Wafer Probing Machine

Overall AccuracyWafer SizeX-Y axis

Z axis

axisFine Alignment Loader

Hard DiskUSB InterfaceDisplay Power Consumption Air Supply

Vacuum Supply

DimensionWeight

Probing AreaMaximum SpeedFull Stroke Maximum SpeedRotation Range

Cassette MountsWafer Handling

Source PressureConsumptionSource PressureConsumption

Within 1.8m(in accordance with company-defined conditions) 200mm300mm170 mm (X-Y axis probing area) X axis: 500 mm/sec, Y axis: 500 mm/sec37mm30mm/S4CCD lTV pattern matching 1 (2nd cassette with option) Wafer back surface handling arm 3.5" 40 GBUse of external memory possible 15-inch TFT high-resolution color LCD AC 200 V, 50/60 Hz, Max: 3 kVA or less (includes high-temperature specifications) 0.6 0.99MPaApprox 0.1/ wafer-53 -100kPa30/min 1525W1622D967Hmm (1422H mm: includes loading port) 1650 kg (standard)

Chuck: Normal Temperature/High Temperature/Low Temperature/Ultra-Low Temperature (Low Noise Option On All Chucks Available) APC: Automatic Probe Card Changer Cassette ID Reader Wafer ID Reader (Front Surface/Back Surface) Printer GP-IB Interface XY Coordinator Interface Wafer Probing Machine Network System (Veganet, Light-Veganet, Vega-Planet, GEM, PMI Viewer)

Full Contact Probing Multi-Die Probing Needle Cleaning Mini-Environment PMI: Probe Mark Inspection Various Test Heads / Probe Card Connecting Parts Loader: Double Loader/Various Automated Loaders Including OHT HST: Head Stage Tilt Unit (Probe Card Tilt Unit)

GEMLight-Veganet

MAP Editor

EthernetEthernet

PMI VeiwerReoteController

DeviceCommander

Veganet

FP200A

UF200R

UF190R

UF2000UF3000EX-e

UF3000EXFP3000

OTS (Optical Target Scope)

Optical Target Scope (OTS) : Measures relative positions of probe card and chuck with absolute accuracy. By OTS wafer alignment technology we have created a new global benchmark in high-precision positioning systems

Real-time wafer handling status has been made possible via the navigation display function. With a simple touch on the wafer map the operator can easily navigate to any desired wafer location.

GUI

Handling navigaton display Wafer map display

Automation with ACCRETECHNetwork Options for Customer test floor automation

Network OptionVeganet1. Automate Prober Process 2. Manage Process Information to

Reduce Down Time 3. Support Data Analysis

GEM1. Base on SEMI SECS-I HSMS-SS 2. Direct Communication to CIM

Variable Status data collection Alarm Management

Remote Control etc 3. Automated loading possible

using OHT RGV etc.

Light-Veganet1. Data Management Device data Measurement data 2. Low Cost (Utilize user's host

network)

Vega-Planet: Network tool Device Data Editor: Create Device Data

Log Analyzer: Quick Error Recovery

Remote Controller: Monitoring & Control

MAP Editor: Visual Analyzing Tool

Device data PAD data MAP data

Error Helpdisplay Interfacehistory

Running Status Management Central Prober operation

Wafer Map display Data analysis

The World's No.l supplier presents the Next Generation probing machine --

The synergistic effects of the new algorithm and the newly developed purpose-built XY stage drive unit enabled throughput to reach phenomenal levels. The improved z-stage provides highest level of probe force for uniform contact on large array/high pin count probe cards. An optimal structural design that employs topology ensures excellent contact by eliminating any flatness changes resulting from positioning.

High-rigidity Z-axis large size cleaning unit

15inch LCD touch screen

Automation with ACCRETECH

Network Option

Vega-Planet: Network tool

Network Options for Customer test floor automation

Veganet1. Automate Prober Process

2. Manage Process Information to Reduce Down Time

3. Support Data Analysis

Device data Running Status Management

Data analysis

Map data Central Prober operation

Wafer Map display

PAD data

Device Data Editor: Create Device Data Remote Controller: Monitoring & Control

MAP Editor: Visual Analyzing Tool

1. Base on SEMI SECS-I, HSMS-SS

2. Direct Communication to CIM Variable, Status data collection Alarm Management

3. Automated loading possible using OHT, RGV, etc.

1. Data Management Device data Measurement data

2. Low Cost (Utilize user's host network)

GEM Light-Veganet

Probe mark analysis Probe mark distribution display

PMI Viewer: Display and analysis of probe mark

GEMLight-Veganet

MAP Editor

EthernetEthernet

PMI VeiwerReoteController

DeviceCommander

Veganet

FP200A

UF200R

UF190R

UF2000UF3000EX-e

UF3000EXFP3000

OTS (Optical Target Scope)

Optical Target Scope (OTS) : Measures relative positions of probe card and chuck with absolute accuracy. By OTS wafer alignment technology we have created a new global benchmark in high-precision positioning systems

Real-time wafer handling status has been made possible via the navigation display function. With a simple touch on the wafer map the operator can easily navigate to any desired wafer location.

