P-Channel 30-V (D-S) MOSFET - Elcodisdatasheet.elcodis.com/pdf2/99/13/991339/si3457cdv.pdf ·...
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Vishay SiliconixSi3457CDV
Document Number: 68602S09-0131-Rev. B, 02-Feb-09
www.vishay.com1
New Product
P-Channel 30-V (D-S) MOSFET
FEATURES • Halogen-free According to IEC 61249-2-21
Available • TrenchFET® Power MOSFET
APPLICATIONS • Load Switch
PRODUCT SUMMARY VDS (V) RDS(on) (Ω) ID (A)a Qg (Typ.)
- 300.074 at VGS = - 10 V - 5.1
5.1 nC0.113 at VGS = - 4.5 V - 4.1
(4) S
(3) G
(1, 2, 5, 6) D
TSOP-6Top View
6
4
1
2
3
5
Ordering Information: Si3457CDV-T1-E3 (Lead (Pb)-free)Si3457CDV-T1-GE3 (Lead (Pb)-free and Halogen-free) P-Channel MOSFET
3 mm
2.85 mm
Marking Code
AT XXXLot Traceabilityand Date Code
Part # Code
Notes:a. Based on TC = 25 °C.b. Surface Mounted on 1" x 1" FR4 board.c. t = 5 s. d. Maximum under Steady State conditions is 110 °C/W.
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise notedParameter Symbol Limit Unit Drain-Source Voltage VDS - 30
VGate-Source Voltage VGS ± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
ID
- 5.1
A
TC = 70 °C - 4.1TA = 25 °C - 4.1b, c
TA = 70 °C - 3.3b, c
Pulsed Drain Current IDM - 20
Continuous Source-Drain Diode Current TC = 25 °C
IS- 2.5
TA = 25 °C - 1.67b, c
Maximum Power Dissipation
TC = 25 °C
PD
3.0
WTC = 70 °C 2.0TA = 25 °C 2.0b, c
TA = 70 °C 1.3b, c
Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C
THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambientb, d t ≤ 5 s RthJA 55 62.5°C/W
Maximum Junction-to-Foot (Drain) Steady State RthJF 34 41
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Document Number: 68602S09-0131-Rev. B, 02-Feb-09
Vishay SiliconixSi3457CDV
New Product
Notes:a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operationof the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximumrating conditions for extended periods may affect device reliability.
SPECIFICATIONS TJ = 25 °C, unless otherwise notedParameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = - 250 µA - 30 V
VDS Temperature Coefficient ΔVDS/TJID = - 250 µA
- 31mV/°C
VGS(th) Temperature Coefficient ΔVGS(th)/TJ 4.5
Gate-Source Threshold Voltage VGS(th) VDS = VGS, ID = - 250 µA - 1.0 - 3.0 V
Gate-Source Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA
Zero Gate Voltage Drain Current IDSSVDS = - 30 V, VGS = 0 V - 1
µAVDS = - 30 V, VGS = 0 V, TJ = 55 °C - 10
On-State Drain Currenta ID(on) VDS ≤ - 5 V, VGS = - 10 V - 20 A
Drain-Source On-State Resistancea RDS(on)VGS = - 10 V, ID = - 4.1 A 0.060 0.074
ΩVGS = - 4.5 V, ID = - 1.0 A 0.092 0.113
Forward Transconductancea gfs VDS = - 15 V, ID = - 4.1 A 8 S
Dynamicb
Input Capacitance Ciss
VDS = - 15 V, VGS = 0 V, f = 1 MHz
450
pFOutput Capacitance Coss 80
Reverse Transfer Capacitance Crss 63
Total Gate Charge Qg VDS = - 15 V, VGS = - 10 V, ID = - 4.1 A 10 15
nCVDS = - 15 V, VGS = - 4.5 V, ID = - 4.1 A
5.1 8
Gate-Source Charge Qgs 1.8
Gate-Drain Charge Qgd 2.5
Gate Resistance Rg f = 1 MHz 7 Ω
Turn-On Delay Time td(on)
VDD = - 15 V, RL = 4.6 Ω ID ≅ - 3.3 A, VGEN = - 4.5 V, Rg = 1 Ω
40 60
ns
Rise Time tr 80 120
Turn-Off Delay Time td(off) 20 30
Fall Time tf 12 20
Turn-On Delay Time td(on)
VDD = - 15 V, RL = 4.6 Ω ID ≅ - 3.3 A, VGEN = - 10 V, Rg = 1 Ω
5 10
Rise Time tr 13 20
Turn-Off Delay Time td(off) 20 30
Fall Time tf 10 15
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current IS TC = 25 °C - 2.5A
Pulse Diode Forward Currenta ISM - 20
Body Diode Voltage VSD IS = - 3.3 A - 0.8 - 1.2 V
Body Diode Reverse Recovery Time trr
IF = - 3.3 A, di/dt = 100 A/µs, TJ = 25 °C
20 30 ns
Body Diode Reverse Recovery Charge Qrr 20 30 nC
Reverse Recovery Fall Time ta 14ns
Reverse Recovery Rise Time tb 6
