SO8 SOT96-1plastic, small outline package; 8 terminals; 1.27 mm pitch; 4.9mm x 3.9 mm x 1.75 mm body9 January 2017 Package information

1. Package summaryDimensions (mm) 4.9 x 3.9 x 1.75

Terminal position code D (double)

Package type descriptive code SO8

Package outline version code SOT96-1

Manufacturer package code SOT96

Package type industry code SO8

Package outline version description plastic, small outline package; 8 terminals; 1.27mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body

Package style descriptive code SO (small outline)

Package body material type P

IEC package outline code 076E03

JEDEC package outline code MS-012

Handling precautions IC26_CHAPTER_3_2000

Thermal design considerations IC26_CHAPTER_6_2000

Mounting method type S (surface mount)

Generic mounting and soldering information AN10365_3

Reflow soldering footprint SO-SOJ-REFLOW

Wave soldering footprint SO-SOJ-WAVE

Package life cycle status REL

Major version date 18-9-2008

Minor version date 14-5-2012

Security status COMPANY PUBLIC

Modified date 23-10-2012

Issue date 18-2-2003

Web publication date 28-11-2012

Initial web publication date 11-3-2011

Customer specific indicator N

Maturity Product

Package author Nair Deepa

Package approver Nair Deepa

Table 1. Package summarySymbol Parameter Min Typ Nom Max Unit

A2 package height 1.25 - 1.35 1.45 mm

NXP Semiconductors SOT96-1plastic, small outline package; 8 terminals; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body

SOT96-1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved

Package information 9 January 2017 2 / 6

Symbol Parameter Min Typ Nom Max Unit

A seated height - - 1.75 1.75 mm

D package length 4.8 - 4.9 5 mm

E package width 3.8 - 3.9 4 mm

e nominal pitch - - 1.27 - mm

n2 actual quantity of termination - - 8 -

NXP Semiconductors SOT96-1plastic, small outline package; 8 terminals; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body

SOT96-1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved

Package information 9 January 2017 3 / 6

2. Package outline

UNITA

max. A1 A2 A3 bp c D(1) E(2) (1)e HE L Lp Q Zywv θ

REFERENCESOUTLINEVERSION

EUROPEANPROJECTION ISSUE DATE

IEC JEDEC JEITA

mm

inches

1.75 0.250.10

1.451.25 0.25 0.49

0.360.250.19

5.04.8

4.03.8 1.27 6.2

5.8 1.05 0.70.6

0.70.3 8

0

oo

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.00.4

SOT96-1

X

w M

θ

AA1A2

bp

D

HE

L p

Q

detail X

E

Z

e

c

L

v M A

(A )3

A

4

5

pin 1 index

1

8

y

076E03 MS-012

0.069 0.0100.004

0.0570.049 0.01 0.019

0.0140.01000.0075

0.200.19

0.160.15 0.05 0.244

0.2280.0280.024

0.0280.0120.010.010.041 0.0040.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

99-12-2703-02-18

Fig. 1. Package outline SO8 (SOT96-1)

NXP Semiconductors SOT96-1plastic, small outline package; 8 terminals; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body

SOT96-1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved

Package information 9 January 2017 4 / 6

3. Soldering

sot096-1_froccupied area

solder lands

Dimensions in mmplacement accuracy ± 0.25

1.30

0.60 (8×)

1.27 (6×)

4.00 6.60

5.50

7.00

Fig. 2. Reflow soldering footprint for SO8 (SOT96-1)

sot096-1_fw

solder resist

occupied area

solder lands

Dimensions in mm

board direction

placement accurracy ± 0.25

4.00

5.50

1.30

0.3 (2×)0.60 (6×)

1.20 (2×)

1.27 (6×)

7.006.60

enlarged solder land

Fig. 3. Wave soldering footprint for SO8 (SOT96-1)

NXP Semiconductors SOT96-1plastic, small outline package; 8 terminals; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body

SOT96-1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved

Package information 9 January 2017 5 / 6

4. Legal information

DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, NXP Semiconductors does not giveany representations or warranties, expressed or implied, as to the accuracyor completeness of such information and shall have no liability for theconsequences of use of such information. NXP Semiconductors takes noresponsibility for the content in this document if provided by an informationsource outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removalor replacement of any products or rework charges) whether or not suchdamages are based on tort (including negligence), warranty, breach ofcontract or any other legal theory.

Notwithstanding any damages that customer might incur for any reasonwhatsoever, NXP Semiconductors’ aggregate and cumulative liability towardscustomer for the products described herein shall be limited in accordancewith the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right tomake changes to information published in this document, including withoutlimitation specifications and product descriptions, at any time and withoutnotice. This document supersedes and replaces all information supplied priorto the publication hereof.

NXP Semiconductors SOT96-1plastic, small outline package; 8 terminals; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body

SOT96-1 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved

Package information 9 January 2017 6 / 6

5. Contents

1. Package summary........................................................ 12. Package outline............................................................ 33. Soldering....................................................................... 44. Legal information......................................................... 5

© NXP Semiconductors N.V. 2017. All rights reservedFor more information, please visit: http://www.nxp.comFor sales office addresses, please send an email to: salesaddresses@nxp.comDate of release: 9 January 2017