This is information on a product in full production.

July 2013 DocID024772 Rev 2 1/19

STB6N60M2, STD6N60M2

N-channel 600 V, 1.06 Ω typ., 4.5 A MDmesh II Plus™ low Qg Power MOSFET in D2PAK and DPAK packages

Datasheet - production data

Figure 1. Internal schematic diagram

Features

• Extremely low gate charge

• Lower RDS(on) x area vs previous generation

• Low gate input resistance

• 100% avalanche tested

• Zener-protected

Applications• Switching applications

DescriptionThese devices are N-channel Power MOSFETs developed using a new generation of MDmesh™ technology: MDmesh II Plus™ low Qg. These revolutionary Power MOSFETs associate a vertical structure to the company's strip layout to yield one of the world's lowest on-resistance and gate charge. They are therefore suitable for the most demanding high efficiency converters.

13

TAB

DPAKD PAK2

13

TAB

AM15572v1

, TAB

Order codesVDS @ TJmax

RDS(on) max

ID

STB6N60M2650 V 1.2 Ω 4.5 A

STD6N60M2

Table 1. Device summary

Order codes Marking Package Packaging

STB6N60M26N60M2

D2PAKTape and reel

STD6N60M2 DPAK

www.st.com

Contents STB6N60M2, STD6N60M2

2/19 DocID024772 Rev 2

Contents

1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

DocID024772 Rev 2 3/19

STB6N60M2, STD6N60M2 Electrical ratings

19

1 Electrical ratings

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit

VGS Gate-source voltage ±25 V

ID Drain current (continuous) at TC = 25 °C 4.5 A

ID Drain current (continuous) at TC = 100 °C 2.9 A

IDM (1)

1. Pulse width limited by safe operating area

Drain current (pulsed) 18 A

PTOT Total dissipation at TC = 25 °C 60 W

dv/dt (2)

2. ISD ≤ 4.5 A, di/dt ≤ 400 A/µs; VDS peak < V(BR)DSS, VDD=400 V

Peak diode recovery voltage slope 15V/ns

dv/dt (3)

3. VDS ≤ 480 V

MOSFET dv/dt ruggedness 50

Tstg Storage temperature-55 to 150 °C

Tj Max. operating junction temperature

Table 3. Thermal data

Symbol ParameterValue

UnitD2PAK DPAK

Rthj-case Thermal resistance junction-case max 2.08 °C/W

Rthj-pcb Thermal resistance junction-pcb max(1)

1. When mounted on 1 inch² FR-4, 2 Oz copper board

30 50 °C/W

Table 4. Avalanche characteristics

Symbol Parameter Value Unit

IARAvalanche current, repetitive or not repetitive (pulse width limited by Tjmax)

1 A

EASSingle pulse avalanche energy (starting Tj=25°C, ID= IAR; VDD=50)

86 mJ

Electrical characteristics STB6N60M2, STD6N60M2

4/19 DocID024772 Rev 2

2 Electrical characteristics

(TC = 25 °C unless otherwise specified)

Table 5. On /off states

Symbol Parameter Test conditions Min. Typ. Max. Unit

V(BR)DSSDrain-source breakdown voltage

ID = 1 mA, VGS = 0 600 V

IDSSZero gate voltage drain current (VGS = 0)

VDS = 600 V 1 µA

VDS = 600 V, TC=125 °C 100 µA

IGSSGate-body leakage

current (VDS = 0)VGS = ± 25 V ±10 µA

VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 2 3 4 V

RDS(on)Static drain-source on-resistance

VGS = 10 V, ID = 2.25 A 1.06 1.2 Ω

Table 6. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit

Ciss Input capacitance

VDS = 100 V, f = 1 MHz, VGS = 0

- 232 - pF

Coss Output capacitance - 14 - pF

Crss Reverse transfer capacitance - 0.7 - pF

Coss eq.(1)

1. Coss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS

Equivalent output capacitance

VDS = 0 to 480 V, VGS = 0 - 71 - pF

RGIntrinsic gate resistance

f = 1 MHz open drain - 6.5 - Ω

Qg Total gate charge VDD = 480 V, ID = 4.5 A,VGS = 10 V(see Figure 16)

- 8 - nC

Qgs Gate-source charge - 1.7 - nC

Qgd Gate-drain charge - 4 - nC

Table 7. Switching times

Symbol Parameter Test conditions Min. Typ. Max. Unit

td(on) Turn-on delay time VDD = 300 V, ID = 1.65 A, RG = 4.7 Ω, VGS = 10 V(see Figure 15 and Figure 20)

