P-Channel QFET MOSFET Description · ©2000 Fairchild Semiconductor Corporation FQP4P40 Rev. C0 3...

November 2013

Thermal Characteristics

FQP4P40P-Channel QFET® MOSFET-400 V, -3.5 A, 3.1 Ω

Description

©2000 Fairchild Semiconductor Corporation FQP4P40 Rev. C0

www.fairchildsemi.com1

FQP4P40 —

P-Channel Q

FET® M

OSFET

This P-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor’s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, audio amplifier, DC motor control, and variable switching power applications.

Features• -3.5 A, -400 V, RDS(on) = 3.1 Ω (Max.) @ VGS = -10 V,

ID = -1.75 A

• Low Gate Charge (Typ. 18 nC)

• Low Crss (Typ. 11 pF)

• 100% Avalanche Tested

Absolute Maximum Ratings TC = 25°C unless otherwise noted.

FQP4P40

+θ Thermal Resistance, Junction-to-Case, Max. 1.47 6?

+θ Thermal Resistance, Junction-to-Ambient, Max. -' & 6?

TO-220

GDS

G

S

D

Symbol Parameter FQP4P40 Unit

VDSS Drain-Source Voltage -400 V

ID Drain Current -3.5 A- Continuous (TC = 25°C)

- Continuous (TC = 100°C) -2.2 A

IDM Drain Current - Pulsed (Note 1) -14 A

VGSS Gate-Source Voltage ± 30 V

EAS Single Pulsed Avalanche Energy (Note 2) 260 mJ

IAR Avalanche Current (Note 1) -3.5 A

EAR Repetitive Avalanche Energy (Note 1) 8.5 mJ

dv/dt Peak Diode Recovery dv/dt (Note 3) -4.5 V/ns

PD Power Dissipation (TC = 25°C) 85 W

- Derate above 25°C 0.68 W/°C

TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C

TLMaximum lead temperature for soldering, 1/8" from case for 5 seconds

300 °C

Package Marking and Ordering Information



FQP4P40 —

P-Channel Q

FET® M

OSFET

Electrical Characteristics TC = 25°C unless otherwise noted.

1. Repetitive rating : pulse-width limited by maximum junction temperature.2. L = 37 mH, IAS = -3.5 A, VDD = -50 V, RG = 25 Ω, starting TJ = 25°C.3. ISD ≤ -3.5 A, di/dt ≤ 200 A/µs , VDD ≤ BVDSS, starting TJ = 25°C.4. Essentially independent of operating temperature.

Notes:

Part Number Top Mark Package Reel Size Tape Width QuantityFQP4P40FQP4P40 TO-220 N/A N/A 50 units

Packing MethodTube

( N ote 4)

( Note 4)

Symbol Parameter Test Conditions Min. Typ. Max. Unit

Off CharacteristicsBVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = -250 µA -400 -- -- V

∆BVDSS

/ ∆TJ

Breakdown Voltage Temperature Coefficient

ID = -250 µA, Referenced to 25°C -- 0.36 -- V/°C

IDSSZero Gate Voltage Drain Current

VDS = -400 V, VGS = 0 V -- -- -1 µA

VDS = -320 V, TC = 125°C -- -- -10 µA

IGSSF Gate-Body Leakage Current, Forward VGS = -30 V, VDS = 0 V -- -- -100 nA

IGSSR Gate-Body Leakage Current, Reverse VGS = 30 V, VDS = 0 V -- -- 100 nA

On Characteristics VGS(th) Gate Threshold Voltage VDS = VGS, ID = -250 µA -3.0 -- -5.0 V

RDS(on) Static Drain-Source On-Resistance

VGS = -10 V, ID = -1.75 A -- 2.44 3.1 Ω

gFS Forward Transconductance VDS = -50 V, ID = -1.75 A -- 2.7 -- S

Dynamic CharacteristicsCiss Input Capacitance VDS = -25 V, VGS = 0 V,

f = 1.0 MHz

-- 520 680 pF

Coss Output Capacitance -- 80 105 pF

Crss Reverse Transfer Capacitance -- 11 15 pF

Switching Characteristics td(on) Turn-On Delay Time

VDD = -200 V, ID = -3.5 A,

RG = 25 Ω

-- 13 35 ns

tr Turn-On Rise Time -- 55 120 ns

td(off) Turn-Off Delay Time -- 35 80 ns

tf Turn-Off Fall Time -- 37 85 ns

Qg Total Gate Charge VDS = -320 V, ID = -3.5 A,

VGS = -10 V

-- 18 23 nC

Qgs Gate-Source Charge -- 3.8 -- nC

Qgd Gate-Drain Charge -- 9.4 -- nC

Drain-Source Diode Characteristics and Maximum RatingsIS Maximum Continuous Drain-Source Diode Forward Current -- -- -3.5 A

ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- -14 A

VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = -3.5 A -- -- -5.0 V

trr Reverse Recovery Time VGS = 0 V, IS = -3.5 A,

dIF / dt = 100 A/µs

-- 260 -- ns

Qrr Reverse Recovery Charge -- 1.4 -- µC



FQP4P40 —

P-Channel Q

FET® M

OSFET

Typical Characteristics

0 2 4 6 8 10 21 41 16 81 200

2

4

6

8

10

12

VDS

= -200V

VDS

= -80V

VDS

= -320V

※ Note : ID = -3.5 A

-VG

S, G

ate-

Sou

rce

Vol

tage

[V]

QG, Total Gate Charge [nC]

10-1 0

101

0

200

400

600

800

1000

1200C

iss = C

gs + C

gd (C

ds = shorted)

Coss

= Cds

+ Cgd

Crss

= Cgd

※ Notes : 1. V

GS = 0 V

2. f = 1 MHzCrss

Coss

Ciss

Cap

acita

nce

[pF]

10

VDS

, Drain-Source Voltage [V]

0.0 0.5 1.0 1.5 2.0 2.5 3.010

-1

100

101

150 ※ Notes : 1. V

GS = 0V

2. 250μs Pulse Test

25

-ID

R ,

Rev

erse

Dra

in C

urre

nt [

A]

-VSD

, Source-Drain Voltage [V]

00 30 120

2

4

6

8

※ Note : TJ = 25

VGS

= - 20V

VGS

= - 10V

RD

S(o

n) [

Ω],

Dra

in-S

ourc

e O

n-R

esis

tanc

e

-ID , Drain Current [A]

2 6 84 1010

-1

100

101

150

25

-55 ※ Notes : 1. V

DS = -50V

2. 250μs Pulse Test

-ID ,

Dra

in C

urre

nt [

A]

-VGS

, Gate-Source Voltage [V]10

-110

010

110

-2

10-1

100

101 V

GS

Top : -15.0 V -10.0 V -8.0 V -7.0 V -6.5 V -6.0 V

Bottom : -5.5 V

※ Notes : 1. 250μs Pulse Test 2. T

C = 25

-ID, D

rain

Cur

rent

[A]

-VDS


Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics

Figure 3. On-Resistance Variation vs.Drain Current and Gate Voltage

Figure 4. Body Diode Forward Voltage Variation vs. Source Current

and Temperature

Figure 2. Transfer CharacteristicsFigure 1. On-Region Characteristics



FQP4P40 —

P-Channel Q

FET® M

OSFET

Typical Characteristics (Continued)

1 0-5

1 0-4

1 0-3

1 0-2

1 0-1

1 00

1 01

1 0-2

1 0-1

1 00

※ N o te s : 1 . Z θ J C

( t ) = 1 4 7.4 /W M a x . 2 . D u ty F a c to r , D = t

1/ t

2

3 . TJ M

- TC

= PD M

* Z θ J C( t )

s in g le p u ls e

D = 0 .5

0 .0 2

0 .2

0 .0 5

0 .1

0 .0 1

25 50 75 100 125 1500

1

2

3

4

-ID, D

rain

Cur

rent

[A]

TC, Case Temperature []

100

101

102

103

10-2

10-1

100

101

102

DC

10 ms

1 ms

100 µs

Operation in This Area is Limited by R

DS(on)

※ Notes :

1. TC = 25

oC

2. TJ = 150

oC

3. Single Pulse

-ID, D

rain

Cur

rent

[A]

-100 -50 0 50 100 150 2000.0

0.5

1.0

1.5

2.0

2.5

※ Notes : 1. V

GS = -10 V

2. ID = -1.75 A

RD

S(O

N), (

Nor

mal

ized

)D

rain

-Sou

rce

On-

Res

ista

nce

TJ, Junction Temperature [

oC]

-100 -50 0 50 100 150 2000.8

0.9

1.0

※ Notes : 1. V

GS = 0 V

2. ID = -250 μA

-BV

DSS

, (N

orm

aliz

ed)

Dra

in-S

ourc

e Br

eakd

own

Volta

ge

TJ, Junction Temperature [

oC]

-VDS


Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Currentvs. Case Temperature

Figure 7. Breakdown Voltage Variationvs. Temperature

Figure 8. On-Resistance Variationvs. Temperature

t1, S q u a re W a v e P u ls e D u ra t io n [s e c ]

Figure 11. Transient Thermal Response Curve

t1

PDM

t2

Z JC

(t), T

herm

al R

espo

nse

[o C/W

]



