LT Q39E

1 Version 1.4 | 2018-03-29

Produktdatenblatt | Version 1.1 www.osram-os.com

LT Q39E

CHIPLED® 0603

Applications — Electronic Equipment — Gaming, Amusement, Gambling

— White Goods

Features: — Package: SMT package 0603, colorless diffused resin

— Chip technology: InGaN on Sapphire

— Typ. Radiation: 170° (horizontal), 130° (vertical)

— Color: λdom = 530 nm (● true green)

— Corrosion Robustness Class: 3B

— ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

LT Q39E

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Ordering Information

Type Luminous Intensity 1) Ordering CodeIF = 5 mAIv

LT Q39E-Q1OO-25-1 ≥ 71 mcd Q65110A7998

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Maximum RatingsParameter Symbol Values

Operating Temperature Top min. max.

-30 °C 85 °C

Storage Temperature Tstg min. max.

-40 °C 85 °C

Junction Temperature Tj max. 95 °C

Forward current TA = 25 °C

IF max. 15 mA

Surge Current t ≤ 10 µs; D = 0.005 ; TA = 25 °C

IFS max. 100 mA

ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

VESD 8 kV

Reverse voltage 2) VR max. Not designed for reverse operation

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CharacteristicsIF = 5 mA; TA = 25 °C

Parameter Symbol Values

Peak Wavelength 3) λpeak typ. 525 nm

Dominant Wavelength 3) λdom min. typ. max.

520 nm 530 nm 540 nm

Spectral Bandwidth at 50% Irel,max ∆λ typ. 30 nm

Viewing angle at 50 % IV values for 0°, 90°

2φ typ. typ.

170 ° 130 °

Forward Voltage 4) IF = 5 mA

VF min. typ. max.

2.60 V 2.85 V 3.10 V

Reverse current 2) IR Not designed for reverse

operation

Real thermal resistance junction/ambient 5), 6) RthJA real max. 650 K / W

Real thermal resistance junction/solderpoint 5) RthJS real max. 370 K / W

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Brightness Groups

Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)

IF = 5 mA IF = 5 mA IF = 5 mAmin. max. typ.Iv Iv ΦV

Q1 71 mcd 90 mcd 340 mlm

Q2 90 mcd 112 mcd 420 mlm

R1 112 mcd 140 mcd 530 mlm

R2 140 mcd 180 mcd 670 mlm

S1 180 mcd 224 mcd 850 mlm

S2 224 mcd 280 mcd 1060 mlm

T1 280 mcd 355 mcd 1330 mlm

T2 355 mcd 450 mcd 1690 mlm

Forward Voltage Groups

Group Forward Voltage 4) Forward Voltage 4)

IF = 5 mA IF = 5 mAmin. max.VF VF

3X 2.60 V 2.70 V

3Y 2.70 V 2.80 V

3Z 2.80 V 2.90 V

4X 2.90 V 3.00 V

4Y 3.00 V 3.10 V

Wavelength Groups

Group Dominant Wavelength 3) Dominant Wavelength 3)

min. max.λdom λdom

2 520 nm 525 nm

3 525 nm 530 nm

4 530 nm 535 nm

5 535 nm 540 nm

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Group Name on Label Example: Q1-2-3XBrightness Wavelength Forward Voltage

Q1 2 3X

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LT Q39G

350 400 450 500 550 600 650 700 750 800

λ [nm]

0,0

0,2

0,4

0,6

0,8

1,0Irel

: true green: Vλ

Relative Spectral Emission 7) Irel = f (λ); IF = 5 mA; TA = 25 °C

LT Q39G

-100°

-90°

-80°

-70°

-60°

-50°

-40°

-30°

-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°

ϕ [°]

0,0

0,2

0,4

0,6

0,8

1,0Irel

: 0°: 90°

Radiation Characteristics 7) Irel = f (ϕ); TA = 25 °C

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LT Q39G

0,91 2 3 4 5 6 7 8 9 10

IF [mA]

0,3

0,4

0,5

0,6

0,7

0,8

0,9

1

2IV

IV(5mA)

Relative Luminous Intensity 7), 8)

Iv/Iv(5 mA) = f(IF); TA = 25 °C

LT Q39G

2,4 2,6 2,8 3,0

VF [V]

1

2

3

4

5

10

IF [mA]

Forward current 7), 8)

IF = f(VF); TA = 25 °C

LT Q39G

2 4 6 8 10 12 14

IF [mA]

520

525

530

535

540

545

550λ dom [nm]

Dominant Wavelength 7)

∆λdom = f(IF); TA = 25 °C

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LT Q39G

30 40 50 60 70 80

Tj [°C]

0,0

0,2

0,4

0,6

0,8

1,0

1,2IvIv(25°C)

Relative Luminous Intensity 7)

Iv/Iv(25 °C) = f(Tj); IF = 5 mA

LT Q39G

30 40 50 60 70 80

Tj [°C]

-0,18

-0,16

-0,14

-0,12

-0,10

-0,08

-0,06

-0,04

-0,02

0,00∆VF [V]

Forward Voltage 7)

∆VF = VF - VF(25 °C) = f(Tj); IF = 5 mA

LT Q39G

30 40 50 60 70 80

Tj [°C]

-10

-5

0

5

10∆λ dom [nm]

