QUALIFICATION REPORT RELIABILITY LABORATORY

PCN #: IIRA-15VSSG404

Date August 25, 2014

Qualification of HR-5104 die attach film for 24AA1025,

24AA1026, 24FC1025, 24FC1026, 24LC1025 and 24LC1026 device families in the 8L PDIP package at NSEB (UTL)

assembly site

Distribution

Somnuek T. Rangsun K. V.Danginis A. Navarro Wichai K. J. Fernandez Supakorn L. S. Kelsall S. Iliev

Microchip Technology (Thailand) Co., Ltd. 14 Moo 1 T.Wangtakien A. Muangchacherngsao, Chacherngsao, Thailand, 24000 Tel. (+66 38) 857119-45, 857311-19 ext. 1231 Fax (+66 38) 857149-50

PACKAGE QUALIFICATION REPORT

Purpose Qualification of HR-5104 die attach film for 24AA1025, 24AA1026, 24FC1025,

24FC1026, 24LC1025 and 24LC1026 device families in the 8L PDIP package at NSEB (UTL) assembly site

CN BC140583

QUAL ID Q14075

MP CODE 360037C4XB00

Part No. 24AA1025-I/P

Bonding No. BDE-002613 Rev. 02

CCB No.: 1397.02

Package

Type 8L PDIP

Package size 300 mils

Die thickness 8 mils top/ 8 mils bottom / 8 mils spacer

Die size 114.3 x 109.5 mils

Lead frame:

Paddle size: 160x185mils

Manufacturer ASM

Material C194

Surface no treatment

Paddle plating Ag spot

Process Etched

Lead Lock Yes

Part Number FB0071

Strip dimensions 9.440x2.756

Die attach material

Wire Au wire

Part Number HR-5104

Manufacturer Hitachi

Conductive No

Mold Compound:

Part Number G600

Manufacturer Sumitomo

Plating Composition Matte Tin

PACKAGE QUALIFICATION REPORT

Manufacturing Information

Result Χ Pass Fail

8L PDIP (.300”) assembled by UTL (NSEB) pass reliability test per QCI-39000.

Prepared By: Date: August 25, 2014 (Sr.Reliability Engineer)

(Mr.Udom Suksansakul)

Approved By: Date: August 25, 2014 (Reliability Manager)

(Mr. Somnuek Thongprasert)

Assembly Lot No . Wafer Lot No. Date Code

NSEB150501007.000 GRSM414323296.160 1418HU6

NSEB150600883.000 GRSM414323296.160 1419HU9

NSEB150600884.000 GRSM414323296.160 1419HUA

PACKAGE QUALIFICATION REPORT Test Number (Reference)

Test Condition Standard/

Method

Qty. (Acc.)

Def/SS. Result Remarks

Electrical Test Electrical Test:+25°C and 85°C System: NEXTEST_PT

JESD22-A113

693(0) 693 Good Devices

Temp Cycle

Stress Condition: -65°C to +150°C, 500 Cycles System : TABAI ESPEC TSA-70H

JESD22-A104

231

Electrical Test: + 85°C

System: NEXTEST_PT

231(0)

0/231 Pass 77 units / lot

Bond Strength: Wire Pull (> 4.0 grams) Bond Shear (18.00 grams)

15 (0)

15 (0)

0/15

0/15

Pass

Pass

UNBIASED-HAST

Stress Condition: +130°C/85%RH, 96 hrs. System: HAST 6000X

JESD22-A118

231

Electrical Test: +25°C System: NEXTEST_PT

231(0) 0/231 Pass 77 units / lot

HAST

Stress Condition: +130°C/85%RH, 96 hrs. Bias Volt: 5.5 Volts System: HAST 6000X

JESD22-A110

231

Electrical Test:+25°C and 85°C System: NEXTEST_PT

231(0) 0/231 Pass 77 units / lot

High Temperature Storage Life

Stress Condition: Bake 175°C, 504 hrs System: SHEL LAB

JESD22-A103

45

45 units

Electrical Test :+25°C and 85°C System: NEXTEST_PT

45(0) 0/45 Pass

PACKAGE QUALIFICATION REPORT Test Number (Reference)

Test Condition Standard/

Method

Qty. (Acc.)

Def/SS. Result Remarks

Bond Line Thickness

Bond Line Thickness SPI-45528 15(0) 15(0) Pass 5 units / lot

Physical

Dimensions

Physical Dimension,

30 units from 1 lot

JESD22-B100/B108

30(0) Units

0/30 Pass

Bond Strength

Data Assembly

Wire Pull (> 4.0 grams)

M2011

JESD22-B116

30 (0) Wires

0/30

Pass

Bond Shear (18.00 grams)

30 (0) bonds

0/30

Pass