Le87502 PLC Dual Channel Line Driver Line Driver BD870 Series
Traction InverterL9502B / L9502 Isolated Gate Driver for Traction Inverter 5 • 15A driver...
Transcript of Traction InverterL9502B / L9502 Isolated Gate Driver for Traction Inverter 5 • 15A driver...
![Page 1: Traction InverterL9502B / L9502 Isolated Gate Driver for Traction Inverter 5 • 15A driver sink/source current capability • Miller clamp • Advanced Diagnostic and Protection •](https://reader030.fdocument.org/reader030/viewer/2022033118/5ed7cecd8e533201dc4ada7b/html5/thumbnails/1.jpg)
Traction Inverter
ST New Solutions
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System Block diagram 2
• SPC58NN
• GTM V3 for fully programmable and flexible
timer system designed to unload the CPU
• SAR ADC & Σ-Δ ADC support Software
Resolver in evaluation
• SBC L9396
• Multiple Power Supply IC
• SIC/ IGBT
• 750V SiC MOSFETs
Gen 2 High Voltage Product Family
• 1200V SiC MOSFETs
Gen 2 High Voltage High Performance
Product
• L9502
• Single isolated Gate Driver (6kV)for TRACTION
With protection, diagnostics and communication
• Designed for ISO26262 compliance
• Kit Solution approach
LVBAT
VCUVoltage
regulator
Power supply protection
Can interface
Analog input
SPC58
VDD-HSVDD-LS
SPIINTWDIRST
ERROR
Driver temp*3Phase current UVW
Power supply
protectionHVBAT
ASC
SPI
Gate signal
Motor temp
Currentsensor
Over current protection
Voc
Vref
Buffercircuit
Exc+Exc-
S1S2S3S4
HV
conn
ecto
r
U V W
Supplymonitor
VB
STV
CC
VC
C5
VP
RE
RE
G
VCORE
VCC5
VDD30VCC
VCC
Isolate
Low voltage
High voltage
Boost
L9396
Flyback
Three-phase bridgeSIC Mosfet & IGBT
InverterTemp
Sensor
Tsen
Gate signal
VDD-HSVDD-LS
Resolver & Temp sensor
conn
ector
L9502*6Capacitive Isolation
Phase current UVW
Isen
Digital input Air bagASC
VDD30
M
HV
conn
ecto
r
conn
ector
Ain
FSNASC
Backup PowerBrake
DISADC_OUT
AD
C_O
UT
H-bridge
VNHD7008
/
VNHD7012
Parking locker
IGBT: STGYA120M65DF2AG/
STG200M65F2D8AG
SiC module: ADP86012W2/ ADP50075W2
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ST Automotive Microcontroller 10.03.2020
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Debug
JTAG
Nexus
Memory Protection Unit
Crossbar Switch
6M
4x 64k
FLASH
64K
SRAM
3*
LIN
Fle
x
4*D
SP
I
1* SENT
45
*DS
PI
49
* L
INF
lex
MEMU
64K
SRAM
HSM
1* PSI5
ASILDSEooC
1* SENT
4*
CA
N-F
D
4*
MC
AN
1* PSI5
Product / Application Specific Memory ConnectivitySystem / Platform
supervisor
˙˙˙
ADC2xSAR12
1xSAR10
3xΣΔ
˙˙˙
ADC2xSAR12
1xSAR10
3xΣΔ
1 * PIT 1 * PIT CRCCRC TSENS
INTCPower Architecture™
e200z4d
VLE
INTC
STM
SWT
16k-i
Cache
FPU
CMPU
128k-dTCM
STM
SWT
128k-dTCM
32k-iTCM
32k-iTCMLSP
Power Architecture™
e200z4d
16k-i
Cache
CMPU
8k-d
Cache
VLE FPU
Periph.
Bridge
Memory Protection Unit
Crossbar Switch
1* PSI5-S
FMPLL
IRC
x21 LS
GTM48x IC
96x OC
5x MCS
1*
Eth
ern
et
Zip
wir
e
SIP
I
32
eD
MA
1*F
lexR
ay
64
eD
MA
Periph.
