PESD1IVN24-A 2. Features and benefits 3. Applications€¢ Reverse stand-off voltage: VRWM = 24 V...

PESD1IVN24-AESD protection for In-vehicle networks16 November 2017 Product data sheet

1. General descriptionESD protection device in a small SOD323 (SC-76) Surface-Mounted Device (SMD) plasticpackage designed to protect automotive In-vehicle network bus lines from the damage caused byElectroStatic discharge (ESD) and other transients.

2. Features and benefits• Reverse stand-off voltage: VRWM = 24 V• Low clamping voltage: VCL= 33 V at IPP = 3.5 A• ESD protection up to 30 kV (IEC 61000-4-2)• ESD protection up to 30 kV (ISO 10605: C = 330 pF, R = 330 Ω)• ISO 7637-3: Pulse a: VS = -150 V / Pulse b: VS = +100 V• Ultra low leakage current: IRM < 1 nA• Qualified according to AEC-Q101 / Automotive grade

3. ApplicationsESD protection for In-vehicle network lines in automotive enviroments

• CAN• LIN• FlexRay• SENT

4. Quick reference data

Table 1. Quick reference dataSymbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoffvoltage

Tamb = 25 °C - - 24 V

IPPM rated peak pulsecurrent

tp = 8/20 µs [1] - - 3.5 A

VCL clamping voltage IPPM = 3.5 A; tp = 8/20 µs; Tamb = 25 °C [1] - 33 42 V

[1] Device stressed with 8/20 μs exponential decay waveform according to IEC 61000-4-5.

Nexperia PESD1IVN24-AESD protection for In-vehicle networks

PESD1IVN24-A All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2017. All rights reserved

Product data sheet 16 November 2017 2 / 12

5. Pinning information

Table 2. Pinning informationPin Symbol Description Simplified outline Graphic symbol

1 K1 cathode (diode 1)

2 K2 cathode (diode 2)

21

SOD323006aab041

1 2

6. Ordering information

Table 3. Ordering informationPackageType number

Name Description Version

PESD1IVN24-A SOD323 plastic, surface-mounted package; 2 leads; 1.3 mm pitch; 1.7mm x 1.25 mm x 0.95 mm body

SOD323

7. Marking

Table 4. Marking codesType number Marking code

PESD1IVN24-A AJ




8. Limiting values

Table 5. Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit

IPPM rated peak pulse current tp = 8/20 µs [1] - 3.5 A

Tj junction temperature - 150 °C

Tamb ambient temperature -55 150 °C

Tstg storage temperature -65 150 °C

ESD maximum ratings

IEC 61000-4-2; contact discharge [2] - 30 kV

ISO 10605: contact discharge;C = 330 pF, R = 330 Ω

[2] - 30 kV

VESD electrostatic dischargevoltage

ISO 10605: contact discharge;C = 150 pF, R = 330 Ω

[2] - 30 kV

[1] Device stressed with 8/20 μs exponential decay waveform according to IEC 61000-4-5.[2] Device stressed with ten non-repetitive ESD pulses.

t (µs)0 403010 20

001aaa630

40

80

120

IPP(%)

0

e-t

100 % IPP; 8 µs

50 % IPP; 20 µs

Fig. 1. 8/20 µs pulse waveform according toIEC 61000-4-5

001aaa631

IPP

100 %

90 %

t

30 ns60 ns

10 %

tr = 0.6 ns to 1 ns

Fig. 2. ESD pulse waveform according toIEC 61000-4-2




9. Characteristics

Table 6. CharacteristicsSymbol Parameter Conditions Min Typ Max Unit

VRWM reverse standoffvoltage

Tamb = 25 °C - - 24 V

VBR breakdown voltage IR = 10 mA; Tamb = 25 °C 25.5 30.5 35.5 V

IRM reverse leakagecurrent

VR = 24 V; Tamb = 25 °C - 1 50 nA

Cd diode capacitance f = 1 MHz; VR = 0 V; Tamb = 25 °C - 14 17 pF

IPPM = 1 A; tp = 8/20 µs; Tamb = 25 °C [1] - 31 40 V

IPPM = 3.5 A; tp = 8/20 µs; Tamb = 25 °C [1] - 33 42 V

VCL clamping voltage

IPP = 16 A; tp = TLP; Tamb = 25 °C [2] - 32 - V

Rdyn dynamic resistance IR = 10 A; Tamb = 25 °C [2] - 0.2 - Ω

[1] Device stressed with 8/20 μs exponential decay waveform according to IEC 61000-4-5.[2] Non-repetitive current pulse, Transmission Line Pulse (TLP); square pulse; ANSI / ESD STM5.5.1-2008

006aaa676

- VCL - VBR - VRWMVCLVBRVRWM- IRM

IRM

- IR

IR

- IPP

IPP

- +

Fig. 3. V-I characteristics for a bidirectional ESDprotection diode

VR (V)-25 255-5-15 15

aaa-02770716

Cd(pF)

0

2

4

6

8

10

12

14

Fig. 4. Diode capacitance as a function of reversevoltage, typical values




VCL (V)0 5040302010

aaa-02770870

IPP(A)

0

Rdyn = 0.16 Ω

10

20

30

40

50

60

tp=100 ns; Transmission Line Pulse (TLP)

Fig. 5. Positive clamping voltage (TLP); typical values

VCL (V)-50 0-10-20-30-40

aaa-0277090IPP

(A)

-90

Rdyn = 0.16 Ω

-80

-70

-60

-50

-40

-30

-20

-10

tp=100 ns; Transmission Line Pulse (TLP)

