This is information on a product in full production.

January 2013 Doc ID 022111 Rev 6 1/25

1

STM6519

4-pin Smart Reset™

Datasheet - production data

Features■ Operating voltage range 2 V to 5.5 V

■ Low supply current 1 μA

■ Integrated test mode

■ Single Smart Reset™ push-button input with fixed extended reset setup delay (tSRC) from 0.5 s to 10 s in 0.5 s steps (typ.), option with internal input pull-up resistor

■ Push-button controlled reset pulse duration– Option 1: fully push-button controlled, no

fixed or minimum pulse width guaranteed– Option 2: defined output reset pulse

duration (tREC), factory-programmed

■ Single reset output– Active-low or active-high– Push-pull or open drain with optional

pull-up resistor

■ Fixed Smart Reset input logic voltage levels

■ Operating temperature: -40 °C to +85 °C

■ UDFN4 package 1.00 mm x 1.45 mm and UDFN6 package 1.00 mm x 1.45 mm

■ ECOPACK®2 (RoHS compliant, Halogen-Free)

Applications■ Mobile phones, smartphones, PDAs

■ e-books

■ MP3 players

■ Games

■ Portable navigation devices

■ Any application that requires delayed reset push-button response for improved system stability

UDFN6 1.00 mm x 1.45 mm

UDFN4 1.00 mm x 1.45 mm

www.st.com

Contents STM6519

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Contents

1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.1 Test mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

1.2 Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

1.3 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2 Device overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3 Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1 Power supply (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.2 Power-up sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.3 Ground (VSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.4 Smart Reset input (SR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.5 Reset output (RST) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.6 RST output undervoltage behavior (for open-drain option) . . . . . . . . . . . . 8

4 Typical application diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5 Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6 Typical operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

7 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

9 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

10 Tape and reel information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

11 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

12 Package marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

STM6519 List of tables

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List of tables

Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Table 2. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14Table 3. Operating and measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15Table 4. DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16Table 5. UDFN4, 1.00 mm x 1.45 mm x 0.50 mm, 0.65 mm pitch package mechanical data . . . . . 18Table 6. UDFN6, 1.00 mm x 1.45 mm x 0.50 mm, 0.50 mm pitch package mechanical data . . . . . 19Table 7. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22Table 8. Package marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23Table 9. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

List of figures STM6519

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List of figures

Figure 1. STM6519 logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Figure 2. UDFN4 pin connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Figure 3. UDFN6 pin connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6Figure 4. STM6519 block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7Figure 5. Typical application diagram - input, output and STM6519 device in one voltage

domain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 6. Typical application diagram - STM6519 device in a different voltage domain than

input and output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9Figure 7. Typical application diagram in different voltage domains - SR input in VBAT domain

like VCC totally disables the test mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Figure 8. RST output without tREC option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 9. RST output with tREC option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11Figure 10. Supply current (ICC) vs. temperature (TA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12Figure 11. Smart Reset delay (tSRC) vs. temperature (TA), tSRC = 4.0 s (typ.) . . . . . . . . . . . . . . . . . . 12Figure 12. Test mode entry voltage (VTEST) vs. temperature (TA). . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 13. Initial test mode time (tSRC-INI) vs. temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Figure 14. UDFN4, 1.00 mm x 1.45 mm x 0.50 mm, 0.65 mm pitch package outline . . . . . . . . . . . . . 17Figure 15. Footprint recommendation for UDFN4, 1.00 mm x 1.45 mm x 0.50 mm, 0.65 mm pitch . . 18Figure 16. UDFN6, 1.00 mm x 1.45 mm x 0.50 mm, 0.50 mm pitch package outline . . . . . . . . . . . . . 19Figure 17. Footprint recommendation for UDFN6 1.00 mm x 1.45 mm x 0.50 mm, 0.50 mm pitch. . . 20Figure 18. Carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Figure 19. Pin 1 orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21Figure 20. Package marking (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

STM6519 Description

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1 Description

The Smart ResetTM devices provide a useful feature which ensures that inadvertent short reset push-button closures do not cause system resets. This is done by implementing an extended Smart Reset input delay time (tSRC), which ensures a safe reset and eliminates the need for a specific dedicated reset button.