Bridge
Cal Bus
1*I
2C
Core
• 3x 200 MHz Power Architecture™ ISA e200z4d Core (VLE)• Dual Issue Core with Floating Point Unit &
LSP(DSP)• 3x (16k-Instruction Cache, 8k-Data
Cache)• 3x (32k Local i-RAM, 128k Local d-RAM) • 2x Lock Step configuration
Memory
• 6M byte RWW Flash with ECC • +4x64k+2x16k Data Flash with ECC
• 512k RAM (128k SRAM, 384k Local d-RAM) with ECC• +61k SRAM on Timer Module• +32k Overlay RAM
I/O
• Generic Timer Module (High-End Version)
• Dual Channel FlexRay (10MB/s), 128 buffers
• 7 x (FD)M-CAN, 1 x (FD)M-TTCAN
• 7 x LINFlex, 8 x DSPI including 2 x μSB
• 1 x Ethernet, 1 x I2C
• 15 x SENT, 2 x PSI5, 1 x PSI5-S
• 61/84 channel ADC (QFP176/BGA292)• 4 SAR ADC, 12-bit, TUE ±4LSB• 1 Supervisor ADC, 12-bit, TUE ±4LSB• 3 SAR ADC, 10-bit, TUE ±1.5LSB• 6 Σ-Δ ADC with OSR x32-64
System
• Security Module (HSM)
• FM-PLL
• MPU
• AMU
• 96 Channel eDMA Controller
• 2 x CRC Unit
• Fault Collection & Control Unit (incl. error pin)
• 8 x PIT
• 1x LFAST (Interprocessor bus)
• Nexus Class 3+
• EBI only for Calibration (High speed debug interface)
• Designed for eLQFP176, LFBGA292 and KGD
8k-d
Cache
LSP
FCCU
ADCQ
SPC58 xN - BerninaSuperset Block Diagram
Qualified
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FAULT
WDTDIS
Voltage
Monitor
Wake-up
Monitor
IGN
Boost
Controller
9V
300mA
2MHzGNDBST
BSTSW
VBG
VBM
VBST
CPCharge Pump
GN
DA
ResetRESET
GN
D1
Control & Logic
Blocks
SPI
Ctrl/
Status
Reg.
Temp
Mon
Oper
Modes
Fail-
Safe OpFSN
WD
CSN
SDISDO
CLK
Int. analog
3V3 supply
Int. digital
3V3 supply
POR &
Osc.
Buck
6.5V / 7.2V
1000mA
465KHz
BCKSW
VPREREG
LDO VCC5
5.0V
250mA VCC5
LDO VCC
3.3V / 5.0V
100mA VCC
VCCSEL
VCORE
0.8V / 3.3V
1000mA
Buck w/ext FET
500mA
Lin w/ext. FET
VCOREFDBK
Fail Safe
FET
HS predr
Pump Motor FET
HS+LS pre driver
(PWM control)
PD
S
VDBATTWSS / TrackRegRSU0H/L
WS
O0
WS
O1
WS
O2
WS
O3
AI[0..4]
HV Mux +
ADC Converter
Battery protected
switch
VB VB_SW
Decoding
GCORE
VC1 VC2
PD
G
VDSVDG
SCORE
System
Voltages
LS GPO driver
(PWM control)
GPOD0
Voltage
regulation
Motor turn
counter in Low
Power Mode
VC3 VC4
I_CORE_SH
I_CORE_SL
VCORE
PRN
RSU1H/LRSU2H/LRSU3H/L
PR
S
PR
G
PR
I
PD
I PDBATT
• Boost Converter, 9V, up to 0.3A - 2MHz with spread spectrum
• Buck Converter, 6.5V/7.2V, up to 1.0A – 465KHz with spread
spectrum
• LDO VCC5 (5V +/-2%, 250mA), LDO VCC (3.3V / 5V +/-2%,
100mA), VCORE (0.8V / 5V +/-2% - µC core supply, max
1000mA in switching mode, max 750mA in linear mode)
• 4 WSS regulated interface /2 tracking regulators (120mA)
• Integrated 10-bit ADC
• HS pre-drivers for fail safe relay and for motor pump
• Configurable Watchdog (Time-out / Window / Periods) &
configurable Fail-Safe Functionality
• Fail-Safe Output (FSN), Wake-up input
• Voltage monitoring UV/OV on all regulated rails
• Temp. monitoring and Thermal Shutdown
• Commercial samples : available
• In production
Technical information
Timing information
Key Value• Designed for ISO26262 compliance
• Flexible solution to 3 configurable voltage rails
• Boost - Buck topology for low battery functionality for Start/Stop systems
• BOM selection optimized on output current needs
• Low emission design
TQFP64EP
Application Note
Demo board w/ GUI
Safety Manual
FMEDA / DFA
Automotive Multiple Power Supply IC
SBC L9396
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L9502B / L9502Isolated Gate Driver for Traction Inverter
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• 15A driver sink/source current capability
• Miller clamp
• Advanced Diagnostic and Protection
• 10-bit A/D Converter with 2 exteranl inputs
• BRAKE pin with programmable safe state
• 5MHz SPI interface with enhanced safety
• Output flyabck voltage 23V (-5V 18V; -8V 15V) on L9502
Single channel isolated gate driver
AEC-Q100 Grade 1
ASIL D systems ready
6kV galvanic isolation
Flyback controller on L9502
IGBT
In development
Is
ol
at
io
n
Driver Controller
(Flyback Contr.)
