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18
2013 Microchip Technology Inc. Preliminary DS70005126A-page 1 Features Small package size - 20-contact UQFN (4mm x 4mm x 0.6 mm max) • 50input and output match including DC blocks Integrated harmonic filter Operating voltage -V CC = 5.0V Operating frequency: 5.1 to 5.9 GHz High linear output power, typical performance: - 802.11a OFDM Spectrum mask compliant up to 24 dBm - 802.11n HT40 OFDM Spectrum mask compliant up to 23.5 dBm - 3% EVM up to 20.5 dBm for 802.11a, 54 Mbps signal - 2.5% EVM up to 20 dBm for 802.11n, HT40 - 1.8% EVM up to 19 dBm for 802.11ac, MCS9, 80 MHz BW (bandwidth) signal High power-added efficiency/low operating cur- rent for 54 Mbps 802.11a applications - ~11% @ P OUT = 24 dBm for 802.11a OFDM • Gain: - Typically 31 dB gain across 5.1–5.9 GHz Idle current - ~290 mA I CQ High-speed power-up/down - Turn on/off time (10%-90%) <100 ns Shut-down current (~2 μA) On-chip power detection - 20 dB linear dynamic range - VSWR insensitive All devices are RoHS compliant Applications WLAN (IEEE 802.11a/n/ac) • HyperLAN2 • Multimedia Product Description SST11CP22 is a 50, RF-matched power amplifier module (PAM) with a FCC-compliant harmonic filter that is based on the highly-reliable InGaP/GaAs HBT technology. Operating over the 5.1–5.9 GHz frequency band, SST11CP22 meets 802.11a spectrum mask require- ments up to 24 dBm and 802.11n HT40 spectrum mask at 23.5 dBm. With 802.11a modulation, this PA typically provides up to 20.5 dBm with 3% EVM, and provides 19 dBM with less tan 1.8% dynamic EVM using 802.11ac modulation, MCS9, 80 MHz bandwidth. This power amplifier module also features easy board-level operation, with a simple application circuit requiring only four external components. With its high-speed power-up/-down control and low enable control current of less than 3 mA, SST11CP22 is controllable directly from the baseband chip. SST11CP22 also features a wide dynamic-range, linear power detector that is temperature-stable and VSWR- insensitive. SST11CP22 is offered in 20-contact QFN package. See Figure 2-1 for pin assignments and Table 2-1 for pin descriptions. SST11CP22 5.1-5.9 GHz High-Power 11ac WLAN Power Amplifier

Transcript of SST11CP22 - Home | Microchip Technology Inc. Detector Voltage (V Output Power (dBm 5180 5850 5850...

Page 1: SST11CP22 - Home | Microchip Technology Inc. Detector Voltage (V Output Power (dBm 5180 5850 5850 2013 Microchip Technology Inc. Preliminary SST11CP22 1 50Ω SST11CP22 A SST11CP22

2013 Microchip Technology Inc. Preliminary DS70005126A-page 1

Features

• Small package size

- 20-contact UQFN (4mm x 4mm x 0.6 mm max)

• 50Ω input and output match including DC blocks

• Integrated harmonic filter

• Operating voltage

- VCC = 5.0V

• Operating frequency: 5.1 to 5.9 GHz

• High linear output power, typical performance:

- 802.11a OFDM Spectrum mask compliant up to 24 dBm

- 802.11n HT40 OFDM Spectrum mask compliant up to 23.5 dBm

- 3% EVM up to 20.5 dBm for 802.11a, 54 Mbps signal

- 2.5% EVM up to 20 dBm for 802.11n, HT40- 1.8% EVM up to 19 dBm for 802.11ac, MCS9,

80 MHz BW (bandwidth) signal

• High power-added efficiency/low operating cur-rent for 54 Mbps 802.11a applications

- ~11% @ POUT = 24 dBm for 802.11a OFDM

• Gain:

- Typically 31 dB gain across 5.1–5.9 GHz

• Idle current

- ~290 mA ICQ

• High-speed power-up/down

- Turn on/off time (10%-90%) <100 ns

• Shut-down current (~2 µA)

• On-chip power detection

- 20 dB linear dynamic range- VSWR insensitive

• All devices are RoHS compliant

Applications

• WLAN (IEEE 802.11a/n/ac)

• HyperLAN2

• Multimedia

Product Description

SST11CP22 is a 50Ω, RF-matched power amplifiermodule (PAM) with a FCC-compliant harmonic filterthat is based on the highly-reliable InGaP/GaAs HBTtechnology.

