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©2001 Fairchild Semiconductor Corporation 1 www.fairchildsemi.comFQP27P06 Rev.C0

FQP27P06P-Channel QFET® MOSFET- 60 V, - 27 A, 70 m

Description

This P-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor®’s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, audio amplifier, DC motor control, and variable switching power applications.

Features

• - 27 A, - 60 V, RDS(on) = 70 m (Max.) @ VGS = - 10 V, ID = - 13.5 A

• Low Gate Charge (Typ. 33 nC)

• Low Crss (Typ. 120 pF)

• 100% Avalanche Tested

• 175C Maximum Junction Temperature Rating

Absolute Maximum Ratings TC = 25°C unless otherwise noted

Thermal Characteristics

Symbol Parameter FQP27P06 UnitVDSS Drain-Source Voltage -60 V

ID Drain Current - Continuous (TC = 25°C) -27 A

- Continuous (TC = 100°C) -19.1 A

IDM Drain Current - Pulsed (Note 1) -108 A

VGSS Gate-Source Voltage 25 V

EAS Single Pulsed Avalanche Energy (Note 2) 560 mJ

IAR Avalanche Current (Note 1) -27 A

EAR Repetitive Avalanche Energy (Note 1) 12 mJ

dv/dt Peak Diode Recovery dv/dt (Note 3) -7.0 V/nsPD Power Dissipation (TC = 25°C) 120 W

- Derate above 25°C 0.8 W/°CTJ, TSTG Operating and Storage Temperature Range -55 to +175 °C

TLMaximum lead temperature for soldering purposes,1/8" from case for 5 seconds

300 °C

Symbol Parameter FQP27P06 UnitRJC Thermal Resistance, Junction-to-Case, Max. 1.25 °C/W

RCS Thermal Resistance, Case-to-Sink, Typ. 0.5 °C/W

RJA Thermal Resistance, Junction-to-Ambient, Max. 62.5 °C/W

●

●

●

▲▶

●

●

●

▲▶

S

D

G

SD

G

TO-220

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©2001 Fairchild Semiconductor Corporation 2 www.fairchildsemi.comFQP27P06 Rev.C0

Elerical Characteristics TC = 25°C unless otherwise noted

Notes:1. Repetitive Rating : Pulse width limited by maximum junction temperature2. L = 0.9mH, IAS = -27A, VDD = -25V, RG = 25 Starting TJ = 25°C3. ISD ≤ -27A, di/dt ≤ 300A/s, VDD ≤ BVDSS, Starting TJ = 25°C 4. Essentially independent of operating temperature

Symbol Parameter Test Conditions Min Typ Max UnitOff CharacteristicsBVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = -250 A -60 -- -- V

BVDSS

/ TJ

Breakdown Voltage Temperature Coefficient

ID = -250 A, Referenced to 25°C -- -0.06 -- V/°C

IDSSZero Gate Voltage Drain Current

VDS = -60 V, VGS = 0 V -- -- -1 A

VDS = -48 V, TC = 150°C -- -- -10 A

IGSSF Gate-Body Leakage Current, Forward VGS = -25 V, VDS = 0 V -- -- -100 nA

IGSSR Gate-Body Leakage Current, Reverse VGS = 25 V, VDS = 0 V -- -- 100 nAOn Characteristics VGS(th) Gate Threshold Voltage VDS = VGS, ID = -250 A -2.0 -- -4.0 V

RDS(on) Static Drain-Source On-Resistance

VGS = -10 V, ID = -13.5 A -- 0.055 0.07

gFS Forward Transconductance VDS = -30 V, ID = -13.5 A -- 12.4 -- SDynamic CharacteristicsCiss Input Capacitance VDS = -25 V, VGS = 0 V,

f = 1.0 MHz

-- 1100 1400 pF

Coss Output Capacitance -- 510 660 pF

Crss Reverse Transfer Capacitance -- 120 155 pFSwitching Characteristics td(on) Turn-On Delay Time

VDD = -30 V, ID = -13.5 A,

RG = 25

-- 18 45 ns

tr Turn-On Rise Time -- 185 380 ns

td(off) Turn-Off Delay Time -- 30 70 ns

tf Turn-Off Fall Time -- 90 190 ns

Qg Total Gate Charge VDS = -48 V, ID = -27 A,

VGS = -10 V

-- 33 43 nC

Qgs Gate-Source Charge -- 6.8 -- nC

Qgd Gate-Drain Charge -- 18 -- nC

Drain-Source Diode Characteristics and Maximum RatingsIS Maximum Continuous Drain-Source Diode Forward Current -- -- -27 A

ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- -108 A

VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = -27 A -- -- -4.0 V

trr Reverse Recovery Time VGS = 0 V, IS = -27 A,

dIF / dt = 100 A/s

-- 105 -- ns

Qrr Reverse Recovery Charge -- 0.41 -- C

(Note 4)