This reset configuration provides versatility and allows the application to distinguish between a software generated interrupt and a hard system reset. When the input push-button is connected to the microcontroller interrupt input, and is closed for a short time, the processor can only be interrupted. If the system still does not respond properly, continuing to keep the push-buttons closed for the extended setup time tSRC causes a hard reset of the processor through the reset output.

The STM6519 has one Smart Reset input (SR) with preset delayed Smart Reset setup time (tSRC). The reset output (RST) is asserted after the Smart Reset input is held active for the selected tSRC delay time. The RST output remains asserted either until the SR input goes to inactive logic level (i.e. neither fixed nor minimum reset pulse width is set) or the output reset pulse duration is fixed for tREC (i.e. factory-programmed). The device fully operates over a broad VCC range from 2.0 V to 5.5 V.

1.1 Test modeAfter pulling SR up to VTEST (VCC + 1.4 V) or above, the counter starts to count the initial shortened tSRC-INI (42 ms, typ.). After tSRC-INI expires, the RST output either goes down for tREC (if tREC option is used) or stays low as long as overvoltage on SR is detected (if tREC option is not used). This is feedback, and the user only knows that the device is locked in test mode. Each time the SR input is connected to ground in test mode, a shortened tSRC-SHORT (tSRC/128) is used instead of regular tSRC (0.5 s - 10 s). In this way the device can be quickly tested without repeating test mode triggering. Return to normal mode is possible by performing a new startup of the device (i.e. VCC goes to 0 V and back to its original state).

The advantages of this solution are its high glitch immunity, user feedback regarding entry into test mode, and testability within the full VCC range.

Description STM6519

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1.2 Logic diagram

Figure 1. STM6519 logic diagram

1.3 Pin connections

Figure 2. UDFN4 pin connections (top view)

Figure 3. UDFN6 pin connections (top view)

1. Not connected (not bonded); should be connected to VSS.

STM6519 Device overview

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2 Device overview

Figure 4. STM6519 block diagram

Table 1. Signal names

Pin numberName Type Description

UDFN6 UDFN4

1 4 RST Output Reset output, active-low, open drain.

2 1 VSS Supply ground Ground

3 2 SR Input Smart Reset input, active-low.

4 3 VCC Supply voltagePositive supply voltage for the device. A 0.1 µF decoupling ceramic capacitor is recommended to be connected between VCC and VSS pins.

5 - NC - Not connected (not bonded); should be connected to VSS.

6 - NC - Not connected (not bonded); should be connected to VSS.

Pin descriptions STM6519

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3 Pin descriptions

3.1 Power supply (VCC)This pin is used to provide power to the Smart Reset device. A 0.1 µF ceramic decoupling capacitor is recommended to be connected between the VCC and VSS pins, as close to the STM6519 device as possible.

3.2 Power-up sequenceIn normal mode, if different input side (SR) and VCC voltage domains are used, power-on sequence must avoid meeting the test mode entry condition to avoid inadvertent test mode entry: there should not be logic high present on the SR input before the VCC power-up. However VCC and V(SR) rising at the same time is OK (e.g. if both are in the same voltage domain), the device will then safely start into normal operating mode, with RST output inactive (in High-Z mode for open-drain option).

3.3 Ground (VSS)This is the ground pin for the device.

3.4 Smart Reset input (SR)Push-button Smart Reset input, active-low with optional pull-up resistor. SR input needs to be asserted for at least tSRC to assert the reset output (RST).

By connecting a voltage higher than VCC + 1.4 V to the SR input the device enters test mode (see Section 1: Description on page 5 for more information).

3.5 Reset output (RST)RST is active-low or active-high, open drain or push-pull reset output with optional internal pull-up resistor.

