EE 5340 Semiconductor Device Theory Lecture 15 - Fall 2009 Professor Ronald L. Carter [email protected] .
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Transcript of EE 5340 Semiconductor Device Theory Lecture 15 - Fall 2009 Professor Ronald L. Carter [email protected] .
EE 5340Semiconductor Device TheoryLecture 15 - Fall 2009
Professor Ronald L. [email protected]
http://www.uta.edu/ronc
Minority hole lifetimesMark E. Law, E. Solley, M. Liang, and Dorothea E. Burk, “Self-Consistent Model of Minority-Carrier Lifetime, Diffusion Length, and Mobility, IEEE ELECTRON DEVICE LETTERS, VOL. 12, NO. 8, AUGUST 1991
The parameters used in the fit are
τo = 10 μs,
Nref = 1×1017/cm2, and
CA = 1.8×10-31cm6/s.
2DAorefD
op NCNN1 τ
ττ
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Minority electron lifetimesMark E. Law, E. Solley, M. Liang, and Dorothea E. Burk, “Self-Consistent Model of Minority-Carrier Lifetime, Diffusion Length, and Mobility, IEEE ELECTRON DEVICE LETTERS, VOL. 12, NO. 8, AUGUST 1991
The parameters used in the fit are
τo = 30 μs,
Nref = 1×1017/cm2, and
CA = 8.3×10-32 cm6/s.
2DAorefD
on NCNN1 τ
ττ
L 15 Oct 13 3
References for Part A: Based on the information in these resources, decide which model formulae and parameters are the most accurate for Dn and Ln for electrons in p-type material, and Dp and Lp holes in n-type material.
1. Device Electronics for Integrated Circuits, 3rd ed., by Richard S. Muller, Theodore I. Kamins, and Mansun Chan, John Wiley and Sons, New York, 2003.
2. Mark E. Law, E. Solley, M. Liang, and Dorothea E. Burk, “Self-Consistent Model of Minority-Carrier Lifetime, Diffusion Length, and Mobility, IEEE ELECTRON DEVICE LETTERS, VOL. 12, NO. 8, AUGUST 1991.
3. Note: This article is removed from the list and items 6 and 7 are added. D.B.M. Klaassen; “A UNIFIED MOBILITY MODEL FOR DEVICE SIMULATION”, Electron Devices Meeting, 1990. Technical Digest., International 9-12 Dec. 1990 Page(s):357 – 360.
4. David Roulston, Narain D. Arora, and Savvas G. Chamberlain “Modeling and Measurement of Minority-Carrier Lifetime versus Doping in Diffused Layers of n+-p Silicon Diodes”, IEEE TRANSACTIONS ON ELECTRON DEVICES, VOL. ED-29, NO. 2, FEBRUARY 1982, pages 284-291.
5. M. S. Tyagi and R. Van Overstraeten, “Minority Carrier Recombination in Heavily Doped Silicon”, Solid-State Electr. Vol. 26, pp. 577-597, 1983. Download a copy at Tyagi.pdf.
6. D.B.M. Klaassen, “A Unified Mobility Model for Device Simulation – I. Model Equations and Concentration Dependence”, Solid-State Electr. Vol. 35, pp. 953-959, 1992. See below.
7. D.B.M. Klaassen, “A Unified Mobility Model for Device Simulation – II. Temperature Dependence of Carrier Mobility and Lifetime”, Solid-State Electr. Vol. 35, pp. 961-967, 1992. Download at DbmK.pdf.
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Taken from Synopsys [1] manual
Taken from Synopsys [1] Table 3-6. Default … parameters –
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Part of a SPICE model for the Motorola 1N5233 Zener diode is shown in Table
1.For purposes of this assignment, this
means that
1. IS may be interpreted as the multiplier of the (exp(vD/NVt) – 1) term in the diffusion current.
2. The multiplier of the exp(vD/(NRVt)) term in the recombination current may be interpreted as ISR.
3. The M value implies that this is essential a step diode.
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Table 1. A SPICE model for the Motorola 1N5233 diode
.model D1N5233 Is=629E-18 Rs=1.176 N=1 Xti=3 Eg=1.11
Cjo=140p M=.5369Vj=.75 Isr=1.707n Nr=2 BV = 6
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Use the information given to make the best estimate of the following:
1. Diode area.2. Concentration of donors or acceptors on the lightly doped side.
Support your conclusion as to the type of Si on the lightly doped side.