Dominant Wavelength 7)

∆λdom = λdom - λdom(25 °C) = f(Tj); IF = 5 mA

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00

˚CT

IFmA

OHL03587

TSTA

temp. ambientTtemp. solder pointST

A

20 40 60 80 100

2

4

6

8

10

12

14

16

20

Max. Permissible Forward CurrentIF = f(T)

0-5

FIA

tp

s

OHL03589

-410 -310 -210 -110 010 110 21010

0.01

0.1

0.020.05

0.005D =

T

tTD = P

PtIF

0.20.30.5

0.01

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.11

Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 85 °C

0-5

FIA

tp

s

OHL03588

-410 -310 -210 -110 010 110 21010

0.01

0.1

0.020.05

0.005D =

T

tTD = P

PtIF

0.20.30.5

0.01

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.11

Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 25 °C

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11 Version 1.4 | 2018-03-29

Dimensional Drawing 9)

Approximate Weight: 1.0 mg

Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)

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For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

Recommended Solder Pad 9)

0.8 (0.031)

0.7 (0.028)

OHAPY606

0.8

(0.0

31)

0.8 (0.031)

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Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

Ramp-up rate to preheat*)

25 °C to 150 °C2 3 K/s

Time tSTSmin to TSmax

tS 60 100 120 s

Ramp-up rate to peak*)

TSmax to TP

2 3 K/s

Liquidus temperature TL 217 °C

Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 260 °C

Time within 5 °C of the specified peaktemperature TP - 5 K

tP 10 20 30 s

Ramp-down rate*TP to 100 °C

3 6 K/s

Time25 °C to TP

480 s

All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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Taping 9)

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Tape and Reel 10)

Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 60 8.4 + 2 14.4 4000

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Barcode-Product-Label (BPL)

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

Dry Packing Process and Materials 9)

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity IndicatorMIL-I-8835

If wet,

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6

Hours

a) H

umid

ity In

dicato

r C

ard is

> 1

0% w

hen read a

t 23 ˚

C ±

5 ˚C

, or

reflo

w, v

apor-phase r

eflow

, or equiv

alent p

rocessin

g (peak p

ackage

2. Afte

r th

is b

ag is o

pened, devic

es that w

ill b

e subje

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infrare

d

1. Shelf

life in

seale

d bag: 2

4 month

s at <

40 ˚

C a

nd < 9

0% rela

tive h

umid

ity (R

H).

Mois

ture

Level 5

a

at facto

ry c

onditions o

f

(if b

lank, s

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is id

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ith d

ate c

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a) M

ounted w

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b) S

tore

d at

body tem

p.

3. Devic

es require

bakin

g, befo

re m

ounting, i

f:

Bag s

eal date

Mois

ture

Level 1

Mois

ture

Level 2

Mois

ture

Level 2

a4. If b

aking is

require

d,

b) 2a o

r 2b is

not m

et.

Date

and ti

me o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD

-033 fo

r bake p

rocedure

.

Flo

or tim

e see b

elow

If bla

nk, see b

ar code la

bel

Flo

or tim

e > 1

Year

Flo

or tim

e 1

Year

Flo

or tim

e 4

Weeks10%

RH

.

_<

Mois

ture

Level 4

Mois

ture

Level 5

˚C).

OPTO

SEM

ICO

NDUCTORS

MO

ISTURE S

ENSITIV

E

This b

ag conta

ins

CAUTION

Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If bla

nk, see

bar code la

bel

LT Q39E

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Transportation Packing and Materials 9)

Dimensions of transportation box in mmWidth Length Height

260 ± 5 mm 230 ± 5 mm 85 ± 5 mm

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Chip Technology: 1: TSN 3: standard InGaN 4: AlGaAs 6: standard InGalP E: ThinGaN & package with 8 kV ESD stability G: NOTA, Powerflip, ThinGaN

´ Encapsulant Type / Lens Properties 1: focusing lens (=20°) 7: clear resin or white volume conversion 8: white volume conversion 9: clear resin

Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: B: 470 nm blue W: white S: 633 nm super red T: 528 nm true green Y: 587 nm yellow A: 617 nm amber R/J: 625 nm red H: 645 nm hyper-red O: 606 nm orange G: 570 nm green

L: Light emitting diode

Package Type Q: CHIPLED 0603 / 0402 R: CHIPLED 0805 N: CHIPLED 1206 /

CHIPLED with lens

Lead / Package Properties 1: footprint: 0603 / height: 0.6 mm 3: footprint: 0603 / height: 0.35 mm 9: standard H: footprint: 0402 / height: 0.35 mm

Type Designation System

L B Q H 9 G

LT Q39E

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NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.

Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-duction, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

Based on very short life cycle times in chip technology this component is subject to frequent adaption to the latest chip technology.

For further application related informations please visit www.osram-os.com/appnotes

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Disclaimer

DisclaimerLanguage english will prevail in case of any discrepancies or deviations between the two language word-ings.

Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS webside.

PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.

In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.

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Glossary1) Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of

±11 %.2) Reverse Operation: Not designed for reverse operation. Continuous reverse operation can cause mi-

gration and damage of the device.3) Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm.4) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of

±0.1 V.5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad)7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data

or calculated correlations of technical parameters can only reflect statistical figures. These do not nec-essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single LEDs within one packing unit.

9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.

10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

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