(Note 4)

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©2001 Fairchild Semiconductor Corporation 3 www.fairchildsemi.comFQP27P06 Rev.C0

0 5 10 15 20 25 30 350

2

4

6

8

10

12

VDS

= -30V

VDS

= -48V

※ Note : ID = -27 A

-VG

S,

Gat

e-S

ourc

e V

olta

ge

[V

]

QG, Total Gate Charge [nC]10-1 100 1010

500

1000

1500

2000

2500

3000Ciss = Cgs + Cgd (Cds = shorted)

Coss = Cds + Cgd

Crss = Cgd

※ Notes :

1. VGS = 0 V

2. f = 1 MHz

Crss

Coss

Ciss

Ca

paci

tan

ce [p

F]

VDS, Drain-Source Voltage [V]

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.810

-1

100

101

102

175℃※ Notes : 1. V

GS = 0V

2. 250μs Pulse Test

25℃

-ID

R ,

Rev

erse

Dra

in C

urre

nt

[A]

-VSD

, Source-Drain Voltage [V]

0 10 20 30 40 50 60 70 80 90 100 110 120 1300.00

0.04

0.08

0.12

0.16

0.20

0.24

※ Note : TJ = 25℃

VGS

= - 20V

VGS = - 10V

RD

S(o

n)

[],

Dra

in-S

ourc

e O

n-R

esis

tan

ce

-ID , Drain Current [A]

2 4 6 8 1010

-1

100

101

102

175℃

25℃

-55℃※ Notes : 1. V

DS = -30V

2. 250μs Pulse Test

-ID ,

Dra

in C

urre

nt [

A]

-VGS , Gate-Source Voltage [V]10-1 100 101

100

101

102

VGS

Top : - 15.0 V - 10.0 V - 8.0 V - 7.0 V - 6.0 V - 5.5 V - 5.0 VBottom : - 4.5 V

※ Notes : 1. 250μs Pulse Test 2. T

C = 25℃

-I

D, D

rain

Cur

rent

[A

]

-VDS, Drain-Source Voltage [V]

Typical Characteristics

Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics

Figure 3. On-Resistance Variation vs.Drain Current and Gate Voltage

Figure 4. Body Diode Forward Voltage Variation vs. Source Current

and Temperature

Figure 2. Transfer CharacteristicsFigure 1. On-Region Characteristics

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©2001 Fairchild Semiconductor Corporation 4 www.fairchildsemi.comFQP27P06 Rev.C0

1 0 -5 1 0 -4 1 0 -3 1 0 -2 1 0 -1 1 0 0 1 0 11 0

-2

1 0-1

1 00

※ N o te s : 1 . Z

θ J C( t ) = 1 .2 5 /W M a x .℃

2 . D u ty F a c to r , D = t1/ t

2

3 . TJ M

- TC

= PD M

* Zθ J C

( t )

s in g le p u ls e

D = 0 .5

0 .0 2

0 .2

0 .0 5

0 .1

0 .0 1

Zθ

JC(t

), T

herm

al R

espo

nse

t 1 , S q u a re W a v e P u ls e D u ra t io n [s e c ]

25 50 75 100 125 150 1750

5

10

15

20

25

30

-ID,

Dra

in C

urre

nt [

A]

TC, Case Temperature [ ]℃

100

101

102

10-1

100

101

102

DC

10 ms

1 ms

100 s

Operation in This Area is Limited by R

DS(on)

※ Notes :

1. TC = 25

oC

2. TJ = 175

oC

3. Single Pulse

-ID,

Dra

in C

urre

nt [

A]

-VDS

, Drain-Source Voltage [V]

-100 -50 0 50 100 150 2000.0

0.5

1.0

1.5

2.0

2.5

※ Notes : 1. V

GS = -10 V

2. ID = -13.5 A

RD

S(O

N),

(Nor

mal

ized

)D

rain

-Sou

rce

On-

Res

ista

nce

TJ, Junction Temperature [

oC]

-100 -50 0 50 100 150 2000.8

0.9

1.0

1.1

1.2

※ Notes : 1. V

GS = 0 V

2. ID = -250 μA

-BV

DS

S,

(Nor

mal

ized

)D

rain

-Sou

rce

Bre

akdo

wn

Vol

tag

e

TJ, Junction Temperature [

oC]

Typical Characteristics (Continued)

Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Currentvs. Case Temperature

Figure 7. Breakdown Voltage Variationvs. Temperature

Figure 8. On-Resistance Variationvs. Temperature

Figure 11. Transient Thermal Response Curve

t1

PDM

t2

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©2001 Fairchild Semiconductor Corporation 5 www.fairchildsemi.comFQP27P06 Rev.C0