Operating over the 5.1–5.9 GHz frequency band,SST11CP22 meets 802.11a spectrum mask require-ments up to 24 dBm and 802.11n HT40 spectrum maskat 23.5 dBm. With 802.11a modulation, this PA typicallyprovides up to 20.5 dBm with 3% EVM, and provides19 dBM with less tan 1.8% dynamic EVM using802.11ac modulation, MCS9, 80 MHz bandwidth.

This power amplifier module also features easy board-leveloperation, with a simple application circuit requiring only fourexternal components. With its high-speed power-up/-downcontrol and low enable control current of less than 3 mA,SST11CP22 is controllable directly from the baseband chip.

SST11CP22 also features a wide dynamic-range, linearpower detector that is temperature-stable and VSWR-insensitive.

SST11CP22 is offered in 20-contact QFN package. SeeFigure 2-1 for pin assignments and Table 2-1 for pindescriptions.

SST11CP225.1-5.9 GHz High-Power 11ac WLAN Power Amplifier

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DS70005126A-page 2 Preliminary 2013 Microchip Technology Inc.

TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchipproducts. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined andenhanced as new volumes and updates are introduced.

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department viaE-mail at [email protected]. We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for currentdevices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revisionof silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site; http://www.microchip.com• Your local Microchip sales office (see last page)When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you areusing.

Customer Notification System

Register on our web site at www.microchip.com to receive the most current information on all of our products.

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2013 Microchip Technology Inc. Preliminary DS70005126A-page 3

SST11CP22

1.0 FUNCTIONAL BLOCKS

FIGURE 1-1: FUNCTIONAL BLOCK DIAGRAM

70005126 B1.0

2

1

4

3

5

6 7 8 9 10

14

15

12

13

11

20 19 18 17 16

VC

C1

VC

C3

VC

C2

GN

D

NC

NC

GND

GND

RFOUT

GND

NC

GND

RF-IN

GND

PEN

NC

NC

DE

TGND

GN

D

Bias Circuit

InputMatch

OutputMatch/Filter

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2.0 PIN ASSIGNMENTS

FIGURE 2-1: PIN ASSIGNMENTS FOR 20-CONTACT UQFN

TABLE 2-1: PIN DESCRIPTION

Symbol Pin No. Pin Name Function

GND 0 Center ground contact The center pad should be connected to RF ground with sev-eral low inductance, low resistance vias.

NC 1 No Connection Unconnected, no internal connection

GND 2 Ground

RFIN 3 RF input RF input port

GND 4 Ground

PEN 5 PA enable PA enable control input

NC 6 No Connection Unconnected, no internal connection

NC 7 No Connection Unconnected, no internal connection

NC 8 No Connection Unconnected, no internal connection

NC 9 No Connection Unconnected, no internal connection

DET 10 TX detector output TX detector output

GND 11 Ground

GND 12 Ground

RF OUT 13 RF Out RF Output port

GND 14 Ground

GND 15 Ground

GND 16 Ground

GND 17 Ground

VCC3 18 PA supply PA Supply

VCC2 19 PA supply PA Supply

VCC1 20 PA supply PA Supply

70005126 P1.0

2

1

4

3

5

6 7 8 9 10

14

15

12

13

11

20 19 18 17 16

VC

C1

VC

C3

VC

C2

GN

D

NC

NC

GND

GND

RFOUT

GND

NC

GND

RF-IN

GND

PEN

NC

NC

DE

T

GND

GN

D

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2013 Microchip Technology Inc. Preliminary DS70005126A-page 5

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3.0 ELECTRICAL SPECIFICATIONS

The AC and DC specifications for the power amplifierinterface signals. Refer to Table 3-2 for the DC voltageand current specifications. Refer to Figures 4-1 through4-8 for the RF performance.

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maxi-mum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and func-tional operation of the device at these conditions or conditions greater than those defined in the operationalsections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions mayaffect device reliability.)

Supply Voltage at pins 18, 19, and 20 (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6.5V

Supply voltage to pins 5, 6, and 7 (VPEN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.6V

DC supply current (ICC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 600 mA

Operating Temperature (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -20ºC to +85ºC

Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC

Maximum Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150ºC

Maximum Output Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 dBm

Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds

TABLE 3-1: OPERATING RANGE

Range Ambient Temp VCC

Industrial -10°C to +85°C 5.0V-6.0V

TABLE 3-2: DC ELECTRICAL CHARACTERISTICS

Symbol Parameter Min. Typ Max. Unit

VCC Supply Voltage 5.0 6.0 V

ICC Supply Current @ POUT = 20 dBm 370 mA

ICQ VCC Quiescent Current 290 mA

IOFF Shutdown Current 2 µA

VPEN Recommended Enable Voltage 2.95 V

IPEN Total Enable Current 2 mA

VDETRF Power Detector Voltage Output Range 0.4 1.5 V

Voltage at 19 dBm 1.0 V

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DS70005126A-page 6 Preliminary 2013 Microchip Technology Inc.