GUI

Handling navigaton display Wafer map display

Automation with ACCRETECHNetwork Options for Customer test floor automation

Network OptionVeganet1. Automate Prober Process 2. Manage Process Information to

Reduce Down Time 3. Support Data Analysis

GEM1. Base on SEMI SECS-I HSMS-SS 2. Direct Communication to CIM

Variable Status data collection Alarm Management

Remote Control etc 3. Automated loading possible

using OHT RGV etc.

Light-Veganet1. Data Management Device data Measurement data 2. Low Cost (Utilize user's host

network)

Vega-Planet: Network tool Device Data Editor: Create Device Data

Log Analyzer: Quick Error Recovery

Remote Controller: Monitoring & Control

MAP Editor: Visual Analyzing Tool

Device data PAD data MAP data

Error Helpdisplay Interfacehistory

Running Status Management Central Prober operation

Wafer Map display Data analysis

The World's No.l supplier presents the Next Generation probing machine --

The synergistic effects of the new algorithm and the newly developed purpose-built XY stage drive unit enabled throughput to reach phenomenal levels. The improved z-stage provides highest level of probe force for uniform contact on large array/high pin count probe cards. An optimal structural design that employs topology ensures excellent contact by eliminating any flatness changes resulting from positioning.

High-rigidity Z-axis large size cleaning unit

15inch LCD touch screen

Overall AccuracyWafer SizeX-Y axis

Z axis

axisFine Alignment Loader

Hard DiskUSB InterfaceDisplay Power Consumption Air Supply

Vacuum Supply

DimensionWeight

Probing AreaMaximum SpeedFull Stroke Maximum SpeedRotation Range

Cassette MountsWafer Handling

Source PressureConsumptionSource PressureConsumption

Within 1.8m(in accordance with company-defined conditions) 200mm300mm170 mm (X-Y axis probing area) X axis: 500 mm/sec, Y axis: 500 mm/sec37mm30mm/S4CCD lTV pattern matching 1 (2nd cassette with option) Wafer back surface handling arm 3.5" 40 GBUse of external memory possible 15-inch TFT high-resolution color LCD AC 200 V, 50/60 Hz, Max: 3 kVA or less (includes high-temperature specifications) 0.6 0.99MPaApprox 0.1/ wafer-53 -100kPa30/min 1525W1622D967Hmm (1422H mm: includes loading port) 1650 kg (standard)

Chuck: Normal Temperature/High Temperature/Low Temperature/Ultra-Low Temperature (Low Noise Option On All Chucks Available) APC: Automatic Probe Card Changer Cassette ID Reader Wafer ID Reader (Front Surface/Back Surface) Printer GP-IB Interface XY Coordinator Interface Wafer Probing Machine Network System (Veganet, Light-Veganet, Vega-Planet, GEM, PMI Viewer)

Full Contact Probing Multi-Die Probing Needle Cleaning Mini-Environment PMI: Probe Mark Inspection Various Test Heads / Probe Card Connecting Parts Loader: Double Loader/Various Automated Loaders Including OHT HST: Head Stage Tilt Unit (Probe Card Tilt Unit)

UF3000EX SPECIFICATIONS

Main Options

C-91-556-E-1302

International Marketing Dept. http://www.accretech.jpJapanTel: 81 (42) 642-0381 Fax: 81 (42) 631-5234

North AmericaAccretech America Inc.(Head Office)Tel: 1 (214 459-1688 Fax: 1 (214) 459-1696(Fremont Office)Tel: 1 (510) 344-5411 Fax: 1 (510) 344-5410(Boise Office)Tel: 1 (208) 429-6500 Fax: 1 (208) 429-6555

EuropeAccretech (Europe) GmbH(Head Office / Germany)Tel: 49 (89) 546788-0 Fax: 49 (89) 546788-10(Dresden Office)Tel: 49 (351) 89024-11 Fax: 49 (351) 89024-12(French Office)Tel: 33 (476) 04-4080 Fax: 33 (476) 04-0730(Milan Office)Tel: 39 (02) 92112357 Fax: 39 (02) 92111477

KoreaAccretech Korea Co., Ltd.Tel: 82 (31) 786-4000 Fax: 82 (31) 786-4090

TaiwanAccretech Taiwan Co., Ltd.Tel: 886-3-5531300 Fax: 886-3-5531319

MalaysiaAccretech (Malaysia) Sdn. Bhd.(Head Office)Tel: 60 (3) 5632-7488 Fax: 60 (3) 5632-7489(Kulim Office)Tel: 60 (4) 4930082 Fax: 60 (4) 4930082

SingaporeAccretech Singapore Pte. Ltd.Tel: 65 (6853) 5119 Fax: 65 (6484) 4327

ThailandTokyo Seimitsu Thailand Co., Ltd.(Semiconductor)Tel: (66) 2 982 8337, 8338 Fax: (66) 2 982 8339

ChinaAccretech China Co., Ltd.(Head Office / Shanghai)Tel: 86 (21) 3887-0801 Fax: 86 (21) 3887-0805

(Wuxi Office)Tel: 86 (510) 8522-3533 Fax: 86 (510) 8101-7346(Suzhou Office)Tel: 86 (512) 6265-6436 Fax: 86 (512) 6265-6435(Shenzhen Office)Tel: 86 (755) 2515-9842 Fax: 86 (755) 2515-7737(Chengdu Office)Tel: 86 (28) 8738-2279 Fax: 86 (28) 8738-2279(Beijing Office)Tel: 86 (10) 8447-7011 Fax: 86 (10) 8447-7010