Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural...

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Miniaturized Energy-Efficient Integrated Neural Interfaces Chul Kim Department of Bio and Brain Engineering KAIST

Transcript of Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural...

Page 1: Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires CICC2017, JSSC2018b, JSSC2018c,

Miniaturized Energy-Efficient Integrated Neural Interfaces

Chul KimDepartment of Bio and Brain Engineering

KAIST

Page 2: Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires CICC2017, JSSC2018b, JSSC2018c,

Microelectrocorticography (µECoG)

Emerging µECoG technologies- High spatiotemporal resolution- Fully implantable

- Minimally invasive- Long-term monitoring

Slide 1

Emerging μECoG TechnologiesFlexibleArray Modular

Page 3: Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires CICC2017, JSSC2018b, JSSC2018c,

ENIAC:Encapsulated Neural Interfacing and Acquisition Chip

No external components or wires

CICC2017, JSSC2018b, JSSC2018c, JSSC2017, VLSI2015a, VLSI2016, ProcIEEE2017, BioCAS2017Slide 12

Page 4: Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires CICC2017, JSSC2018b, JSSC2018c,

Slide 3

Neural Recording ADC – State-of-the-Art

Large GainMax

range

Page 5: Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires CICC2017, JSSC2018b, JSSC2018c,

Slide 4

Neural Recording ADC – Improvements

ADC-Direct Front-End

Maxrange

JSSC2018b

Page 6: Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires CICC2017, JSSC2018b, JSSC2018c,

Neural Recording ADC – Micrograph

Slide 5ISSCC2018

Page 7: Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires CICC2017, JSSC2018b, JSSC2018c,

Slide 6ISSCC2018, JSSC2018b

Neural Recording ADC – in vivo testsLFPs in marmoset non-human primate

Page 8: Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires CICC2017, JSSC2018b, JSSC2018c,

Slide 7ISSCC2018, JSSC2018b

Neural Recording ADC – in vivo testsLFPs in marmoset non-human primate

Page 9: Miniaturized Energy-Efficient Integrated Neural Interfaces · ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires CICC2017, JSSC2018b, JSSC2018c,

Collaboration

Scalp

Skull

Dura materArachnoid

Pia mater

Outer skull table

Inner skull table

Cortex

CSF

Diploe

Flexible Array “Modular” µECoG Implants

Slide 8

1 mm

1 mm

Joint proposal opportunities for µECoG systems working on freely moving subjects for next-generation brain imaging with:

1) < 1mV spatial resolution;2) > 1000 recording channels;3) > 100 stimulation channels; 4) > at least 24 hours operation time, and;5) coverage of entire brain.

Joint proposal opportunities for unobtrusive wireless energy-efficient brain-machine interface systems.