TABLE 3-3: AC ELECTRICAL CHARACTERISTICS FOR CONFIGURATION VCC = 5.0V, VPEN=2.95V

Symbol Parameter Min. Typ Max. Unit

FL-U Frequency range 5.1 5.9 GHz

Linear Power

Output power at 3% EVM at 54 Mbps OFDM signal, 802.11a

20.5 dBm

Output power at 2.5% dynamic EVM 802.11n HT40 20 dBm

Output power 1.8% dynamic EVM MCS9 80 MHz BW

19 dBm

ACPRA output power level with 802.11a mask com-pliance @ 6Mbps OFDM

24 dBm

ACPRN40 output power level with 802.11n HT40 mask compliance

23.5 dBm

G Power gain from 5.18-5.9 GHz 31 dB

RF Input Return Loss

Small signal 10 dB

2ƒ0 Second Harmonic Power Den-sity

Harmonics at 24 dBm -45 dBm/MHz

3ƒ0ThirdHarmonic Power Den-sity

Harmonics at 24 dBm -50 dBm/MHz

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2013 Microchip Technology Inc. Preliminary DS70005126A-page 7

SST11CP22

4.0 TYPICAL PERFORMANCE CHARACTERISTICS

Test Conditions: VCC = 5.0V, TA = 25°C, VPEN = 2.95V, 802.11a 54 Mbps OFDM Modulation Unless otherwise specified

FIGURE 4-1: S-PARAMETERS

FIGURE 4-2: EVM VERSUS OUTPUT POWER, 802.11a 54 Mbps, 100% DUTY CYCLE MEASURED WITH EQUALIZER CHANNEL ESTIMATION SET TO “SEQUENCE ONLY”, VPEN=2.95V

70005121 Sparams 1.0

-60

-50

-40

-30

-20

-10

0

10

20

30

40

0 1 2 3 4 5 6 7 8 9 10 11 12 13

S-P

aram

eter

(dB)

Frequency, GHz

S11

S21

S12

S22

70005126 F4.0

0

1

2

3

4

5

6

7

8

9

10

5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

EV

M (%

)

Output Power (dBm)

5180

5500

5850

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DS70005126A-page 8 Preliminary 2013 Microchip Technology Inc.

FIGURE 4-3: DYNAMIC EVM VERSUS OUTPUT POWER, 802.11n HT40, 50% DUTY CYCLE MEASURED WITH EQUALIZER CHANNEL ESTIMATION SET TO “SEQUENCE ONLY”, VPEN=2.95V

FIGURE 4-4: DYNAMIC EVM VERSUS OUTPUT POWER, 802.11ac MCS9, 80 MHz, 60 µS PULSE, 50% DUTY CYCLE, MEASURED WITH EQUALIZER CHANNEL ESTIMATION SET TO SEQUENCE ONLY, VPEN=2.95V

70005126 F5.0

0.0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

9.0

10.0

5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

EV

M (%

)

Output Power (dBm)

5180

5500

5850

70005126 F6.0

0.0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

9.0

10.0

5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

EV

M (%

)

Output Power (dBm)

5180

5500

5850

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2013 Microchip Technology Inc. Preliminary DS70005126A-page 9

SST11CP22

FIGURE 4-5: POWER SUPPLY CURRENT VERSUS OUTPUT POWER, VCC = 5.0V, 802.11a 54 Mbps, 100% DUTY CYCLE, VPEN=2.95V

FIGURE 4-6: INSTANTANEOUS POWER SUPPLY CURRENT VERSUS OUTPUT POWER, VCC=5.0V, 802.11ac MCS9, 80 MHz, 60 µs PULSE, 50% DUTY CYCLE VPEN=2.95V

70005126 F7.0

260270280290300310320330340350360370380390400410420

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

Supp

ly C

urre

nt (m

A)

Output Power (dBm)

5180

5500

5850

70005126 F8.0

260270280290300310320330340350360370380390400410420

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

Supp

ly C

urre

nt (m

A

Output Power (dBm

5180

5500

5850

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DS70005126A-page 10 Preliminary 2013 Microchip Technology Inc.

