ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING...

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APPLICATIONS Ethernet - 10/100/1000 Base T Cellular Phones I 2 C Bus Protection Parallel & Serial Port Protection Personal Digital Assistant (PDA) Microcontroller Input Protection ISDN S/T Interface WAN/LAN Equipment IEC COMPATIBILITY IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC61000-4-4 (EFT) 40A (5/50ηs) IEC61000-4-5 (Lightning) 12A (8/20µs) Low Capacitance TVS Diode Array SOD-323 PIN CONFIGURATION FEATURES 400 Watts Peak Pulse Power per Line (tp=8/20µs) Protects One Uidirectional I/O line Low clamping voltage Working voltages : 3.3V, 5.0V Low leakage current MECHANICAL CHARACTERISTICS JEDEC SOD-323 Package Molding Compound Flammability Rating : UL 94V-O Weight 5.0 Millgrams (Approximate) Quantity Per Reel : 3,000pcs Reel Size : 7 inch Lead Finish : Lead Free PIN CONFIGURATION 1 http://www.qysemi.com Email:[email protected] ESD3.3V32D-LA thru ESD05V32D-LA

Transcript of ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING...

Page 1: ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT 3  Email:qy@qysemi.com ESD3.3V32D-LA thru ESD05V32D-LA

APPLICATIONS

◆ Ethernet - 10/100/1000 Base T

◆ Cellular Phones

◆ I2C Bus Protection

◆ Parallel & Serial Port Protection

◆ Personal Digital Assistant (PDA)

◆ Microcontroller Input Protection

◆ ISDN S/T Interface

◆ WAN/LAN Equipment

IEC COMPATIBILITY

◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

◆ IEC61000-4-4 (EFT) 40A (5/50ηs)

◆ IEC61000-4-5 (Lightning) 12A (8/20µs)

Low Capacitance TVS Diode Array

SOD-323

PIN CONFIGURATION

FEATURES

◆ 400 Watts Peak Pulse Power per Line (tp=8/20µs)

◆ Protects One Uidirectional I/O line

◆ Low clamping voltage

◆ Working voltages : 3.3V, 5.0V

◆ Low leakage current

MECHANICAL CHARACTERISTICS

◆ JEDEC SOD-323 Package

◆ Molding Compound Flammability Rating : UL 94V-O

◆ Weight 5.0 Millgrams (Approximate)

◆ Quantity Per Reel : 3,000pcs

◆ Reel Size : 7 inch

◆ Lead Finish : Lead Free

PIN CONFIGURATION

1

http://www.qysemi.com Email:[email protected]

ESD3.3V32D-LAthru

ESD05V32D-LA

Page 2: ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT 3  Email:qy@qysemi.com ESD3.3V32D-LA thru ESD05V32D-LA

(V) (V) @1A (µA) (pF)

(max.) (min.) (mA) (max.) (max.) (@A) (max.) (typ.)

18.3 8 5 0.4

0.42085.15 13.9

ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)

VC

Storage Temperature Range TSTG -55 ~ 150 ℃

IR CT

-55 ~ 150 ℃

Lead Soldering Temperature

Operating Temperature Range

SYMBOL VALUE

PPP 350 Watts

PARAMETER

MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)

VCIT

TL 260 (10 sec.) ℃

DEVICE CHARACTERISTICS

VB

PART NUMBERDEVICE

MARKING

VRWM

UNITS

Peak Pulse Power (tp=8/20µs waveform)

TJ

2

http://www.qysemi.com Email:[email protected]

ESD3.3V32D-LAthru

ESD05V32D-LA

ESD3.3V32D-LA S3 3.3 4 1

ESD05V32D-LA S5 5.0 6 1 9.8

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SOD-323 PACKAGE OUTLINE & DIMENSIONS

* SOLDERING FOOTPRINT

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http://www.qysemi.com Email:[email protected]

ESD3.3V32D-LAthru

ESD05V32D-LA

Page 4: ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT 3  Email:qy@qysemi.com ESD3.3V32D-LA thru ESD05V32D-LA

APPLICATIONS

◆ Cell Phone Handsets and Accessories

◆ Microprocessor based equipment

◆ Personal Digital Assistants (PDA’s)