Output reset pulse width is optional as follows:

● Neither fixed nor minimum output reset pulse duration (releasing the push-button while reset output is active, causes the output to de-assert)

● Fixed, factory-programmed output reset pulse duration for tREC independent on Smart Reset input state.

3.6 RST output undervoltage behavior (for open-drain option)High-Z on RST output below the specified operating voltage range is guaranteed at VCC power-on or in case that valid VCC dropped while the device was idle, i.e. while both output and input were inactive.

STM6519 Typical application diagrams

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4 Typical application diagrams

Figure 5. Typical application diagram - input, output and STM6519 device in one voltage domain

Figure 6. Typical application diagram - STM6519 device in a different voltage domain than input and output

1. Open-drain RST output type and fixed SR input logic threshold allows to use the device in different voltage domains. To prevent entering test mode by creating a condition V(SR) > VCC + 1.1 V typ., VCC should be powered up before or together with voltage on the SR input.

Typical application diagrams STM6519

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Figure 7. Typical application diagram in different voltage domains - SR input in VBAT domain like VCC totally disables the test mode

STM6519 Timing diagrams

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5 Timing diagrams

Figure 8. RST output without tREC option

1. VCC should be powered up before or together with voltage on the SR input to prevent entering test mode by creating a condition V(SR) > VCC +1.1 V typ.

Figure 9. RST output with tREC option

1. VCC should be powered up before or together with voltage on the SR input to prevent entering test mode by creating a condition V(SR) > VCC +1.1 V typ.

Typical operating characteristics STM6519

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6 Typical operating characteristics

Figure 10. Supply current (ICC) vs. temperature (TA)

Figure 11. Smart Reset delay (tSRC) vs. temperature (TA), tSRC = 4.0 s (typ.)

STM6519 Typical operating characteristics

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Figure 12. Test mode entry voltage (VTEST) vs. temperature (TA)

Figure 13. Initial test mode time (tSRC-INI) vs. temperature (TA)

Maximum ratings STM6519

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7 Maximum ratings

Stressing the device above the rating listed in Table 2: Absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in Table 3: Operating and measurement conditions of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics™ SURE program and other relevant quality documents.

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit

TSTG Storage temperature (VCC off) -55 to +150 °C

TSLD(1)

1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.

Lead solder temperature for 10 seconds 260 °C

VIO Input or output voltage -0.3 to 5.5 V

VCC Supply voltage -0.3 to 7 V

ESD

VHBMElectrostatic discharge protection, human body model (JESD22-A114-B level 2)

2 kV

VRCDM Electrostatic discharge protection, charged device model, all pins 1 kV

VMMElectrostatic discharge protection, machine model, all pins (JESD22-A115-A level A)

200 V

Latch-up (VCC pin, SR reset input pin) EIA/JESD78

STM6519 DC and AC parameters

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8 DC and AC parameters

This section summarizes the operating measurement conditions, and the DC and AC characteristics of the device. The parameters in Table 4: DC and AC characteristics are derived from tests performed under the measurement conditions summarized in Table 3: Operating and measurement conditions. Designers should check that the operating conditions in their circuit match the operating conditions when relying on the quoted parameters.

Table 3. Operating and measurement conditions

Symbol Parameter Value Unit

VCC Supply voltage 2.0 to 5.5 V

TA Ambient operating temperature -40 to +85 °C

tR, tF Input rise and fall times ≤ 5 ns

Input pulse voltages 0.2 to 0.8 VCC V

Input and output timing reference voltages 0.3 to 0.7 VCC V

DC and AC parameters STM6519

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Table 4. DC and AC characteristics

