Process log Status of working Monitor data during EP & Rinsing process Comparison of EP2

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Process log Status of working Monitor data during EP & Rinsing process Comparison of EP2 iod : 2011/4/19 ~ 4/21 cess : EP1(100μm, 50mA/cm 2 ), Normal 1 st Water Rinsing [90min], Degreasing (FM-20, 2%) [30min], HPR [6 hours] paration :Attachment to jigs kers : M. Sawabe, Kirk, M. Satoh (KEK), K. Nakamura, N. Tasaki, F. Tsukada (Assist Engineering Co. T. Okada (K-VAC), M. Asano, S. Imada, T. Yanagimachi (Nihon Advanced Technol Kirk 1 STF Cavity Group Meeting @2011/4/25 MHI#14 号号号 号号号 EP1

description

MHI#14 号機の2回目の EP1. Period : 2011/4/19 ~ 4/21 Process : EP1(100 μ m, 50mA/cm 2 ), Normal 1 st Water Rinsing [90min], Degreasing (FM-20, 2%) [30min], HPR [6 hours] Preparation :Attachment to jigs Workers : M. Sawabe, Kirk, M. Satoh (KEK), - PowerPoint PPT Presentation

Transcript of Process log Status of working Monitor data during EP & Rinsing process Comparison of EP2

Page 1: Process log  Status of working  Monitor data during EP & Rinsing process  Comparison of EP2

Process log Status of working Monitor data during EP & Rinsing process Comparison of EP2

Period : 2011/4/19 ~ 4/21Process : EP1(100μm, 50mA/cm2), Normal 1st Water Rinsing [90min],

Degreasing (FM-20, 2%) [30min], HPR [6 hours]Preparation :Attachment to jigsWorkers : M. Sawabe, Kirk, M. Satoh (KEK),

K. Nakamura, N. Tasaki, F. Tsukada (Assist Engineering Co.),T. Okada (K-VAC),M. Asano, S. Imada, T. Yanagimachi (Nihon Advanced Technology)

Kirk1STF Cavity Group Meeting

@2011/4/25

MHI#14号機の2回目のEP1

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• EP acid (4/20の EP1後のサンプルを使用 )• Nb ingredient : 9.6g/ℓ• HF ingredient : ? g/ℓ (全体 ?g/ℓの 65%が反応に使われる )• Al ingredient : 18mg/ℓ• Current density : ~ 50mA/cm2 (EP1の時は通常の電流密度で行う )

• Cavity surface temperature : <40℃• Control Voltage : 温度と電流密度を見ながら制御• With normal N2 gas flow during extracting EP acid (8ℓ/min)

• 1st water rinsing (1.5hour)• 10min (storing)/3min (flushing)で行う

• Degreasing (30min)• FM-20 (2%)

• HPR (~ 6 hours)• 28m (1 turn, w/o blind flanges)• 5h16m (6 turns, w/o blind flanges)STF Cavity Group Meeting

@2011/4/252

Condition of EP & Rinsing

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Process log ①

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4/19 9:00 MHI#14 is moved to EP area10:00 Check every flange [O.K.] (polishing HOM at input side)10:05 Attachment of jigs for EP10:30 HPR starts without cavity11:00 Meeting for tomorrow’s working procedure11:20 Set cavity to EP bed with crane11:25 Installation of cathode bar to cavity11:40 Set data logger to cavity (totally 12ch)

Leak check with N2 gas [O.K.]13:15 fin.

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STF Cavity Group Meeting @2011/4/25

4/20 8:35 Cavity rotation starts / EP acid flow starts 8:59 EP1 starts10:38 Alarm occurred due to low acid level in reservoir! @36.6μm

Stop current flow and acid flowIt was not recover even after pushing “Reset” button many timesCheck acid level meter in reservoir (dangerous working!)

