Low G MEMS Inertia Switchesfor Fuzing Applications

HT MicroAnalytical, Inc.Sam Rogers, Danny Czaja, Hopper Chu,Todd Christenson, Chairman & CTO

todd.c@htmicro.com

ReliabilityScaling

Issues

Approach

Results

DesignFabrication

Initial Testing

• Reliability Force Δ Energy Volume

Reliability

Reliability

Design

Reliability

Design

Design

Design

1) Materials – ρ, σy , σ-n - $

2) High Aspect Ratio - $

3) Tolerances / Integration / Packaging - $

Keys for High FOM / Viable Microfabricated Component

4) Testing - $

Design

Custom metal proof mass

CeramicPackage(Hermetic)

Conductive via fill

Hard Gold Contact Pads

Common contact

Top contact

Bottom contact

Side contact

Spin contact not visible

Integrated Inertia Switch Anatomy

Multi-layer spring-mass fabrication

multi-layer fabrication

Multi-layer spring-mass fabrication

Multi-layer spring-mass fabrication

ma = kx

ma = kx

~ 0.05 G / Hz

Diced Wafer

‘WLP’ Diced Parts

Edge of Device

Resonance Measurements

Acknowledgements

Ryan Knight (ARL)

Daniel Jean (Indian Head)

Edward Cornell (China Lake)

ht micro Albuquerque, NM USA(505)341-0466info@htm icro.com

Thank You!