Symbol Parameter Test conditions(1) Min. Typ.(2) Max. Unit

VCC Supply voltage 2.0 5.5 V

ICC Supply currentSR = VCC, tREC and tSRC counter is not running

0.4 1.0 µA

VOL Reset output voltage low

VCC ≥ 4.5 V, sinking 3.2 mA 0.3 V

VCC ≥ 3.3 V, sinking 2.5 mA 0.3 V

VCC ≥ 2.0 V, sinking 1 mA 0.3 V

tRECReset timeout delay, factory-programmed

(device option)

0.85 1.28 1.71 ms

66 100 134 ms

140 210 280 ms

240 360 480 ms

RPUOInternal output pull-up resistor on RST

(device option) 65 kΩ

ILO Output leakage currentVRST = 5.5 V, open drain device option without output pull-up resistor

-0.1 0.1 µA

Smart Reset

tSRC Smart Reset delayTA = -40 to +85 °C 0.8 x tSRC

tSRC(3)

1.2 x tSRCs

TA = 25 °C 0.9 x tSRC 1.1 x tSRC

VIL SR input voltage low VSS-0.3 0.3 V

VIH SR input voltage high 0.85 5.5 V

RPUIInternal input pull-up resistor on SR

(device option) 65 kΩ

ILEAK SR input leakage currentdevice option without input pull-up resistor

-0.1 0.1 µA

Input glitch immunity tSRC s

Test mode

VTEST Test mode entry voltage VCC +0.9 VCC +1.1 VCC +1.4 V

tSRC-INI Initial test mode time 28 42 56 ms

tSRC-SHORTShortened Smart Reset delay

tSRC / 128 ms

1. Valid for ambient operating temperature TA = -40 to +85 °C, VCC = 2.0 to 5.5 V.

2. Typical values are at 25 °C and VCC = 3.3 V unless otherwise noted.

3. Factory-programmable in the range of 0.5 s to 10 s typ. in 0.5 s steps.

STM6519 Package information

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9 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.

Figure 14. UDFN4, 1.00 mm x 1.45 mm x 0.50 mm, 0.65 mm pitch package outline

Package information STM6519

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Figure 15. Footprint recommendation for UDFN4, 1.00 mm x 1.45 mm x 0.50 mm, 0.65 mm pitch

Table 5. UDFN4, 1.00 mm x 1.45 mm x 0.50 mm, 0.65 mm pitch package mechanical data

Symbol

Dimensions

Note(1)

1. Controlling dimension: millimeters.

(mm) (inches)

Min. Typ. Max. Min. Typ. Max.

A 0.50 0.55 0.60 0.020 0.022 0.024

A1 0.00 0.02 0.05 0.000 0.001 0.002

A3 0.127 0.005

b 0.20 0.25 0.30 0.008 0.010 0.012

D 1.40 1.45 1.50 0.055 0.057 0.059

E 0.95 1.0 1.05 0.037 0.039 0.041

e 0.65 0.026

L 0.30 0.35 0.40 0.012 0.014 0.016

N 4 4

STM6519 Package information

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Figure 16. UDFN6, 1.00 mm x 1.45 mm x 0.50 mm, 0.50 mm pitch package outline

Table 6. UDFN6, 1.00 mm x 1.45 mm x 0.50 mm, 0.50 mm pitch package mechanical data

Symbol

Dimensions

Note(1)

1. Package outline exclusive of any mold flashes dimensions and metal burrs.

(mm) (inches)

Min. Typ. Max. Min. Typ. Max.

A 0.50 0.55 0.60 0.0197 0.0217 0.0236

A1 0.00 0.02 0.05 0.000 0.0008 0.0020

b 0.18 0.25 0.30 0.0071 0.0098 0.0118

D 1.40 1.45 1.50 0.0551 0.0571 0.0591

E 0.95 1.00 1.05 0.0374 0.0394 0.0413

e 0.45 0.50 0.55 0.0177 0.0197 0.0217

k 0.20 0.0079

L 0.30 0.35 0.40 0.0118 0.0138 0.0157

Package information STM6519

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Figure 17. Footprint recommendation for UDFN6 1.00 mm x 1.45 mm x 0.50 mm, 0.50 mm pitch

STM6519 Tape and reel information

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10 Tape and reel information

Figure 18. Carrier tape

1. 10-sprocket hole pitch cumulative tolerance ±0.20.