- 9.5 - ns

tr Rise time - 7.4 - ns

td(off) Turn-off delay time - 24 - ns

tf Fall time - 22.5 - ns

DocID024772 Rev 2 5/19

STB6N60M2, STD6N60M2 Electrical characteristics

19

Table 8. Source drain diode

Symbol Parameter Test conditions Min. Typ. Max. Unit

ISD Source-drain current - 4.5 A

ISDM (1)

1. Pulse width limited by safe operating area.

Source-drain current (pulsed) - 18 A

VSD (2)

2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%

Forward on voltage ISD = 4.5 A, VGS = 0 - 1.6 V

trr Reverse recovery timeISD = 4.5 A, di/dt = 100 A/µsVDD = 60 V (see Figure 17)

- 274 ns

Qrr Reverse recovery charge - 1.47 nC

IRRM Reverse recovery current - 10.7 A

trr Reverse recovery time ISD = 4.5 A, di/dt = 100 A/µsVDD = 60 V, Tj = 150 °C(see Figure 17)

- 376 ns

Qrr Reverse recovery charge - 1.96 nC

IRRM Reverse recovery current - 10.5 A

Electrical characteristics STB6N60M2, STD6N60M2

6/19 DocID024772 Rev 2

2.1 Electrical characteristics (curves)

Figure 2. Safe operating area for D2PAK Figure 3. Thermal impedance for D2PAK

ID

1

0.1

0.010.1 1 VDS(V)10

(A)

Operatio

n in th

is are

a is

Limite

d by max RDS(o

n)

10µs

100µs

1ms

Tj=150°CTc=25°CSingle pulse

10

10ms

100

AM15885v1

Figure 4. Safe operating area for DPAK Figure 5. Thermal impedance for DPAK

ID

1

0.1

0.010.1 1 VDS(V)10

(A)

Operatio

n in th

is are

a is

Limite

d by max RDS(o

n)

10µs

100µs

1ms

Tj=150°CTc=25°CSingle pulse

10

10ms

100

AM15875v1

Figure 6. Output characteristics Figure 7. Transfer characteristics

ID

3

2

1

00 10 VDS(V)

(A)

5

4

VGS= 4 V

VGS= 5 V

VGS= 8, 9, 10 V

5VGS= 6 V

VGS= 7 V

6

8

15 20

7

AM15876v1ID

3

2

1

00 2 VGS(V)4

(A)

4

6

VDS= 20 V

8

5

6

7

10

8

AM15877v1

DocID024772 Rev 2 7/19

STB6N60M2, STD6N60M2 Electrical characteristics

19

Figure 8. Gate charge vs gate-source voltage Figure 9. Static drain-source on-resistance

Figure 10. Capacitance variations Figure 11. Normalized VDS vs temperature

Figure 12. Normalized gate threshold voltage vs temperature

Figure 13. Normalized on-resistance vs temperature

VGS

6

4

2

00 2 Qg(nC)

(V)

8

4 6

10

VDD=480V

8

12 ID=4.5VVDS

300

200

100

0

400

500

VDS

(V)

AM15878v1RDS(on)

1.060

1.040

1.0200 3 ID(A)

(Ω)

1

1.080

1.100

2 4

VGS=10V1.120

AM15879v1

C

100

10

1

0.10.1 10 VDS(V)

(pF)

1 100

Ciss

Coss

Crss

1000

AM15880v1 VDS

-50 TJ(°C)

(norm)

-25 500 25 750.93

0.95

0.97

1.03

1.05

1.07

100

0.99

1.01

1.09

1.11 I =1 mAD

AM15881v1

VGS(th)

0.8

0.7-50 TJ(°C)

(norm)

-25

0.9

500 25 75 100

ID=250 µA1.1

1.0

AM15882v1RDS(on)

0.9

0.70.5

-25 TJ(°C)-50 0

1.1

25 50 75

1.3

(norm)

100

1.5

1.7

1.9

2.1

2.3ID=2.2 A

AM15883v1

Electrical characteristics STB6N60M2, STD6N60M2

8/19 DocID024772 Rev 2

Figure 14. Source-drain diode forward characteristics

VSD

0 2 ISD(A)

(V)

1 30

0.2

0.4

0.6

0.8

TJ=-50°C

TJ=150°C

TJ=25°C

4

1.2

1

1.4

AM15884v1

DocID024772 Rev 2 9/19

STB6N60M2, STD6N60M2 Test circuits

19

3 Test circuits

Figure 15. Switching times test circuit for resistive load

Figure 16. Gate charge test circuit

Figure 17. Test circuit for inductive load switching and diode recovery times

Figure 18. Unclamped inductive load test circuit

Figure 19. Unclamped inductive waveform Figure 20. Switching time waveform

AM01468v1

VGS

PW

VD

RG

RL

D.U.T.