Fig. 6. Negative clamping voltage (TLP); typical valuesaaa-027719

tp (ms)10-1 1 10

102

PPP(W)

1

10

Fig. 7. Peak pulse power as a function of exponentialpulse duration; typical values

Tj (°C)0 20015050 100

001aaa193

0.4

0.8

1.2

PPP

0

PPP(25°C)

Fig. 8. Relative variation of peak pulse power as afunction of junction temperature; typical values




50 Ω

Rd

Cs

DUT(DEVICEUNDERTEST)

RG 223/U50 Ω coax

ESD TESTER

IEC 61000-4-2 ed.2Cs = 150 pF; Rd = 330 Ω

4 GHz DIGITALOSCILLOSCOPE

40 dBATTENUATOR

unclamped +8 kV ESD pulse waveform(IEC 61000-4-2 network)

0

6

2

10

V(kV)

-2

t (ns)-10 7030

4

8

4020100 50 60

unclamped -8 kV ESD pulse waveform(IEC 61000-4-2 network)

-8

-2

-6

2

V(kV)

-10

t (ns)-10 7030

-4

0

4020100 50 60

aaa-003952

Fig. 9. ESD clamping test setup and waveforms

t (ns)-10 700 6050403010 20

aaa-027505

20

60

-20

100

140

VCL(V)

-60

Fig. 10. Clamped +8 kV pulse waveform (IEC 61000-4-2network)

t (ns)-10 700 6050403010 20

aaa-027506

-40

0

-80

40

80

VCL(V)

-120

Fig. 11. Clamped -8 kV pulse waveform (IEC 61000-4-2network)




10. Application informationThe PESD1IVN24-A is designed for the protection of one automotive IVN bus line from thedamage caused by ESD and surge pulses.

aaa-027525

LINtransceiver

PESD1IVNx

CMASTER/SLAVE

CBAT

application (e.g. voltage regulator and microcontroller)

power application (e.g. electro motor, inductive loads)

LIN nodeconnector

BAT

GND

LIN

1

2

Fig. 12. Typical application: ESD protection of one automotive LIN bus line

Circuit board layout and protection device placement

Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surgetransients. The following guidelines are recommended:

1. Place the device as close to the input terminal or connector as possible.2. Minimize the path length between the device and the protected line.3. Keep parallel signal paths to a minimum.4. Avoid running protected conductors in parallel with unprotected conductors.5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.6. Minimize the length of the transient return path to ground.7. Avoid using shared transient return paths to a common ground point.8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.




11. Package outline

REFERENCESOUTLINEVERSION

EUROPEANPROJECTION ISSUE DATE

IEC JEDEC JEITA

SOD323 SC-76

SOD323

03-12-1706-03-16

Note1. The marking bar indicates the cathode

UNIT A

mm 0.051.10.8

0.400.25

0.250.10

1.81.6

1.351.15

2.72.3

0.450.15

A1max

DIMENSIONS (mm are the original dimensions)

Plastic surface-mounted package; 2 leads

0 1

(1)

21

2 mm

scale

bp c D E HD Q

0.250.15

Lp v

0.2

AD

A

E

Lp

bp

detail X

A1c

Q

HD v AM

X

Fig. 13. Package outline SOD323




12. Soldering

0.951.65

2.2

2.1

3.05

solder lands

solder resist

occupied area

solder paste

0.5(2×)0.6(2×)

0.6 (2×)0.5 (2×)

sod323_fr

Dimensions in mm

Fig. 14. Reflow soldering footprint for SOD323

1.5 (2×)

2.9

5

1.2(2×)2.75

sod323_fw

solder lands

solder resist

occupied area

preferred transportdirection during soldering

Dimensions in mm

Fig. 15. Wave soldering footprint for SOD323




13. Revision history

Table 7. Revision historyData sheet ID Release date Data sheet status Change notice Supersedes

PESD1IVN24-A v.1 20171116 Product data sheet - -




14. Legal information

Data sheet status

Documentstatus [1][2]

Productstatus [3]

Definition

Objective[short] datasheet

Development This document contains data fromthe objective specification for productdevelopment.

Preliminary[short] datasheet

Qualification This document contains data from thepreliminary specification.

Product[short] datasheet

Production This document contains the productspecification.

[1] Please consult the most recently issued document before initiating orcompleting a design.

[2] The term 'short data sheet' is explained in section "Definitions".[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL http://www.nexperia.com.

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Limiting values — Stress above one or more limiting values (as defined inthe Absolute Maximum Ratings System of IEC 60134) will cause permanentdamage to the device. Limiting values are stress ratings only and (proper)operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or theCharacteristics sections of this document is not warranted. Constant orrepeated exposure to limiting values will permanently and irreversibly affectthe quality and reliability of the device.

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15. Contents

1. General description......................................................12. Features and benefits.................................................. 13. Applications.................................................................. 14. Quick reference data....................................................15. Pinning information......................................................26. Ordering information....................................................27. Marking..........................................................................28. Limiting values............................................................. 39. Characteristics..............................................................410. Application information............................................. 711. Package outline.......................................................... 812. Soldering..................................................................... 913. Revision history........................................................1014. Legal information..................................................... 11

© Nexperia B.V. 2017. All rights reservedFor more information, please visit: http://www.nexperia.comFor sales office addresses, please send an email to: [email protected] of release: 16 November 2017

PESD1IVN24-A 2. Features and benefits 3. Applications€¢ Reverse stand-off voltage: VRWM = 24 V...

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Transcript of PESD1IVN24-A 2. Features and benefits 3. Applications€¢ Reverse stand-off voltage: VRWM = 24 V...