N-Channel 30-V (D-S) MOSFET - Vishay Intertechnology Siliconix Si4174DY New Product Document Number:...

Vishay SiliconixSi4174DY

New Product

Document Number: 68998S-82773-Rev. A, 17-Nov-08

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N-Channel 30-V (D-S) MOSFET

FEATURES • Halogen-free According to IEC 61249-2-21 • TrenchFET® Power MOSFET • 100 % Rg and UIS Tested

APPLICATIONS • Notebook CPU Core

- High-Side Switch

PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A)a Qg (Typ.)

300.0095 at VGS = 10 V 17

8 nC0.013 at VGS = 4.5 V 14.5

SO-8

S D

S D

S D

G D 5

6

7

8

Top View

2

3

4

1

Ordering Information: Si4174DY-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET

G

D

S

Notes:a. Based on TC = 25 °C.b. Surface Mounted on 1" x 1" FR4 board.c. t = 10 s. d. Maximum under Steady State conditions is 85 °C/W.

ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Limit Unit Drain-Source Voltage VDS 30

VGate-Source Voltage VGS ± 20

Continuous Drain Current (TJ = 150 °C)

TC = 25 °C

ID

17

A

TC = 70 °C 13.5TA = 25 °C 12b, c

TA = 70 °C 9.6b, c

Pulsed Drain Current IDM 50

Continuous Source-Drain Diode Current TC = 25 °C

IS4.5

TA = 25 °C 2.2b, c

Single Pulse Avalanche CurrentL = 0.1 mH

IAS 20

Avalanche Energy EAS 20 mJ

Maximum Power Dissipation

TC = 25 °C

PD

5

WTC = 70 °C 3.2TA = 25 °C 2.5b, c

TA = 70 °C 1.6b, c

Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C

THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit

Maximum Junction-to-Ambientb, d t ≤ 10 s RthJA 38 50°C/W

Maximum Junction-to-Foot (Drain) Steady State RthJF 20 25

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Notes:a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %b. Guaranteed by design, not subject to production testing.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operationof the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximumrating conditions for extended periods may affect device reliability.

SPECIFICATIONS TJ = 25 °C, unless otherwise notedParameter Symbol Test Conditions Min. Typ. Max. Unit

Static

Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = 250 µA 30 V

VDS Temperature Coefficient ΔVDS/TJID = 250 µA

34mV/°C

VGS(th) Temperature Coefficient ΔVGS(th)/TJ - 4.7

Gate-Source Threshold Voltage VGS(th) VDS = VGS , ID = 250 µA 1.0 2.2 V

Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA

Zero Gate Voltage Drain Current IDSSVDS = 30 V, VGS = 0 V 1

µAVDS = 30 V, VGS = 0 V, TJ = 55 °C 10

On-State Drain Currenta ID(on) VDS ≥ 5 V, VGS = 10 V 30 A

Drain-Source On-State Resistancea RDS(on)VGS = 10 V, ID = 10 A 0.0078 0.0095

ΩVGS = 4.5 V, ID = 7 A 0.0108 0.0130

Forward Transconductancea gfs VDS = 15 V, ID = 10 A 30 S

Dynamicb

Input Capacitance Ciss

VDS = 15 V, VGS = 0 V, f = 1 MHz

985

pFOutput Capacitance Coss 205

Reverse Transfer Capacitance Crss 76

Total Gate Charge Qg VDS = 15 V, VGS = 10 V, ID = 10 A 18 27

nCVDS = 15 V, VGS = 4.5 V, ID = 10 A

8 12

Gate-Source Charge Qgs 2.4

Gate-Drain Charge Qgd 2.3

Gate Resistance Rg f = 1 MHz 0.3 1.3 2.6 Ω

Turn-On Delay Time td(on)

VDD = 15 V, RL = 1.5 Ω ID ≅ 10 A, VGEN = 4.5 V, Rg = 1 Ω

14 25

ns

Rise Time tr 12 24

Turn-Off Delay Time td(off) 19 35

Fall Time tf 9 18

Turn-On Delay Time td(on)

VDD = 15 V, RL = 1.5 Ω ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω

8 16

Rise Time tr 10 20

Turn-Off Delay Time td(off) 16 30

Fall Time tf 9 18

Drain-Source Body Diode Characteristics

Continuous Source-Drain Diode Current IS TC = 25 °C 4.5A

Pulse Diode Forward Currenta ISM 50

Body Diode Voltage VSD IS = 3 A 0.76 1.1 V

Body Diode Reverse Recovery Time trr

IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C

14 28 ns

Body Diode Reverse Recovery Charge Qrr 5 10 nC

Reverse Recovery Fall Time ta 8ns

Reverse Recovery Rise Time tb 6


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TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted

Output Characteristics

On-Resistance vs. Drain Current and Gate Voltage

Gate Charge

0

10

20

30

40

50

0.0 0.5 1.0 1.5 2.0 2.5

VGS = 10 thru 4 V

VGS = 3 V

VDS - Drain-to-Source Voltage (V)

- D

rain

Cur

rent

(A)

I D

0.005

0.007

0.009

0.011

0.013

0.015

0 10 20 30 40 50

VGS = 10 V

VGS = 4.5 V

- O

n-R

esis

tanc

e(Ω

)R

DS

(on)

ID - Drain Current (A)

0

2

4

6

8

10

0.0 3.7 7.4 11.1 14.8 18.5

VDS = 20 V

ID = 10 A

VDS = 15 V

VDS = 10 V

- G

ate-

to-S

ourc

eV

olta

ge(V

)

Qg - Total Gate Charge (nC)

