Keysight 1GG7-8251 DC to 8 GHz Terminated SPDT Packaged Switch · 2019-12-04 · Keysight 1GG7-8251...

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Keysight 1GG7-8251 DC to 8 GHz Terminated SPDT Packaged Switch Data Sheet Features RoHS compliant Outputs terminated in 50 Ω when off Internal LED for faster settling Frequency range: DC - 8 GHz Insertion loss: 2.5 dB @ 8 GHz Isolation: > 70 dB @ 45 MHz > 30 dB @ 8 GHz Return loss: 25 dB (Both input and selected output) 15 dB unselected output Switching speed: < 20 μs (10% - 90% RF) P –1dB : 27 dBm Harmonics (DC coupled): < –80 dBc @ 10 dBm QFN SMT package

Transcript of Keysight 1GG7-8251 DC to 8 GHz Terminated SPDT Packaged Switch · 2019-12-04 · Keysight 1GG7-8251...

Page 1: Keysight 1GG7-8251 DC to 8 GHz Terminated SPDT Packaged Switch · 2019-12-04 · Keysight 1GG7-8251 DC to 8 GHz Terminated SPDT Packaged Switch Data Sheet Features – RoHS compliant

Keysight 1GG7-8251DC to 8 GHz Terminated SPDT Packaged Switch

Data Sheet

Features – RoHS compliant – Outputs terminated in 50 Ω

when off – Internal LED for faster settling – Frequency range: DC - 8 GHz – Insertion loss: 2.5 dB @ 8 GHz – Isolation:

> 70 dB @ 45 MHz > 30 dB @ 8 GHz

– Return loss: 25 dB (Both input and selected output) 15 dB unselected output

– Switching speed: < 20 μs (10% - 90% RF)

– P–1dB: 27 dBm – Harmonics (DC coupled):

< –80 dBc @ 10 dBm – QFN SMT package

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– Package type: 3 x 3 mm MLF-16/QFN-16

– Package dimensions: 3 × 3 mm (118 × 118 mils)

– Package thickness: 0.90 mm (35 mils)

– Pad (lead) pitch: 0.5 mm (20 mils)

– Pad (lead) width: 0.25 mm (10 mils)

Description

The 1GG7-8251 is a GaAs monolithic microwave integrated circuit (MMIC) fabricated using the Keysight Technologies, Inc. GaAs FET process and is designed for low insertion loss and high isolation from DC to 8 GHz. It is intended for use as a general–purpose, single-pole, double-throw (SPDT), absorptive switch. Two series and two shunt MESFETs per throw provide 1.4 dB maximum insertion loss and 38 dB typical isolation at 6 GHz. The IC is packaged with an LED in a plastic molded 3 x 3 mm QFN SMT package.

Absolute maximum ratings1

Symbol Parameters/conditions Min Max Units

Vsel Select voltages 1 & 2 −10.5 +10.5 volts

Pin RF input power 27 dBm

Tbs Operating pkg backside temperature −25 +70 °C

Tstg Storage temperature −65 +165 °C

Tassy Maximum solder reflow temperature(max 3 cycles @ 30 sec./cycle)

+260 °C

Punsel Power into unselected output 27 dBm

ILED LED control, forward current 15 30 mA

VLED Led control, reverse voltage -5 V

1. Parameters specified for continuous operation at the Tbs ≤ 70 °C. Continuous operation in excess of any one of these conditions may result in performance and/or reliability degradation to this component

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DC specifications/physical properties(TA = 25 °C)

Symbol Parameters/conditions Min Typ Max Units

ISEL −10V Leakage current @ −10 V 300 µA

ISEL +10V Leakage current @ +10 V 20 µA

Vp Pinchoff voltage (VSEL2 = Vp, VRFout2 = +2 V, IRFout2 = 4 mA, VSEL1 = −10 V, VRFout1 = open circuit, VRFin= GND)

−6.75 −3.00 volts

BV Breakdown voltage (Test FET w/ VD = VS = GND, IG = −50 µA) −13.0 volts

VLED fwd LED forward voltage +1.9 +2.25 +2.7 volts

ILED Ctrl LED Forward current 20 mA

RF specifications(TA = 25 °C, Z0 = 50 Ω, Vsel–high = +10 V, Vsel–low = –10 V)

Symbol Parameters/conditions Min Typ Max Units

BW Guaranteed operating bandwidth 8.0 GHz

IL Insertion loss, RFin to selected RFout (ON throw), 8 GHz 2.5 dB

ISO Isolation, RFin to unselected RFout (OFF throw), 8 GHz 35 dB

RLin Input return loss @ 8 GHz 25 dB

RLout−ON Output return loss, ON throw @ 8 GHz 25 dB

RLout−OFF Output return loss, OFF throw @ 8 GHz 15 dB

P−1dB Input power where IL increases by 1 dB, fin = 2 GHz 27 dBm

ts Switching speed, 10% - 90% RF envelope, f in = 2 GHz 20 µs

tsettle Settling time, within 0.01 dB of final state, f in = 8 GHz, LED on 100 µs

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ApplicationsThe 1GG7-8251 can be used in instrumentation, communications, radar, ECM, EW, and many other systems requiring SPDT switching. It can be used for pulse modulation, port isolation, transfer switching, high-speed switching, replacement of mechanical switches, and so on.

