Wafer Edge Grinding Machine - · PDF fileWafer Edge Grinding Machine ... Mechanical...

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  • Wafer Edge Grinding Machine

    TOSEI ENGINEERING CORP.

    Best Seller Machine W-GM-Series

    Improve the Space Efficiency by the Compact Design

    Highly Accurate Grinding by the Synchronized X Support Control

    Easy Operation by Touch Panel

    Automatic feed-back of processing result will be given

  • TOSEI AMERICA , Inc.

    ACCRETECH EUROPE

    TOSEI ENGINEERING Pvt.,Ltd

    TOSEI (Thailand) Co.,Ltd

    TOSEI MEASURING(PINGHU)CORP.

    PT TOSEI INDONESIA

    TOSEI KOREA Co.,Ltd

    TOSEI ENGINEERING CORP.

    TOSEI TAIWAN Co.,Ltd

    TOSEI BRAZIL ENGENHARIA E REPRESENTACAO COMERCIAL LTDA.

    TOSEI MEXICO SA DE CV.TOSEI PHILIPPINES CORP.

    Specification of W-GM-4200

    Basic SpecificationWafer Size 2 6 / 5 8Wafer Thickness 0.4 1.0mm (Standard)Wafer Type OFCF 2 (