Key Idea For elastically isotropic thin film Strain Biaxial Elastic Modulus Evaluation of Elastic...
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Key Idea
For elastically isotropic thin film
Strain
Biaxial Elastic Modulus
2
0
)(1 A
E
20 )(A
1
E
Evaluation of Elastic Property of Thin Films by MEMSEvaluation of Elastic Property of Thin Films by MEMS
100 200 300 400 500 600
0
50
100
150
200
Bridge Method
Freehang Method
E/(
1-)
(G
Pa)
Negative Bias Voltage (V)
0.0 0.2 0.4 0.6 0.8 1.0
25
50
75
100
on Si on W on SiO
2
Biax
ial E
last
ic M
odul
us (G
Pa)
Thickness(m)
Free-hang
Bridge
Results
T : Elastic energy
U : Bending strain energy
Δγ : Surface energy
=(- fs+ fv+ sv)
fsT
svfvU
22
2)1(3
B
B
B
ut
tE
BB UT Buckling under Residual Compressive Stress & Energy Balance
Fundamental Adhesion Energy Fundamental Adhesion Energy MeasurementMeasurement
0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36-10
-5
0
5
10
15
20
25
30
(J
/m2 )
Thickness(m)100 200 300 400 500 600 700
-5
0
5
10
15
20
25
30
(J
/m2 )
Negative Bias Votage(V)
Results
Mirror
Mirror
Mirror
He-Ne laser
PSD
Beam Splitter
Chamber
• Step-
•Motor
•5Interface
System He-Ne laser : 632.8nm
Step-motor : 1 rpm
Lens FL : 500mm
PSD : S1300 (13×13mm)
In-situ stress measurement with temperature variation
i.e. Stress relaxation mechanism.
In-situ stress measurement under various environments
i.e. Stress vs. Humidity
In-situ Stress In-situ Stress MeasurementMeasurement
Residual stress versus. DC bias voltageIn Filtered Cathodic Arc Deposition
Principle Measurement of curvature Results
Residual Stress Residual Stress MeasurementMeasurement
Curvature (R)
dsdf
f
s
s
s
d
dE
R
2
216
1
Assumptions
1.The bending displacement is small compared with the thickness of the substrate
2. For a very thin deposit. ( ds << df )
dx
dsinθ
dx
dθcosθ
d
dθ
R
1K
I-V Curve F-N Plot
Emission Pattern from Vitreous Carbon
Keithley 6517Electrometer
SRS PS350Power Supply
x
y
ze
Anode
Cathode
CCDViewing System
ComputerInterface
3-D Manipulator
I-V Curve & Fluctuation Measuring System
Viewing System
SRS PS350Power Supply
Keithley 6517Electrometer
Phosphor coated ITO-glass
Cathode
Spacer
CCD
Emission Behavior from Vitreous Carbon
Emission Pattern Observing System
e
Visible Light
Current-Voltage Current-Voltage MeasurementMeasurement
Friction Behaviors of Pure DLC and Si-DLC in Ambient Environment
Ft
Ball
Film
Substrate
Ball On Disc Type TribometerBall On Disc Type Tribometer Results
n
t
F
F
Principle
Ft : Tangential Force Fn : Normal Force
Friction Coefficient
Fn
Substrate
Sessile-drop
l
sls
s : Substrate tension
l : Liquid tension
sl : Interface tension
Contact angle
Effects of CF4 Plasma Treatment of DLC Films
p : Polar componentd : Dispersive component
)cos1( lds
dl
ps
pl
High Surface Energy Low Surface Energy
Surface Energy Surface Energy MeasurementMeasurement
Results Principle
(a)
5N
Fractures morphology of DLC films(a) DLC on Tool Steel
(b) DLC on Tool Steel with W interlayer
Visual examination of the scratch to determine the critical load Fc that causes adhesion failure
Analysis of emission of acoustic signals that are small in magnitude when the film adheres at low load
Adhesion Measurement Adhesion Measurement Scratch testerScratch tester
Principle Results
(b)