VG

S

Transfer Characteristics

Capacitance

On-Resistance vs. Junction Temperature

0.0

1.6

3.2

4.8

6.4

8.0

0 1 2 3 4 5

TC = 25 °C

TC = 125 °C

TC = - 55 °C

VGS - Gate-to-Source Voltage (V)

- D

rain

Cur

rent

(A)

I D

Crss

0

260

520

780

1040

1300

0 2.4 4.8 7.2 9.6 12

Ciss

Coss

VDS - Drain-to-Source Voltage (V)

C -

Cap

acita

nce

(pF

)

0.6

0.8

1.0

1.2

1.4

1.6

1.8

- 50 - 25 0 25 50 75 100 125 150

ID = 10 A

VGS = 4.5 V

VGS = 10 V

TJ - Junction Temperature (°C)

(Nor

mal

ized

)

- O

n-R

esis

tanc

eR

DS

(on)

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Source-Drain Diode Forward Voltage

Threshold Voltage

0.0 0.2 0.4 0.6 0.8 1.0 1.2

1

0.01

0.001

0.1

10

100

TJ = 150 °C

TJ = 25 °C

VSD - Source-to-Drain Voltage (V)

- S

ourc

eC

urre

nt(A

)I S

- 0.8

- 0.6

- 0.4

- 0.2

0

0.2

0.4

- 50 - 25 0 25 50 75 100 125 150

ID = 250 µA

ID = 5 mA

Var

ianc

e(V

)V

GS

(th)

TJ - Temperature (°C)

On-Resistance vs. Gate-to-Source Voltage

Single Pulse Power, Junction-to-Ambient

0.00

0.01

0.02

0.03

0.04

0.05

0 1 2 3 4 5 6 7 8 9 10

TJ = 25 °C

TJ = 125 °C

ID = 10 A

- O

n-R

esis

tanc

e(Ω

)R

DS

(on)

VGS - Gate-to-Source Voltage (V)

0

16

32

48

64

80

011100.0 0.01 0.1

Time (s)

Pow

er(W

)

Safe Operating Area, Junction-to-Ambient

100

1

0.1 1 10 1000.01

10

0.1TA = 25 °C

Single Pulse

1 s10 s

Limited by RDS(on)*

BVDSS Limited

1 ms

10 ms

100 ms

DC

VDS - Drain-to-Source Voltage (V)* VGS > minimum VGS at which RDS(on) is specified

-D

rain

Cur

rent

(A)

I D


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* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upperdissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the packagelimit.

Current Derating*

0

4

8

12

16

20

0 25 50 75 100 125 150

TC - Case Temperature (°C)

I D-

Dra

inC

urre

nt(A

)

Power, Junction-to-Ambient

0.0

1.2

2.4

3.6

4.8

6.0

0 25 50 75 100 125 150

TC - Case Temperature (°C)

Pow

er(W

)

Power Derating, Junction-to-Foot

0.0

0.4

0.8

1.2

1.6

2.0

0 25 50 75 100 125 150

TA - Ambient Temperature (°C)

Pow

er(W

)

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Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for SiliconTechnology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, andreliability data, see http://www.vishay.com/ppg?68998.

Normalized Thermal Transient Impedance, Junction-to-Ambient

0.2

0.1

t1t2

Notes:

PDM

1. Duty Cycle, D =

2. Per Unit Base = RthJA = 85 °C/W

3. TJM - TA = PDMZthJA(t)

t1t2

4. Surface Mounted

Duty Cycle = 0.5

Single Pulse

0.02

0.05

10-3 10-2 1 10 100010-110-4 100

Square Wave Pulse Duration (s)

Nor

mal

ized

Effe

ctiv

eTr

ansi

ent

The

rmal

Impe

danc

e

0.1

0.01

1

Normalized Thermal Transient Impedance, Junction-to-Foot

10-3 10-2 01110-110-4

0.2

0.1

Duty Cycle = 0.5

Square Wave Pulse Duration (s)

Nor

mal

ized

Effe

ctiv

eTr

ansi

ent

The

rmal

Impe

danc

e

1

0.1

0.01

0.05

0.02

Single Pulse

Vishay SiliconixPackage Information

Document Number: 7119211-Sep-06

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DIMMILLIMETERS INCHES

Min Max Min Max

A 1.35 1.75 0.053 0.069

A1 0.10 0.20 0.004 0.008

B 0.35 0.51 0.014 0.020

C 0.19 0.25 0.0075 0.010

D 4.80 5.00 0.189 0.196

E 3.80 4.00 0.150 0.157

e 1.27 BSC 0.050 BSC

H 5.80 6.20 0.228 0.244

h 0.25 0.50 0.010 0.020

L 0.50 0.93 0.020 0.037

q 0° 8° 0° 8°

S 0.44 0.64 0.018 0.026

ECN: C-06527-Rev. I, 11-Sep-06DWG: 5498

431 2

568 7

HE

h x 45

C

All Leads

q 0.101 mm

0.004"LB A1

A

e

D

0.25 mm (Gage Plane)

SOIC (NARROW): 8-LEADJEDEC Part Number: MS-012

S

Application Note 826Vishay Siliconix

www.vishay.com Document Number: 7260622 Revision: 21-Jan-08

A

PP

LIC

AT

ION

NO

TE

RECOMMENDED MINIMUM PADS FOR SO-8

0.24

6

(6.2

48)

Recommended Minimum PadsDimensions in Inches/(mm)

0.172

(4.369)

0.15

2

(3.8

61)

0.04

7

(1.1

94)

0.028

(0.711)

0.050

(1.270)

0.022

(0.559)

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Revision: 08-Feb-17 1 Document Number: 91000

DisclaimerALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

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N-Channel 30-V (D-S) MOSFET - Vishay Intertechnology Siliconix Si4174DY New Product Document Number:...

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