Charge

VGS

-10VQg

Qgs Qgd

-3mA

VGS

DUT

VDS

300nF

50KΩ

200nF12V

Same Typeas DUT

Charge

VGS

-10VQg

Qgs Qgd

-3mA

VGS

DUT

VDS

300nF

50KΩ

200nF12V

Same Typeas DUT

VDS

VGS10%

90%

td(on) tr

t on t off

td(off) tfVDD

-10V

VDS

RL

DUT

RG

VGS

VDS

VGS10%

90%

td(on) tr

t on t off

td(off) tfVDD

-10V

VDS

RL

DUT

RG

VGS

EAS = L IAS2----

21 --------------------

BVDSS - VDD

BVDSS

VDD

VDS

BVDSS

t p

VDD

IAS

VDS (t)

ID (t)

Time

-10V DUT

RG

L

I D

t p

EAS = L IAS2----

21

EAS = L IAS2----

21----21 --------------------

BVDSS - VDD

BVDSS

VDD

VDS

BVDSS

t p

VDD

IAS

VDS (t)

ID (t)

Time

-10V DUT

RG

LL

I DI D

t p

Gate Charge Test Circuit & Waveform

Resistive Switching Test Circuit & Waveforms

Unclamped Inductive Switching Test Circuit & Waveforms

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©2001 Fairchild Semiconductor Corporation 6 www.fairchildsemi.comFQP27P06 Rev.C0

Peak Diode Recovery dv/dt Test Circuit & Waveforms

DUT

VDS

+

_

DriverRG

Compliment of DUT (N-Channel)

VGS • dv/dt controlled by RG

• ISD controlled by pulse period

VDD

LI SD

10VVGS

( Driver )

I SD

( DUT )

VDS

( DUT )

VDDBody Diode

Forward Voltage Drop

VSD

IFM , Body Diode Forward Current

Body Diode Reverse Current

IRM

Body Diode Recovery dv/dt

di/dt

D =Gate Pulse Width

Gate Pulse Period--------------------------

DUT

VDS

+

_

DriverRG

Compliment of DUT (N-Channel)

VGS • dv/dt controlled by RG

• ISD controlled by pulse period

VDD

LLI SD

10VVGS

( Driver )

I SD

( DUT )

VDS

( DUT )

VDDBody Diode

Forward Voltage Drop

VSD

IFM , Body Diode Forward Current

Body Diode Reverse Current

IRM

Body Diode Recovery dv/dt

di/dt

D =Gate Pulse Width

Gate Pulse Period--------------------------D =Gate Pulse Width

Gate Pulse Period--------------------------

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©2001 Fairchild Semiconductor Corporation 7 www.fairchildsemi.comFQP27P06 Rev.C0

Package Dimensions

TO-220

©2001 Fairchild Semiconductor Corporation 8 www.fairchildsemi.com

FQP27P06 Rev.C0

TRADEMARKSThe following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.

*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.

LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used here in:1. Life support devices or systems are devices or systems which, (a) are

intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

PRODUCT STATUS DEFINITIONSDefinition of Terms

2Cool™AccuPower™AX-CAP®*BitSiC™Build it Now™CorePLUS™CorePOWER™CROSSVOLT™CTL™Current Transfer Logic™DEUXPEED®

Dual Cool™EcoSPARK®

EfficentMax™ESBC™

Fairchild®

Fairchild Semiconductor®

FACT Quiet Series™FACT®

FAST®

FastvCore™FETBench™

FPS™F-PFS™FRFET®

Global Power ResourceSM

Green Bridge™Green FPS™Green FPS™ e-Series™Gmax™GTO™IntelliMAX™ISOPLANAR™Marking Small Speakers Sound Louder and Better™MegaBuck™MICROCOUPLER™MicroFET™MicroPak™MicroPak2™MillerDrive™MotionMax™mWSaver™OptoHiT™OPTOLOGIC®

OPTOPLANAR®

PowerTrench®

PowerXS™Programmable Active Droop™QFET®

QS™Quiet Series™RapidConfigure™

Saving our world, 1mW/W/kW at a time™SignalWise™SmartMax™SMART START™Solutions for Your Success™SPM®

STEALTH™SuperFET®

SuperSOT™-3SuperSOT™-6SuperSOT™-8SupreMOS®

SyncFET™

Sync-Lock™®*

TinyBoost™TinyBuck™TinyCalc™TinyLogic®

TINYOPTO™TinyPower™TinyPWM™TinyWire™TranSiC®

TriFault Detect™TRUECURRENT®*SerDes™

UHC®

Ultra FRFET™UniFET™VCX™VisualMax™VoltagePlus™XS™

®

™

Datasheet Identification Product Status Definition

Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.

Preliminary First ProductionDatasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.

No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.

Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.

ANTI-COUNTERFEITING POLICYFairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support.Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.

Rev. I64

tm

®

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Mouser Electronics

Authorized Distributor

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