11:02 EP acid flow restarts11:04 EP1 restarts (Set 65μm)13:58 EP1 stops [5h00m] / Idling rotation (3 rpm / 20min) / Plastic case detachment14:16 Idling rotation stops14:18 EP acid is removed from cavity with N2 gas flow(0.020MPa)14:32 First rinsing with ultra pure water starts16:02 First rinsing with ultra pure water stops [1h30m]16:11 Detachment of restriction jigs / Data logger detached16:25 Un-installation of cathode bar from cavity / washing cathode bar (No black mark)16:35 transferring cavity from EP bed to wagon16:58 Detachment of jigs for EP / Detaching every blind flange of teflon

/ Checking inside cavity (No mark) / Checking teflon surface (No mark)17:06 Shower rinsing @CP area17:15 Attachment of flanges for degreasing17:20 Supplying degreaser into cavity17:27 Degreasing with ultrasonic starts17:57 Degreasing with ultrasonic stops [30min]

Process log ②

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STF Cavity Group Meeting @2011/4/25

4/20 18:00 Detachment of flanges for degreasing18:15 Shower rinsing @CP area18:25 Transferring cavity from wagon on turntable for HPR using crane18:38 Checking tolerance between position of nozzle and center of beam pipe18:40 1st HPR for inside cavity starts19:08 1st HPR for inside cavity stops [0h28]19:10 fin

4/21 9:08 2nd HPR starts14:25 2nd HPR stops [5h17m] / Drying @HPR room

4/22 9:00 move MHI#14 to inspection room

4/25 9:00 optical inspection starts

Process log ③

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Status of working ①

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Status of working ②

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Status of working ③

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Status of working ④

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Status of working ⑤

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Status of working ⑥

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Status of 2nd EP1 for MHI#14 ①

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current

voltage

Tcavity

Treservoir

Troom

Tcavity

average current density EP1の場合は通常通り 50mA/cm2で行う。途中で2回ほどジャンプしているのは、電圧を 20V前後で調整していたことによる。

また、リザーバタンク内の液面計のトラブルに因り、20分ほどの中断があった。

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Status of 2nd EP1 for MHI#14 ②左図は平均電流密度と電圧の相関右図は定常状態での分布

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最近の EP1の定常状態の比較

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Cavity Mean temp. [℃]

R.M.S. temp. [℃]

Mean i [mA/cm2]

R.M.S. i [mA/cm2]

MHI#14 1st 30.9 0.5 47.0 1.7

MHI#15 1st 30.9 0.8 47.2 1.5

MHI#16 1st 32.8 1.2 46.3 1.5

MHI#17 1st 33.0 0.7 46.6 1.9

MHI#14 2nd 33.3 0.2 46.9 1.1

MHI#17の EP1の結果はドリフトの効果が大きい。

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Status of 2nd EP1 for MHI#14 ③

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#1 #2 #3 #4 #5 #6 #7 #8 #9 #10

EP1の間の空洞表面温度の状況。

#11

#12

Steady state: 38.5 35.1 34.5 32.4 34.3 20.4 30.8 33.7 32.3 37.0 35.4 11.3

テープが取れてしまった

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Status of 2nd EP1 for MHI#14 ④

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#1 #2 #3 #4 #5 #6 #7 #8 #9 #10

EP1の間の空洞表面温度の状況(前ページの最後の拡大図)。

#11

#12

テープが取れてしまった

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#1 #2 #3 #4 #5 #6 #7 #8 #9 #10 #11

#12

Status of UWR for MHI#14 ①

Steady state: 19.1 18.2 18.8 17.0 17.9 17.5 17.3 18.5 17.7 18.2 18.3 17.7

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一次洗浄中の空洞温度の状況(前ページの拡大図)

#1 #2 #3 #4 #5 #6 #7 #8 #9 #10 #11

#12

Status of UWR for MHI#14 ②

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Status of UWR for MHI#14 ③

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Status of HPR for MHI#14

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クリーンルーム作業を始めるために、クラス1000のフィルターのファンを入れたら、 TOCが徐々に上がっていった。