Figure 19. Pin 1 orientation

Part numbering STM6519

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11 Part numbering

Table 7. Ordering information scheme

Example: STM6519 A H A R UB 6 F

Device type

STM6519

Reset (VCC monitoring threshold) voltage VRST

A = no VCC monitoring feature

Smart Reset setup delay (tSRC)(1)

1. Smart Reset delay (tSRC) is available from 0.5 s to 10 s in 0.5 s steps (typ.). Minimum order quantities may apply. Contact local sales office for availability.

C = factory programmable tSRC = 1.5 s (typ.)

H = factory programmable tSRC = 4.0 s (typ.)

L = factory programmable tSRC = 6.0 s (typ.)

P = factory programmable tSRC = 7.5 s (typ.)

U = factory programmable tSRC = 10.0 s (typ.)

Inputs, outputs type(2)

2. Push-pull reset output type also available (active-low or active-high). SR input and open drain reset output available with optional pull-up resistor. Minimum order quantities may apply. Contact local sales office for availability.

A = active-low SR input with no pull-up, active-low open drain RST output with no pull-up

B = active-low SR input with pull-up, active-low open drain RST output with no pull-up

Reset timeout period (tREC)

A = factory programmable tREC = 210 ms (typ.)

B = factory programmable tREC = 360 ms (typ.)

E = factory programmable tREC = 1.28 ms (typ.)

F = factory programmable tREC = 100 ms (typ.)

R = push-button controlled (no defined tREC)

Package

UC = UDFN-4L

UB = UDFN-6L

Temperature range

6 = -40 °C to +85 °C

Shipping method

F = tape and reel

STM6519 Package marking information

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12 Package marking information

Figure 20. Package marking (top view)

Table 8. Package marking

Part numbertSRC(s)

Smart Reset inputs(1)

1. AL = active-low.

Output type(2)

2. OD = open drain, AL = active-low.

tREC option(3)

3. No tREC = push-button controlled reset pulse width, any other value represents typical value of tREC.

Package Topmark

STM6519AHARUC6F 4.0 AL OD, AL No tREC UDFN4 HA

STM6519ALARUC6F 6.0 AL OD, AL No tREC UDFN4 LA

STM6519APARUC6F 7.5 AL OD, AL No tREC UDFN4 PA

STM6519AUARUC6F 10.0 AL OD, AL No tREC UDFN4 UA

STM6519ACARUB6F 1.5 AL OD, AL No tREC UDFN6 CA

STM6519AHARUB6F 4.0 AL OD, AL No tREC UDFN6 HA

STM6519ALARUB6F 6.0 AL OD, AL No tREC UDFN6 LA

STM6519APAAUB6F 7.5 AL OD, AL 210 ms UDFN6 PB

STM6519APARUB6F 7.5 AL OD, AL No tREC UDFN6 PA

STM6519APBBUB6F 7.5 AL + pull-up OD, AL 360 ms UDFN6 PC

STM6519AUARUB6F 10.0 AL OD, AL No tREC UDFN6 UA

Revision history STM6519

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13 Revision history

Table 9. Document revision history

Date Revision Changes

12-Aug-2011 1 Initial release.

22-Sep-2011 2 Updated Figure 5, Table 4, Table 7 and Table 8.

07-Oct-2011 3 Removed label “Preliminary data”.

27-Oct-2011 4 Updated Figure 3 and Table 1.

13-Jun-2012 5 Updated Features, Table 4, title of Section 9.

17-Jan-2013 6

Moved Figure 4 below Table 1.

Added Section 3.2, Section 3.6, Figure 6 and Figure 7.

Updated title of Figure 5.

Updated Figure 8 and Figure 9 (added notes and minor modifications).

STM6519

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Please Read Carefully:

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