3. Concentration and type of the heavily doped side.4. Estimate the value IKF might have. The multiplier of the
exp(vD/(2NVt)) term in the high level injection current may be interpreted as √(IS×IKF).
5. Length of the charge neutral region on the lightly doped side.6. Show that the estimates are self-consistent for all regions of
diode operation – especially capacitance, BV, recombination, and diffusion ranges.
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pt
apop
nt
anon
V
V-
pononoV
V-V
pon
t
biaponno
xx at ,1VV
expnn sim.
xx at ,1VV
exppp so
,epp ,pepp
giving V
V-Vexpppp
t
bi
t
bia
InjectionConditions
10
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Ideal JunctionTheory
Assumptions
• Ex = 0 in the chg neutral reg. (CNR)
• MB statistics are applicable• Neglect gen/rec in depl reg (DR)• Low level injection applies so that
np < ppo for -xpc < x < -xp, and pn < nno for xn < x < xnc
• Steady State conditions
11
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Ideal Junction Theory (cont.)
ppcn
ncnp
xxx- ,Jq1
dtdn
tn
0
and , xxx ,Jq1
dtdp
tp
0
CNR the to Equation Continuity the applying
and , 0tn
tp
case, (static) state steady the In
12
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Ideal JunctionTheory (cont.)
ppc
nn
p2p
2
ncnpp
n2n
2
ppx
nnxx
xxx- for ,0D
n
dx
nd
and ,xxx for ,0D
p
dx
pd
giving dxdp
qDJ and
dxdn
qDJ CNR, the in 0E Since
13
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Ideal JunctionTheory (cont.)
)contacts( ,0xnxp and
,1en
xn
pxp
B.C. with
.xxx- ,DeCexn
xxx ,BeAexp
So .D L and D L Define
pcpncn
VV
po
pp
no
nn
ppcL
xL
x
p
ncnL
xL
x
n
pp2pnn
2n
ta
nn
pp
14
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0.1
1.0
10.0
100.0
1000.0
1.E+13 1.E+14 1.E+15 1.E+16 1.E+17 1.E+18 1.E+19 1.E+20
Doping Concentration (cm̂ - 3)
Diff
usio
n Le
ngth
, L
(mic
rons
)electrons holes
Diffusion Length model
2imim
minN36E5.4N18E7.71
sec45
L = (D)1/2 Diffusion Coeff. is Pierret* model
15
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Excess minoritycarrier distr fctn
1eLWsinh
Lxxsinhnxn
,xxW ,xxx- for and
1eLWsinh
Lxxsinhpxp
,xxW ,xxx For
ta
ta
VV
np
npcpop
ppcpppc
VV
pn
pncnon
nncnncn
16
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Forward Bias Energy Bands
1eppkT/EEexpnp ta VV0nnFpFiiequilnon
1/exp 0 ta VV
ppFiFniequilnon ennkTEEnn
Ev
Ec
EFi
xn xnc-xpc -xp 0
q(Vbi-Va)
EFPEFNqVa
x
Imref, EFn
Imref, EFp
17
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CarrierInjection
xn-xpc 0
ln(carrier conc)ln Naln Nd
ln ni
ln ni2/Nd
ln ni2/Na
xnc-xp
x
~Va/Vt~Va/Vt
1enxn t
aV
V
popp
1epxp t
aV
V
nonn
18
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Minority carriercurrents
1eLWsinh
Lxxcosh
LNDqn
xxx- for ,qDxJ
1eLWsinh
Lxxcosh
LN
Dqn
xxx for ,qDxJ
ta
p
ta
n
VV
np
npc
na
n2i
ppcdx
ndnn
VV
pn
pnc
pd
p2i
ncndxpd
pp
