•WideportfolioofLGAandPCIeMiniCardmodulesfor2G,3GandLTEnetworks,includingtheworld’sfirstLGAmodulewithLTEsupport

•AllmodulesallowhighspeeddataconnectionandhighlysensitiveGPSwithoptionalPCMvoicecapability

•½sizeandfullsizePCIemodulesofferoptionalWiFiconnectionandoptionalSIMcard/μSDcardholder

•Worldwide2G/3G/4G/LTEcoverage,supportingbothWCDMAandCDMAnetworktechnologies

Embedded broadband connectivityfortomorrow’sconnecteddevices

LGA

TFF/NGFF

1stgeneration 2ndgeneration 3rdgeneration•30×25×2.3mm•BasedonIcera®8040chipset•10.2MbpsDL/5.76MbpsUL•2G/W-CDMAdataonly

•31.8×26.8×2mm•BasedonMDM6200/6600™chipset•14.4MbpsDL/5.76MbpsUL•2G/W-CDMA/EVDOdata&voice,GPS

•37×29.8×2mm•BasedonMDM9215/9615™chipset•100MbpsDL/50MbpsUL•2G/W-CDMA/EVDO/LTEdataandvoice,GPS

501 601 801

The pioneer for LGA modules

Option was the industry pioneer in 2009, introducing the concept ofmodulesthataresoldereddirectlyonthebaseboard.Duetoitsultra-thin form factor and excellent heat dissipation characteristics an LGAmoduleisperfectforintegrationinsmallconsumerelectronicsdevicesor

broadbandM2Mapplications.TheadditionalGPSandvoicecapabilitiesin the last generations give these modules a unique position in theembeddedmodulemarket.Thenewandimprovedfootprintinthe2ndand3rdgenerationfacilitatessoldering.

Duetoitsreducedthicknessandmoreadvancedinterfacingpossibilities(compared to a PCIe Minicard), TFF and NGFF are quickly becomingstandardconnector-basedmoduleformatsfortabletdevices.BysolderingourLGAmodulesonacarrierboard,Optioncanveryquicklysupportthesenewstandards.Thecarrierboarddesignisavailabletoourcustomersforfreesoitcanbeproducedandstuffedtogetherwiththerestofthedevice,maintainingallbenefitsofthewiderangeofapprovalsoftheLGAmodule.Thecarrierboardsarecompatible for theGTM60xandGTM80xso thesamedesigncanbeusedforbothLGAmodules.

601W 609W/Physical specifications •MCMinLGApackage,basedonQualcommMDM6200™(GTM601W)orMDM6600™(GTM609W)

•31.8×26.8×2mm•Operatingtemperature:-30°Cto+80°C

Electrical interface•LGAwith70signalcontactpads&25ground/heatdissipationpads• USB2.0Hi-Speed•DCpowersupply3.2-4.2V(singlecellbattery)

•USIM/SIMconnection–ClassBand

ClassC•W_DISABLE,WAKEandLED_WWANsignals

•Primary,diversityandGPSantennacontactpads

•PCMdigitalaudiointerfacepads Supported frequency bands and connectivity speeds•GSM/GPRS/EDGE:850/900/1800/1900MHz

•UMTS/HSDPA/HSUPA:800-850/900/1900/2100MHz(B1,B2,B5,B6,B8)at14.4MbpsDL/5.76MbpsUL

maxspeed• (GTM609Wonly)CDMA1xRTT/EV-DORevA:800/1900MHz(BC0,BC1)at3.1MbpsFL/1.8MbpsRLmaxspeed

•gpsOneGen8,supportingS-GPS,A-GPS,gpsOneXtra™concurrentwithGlonass

Operator support•AT&T,Verizon,Docomo,VodafoneandOrangeapproval

• MemberofAT&TMobileBroadbandAcceleratorProgram

801U 809U/Physical specifications•MCMinLGApackage,basedonQualcommMDM9215™(GTM801U)orMDM9615™(GTM809U)

•37×29.8×2mm•Operatingtemperature:-30°Cto+65°C

Electrical interface•LGAwith89signalcontactpads&25ground/heatdissipationpads•USB2.0HSandHSIC•DCpowersupply3.0-4.2V•DualUSIM/SIMconnection–classBandclassCforoneconnection,embeddedMFFSIMforotherconnection

•W_DISABLE,WAKEandLED_WWANsignals

• Primaryanddiversity/MIMOantennaandGPSantennacontactpads

• AntennatuningandWiFicoexistencepads

•PCM/Slimbusforaudio•GTM801footprintallowstomountGTM601Waswell

Supported frequency bands and connectivity speeds•GSM/GPRS/EDGE:850/900/1800/1900MHz

•UMTS/HSDPA/HSUPA/HSPA+/DC-HSPA+:•800-850/1900/2100/AWSMHz(B1/B2/B4/B5/B6)at42MbpsDL/5.76MbpsULmaxspeed

• (GTM809Uonly)also900MHz(B8)•FDD-LTE:•700/850/1900/AWSMHz(B2/B4/B5/B17)at100MbpsDL/50MbpsUL

• (GTM809Uonly)also700/1900MHz(B13/B25)

• (GTM809Uonly)CDMA1xRTT/CDMA1xAdv/EV-DORevA/EV-DORevB:

800/1900/2100MHz(BC0,BC1,BC6,BC10)at9.3MbpsFL/5.4MbpsRLmaxspeed

•gpsOneGen8A,supportingS-GPS,A-GPS,gpsOneXtra™concurrentwithGlonass

Other planned variants(2013 – preliminary specification)•GTM801E(Europe):FDD-LTE800/900/1800/2100/2600MHz(B1,B3,B7,B8,B20)

•GTM801J/GTM809J(Japan):FDD-LTE800/1500/2100MHz(B1,B19,B21)(GTM809JalsoB5/B6/B8/B9/B11/B18)

•GTM801C(China):FDD-LTE900/2100(B1,B8)andTDD-LTE1900/2000/2400/2600MHz(B34,B38,B39,B40,B41)

TFF •min42×30×2.9mm(withGTM60x)•min48×30×2.9mm(withGTM80x)

NGFF•min42×30×2.9mm(withGTM60x)•min48×30×2.9mm(withGTM80x)

PCI Express MiniCard

ThisistheoriginalGobi™3000designthatwasmadebyQualcomm.Option is a Gobi licensee and offers this module to its customers,

customizedandbundledwithoptionalsoftwareand/orserviceofferings.

