株式会社 小松精機工作所
Fabrication techniques for Metal MEMS
like as Metal Micro Pump
Tomomi Shiratori Komatsuseiki Kosakusho Co., LTD., Japan
5, Feb., 2018
4th Annual International Symposium on Technology in Medical Devices
UCI CALIT2 building auditorium
1/15
株式会社 小松精機工作所
Table of contents
1. Introduction
2. Novel processes for fabrication of
metal micro-pump
3. Conclusions
2/15
株式会社 小松精機工作所
1. Introduction
Silicon process has been adopted in general MEMS
(Micro Electro Mechanical Systems)
http://www.denso.co.jp/ja/events/tokyomotorshow
/2007/pressinformation/F_MEMS/
http://www.ritsumei-seeds.jp/80mhzmems
c) 80MHz resonatorb) Accelerometer
http://www.fujielectric.co.jp/about/technology/me
ms.html
a) Ultra-high-sensitivity gyro-
sensor
Fig. 1 General MEMS parts
3/15
株式会社 小松精機工作所
1. Introduction
Silicon micro-pump has been developed.
Fig. 2 Silicon micro-pump
If using a silicon
Flow volume limited
only nano-liter
Metal micro-pump has
been expected.
4/15
株式会社 小松精機工作所
Application area of metal micro pump
For Note PCMobile
Insulin pump
Oxygen humidifier
HouseholdFuel cell
Medical
Analyzer
Heat dissipation
device
Water cooling device
Micro mass flow sensor
Micro flow sensor
Submarine(Radio control)
Pump for aquarium
Toys and Interior
Combination
Fig. 3 Application area of metal micro pump
5/15
株式会社 小松精機工作所
1. Introduction
We make a metal micro-pump
Fig. 4 Metal micro-pump
PZT
Adhesion layer
Stainless sheet
(8 pcs)
7mm
7mm
1.00mm
INLET
OUTLET
PZT
http://www.kikuchiseisakusho.co.jp/mechatro2/MicroFluidDevice.html
Thickness
0.01mm
0.02mm
0.05mm
0.40mm
Diffusion
bonding
+
Adhesion
6/15
株式会社 小松精機工作所
1. Introduction
Using novel 3 processes for fabrication of metal micro-pump
Fig. 5 Compare of current and novel processes
Novel
processes
Effectiveness
Material Sheet forming
・Low- temperature
diffusion bonding・High-accuracy
Diffusion bonding
Low-temperature
1073K→973K
Short-bonding time
10hour → 30min
・High-productivity ・ bonded together without
leakage
・High-productivity
5μm
Fine-grained
stainless steel
Nano-metric
accuracy punching
process
【1】 【2】 【3】
Low-temperature
diffusion bonding
7/15
株式会社 小松精機工作所
Thickness: 0.010mm
Fine-grained stainless steel【1】
Coarse general grainsize : 10 μm
Fine-grained size : 1 μm
Average grainsize : 1 μm
2.Novel processes for fabrication of metal micro-pump
Effectiveness
・Decrease diffusion
bonding temperature
・Higher yield stress
8/15
株式会社 小松精機工作所
2.Novel processes for fabrication of metal micro-pump
Fig. 6 Micro piercing shape
a) Parts over all b) Valve shape
How to punch with 0.01mm thickness sheet ?
Nano-metric accuracy punching process【2】
9/15
株式会社 小松精機工作所
c) Pico second laser d) Punch shape
Laser
a) 10kN small servo press system
b) Nano-metric accuracy die
Nano-metric accuracy punching process【2】
e) Laser machining and shaving punch
2.Novel processes for fabrication of metal micro-pump 10/15
株式会社 小松精機工作所
Fig. 7 SEM image of pierced valve sheet (thickness 0.01mm)
a) Shear droop side b) Fractured surface side
500μm 500μm45 degrees slanted view 45 degrees slanted view
After punching of 0.01mm thickness stainless foil Burr can’t see in the image
Nano-metric punching process has been developed completely.
2.Novel processes for fabrication of metal micro-pump
Nano-metric accuracy punching process【2】
11/15
株式会社 小松精機工作所
Coarse-grained
Fig. 8 EBSD phase map of full-
martensitic stainless steel
: Strain induced martensitic phase
: Austenitic phase
Masahito. Katoh et al., Tetsu-to-hagane, 2016; 102: 34-
39.Fig. 9 Correlation between fracture load and bonding temperature
973K 1073K
-100K
Fine-grained material decrease diffusion bonding temperature
Fine-grained
2.Novel processes for fabrication of metal micro-pump
Low-temperature diffusion bonding 【3】
12/15
株式会社 小松精機工作所
Fig. 10 Cross section of pump
Current product Developed Construction of pump 1273K,10h 973K,30min
Low temperature and short time diffusion bonding
has been completed successfully.
2.Novel processes for fabrication of metal micro-pump
Low-temperature diffusion bonding 【3】
13/15
株式会社 小松精機工作所
Pump performance
4990
2772
1416
25
3381
2341
1309
00
1000
2000
3000
4000
5000
6000
0 20 40 60 80 100
Flo
w r
ate
[μl/
min
]
Back pressure [kPa]
Developed pump
Conventional pump
Developed technologies improve
flow volume of pump.
Fig. 11 Results of flow rate and back pressure test
Leakage between valve and valve
sheet are improved.
14/152.Novel processes for fabrication of metal micro-pump
Top Related