/20/65C-96/20/65+D-2/100E-24/50+D-24/23A
Tg
CTE ＊1
Solder Heat Resistance（260℃）T-260（Without Copper）T-288（Without Copper）Decomposition Temperature（5% Weight Loss）Heat Resistance for HDI Process（Semi-Additive）Copper Peel Strength
Surface Roughness（Ra）Flexural Modulus（Lengthwise）
Dielectric Constant
Dissipation Factor
Volume ResistivitySurface ResistanceInsulation Resistance
Water AbsorptionFlammability（UL-94）
MCL-E-679FG Type（R） MCL-E-679FG Type（S）2.4.24
ー
2.4.24
ー
2.4.24.12.3.40
ー
2.4.8
2.2.172.4.4
2.5.5.12.5.5.52.5.5.12.5.5.5
2.5.17
ーー
2.6.2.12.3.10
■Characteristics ●Thin Laminate （t0.4mm）
2,3,5,12,18μm（STD,LP,PF）
Note1） STD:Standard copper foil, LP:Low profile copper foil, PF:Hitachi profile-free copper foil.Note2) STD:12μm,18μm, 35μm, 70μm; LP:2μm, 3μm, 5μm, 12μm, 18μm; PF:2μm, 3μm, 5μm, 12μm. Please contact us for details. Note3) “U” for 1-ply; “T” for 2-ply.Note4) In case laminate thickness lies in between two thickness figures shown above, the tolerance of such laminate would be equal to the tolerance of the thicker one.Note5) The thickness means that of dielectric layer.
●Prepreg
Span : 10mmSpan : 15mmSpan : 20mmSpan : 25mmSpan : 30mmSpan : 35mmSpan : 40mm
0.030.040.060.10.030.030.030.040.060.1
（R）
（S）
75×7569×7253×5360×5895×9575×7575×7569×7253×5360×58
73±273±268±258±278±273±278±273±268±258±2
≦1.5
≦1.0
≦1.5
≦1.0
175±30165±30
155±30
175±30
165±30
（ＧＢＰＥ）（ＧＲＺＰＥ）（ＧＲＲＯＥ）（ＧＲＳＫＥ）（ＧＳＡＰＥ）（ＧＳＢＰＥ）（ＧＳＢＳＥ）（ＧＳＺＰＥ）（ＧＳＲＯＥ）（ＧＳＳＫＥ）
0.0400.0480.0790.1270.0310.0400.0500.0480.0790.127
Type Yarn Content（warp×fill）
Resin Content（％）
Volation Content（％）
Gelation Time（sec.）
Dielectric Thickness（mm）＊1（）After pattern filling
PropertiesGlass Cloth
1027103710782116101710271027103710782116
StylePart Number
GEA-679FG
●Prepreg thickness after pattern filling（Inner layer copper 15μm）
T0.07
●Stiffness Properties
12
10
8
6
4
2
1
0U0.04 T0.04 U0.05 T0.06
Flex
ure（
mm
）
Thickness
Weight（1g）
Span
Flexure
*1）The dielectric thickness after lamination is defined as the thickness of one sheet of prepreg when the resin flow is 0%. This value changes depending on the press condition or inner layer pattern.
Test Method（IPC-TM-650） 2.3.16.1 2.3.19 2.3.18 －
Copper remain ratio（％）
prep
reg
thic
knes
s（μ
m）
60
50
40
30
20
10
0100 20 30 40 50 60 70 80 90 100
Prepreg Thickness
GSBSE
GSBPE
GSAPE
chan
ge ra
tio o
f con
duct
ive
resi
stan
ce（％
）
0 500 600 700 800 900 1000400300200100
Number of cycles
●Through-hole reliabilityTest condition:－55℃, 30min. ⇔150℃, 30min.Pattern:Wall to wall distance 0.3mm, Laminate thickness:t0.8mmPre-condition:260℃ reflow × 2times⇒Solder dipping（260℃ 10sec.）
20
15
10
5
0
－5
●：MCL-E-679FG Type（S）▲：MCL-E-679FG Type（R）
19