19
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Evaluating thediode current
p/nn/pp/nd/a
p/n2isp/sn
spsns
VV
spnnp
LWcothLN
DqnJ
sdefinition with JJJ where
1eJxJxJJ
then DR, in gen/rec no gminAssu
ta
20
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Special cases forthe diode current
nd
p2isp
pa
n2isn
nppn
pd
p2isp
na
n2isn
nppn
WN
DqnJ and ,
WND
qnJ
LW or ,LW :diode Short
LN
DqnJ and ,
LND
qnJ
LW or ,LW :diode Long
21
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Ideal diodeequation• Assumptions:
– low-level injection– Maxwell Boltzman statistics– Depletion approximation– Neglect gen/rec effects in DR– Steady-state solution only
• Current dens, Jx = Js expd(Va/Vt)
– where expd(x) = [exp(x) -1] 22
L 15 Oct 13
Ideal diodeequation (cont.)• Js = Js,p + Js,n = hole curr + ele curr
Js,p = qni2Dp coth(Wn/Lp)/(NdLp) =
qni2Dp/(NdWn), Wn << Lp, “short” =
qni2Dp/(NdLp), Wn >> Lp, “long”
Js,n = qni2Dn coth(Wp/Ln)/(NaLn) =
qni2Dn/(NaWp), Wp << Ln, “short” =
qni2Dn/(NaLn), Wp >> Ln, “long”
Js,n << Js,p when Na >> Nd
23
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Diffnt’l, one-sided diode conductance
Va
IDStatic (steady-state) diode I-V characteristic
VQ
IQ QVa
Dd dV
dIg
t
asD V
VdexpII
24
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Diffnt’l, one-sided diode cond. (cont.)
DQ
t
dQd
QDDQt
DQQd
tat
tQs
Va
DQd
tastasD
IV
g1
Vr ,resistance diode The
. VII where ,V
IVg then
, VV If . V
VVexpI
dV
dIVg
VVdexpIVVdexpAJJAI
Q
25
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Charge distr in a (1-sided) short diode
• Assume Nd << Na
• The sinh (see L10) excess minority carrier distribution becomes linear for Wn << Lp
pn(xn)=pn0expd(Va/
Vt)
• Total chg = Q’p =
Q’p = qpn(xn)Wn/2
x
n
x
xnc
pn(xn
)
Wn = xnc-
xn
Q’p
pn
26
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Charge distr in a 1-sided short diode
• Assume Quasi-static charge distributions
• Q’p = +qpn(xn,Va)Wn/2
• Q’p =q(W/2) x {pn(xn,Va+V)
- pn(xn,Va)}
• Wn = xnc - xn (Va)
xn
xxnc
pn(xn,Va)
Q’p
pn pn(xn,Va+V)
Q’p
27
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Cap. of a (1-sided) short diode (cont.)
p
x
x p
ntransitQQ
transitt
DQ
pt
DQQ
taaa
a
Ddx
Jp
qVV
V
I
DV
IV
VVddVdV
dVA
nc
n2W
Cr So,
. 2W
C ,V V When
exp2
WqApd2
)W(xpqAd
dQC Define area. diode A ,Q'Q
2n
dd
2n
dta
nn0nnn
pdpp
L 15 Oct 13
References
[1] Taurus Medici Medici User Guide Version A-2008.09, September 2008, ©SYNOPSYS Inc pg 3-306 – 3-315. This reference also quotes [2] below.
[2] D.J Roulston, N.D. Arora and S. G Chamberlain, “Modeling and Measurement of Minority-Carrier Versus Doping in Diffused Layers of n+-p Silicon Diodes,” IEEE Trans, Electron Devices, Vol. ED-29, pp. 284-291, Feb. 1982.
[3] Semiconductor Device Fundamentals , 2nd edition, by Robert F. Pierret, Addison Wesley, New York, 1996.
29