Thermal management of semiconductor devices using MEMs ...
Transcript of Thermal management of semiconductor devices using MEMs ...
Thermal management of semiconductor devices using MEMS
technology
JKC Research Team: Gerardo Chavez, Agnes Chiao,
Braulio De La Torre, and Andrew Schwab
Resident Assistant: Mayra Pérez
Faculty Mentor: Dr. Payam Bozorgi
Faculty Advisor: Prof. Noel MacDonald
Department: Mechanical Engineering
MEMS: Micro-Electro-Mechanical-System
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Cooling systems for electronics
Problem: Overheating Electronics
VS.
smaller and more powerful microchips in devices
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More components requires more power, which produces more heat.
Objective: construct a MEMS device to improve thermal management of electronic systems.
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Equipment used to find channel dimensions
optical 3D profiler
computer graphic image of a channel
220 μm
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Wick fabrication & capillary force
Cleaning Procedure:- 10 min. soak in acetone - 5 min. soak in isopropanol - Dry by nitrogen gas gun- 4 min. bake on a heat plate
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Experimental data
Ti-TGP is 25x more efficient
6x lighter and
Much thinner
than copper heat pipe!!
Ti-TGP Vs. Cu-Heat Pipe (Current Technology)
Copper Heat Pipe Ti-TGP
Thickness > 3mm < 1mm
Weight -- X6 lighter
Thermal conductivity
400 W/m K 10,000 W/m K
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Expected improvements to technology
Lighter, thinner and, more efficient devices
Allows for more components in electronic devices
Less risk of overheating and damage
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Future projections for research
Titanium alloy substrate• Lightweight
• Nonreactive with water
• High fracture resistance
• Able to be micro machined
• Higher thermal conductivity
Etching processes• Effective for etching new
substrate
• Reduces difference between expected and actual water volume
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Acknowledgements
We would like to express our gratitude to
Dr. Payam Bozorgi,
The MacDonald Group and Professor Noel C. MacDonald,
The Center for Science and Engineering Partnerships (CSEP),
The California Nanosystems Institute (CNSI),
The Jack Kent Cooke Foundation,
The Cooke-Bridges Staff – Anthony, Ofelia, Jens, Jacob, Mayra, Javier, Jenny, and Jason,
and the other presenters, counselors, faculty and industry professionals whom we have met.
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Citations
http://www.sciencedirect.com/science/article/pii/S001793101300087
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http://blog.dailyobjects.com/wp-content/uploads/2013/04/Hot-
laptop-heating-back-panel.jpg
http://hlt.media.mit.edu/wp-content/uploads/2011/06/IMG_0888.jpg
http://mrbesilly.typepad.com/.a/6a00d8341bfa6953ef01156f89b6639
70c-320wi
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