2200

μF3.3μF

VDD

AM01469v1

VDD

47kΩ 1kΩ

47kΩ

2.7kΩ

1kΩ

12V

Vi=20V=VGMAX

2200μF

PW

IG=CONST100Ω

100nF

D.U.T.

VG

AM01470v1

AD

D.U.T.

SB

G

25 Ω

A A

BB

RG

G

FASTDIODE

D

S

L=100μH

μF3.3 1000

μF VDD

AM01471v1

Vi

Pw

VD

ID

D.U.T.

L

2200μF

3.3μF VDD

AM01473v1

VDS

ton

tdon tdoff

toff

tftr

90%

10%

10%

0

0

90%

90%

10%

VGS

Package mechanical data STB6N60M2, STD6N60M2

10/19 DocID024772 Rev 2

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

DocID024772 Rev 2 11/19

STB6N60M2, STD6N60M2 Package mechanical data

19

Table 9. D²PAK (TO-263) mechanical data

Dim.mm

Min. Typ. Max.

A 4.40 4.60

A1 0.03 0.23

b 0.70 0.93

b2 1.14 1.70

c 0.45 0.60

c2 1.23 1.36

D 8.95 9.35

D1 7.50

E 10 10.40

E1 8.50

e 2.54

e1 4.88 5.28

H 15 15.85

J1 2.49 2.69

L 2.29 2.79

L1 1.27 1.40

L2 1.30 1.75

R 0.4

V2 0° 8°

Package mechanical data STB6N60M2, STD6N60M2

12/19 DocID024772 Rev 2

Figure 21. D²PAK (TO-263) drawing

Figure 22. D²PAK footprint(a)

a. All dimension are in millimeters

0079457_T

16.90

12.20

9.75

3.50

5.08

1.60

Footprint

DocID024772 Rev 2 13/19

STB6N60M2, STD6N60M2 Package mechanical data

19

Table 10. DPAK (TO-252) mechanical data

Dim.mm

Min. Typ. Max.

A 2.20 2.40

A1 0.90 1.10

A2 0.03 0.23

b 0.64 0.90

b4 5.20 5.40

c 0.45 0.60

c2 0.48 0.60

D 6.00 6.20

D1 5.10

E 6.40 6.60

E1 4.70

e 2.28

e1 4.40 4.60

H 9.35 10.10

L 1.00 1.50

(L1) 2.80

L2 0.80

L4 0.60 1.00

R 0.20

V2 0° 8°

Package mechanical data STB6N60M2, STD6N60M2

14/19 DocID024772 Rev 2

Figure 23. DPAK (TO-252) drawing

0068772_K

DocID024772 Rev 2 15/19

STB6N60M2, STD6N60M2 Package mechanical data

19

Figure 24. DPAK footprint (b)

b. All dimensions are in millimeters

Footprint_REV_K

Packaging mechanical data STB6N60M2, STD6N60M2

16/19 DocID024772 Rev 2

5 Packaging mechanical data

Table 11. DPAK (TO-252) tape and reel mechanical data

Tape Reel

Dim.mm

Dim.mm

Min. Max. Min. Max.

A0 6.8 7 A 330

B0 10.4 10.6 B 1.5

B1 12.1 C 12.8 13.2

D 1.5 1.6 D 20.2

D1 1.5 G 16.4 18.4

E 1.65 1.85 N 50

F 7.4 7.6 T 22.4

K0 2.55 2.75

P0 3.9 4.1 Base qty. 2500

P1 7.9 8.1 Bulk qty. 2500

P2 1.9 2.1

R 40

T 0.25 0.35

W 15.7 16.3

DocID024772 Rev 2 17/19

STB6N60M2, STD6N60M2 Packaging mechanical data

19

Figure 25. Tape

Figure 26. Reel

P1A0 D1

P0

F

W

E

D

B0K0

T

User direction of feed

P2

10 pitches cumulativetolerance on tape +/- 0.2 mm

User direction of feed

R

Bending radius

B1

For machine ref. onlyincluding draft andradii concentric around B0

AM08852v1

Top covertape

A

D

B

Full radius G measured at hub

C

N

REEL DIMENSIONS

40mm min.

Access hole

At sl ot location

T

Tape slot in core fortape start 25 mm min.width

AM08851v2

Revision history STB6N60M2, STD6N60M2

18/19 DocID024772 Rev 2

6 Revision history

Table 12. Document revision history

Date Revision Changes

11-Jun-2013 1 First release.

09-Jul-2013 2– Minor text changes– Modified: Rthj-case value for D2PAK in Table 3

DocID024772 Rev 2 19/19

STB6N60M2, STD6N60M2

19

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