Tape and Reel

The 1GG7-8251 component is available in tape and reel format. See Figures 1 and 2.

Moisture Compatibility

Injection mold components are moisture-sensitive. The product is tested to the Moisture and Reflow Sensitivity Level 3 as per IPC/Jedec J-STD-020 and must be mounted within 168 hours of opening the shipping container. Store and handle parts for reflow and for rework per IPC/Jedec J-STD-033B. See Figure 3.

RoHS Compliance

This device is RoHS Compliant. This means the component meets the requirements of the European Parliament and the Council of the European Union Restriction of Hazard-ous Substances Directive 2011/65/EU, commonly known as RoHS. The six regulated substances are lead, mercury, cadmium, chromium VI (hexavalent), polybrominated biphenyls (PBB) and polybrominated biphenyl ethers (PBDE). RoHS compliance implies that any residual concentration of these substances is below the RoHS Directive’s maximum concentration values (MVC); being less than 1000 ppm by weight for allsubstances except for cadmium which is less than 100 ppm by weight.

Figure 1. Tape and reel label

Figure 2. Tape and reel, moisture containment pouch

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1

2

1

N/C1 LED

GND

GNDGND COM

GND

SEL2 SEL1

GND2

N/C1

RF2RF1

N/C1N/C1

N/C1N/C1

3

4

17 5 6 7 8

16 15 14 13

12

11

10

9

1GG7-8251

1. N/C pins can be left open, but it is recommended to connect these to RF/DC ground.2. Pin 17 is the center heat slug this must be connected to RF/DC ground. Use “filled” vias to prevent solder voids.

Topview

Figure 3. 1GG7-8251 schematic

Assembly Techniques

The QFN SMT package is compatible with industry standard solder-reflow attach processes.

The GaAs MMIC incorporated in the 1GG7-8251 SMT package solution is ESD sensitive. ESD preventive measures must be employed in all aspects of storage, handling, and assembly.

Additional ReferencesKeysight Technologies FET Switch Speed and Settling Time - Application Note, literature number 5991-3516EN

Select line RF path

SEL1 SEL2 RF IN to RF OUT2 RF IN to RF OUT1+10 V −10 V Isolated Low loss−10 V +10 V Low loss Isolated

Recommended 1GG7-8251 Logic Operating Conditions(TA = 25 °C)

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3 Permanently mark part number and date code (4 x 4 number, year, work week)

2 Side of lead is not plated (bare copper alloy) max burr 0.15 mm

1 Lead plating per assembly drawing

Notes: (Unless otherwise specified)

3.00 ±0.10

3.00 ±0.10

Pin 1

3

2

1

0.90 ±0.10

(0.02 typ)

(0.02 typ)

(0.203 typ)

(0.50 typ)Pin 16 Pin 16

(1.48)

(1.48)

(3X R0.05)

(R typ)-0.00

0.15

(0.40 typ)

XXXXXXXXYYWW

Pin 1

(0.36 typ)

Figure 4. 1GG7-8251 outline

1

2

3

4

5 6 7 8

9

10

11

12

13141516

GND

RF1

GND

Sel1

GND

RF2

GND

LED

N/C

N/C

N/C

N/C

GN

D

CO

M

GN

DTop view

Sel2

Figure 5. 1GG7-8251 package pin-outs

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0.30

1.10

R0.300.10

4.00

2.00 ±0.05

8.00

3

1

3.30

AR 0.25

Ø1.50+0.10 0

Ø1.50 min

5.50 ±0.05

12.00 ±0.30

1.75 ±0.10

Notes: (Unless otherwise specified)1 10 sprocket hole pitch cumulative tolerance ±0.22. Camber in compliance with EIA 4813 Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole

3

Reel

Tape

User feeddirection Cover tape

Section A-Ascale 10 X

3.30

Figure 6. 1GG7-8251 tape and reel configuration

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Figure 7. Insertion loss1 Figure 8. Input–to–output isolation1

Figure 9. Input return loss1 Figure 10. Output return loss1

Figure 11. Gain compression1

1. Data taken on bare die mounted in a modular breadboard package.

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Figure 12. Settling time vs. LED current1

Figure 13. Settling time with LED OFF or ON1

1. Data taken with device mounted on a PCB.

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This data sheet contains a variety of typical and guaranteed performance data. The information supplied should not be interpreted as a complete list of circuit specifications. Customers considering the use of this, or other Keysight Technologies GaAs ICs, for their design should obtain the current production specifications from Keysight. In this data sheet the term typical refers to the 50th percentile performance. For additional information contact Keysight at [email protected].

The product described in this data sheet is RoHS Compliant and RoHS Process Compatible with a maximum temperature of 260 °C and a maximum of 3 temperature cycles.

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This information is subject to change without notice.© Keysight Technologies, 2016Published in USA, October 10, 20165992-1783ENwww.keysight.com

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