◆ Notebooks, Desktops, and Servers

◆ Portable Instrumentation

◆ Peripherals

◆ Pagers

IEC COMPATIBILITY

◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

◆ IEC61000-4-4 (EFT) 40A (5/50ηs)

◆ IEC61000-4-5 (Lightning) 24A (8/20µs)

FEATURES

◆ 320 Watts Peak Pulse Power per Line (tp=8/20µs)

◆ Protects one I/O or power line

◆ Low clamping voltage

◆ Working voltages: 3V, 5V, 12V, 15V, 24V

◆ Low leakage current

MECHANICAL CHARACTERISTICS

◆ JEDEC SOD-323 Package

◆ Molding Compound Flammability Rating : UL 94V-O

◆ Weight 5 Millgrams (Approximate)

◆ Quantity Per Reel : 3,000pcs

◆ Reel Size : 7 inch

◆ Lead Finish : Lead Free

SOD-323

PIN CONFIGURATION

Bidirectional TVS Diode

1

http://www.qysemi.com Email:[email protected]

ESD03V32D-C

ESD24V32D-Cthru

Page 5: ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT 3  Email:qy@qysemi.com ESD3.3V32D-LA thru ESD05V32D-LA

(V) (V) @5A (µA) (pF)

(max.) (min.) (mA) (max.) (max.) (@A) (max.) (max.)

402H 24 26.7 1

450

15 12 1 100

PART NUMBERDEVICE

MARKING

VRWM

320PPP

ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)

VCIR CTVC

IT

TL 260 (10 sec.) ℃

DEVICE CHARACTERISTICS

VB

MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)

Lead Soldering Temperature

Operating Temperature Range

Watts

PARAMETER SYMBOL VALUE

Peak Pulse Power (tp=8/20µs waveform)

TJ -55 ~ 150 ℃

1 19

Storage Temperature Range TSTG -55 ~ 150 ℃

UNITS

1 7.5

6 2001 9.8 14.5

10.5 20 40

10 1

8 7 1 50

75

17 10

2

ESD03V32D-C 2A 3 4

ESD05V32D-C 2B 5

ESD12V32D-C 2D 12 13.3

ESD15V32D-C 2J 15 16.7 1 24 12

ESD24V32D-C

ESD03V32D-C

ESD24V32D-Cthru

http://www.qysemi.com Email:[email protected]

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* SOLDERING FOOTPRINT

SOD-323 PACKAGE OUTLINE & DIMENSIONS

3

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ESD03V32D-C

ESD24V32D-Cthru

Page 7: ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT 3  Email:qy@qysemi.com ESD3.3V32D-LA thru ESD05V32D-LA

APPLICATIONS

◆ Cellular Handsets and Accessories

◆ High Speed I/O Lines

◆ Notebooks & Handhelds

◆ Peripherals

◆ Personal Digital Assistants (PDA)

◆ Servers, Notebook, and Desktop PC

IEC COMPATIBILITY

◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

◆ IEC61000-4-4 (EFT) 40A (5/50ηs)

BIDIRECTIONAL TVS DIODE

FOR ESD PROTECTION

SOD-323

PIN CONFIGURATION

1

FEATURES

◆ 100 Watts Peak Pulse Power per Line (tp=8/20µs)

◆ Protects One I/O Line (Bidirection)

◆ Low Clamping Voltage

◆ Working Voltages : 5.0V

◆ Low Leakage Current

MECHANICAL CHARACTERISTICS

◆ SOD-323 Package

◆ Molding Compound Flammability Rating : UL 94V-O

◆ Weight 4.7 Millgrams (Approximate)

◆ Quantity Per Reel : 3,000pcs

◆ Reel Size : 7 inch

◆ Lead Finish : Lead Free

PIN CONFIGURATION

1

1

1

ESD0501V32D-LC

http://www.qysemi.com Email:[email protected]

Page 8: ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT 3  Email:qy@qysemi.com ESD3.3V32D-LA thru ESD05V32D-LA

(V) (V) @1A (µA) (pF)

(max.) (min.) (mA) (max.) (max.) (@A) (max.) (typ.)