FIGURE 4-7: POWER GAIN VERSUS OUTPUT POWER

FIGURE 4-8: DETECTOR VOLTAGE VERSUS OUTPUT POWER, VPEN=2.95V

70005126 F9.0

10121416182022242628303234363840

10 11 12 13 14 15 16 17 18 19 20 21 22 23

Pow

er G

ain

(dB

)

Output Power (dBm)

5180

5500

5850

70005126 F10.0

0.000.100.200.300.400.500.600.700.800.901.001.101.20

0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25

Det

ecto

r Vol

tage

(V

Output Power (dBm

5180

5850

5850

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2013 Microchip Technology Inc. Preliminary DS70005126A-page 11

SST11CP22

FIGURE 4-9: TYPICAL SCHEMATIC FOR 802.11a/n/ac APPLICATIONS, VCC=5.0V, VPEN=2.95V

70005126 schematic 1.1

2

1

4

3

5

6 7 8 9 10

14

15

12

13

11

20 19 18 17 16

50Ω

0.1 µF

RFIN

PEN

DET

50ΩRFOUT

VCC0.1 µF0.1 µF2.2 µF

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DS70005126A-page 12 Preliminary 2013 Microchip Technology Inc.

5.0 PACKAGE INFORMATION

BA

0.20 C

0.20 C

D

D2

E2

E

20 X b0.07 C A B0.05 C

(DATUM B)(DATUM A)

CSEATING

PLANE

NOTE 1

1

2

N

2XTOP VIEW

SIDE VIEW

BOTTOM VIEW

For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging

Note:

e

NOTE 1

1

2

N

0.10 C A B

0.10 C A B

(A3)

0.10 C

0.08 C

A1

Microchip Technology Drawing C04-252A Sheet 1 of 2

20-Lead Ultra Thin Quad Flat Pack, No Lead (GN) - 4x4x0.55 mm Body (UQFN)

2X

K

L

A

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SST11CP22

Microchip Technology Drawing C04-252A Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging

Note:

20-Lead Ultra Thin Quad Flat Pack, No Lead (GN) - 4x4x0.55 mm Body (UQFN)

Number of Pins

Overall Height

Terminal Width

Overall Width

Overall Length

Terminal Length

Exposed Pad Width

Exposed Pad Length

Terminal Thickness

Pitch

Standoff

UnitsDimension Limits

A1A

b

DE2

D2

(A3)

e

L

E

N0.50 BSC

0.15 REF

2.45

2.45

0.350.20

0.500.00

0.25

4.00 BSC

0.40

2.50

2.50

0.550.02

4.00 BSC

MILLIMETERSMIN NOM

20

2.55

2.55

0.450.30

0.600.05

MAX

K -0.20 -

REF: Reference Dimension, usually without tolerance, for information purposes only.BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.2.3.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.Package is saw singulatedDimensioning and tolerancing per ASME Y14.5M

Terminal-to-Exposed-Pad

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DS70005126A-page 14 Preliminary 2013 Microchip Technology Inc.

TABLE 5-1: REVISION HISTORY

Revision Description Date

A • Initial release of data sheet Jul 2013

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2013 Microchip Technology Inc. Preliminary DS70005126A-page 15

SST11CP22

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site atwww.microchip.com. This web site is used as a meansto make files and information easily available tocustomers. Accessible by using your favorite Internetbrowser, the web site contains the followinginformation:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keepcustomers current on Microchip products. Subscriberswill receive e-mail notification whenever there arechanges, updates, revisions or errata related to aspecified product family or development tool of interest.

To register, access the Microchip web site atwww.microchip.com. Under “Support”, click on“Customer Change Notification” and follow theregistration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistancethrough several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor,representative or field application engineer (FAE) forsupport. Local sales offices are also available to helpcustomers. A listing of sales offices and locations isincluded in the back of this document.

Technical support is available through the web siteat: http://microchip.com/support

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DS70005126A-page 16 Preliminary 2013 Microchip Technology Inc.

6.0 PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

Device

Device: SST11CP22 = 51.-5.9 GHz Power Amplifier

Package: GN = UQFN (4mm x 4mm), 0.6 max thickness 20-contact

Evaluation KitFlag

K = Evaluation Kit

Valid Combinations:

SST11CP22-GNSST11CP22-GN-K

XXX

Package

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2013 Microchip Technology Inc. Preliminary DS70005126A-page 17

Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

© 2013, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-62077-285-0

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

QUALITY MANAGEMENT SYSTEMCERTIFIED BY DNV

== ISO/TS 16949 ==

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