Wire Saw - SUSUNGGN STWS101.pdf · 2017. 11. 2. · I Cooling Water : 50L/min, 15 1 , 5bar I...
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Effective Length 1020mm 180~200±10㎛ wafer into Φ0.10~0.14mm wire High-precision slicing with TTV of lower than 18㎛ ≥2,800wafers/run, ≤8hour/run I www.susungtech.co.kr I Wire Saw STWS 101 Wire Saw STWS 101 Head Office. #139-13, Sandong-ri, Eumbong-myeon, Asan-si, Chungnam,336-863,Korea Tel : 82-41-584-3955 Fax : 82-41-584-7465 e-mail : [email protected] www.susungtech.co.kr China Office. Guancheng Science & Technology Park Shilong Road Guanlong Road’s Section Dongguan, Guangdong, China Tel : 86-769-2266-7702 Fax : 86-769-2226-1659
Transcript of Wire Saw - SUSUNGGN STWS101.pdf · 2017. 11. 2. · I Cooling Water : 50L/min, 15 1 , 5bar I...
Effective Length 1020mm
180~200±10㎛wafer into Φ0.10~0.14mm wire
High-precision slicing with TTV of lower than 18㎛≥2,800wafers/run, ≤8hour/run
I www.susungtech.co.kr I
Wire SawSTWS 101
Wire SawSTWS 101
Head Office. #139-13, Sandong-ri, Eumbong-myeon, Asan-si, Chungnam,336-863,KoreaTel : 82-41-584-3955 Fax : 82-41-584-7465
e-mail : [email protected] www.susungtech.co.kr
China Office. Guancheng Science & Technology Park Shilong Road Guanlong Road’s Section Dongguan, Guangdong, China
Tel : 86-769-2266-7702 Fax : 86-769-2226-1659
3700
1940
4600
2700
Machine Capability : ≥2,800wafers/run, ≤8hour/runWafer Size : 156 x 156mm or 6"(Mono & Multi Crystalline Wafer)
Wire SawSTWS 101
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w.susungtech.co.kr I
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w.susungtech.co.kr I
Basic SpecificationGuide Roller : Φ350 x 1030 mm x 2setWire Diameter : Φ0.10 ~ 0.14 mmWire Speed : Max. 15 m/sAcceleration : 2 m/s2Wire Tension : 5 ~ 25 NCutting Speed Accuracy : 0.01mm/minSlurry Control : Temperature, Density, & Indicate Mass
Flow Rate, Viscosity(Optional)Foot Print : 4600 x 2700 x 3700 mm (L x W x H)Weight : 16 ton
Facility Consumption(on Normal Operation)
Power : AC 380V 120A 80KVA, AC220V 40A (15KVA)CDA : 5bar 100Liter/minCooling Water : 50L/min, 15±1℃, 5barExhaust : 650mmHg Φ165mm 1 point
Customer BenefitsLow Cost of OwnershipWire consumption : 300km / run, 0.102km / waferSlurry Consumption : 650kg / run, 0.23kg / wafer
Efficiency oriented: 98% yield possible withThickness ±10㎛TTV ≤18㎛Saw-Mark ≤15㎛Breakage ≤0.02%(1 mm of saw mark depth)
Mass production possible2.5 million wafers per year(More than 2,800 wafers per run / Lower than 8 hours per run)Maximum Work Length : 1,020mm / work plate optional(either 2 pieces of 500mm or 3 pieces of 335mm)
User-friendly operationEasy monitoring of all process related dataUser friendly operator interfaceEasy access to all machine elements
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