Fabrication techniques for Metal MEMS like as Metal Micro Pump

15
株式会社 小松精機工作所 Fabrication techniques for Metal MEMS like as Metal Micro Pump Tomomi Shiratori Komatsuseiki Kosakusho Co., LTD., Japan 5, Feb., 2018 4 th Annual International Symposium on Technology in Medical Devices UCI CALIT2 building auditorium 1/15

Transcript of Fabrication techniques for Metal MEMS like as Metal Micro Pump

株式会社 小松精機工作所

Fabrication techniques for Metal MEMS

like as Metal Micro Pump

Tomomi Shiratori Komatsuseiki Kosakusho Co., LTD., Japan

5, Feb., 2018

4th Annual International Symposium on Technology in Medical Devices

UCI CALIT2 building auditorium

1/15

株式会社 小松精機工作所

Table of contents

1. Introduction

2. Novel processes for fabrication of

metal micro-pump

3. Conclusions

2/15

株式会社 小松精機工作所

1. Introduction

Silicon process has been adopted in general MEMS

(Micro Electro Mechanical Systems)

http://www.denso.co.jp/ja/events/tokyomotorshow

/2007/pressinformation/F_MEMS/

http://www.ritsumei-seeds.jp/80mhzmems

c) 80MHz resonatorb) Accelerometer

http://www.fujielectric.co.jp/about/technology/me

ms.html

a) Ultra-high-sensitivity gyro-

sensor

Fig. 1 General MEMS parts

3/15

株式会社 小松精機工作所

1. Introduction

Silicon micro-pump has been developed.

Fig. 2 Silicon micro-pump

If using a silicon

Flow volume limited

only nano-liter

Metal micro-pump has

been expected.

4/15

株式会社 小松精機工作所

Application area of metal micro pump

For Note PCMobile

Insulin pump

Oxygen humidifier

HouseholdFuel cell

Medical

Analyzer

Heat dissipation

device

Water cooling device

Micro mass flow sensor

Micro flow sensor

Submarine(Radio control)

Pump for aquarium

Toys and Interior

Combination

Fig. 3 Application area of metal micro pump

5/15

株式会社 小松精機工作所

1. Introduction

We make a metal micro-pump

Fig. 4 Metal micro-pump

PZT

Adhesion layer

Stainless sheet

(8 pcs)

7mm

7mm

1.00mm

INLET

OUTLET

PZT

http://www.kikuchiseisakusho.co.jp/mechatro2/MicroFluidDevice.html

Thickness

0.01mm

0.02mm

0.05mm

0.40mm

Diffusion

bonding

+

Adhesion

6/15

株式会社 小松精機工作所

1. Introduction

Using novel 3 processes for fabrication of metal micro-pump

Fig. 5 Compare of current and novel processes

Novel

processes

Effectiveness

Material Sheet forming

・Low- temperature

diffusion bonding・High-accuracy

Diffusion bonding

Low-temperature

1073K→973K

Short-bonding time

10hour → 30min

・High-productivity ・ bonded together without

leakage

・High-productivity

5μm

Fine-grained

stainless steel

Nano-metric

accuracy punching

process

【1】 【2】 【3】

Low-temperature

diffusion bonding

7/15

株式会社 小松精機工作所

Thickness: 0.010mm

Fine-grained stainless steel【1】

Coarse general grainsize : 10 μm

Fine-grained size : 1 μm

Average grainsize : 1 μm

2.Novel processes for fabrication of metal micro-pump

Effectiveness

・Decrease diffusion

bonding temperature

・Higher yield stress

8/15

株式会社 小松精機工作所

2.Novel processes for fabrication of metal micro-pump

Fig. 6 Micro piercing shape

a) Parts over all b) Valve shape

How to punch with 0.01mm thickness sheet ?

Nano-metric accuracy punching process【2】

9/15

株式会社 小松精機工作所

c) Pico second laser d) Punch shape

Laser

a) 10kN small servo press system

b) Nano-metric accuracy die

Nano-metric accuracy punching process【2】

e) Laser machining and shaving punch

2.Novel processes for fabrication of metal micro-pump 10/15

株式会社 小松精機工作所

Fig. 7 SEM image of pierced valve sheet (thickness 0.01mm)

a) Shear droop side b) Fractured surface side

500μm 500μm45 degrees slanted view 45 degrees slanted view

After punching of 0.01mm thickness stainless foil Burr can’t see in the image

Nano-metric punching process has been developed completely.

2.Novel processes for fabrication of metal micro-pump

Nano-metric accuracy punching process【2】

11/15

株式会社 小松精機工作所

Coarse-grained

Fig. 8 EBSD phase map of full-

martensitic stainless steel

: Strain induced martensitic phase

: Austenitic phase

Masahito. Katoh et al., Tetsu-to-hagane, 2016; 102: 34-

39.Fig. 9 Correlation between fracture load and bonding temperature

973K 1073K

-100K

Fine-grained material decrease diffusion bonding temperature

Fine-grained

2.Novel processes for fabrication of metal micro-pump

Low-temperature diffusion bonding 【3】

12/15

株式会社 小松精機工作所

Fig. 10 Cross section of pump

Current product Developed Construction of pump 1273K,10h 973K,30min

Low temperature and short time diffusion bonding

has been completed successfully.

2.Novel processes for fabrication of metal micro-pump

Low-temperature diffusion bonding 【3】

13/15

株式会社 小松精機工作所

Pump performance

4990

2772

1416

25

3381

2341

1309

00

1000

2000

3000

4000

5000

6000

0 20 40 60 80 100

Flo

w r

ate

[μl/

min

]

Back pressure [kPa]

Developed pump

Conventional pump

Developed technologies improve

flow volume of pump.

Fig. 11 Results of flow rate and back pressure test

Leakage between valve and valve

sheet are improved.

14/152.Novel processes for fabrication of metal micro-pump

株式会社 小松精機工作所

3.Conclusion

Low-temperature diffusion bonding 【3】

Nano-metric accuracy punching process【2】

Fine-grained stainless steel【1】

Metal MEMS manufacturing succeeded by

combining 3 new techniques.

15/15