FQP4P40 —

P-Channel Q

FET® M

OSFET

Figure 12. Gate Charge Test Circuit & Waveform

Figure 13. Resistive Switching Test Circuit & Waveforms

Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms

VVDSDS

VVGSGS1010%%

90%90%

ttd(d(onon)) ttrr

tt onon tt ofofff

ttd(d(ofofff)) ttffVVDDDD

VVDSDS

RRLL

DUTDUT

RRGG

VVGSGS

ChChargargee

VVGSGS

QQgg

QQgsgs QQgdgdVVGSGS

DUDUTT

VVDSDS

300300nFnF

50K50KΩΩ

200n200nFF12V12V

SamSamee T Tyypepeas as DUDUTT

EEEAS AS AS ----=== 21212121------------ LLL ASASASIII

BVBVDSDSSS222 ----------------------------------------

BVBVDSDSSS - V- VDDDD

VVDDDD

VVDSDS

BVBVDSSDSS

t t pp

VVDDDD

IIASAS

VVDS DS (t)(t)

IID D (t(t))

TiTimmee

DUDUTT

RRGG

LLL

III DDD

t t pp

IG = const.

VVGSGS

VVGSGS



FQP4P40 —

P-Channel Q

FET® M

OSFET

Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms

••

DUTDUT

VVDSDS

++

__

DrivDrivererRRGG

ComCompplliimmentent ofof DUTDUT (N-(N-CChannelhannel))

VVGSGS •• ddvv//dtdt ccoontntrroolllleed d bbyy RRGG

IISDSD ccononttrrolollleded byby pupullsse e peperriiodod

VVDDDD

LLLII SDSD

1010VVVVGSGS

( ( DrivDriver er ))

II SDSD

( ( DUT DUT ))

VVDSDS

( ( DUT DUT ))

VVDDDDBoBodydy DDiiooddee

ForForwward ard VVololttagage e DrDropop

IIFMFM ,, BoBodydy DDiiodode e FFororwwaarrd d CCuurrrrenentt

VVSDSD

BoBodydy DDiiodode e RReevveerrssee CCuurrrrenentt

IIRMRM

BoBodydy DiDiodode e RReecovcoveerryy dvdv/d/dtt

didi//dtdt

D D D === ---------GateGateGate--------------------------- PPPulululsss------------------------e e e WWWiiiddd---------------ttthhh---GaGaGate te te PuPuPulllssseee PePePerrriiiododod



FQP4P40 —

P-Channel Q

FET® M

OSFET

Mechanical Dimensions

Figure 16. TO220, Molded, 3-Lead, Jedec Variation ABPackage drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-ically the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TO220-003



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*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

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As used here in:1. Life support devices or systems are devices or systems which, (a) are

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2. A critical component in any component of a life support, device, orsystem whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety oreffectiveness.

PRODUCT STATUS DEFINITIONSDefinition of Terms

AccuPower™AX-CAP®*BitSiC™Build it Now™CorePLUS™CorePOWER™CROSSVOLT™CTL™Current Transfer Logic™DEUXPEED®

Dual Cool™EcoSPARK®

EfficentMax™ESBC™

Fairchild®

Fairchild Semiconductor®

FACT Quiet Series™FACT®

FAST®

FastvCore™FETBench™FPS™

F-PFS™FRFET®

Global Power ResourceSM

GreenBridge™Green FPS™Green FPS™ e-Series™Gmax™GTO™IntelliMAX™ISOPLANAR™Marking Small Speakers Sound Louder and Better™MegaBuck™MICROCOUPLER™MicroFET™MicroPak™MicroPak2™MillerDrive™MotionMax™mWSaver®

OptoHiT™OPTOLOGIC®

OPTOPLANAR®

PowerTrench®

PowerXS™Programmable Active Droop™QFET®

QS™Quiet Series™RapidConfigure™

Saving our world, 1mW/W/kW at a time™SignalWise™SmartMax™SMART START™Solutions for Your Success™SPM®

STEALTH™SuperFET®

SuperSOT™-3SuperSOT™-6SuperSOT™-8SupreMOS®

SyncFET™

Sync-Lock™®*

TinyBoost®

TinyBuck®

TinyCalc™TinyLogic®

TINYOPTO™TinyPower™TinyPWM™TinyWire™TranSiC™TriFault Detect™TRUECURRENT®*SerDes™

UHC®

Ultra FRFET™UniFET™VCX™VisualMax™VoltagePlus™XS™

®

™

Datasheet Identification Product Status Definition

Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.

Preliminary First ProductionDatasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.

No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.

Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.

ANTI-COUNTERFEITING POLICYFairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support.Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.

Rev. I66

tm

®

FQP4P40 —

P-Channel Q

FET® M

OSFET

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Authorized Distributor

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P-Channel QFET MOSFET Description · ©2000 Fairchild Semiconductor Corporation FQP4P40 Rev. C0 3...

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