Storage Temperature Range TSTG -55 ~ 150 ℃

UNITS

Peak Pulse Power (tp=8/20µs waveform)

TJ -55 ~ 150 ℃

MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)

Operating Temperature Range

DEVICE CHARACTERISTICS

Watts

PARAMETER SYMBOL VALUE

VB

PART NUMBERDEVICE

MARKING

VRWM

100PPP

ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)

VCIR CTVC

IT

TL 260 (10 sec.) ℃Lead Soldering Temperature

2 1 3012 17.5165

2

ESD0501V32D-LC 5CW

http://www.qysemi.com Email:[email protected]

ESD0501V32D-LC

Page 9: ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT 3  Email:qy@qysemi.com ESD3.3V32D-LA thru ESD05V32D-LA

SOD-323 PACKAGE OUTLINE & DIMENSIONS

* SOLDERING FOOTPRINT

3http://www.qysemi.com Email:[email protected]

ESD0501V32D-LC

Page 10: ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT 3  Email:qy@qysemi.com ESD3.3V32D-LA thru ESD05V32D-LA

APPLICATIONS

◆ Cell Phone Handsets and Accessories

◆ Microprocessor based equipment

◆ Personal Digital Assistants (PDA’s)

◆ Notebooks, Desktops, and Servers

◆ Portable Instrumentation

◆ Peripherals

◆ USB Interface

IEC COMPATIBILITY

◆ IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

◆ IEC61000-4-4 (EFT) 40A (5/50ηs)

◆ IEC61000-4-5 (Lightning) 12A (8/20µs)

Low Capacitance TVS Diode Array

SOD-323

PIN CONFIGURATION

FEATURES

◆ 350 Watts Peak Pulse Power per Line (tp=8/20µs)

◆ Protects one I/O line (bidirectional)

◆ Low clamping voltage

◆ Working voltages: 3V, 5V, 8V, 12V, 15V, 24V

◆ Low leakage current

MECHANICAL CHARACTERISTICS

◆ JEDEC SOD-323 Package

◆ Molding Compound Flammability Rating : UL 94V-O

◆ Weight 5 Millgrams (Approximate)

◆ Quantity Per Reel : 3,000pcs

◆ Reel Size : 7 inch

◆ Lead Finish : Lead Free

PIN CONFIGURATION

1http://www.qysemi.com Email:[email protected]

ESD03V32D-LCthru

ESD24V32D-LC

Page 11: ESD3.3V32D-LA thru ESD05V32D-LA - QY Semi · SOD-323 PACKAGE OUTLINE & DIMENSIONS * SOLDERING FOOTPRINT 3  Email:qy@qysemi.com ESD3.3V32D-LA thru ESD05V32D-LA

(V) (V) @1A (µA) (pF)

(max.) (min.) (mA) (max.) (max.) (@A) (max.) (typ.)

4.0

6 1 1.2

1 5.15

6.0

1.2

1 9.80 18.3 8

1 13.40 18.5 8

1.2

Storage Temperature Range TSTG -55 ~ 150 ℃

UNITS

Peak Pulse Power (tp=8/20µs waveform)

TJ -55 ~ 150 ℃

MAXIMUM RATINGS (@ 25℃ Unless Otherwise Specified)

Lead Soldering Temperature

Operating Temperature Range

SYMBOL VALUE

VCIT

TL 260 (10 sec.) ℃

DEVICE CHARACTERISTICS

VB

Watts

PARAMETER

PPP 350

ELECTRICAL CHARACTERISTICS PER LINE (@ 25℃ Unless Otherwise Specified)

VC

IR CT

PART NUMBERDEVICE

MARKING

VRWM

13.9 8 20 1.2

5

1 19.00 28.6

2

LC12CI DC 12.0 13.3 6 1 1.2

EC 15.0 31.8

1 19.00 28.6

5 11 24.0016.7 1.2

HC 24.0 26.7 1 43.00 56.0 3 1 1.2

2

ESD03V32D-LC CC 3.0

ESD05V32D-LC AC 5.0

ESD08V32D-LC BC 8.0 8.5

ESD12V32D-LC DC 12.0 13.3

ESD15V32D-LC

ESD24V32D-LC

http://www.qysemi.com Email:[email protected]

ESD03V32D-LCthru

ESD24V32D-LC

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SOD-323 PACKAGE OUTLINE & DIMENSIONS

* SOLDERING FOOTPRINT

3

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ESD03V32D-LCthru

ESD24V32D-LC