Gate
driver
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VIPowerTM H-Bridges Solution for High Power
VNHD7008AY / VNHD7012AY
• Optimized Standby current
• PWM operations up to 20kHz
• Tailored and compact full bridges in combination with latest
dual-channel F7 technology PowerMOS
• STL64DN4F7AG 8mΩmax
• STL76DN4LF7AG 6mΩmax
• Charge Pump Out for reverse polarity protection
• Drain and Source voltage Monitoring of external PMOSFETs
• Gate Slope Control throgut external Resistor To Optimize
EMI
• PSSO36 Package
Improved Performance
VDS
Monitor
INX PWM SELx MultiSense MS_EN
Vcc clamp
Undervoltage
Logic, Diagnostic and Protections
Power Limitation
HS Over Temperature
HS Current Limit
Short circuit protection
Vcc
Monitor
OFF state
Outputs Monitoring
KSOURCE_LSA
OUT A OUT_B
HS_B
Tchip MonitorCurrent
Sense
Gate
Driver
Gate
Driver
MUX
VREGVREGCPCharge
Pump
GATE LSA GATE_LSB
GND
VREF_OVL
_LSA
VDS
Monitor
KSOURCE_LSB
VREF_OVL_
LSB
HS_A
VccVbatt
Gate
Driver
Gate
Driver
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Power & Discrete Group (PDG) Wide Power Product Portfolio
7
From Discrete to Power Modules, ST leads the innovation
Typical Power: 3 kW ÷ > 30 kW
ACEPACK™ Power ModulesSLLIMM™ IPM
Typical Power: 20 W ÷ 3 kW
Discrete & Drivers & SIP
Typical Power: 10 W ÷ 10 kW
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ACEPACK™ modulesAdaptable, Compact and Easier PACKage
• 100% controlled by ST for silicon
(SiC, MOSFET, IGBT and Diodes)
• Compact design and cost-effective system
approach for a plug & play system solution
• Configuration flexibility
• 2500Vrms electrical isolation
1 & 2
SMIT
DRIVE
• 100% controlled by ST for silicon
(SiC, MOSFET, IGBT and Diodes)
• 2500Vrms electrical isolation
• SMD assembly
• Top side cooling
• Low thermal resistance
• 750 - 1200V SiC MOSFET based switch
• Improved light load power losses for extended
EV driving ranges
• AMB frame for better thermal dissipation
• 3 different lead configuration options
• Extreme low conduction losses
• Direct Cooled Cu Base Plate with pin fins
• CIB
• Six-pack
• Three level Boost
• ….
• Bridge rectifier
• Half Bridge
• Boost
• ….
• Six-pack
ConfigurationsKey featuresOutlook Target ApplicationsACEPACK
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ACEPACK DRIVEDirect liquid cooled high performance power module
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Traction inverter for (H)EV, Trucks, Bus
Press FIT connections for high reliable and long lasting connection
SiC-MOSFET based, 750V and 1200V
Pin-fin for direct cooling
Dedicated NTC for each single substrate
Unequalled RDS(on)
ACEPACKTM DRIVE
Internal layout optimized for minimized stray inductace
High reliability and robustness: Dice sintered to substrate
Different bus bar available to fit welding or screwing connection methods.
AMB substrates for better thermal managment
Incredible high power density
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• Multi Sintering Package: STPAK™
• Very good thermal resistance, no TIM material needed
• Very high current capability
• Top Side Cooling Package: ACEPACK™ SMIT
• Customazible and versatile insulated power module
• In both cases several devices in parallel has to be connecteed to realize an high power system
• connections introduces stray inductance which will limit speed• Inverter room occupation will increase accordingly
• ACEPACK DRIVE
• Represents an easy-to-use solutions, with direct coolign thanks to pin-fin structure integrated in base plate
• Several device are connected in parallel in the same substrate, minimizing stray inductances and boosting speed capabilities
• Thanks to small footprint, power module can be easily integrated in motor chassis
• No soldering or sintering needed, improved manufacturability:
• Press fit avoids soldering process
• Need only to be screwed onto a waterjacked for liquid cooling
• Differnt bus bar options for final used convenience, compatible wiht Hall-effect current
• Sintering needed to get best thermal perfomances
• PCB must be designed to deal with very high current level
ST solutions for traction inverterFrom scalable solutions to ACEPACK DRIVE
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ACEPACK DRIVE case selection 11
Possibility to use an Hall-current sensor thanks to longer tabs
AC bus bar to be welded to motor connections
Long tab optionShort tab option Long tab w/o AC bar holes
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1200V Si based
HybridPACKTM2 (*)
Gen 2 SiC 1200V
AMB Si3N4
including coming Gen 3
1200V SiC MOSFET
120kW(240kWpeak)
160kW
(320kWpeak)
Topology: Three phase inverter
DC-link : 750Vdc
PWM Strategy: Bipolar
Switching frequency: 12kHz
TJ < 80% of Tjmax at any condition
Peak Power for 10 sec
MI = 1, Cos(phi) = 0.8
Tfluid = 70°C
85kW(170kWpeak)
Power
Six-pack Module at 750V DC-link1200V Si IGBT vs. SiC MOSFET
(*) HybridPACK 2 is 30% bigger than ACEPACK DRIVE
600mm2 IGBT+Diode each switch
ACEPACK™ DRIVE
2 times higher power with the first Silicon Carbide
module version based on SiC MOSFET Gen 3
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ACEPACK™ DRIVE