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Document Number: 68602S09-0131-Rev. B, 02-Feb-09
www.vishay.com3
Vishay SiliconixSi3457CDV
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
4
8
12
16
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0
VDS - Drain-to-Source Voltage (V)
I D -
Dra
in C
urre
nt (
A)
VGS = 10 thru 5 V
VGS = 3 V
VGS = 4 V
VGS = 2 V
0.00
0.04
0.08
0.12
0.16
0.20
0 4 8 12 16 20
- O
n-R
esis
tanc
e (Ω
)R
DS
(on)
ID - Drain Current (A)
VGS = 10 V
VGS = 4.5 V
0
2
4
6
8
10
0 2 4 6 8 10 12
ID = 4.1 A
- G
ate-
to-S
ourc
e V
olta
ge (
V)
Qg - Total Gate Charge (nC)
VG
S
VDS = 24 V
VDS = 15 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
1
2
3
4
5
0 1 2 3 4
VGS - Gate-to-Source Voltage (V)
I D -
Dra
in C
urre
nt (
A)
TC = 125 °C
TC = 25 °C
TC = - 55 °C
Crss
0
200
400
600
800
0 5 10 15 20 25 30
Ciss
VDS - Drain-to-Source Voltage (V)
C -
Cap
acita
nce
(pF
)
Coss
0.6
0.8
1.0
1.2
1.4
1.6
- 50 - 25 0 25 50 75 100 125 150
TJ - Junction Temperature (°C)
(Nor
mal
ized
)-
On-
Res
ista
nce
RD
S(o
n)
VGS = 10 V, ID = 4.1 V
VGS = 4.5 V, ID = 4.1 A
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Document Number: 68602S09-0131-Rev. B, 02-Feb-09
Vishay SiliconixSi3457CDV
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Source-Drain Diode Forward Voltage
Threshold Voltage
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
TJ = 150 °C
10
VSD - Source-to-Drain Voltage (V)
I S -
Sou
rce
Cur
rent
(A
)
1
100
TJ = 25 °C
1.2
1.4
1.6
1.8
2.0
2.2
- 50 - 25 0 25 50 75 100 125 150
ID = 250 µA
V
(V
)G
S(t
h)
TJ - Temperature (°C)
On-Resistance vs. Gate-to-Source Voltage
Single Pulse Power
0.00
0.05
0.10
0.15
0.20
0.25
0 2 4 6 8 10
- O
n-R
esis
tanc
e (Ω
)R
DS
(on)
VGS - Gate-to-Source Voltage (V)
TJ = 25 °C
TJ = 125 °C
ID = 4.1 A
0
5
10
15
20
25P
ower
(W)
Time (s)
10 10000.10.010.001 1001
Safe Operating Area
VDS - Drain-to-Source Voltage (V)
* VGS minimum VGS at which RDS(on) is specified
100
1
0.1 1 10 1000.01
10
I D -
Dra
in C
urre
nt (
A)
0.1
TA = 25 °CSingle Pulse
1 ms
10 ms
Limited by RDS(on)*
BVDSSLimited
100 µs
100 ms
DC
1s, 10 s
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Document Number: 68602S09-0131-Rev. B, 02-Feb-09
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Vishay SiliconixSi3457CDV
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upperdissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the packagelimit.
Current Derating*
0
1
2
3
4
5
0 25 50 75 100 125 150
TC - Case Temperature (°C)
6
I D -
Dra
in C
urre
nt (
A)
Power, Junction-to-Foot
0
1
2
3
4
25 50 75 100 125 150
TC - Case Temperature (°C)
Pow
er (
W)
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Document Number: 68602S09-0131-Rev. B, 02-Feb-09
Vishay SiliconixSi3457CDV
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for SiliconTechnology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, andreliability data, see www.vishay.com/ppg?68602.
Normalized Thermal Transient Impedance, Junction-to-Ambient
10-3 10-2 1 10 100010-110-4 100
0.2
0.1
0.05
Square Wave Pulse Duration (s)
Nor
mal
ized
Effe
ctiv
eTr
ansi
ent
The
rmal
Impe
danc
e
1
0.1
0.01
t1t2
Notes:
PDM
1. Duty Cycle, D =
2. Per Unit Base = RthJA = 90 °C/W
3. TJM - TA = PDMZthJA(t)
t1t2
4. Surface Mounted
Duty Cycle = 0.5
0.02
Single Pulse
Normalized Thermal Transient Impedance, Junction-to-Foot
10-3 10-2 01110-110-4
0.2
0.1
Duty Cycle = 0.5
Square Wave Pulse Duration (s)
Nor
mal
ized
Effe
ctiv
eTr
ansi
ent
The
rmal
Impe
danc
e
1
0.1
0.01
Single Pulse
0.02
0.05
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Document Number: 91000 www.vishay.comRevision: 18-Jul-08 1
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All product specifications and data are subject to change without notice.
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