Wafer Edge Grinding Machine - · PDF fileWafer Edge Grinding Machine ... Mechanical...
Transcript of Wafer Edge Grinding Machine - · PDF fileWafer Edge Grinding Machine ... Mechanical...
Wafer Edge Grinding Machine
TOSEI ENGINEERING CORP.
Best Seller Machine W-GM-Series
Improve the Space Efficiency by the Compact Design
Highly Accurate Grinding by the Synchronized X Support Control
Easy Operation by Touch Panel
Automatic feed-back of processing result will be given
TOSEI AMERICA , Inc.
ACCRETECH EUROPE
TOSEI ENGINEERING Pvt.,Ltd
TOSEI (Thailand) Co.,Ltd
TOSEI MEASURING(PINGHU)CORP.
PT TOSEI INDONESIA
TOSEI KOREA Co.,Ltd
TOSEI ENGINEERING CORP.
TOSEI TAIWAN Co.,Ltd
TOSEI BRAZIL ENGENHARIA E REPRESENTACAO COMERCIAL LTDA.
TOSEI MEXICO SA DE CV.TOSEI PHILIPPINES CORP.
Specification of W-GM-4200
Basic SpecificationWafer Size 2 6 / 5 8Wafer Thickness 0.4 1.0mm (Standard)Wafer Type OFCF 2 (