Physical specifications•PCIExpressMiniCardformfactor,version1.2,typeF2(fullsize,singlesided),basedonQualcommMDM6200™(GTM681W)orMDM6600™(GTM689W)

•51×30×3.1mm•Operatingtemperature:-30°Cto+70°C

Electrical interfaces•52-pinedgeconnectorwith:•USB2.0Hi-Speed•DCpowersupply:3.2-3.6V(CDMA/

W-CDMA)and3.0-3.6V(GSM)•USIM/SIMconnection–ClassBandClassC

•W_DISABLE,WAKEandLED_WWANsignals

•PrimaryandDiversity/GPSantenna,U.FLcoaxconnector(primaryonbottom)

Supported frequency bands and connectivity speeds•GSM/GPRS/EDGE:850/900/1800/1900MHz•GPRS:85.6KbpsDL/42.8KbpsUL(class10)

•EDGE:236.8KbpsDL/118.4KbpsUL(class10)

•UMTS/HSDPA/HSUPA:800-850/900/1900/2100MHzandAWSband(1700/2100MHz)(B1,B2,B4,B5,B6,B8)at14.4MbpsDL/5.76MbpsULmaxspeed

• (GTM689Wonly)CDMA1xRTT/EV-DORev0/EV-DORevAat3.1MbpsFL/1.8MbpsRLmaxspeed

•gpsOneGen8,supportingS-GPS,A-GPS,gpsOneXtra™

681W 689W/

881x 889x/By soldering one of our GTM801x/809x module variants on a PCIecarrierboard,OptioncanofferanLTEmodule inPCIeMiniCard formfactor in the most time efficient way. The carrier board design is

availabletoourcustomersforfreesoitcanbeproducedandstuffedtogetherwiththerestofthedevice,benefittingfromallapprovalsoftheGTM801/809module.

Physical specifications •PCIExpressMiniCardformfactor,version1.2,typeF2(fullsize,single-sided)

•50.95×30×3.0mm•Operatingtemperature:-20to+65°C

Interfaces•52-pinedgeconnectorwith•USB2.0Hi-Speed•DCpowersupply:3.0V–4.2V•USIM/SIMconnection–ClassBandClassC

•W_DISABLE,RESET,WAKEandLED_WWANsignals

•4tuneableantennacontroland3coexistencesignals

•Primaryanddiversity/MIMOantenna•GPSantenna

Supported frequency bands and connectivity speeds (for GTM881U/GTM889U)•GSM/GPRS/EDGE:850/900/1800/1900MHz

•UMTS/HSDPA/HSUPA/HSPA+/DC-HSPA+:•800-850/1900/2100/AWSMHz(B1/B2/B4/B5/B6)at42MbpsDL/5.76MbpsULmaxspeed

• (GTM889Uonly)also900MHz(B8)•FDD-LTE:•700/850/1900/AWSMHz(B2/B4/B5/B17)at100MbpsDL/50MbpsUL

• (GTM889Uonly)also700/1900MHz(B13/B25)

• (GTM889Uonly)CDMA1xRTT/CDMA1xAdv/EV-DORevA/EV-DORevB:800/1900/2100MHz(BC0,BC1,BC6,BC10)at9.3MbpsFL/5.4MbpsRLmaxspeed

ByaddinganoptionalWiFicomponentonthe3GPCIeMiniCard,onlyonePCIeminicardslotisneededtointegratebothWiFiand3Gconnectivitytoyourdevice,henceloweringoveralldevicecost.Thismoduleisavailable

in½size form factoror fullsize form factor.For the full-sizemodule,anoptionalSIMcardholderandmicroSDcardholdercanbemountedwhichallowsanall-in-oneconnectivitysolutiononasinglePCIecard.

Physical specifications •PCIExpressMiniCardformfactor,version1.2typeH1(halfsize)/typeF1(fullsize)

•26.8/51×30×4.2mm•Operatingtemperature:-10°Cto+55°Ccertified(+70°Cextendedrange)

Electrical interfaces•52-pinedgeconnectorwith•USB2.0Hi-Speed•DCpowersupply3.3V+/-9%•USIM/SIMconnection–ClassBandClassC

•W_DISABLE,WAKEandLED_WWANsignals

•PCMvoicesignalpins•WiFisignalpins(PCIinterface),LED_WLANandCOEXsignals(GTM67xonly)

•PrimaryandDiversity/GPSantenna,U.FLcoaxconnector

•PrimaryandDiversityWiFiantenna,U.FLcoaxconnector(GTM67xonly)

•OptionalSIMcardholder(antennaside)andµSDcardholder(backside)(GTM6xxWFSonly)

Supported frequency bands and connectivity speed•GSM/GPRS/EDGE:850/900/1800/1900MHz

•GPRS:85.6KbpsDL/85.6KbpsUL(class12)

•EDGE:236.8KbpsDL/236.8KbpsUL(class12)

•UMTS/HSDPA/HSUPA:800-850/900/1900/2100(B1,B2,B5,B6,B8)at14.4MbpsDL/5.76MbpsULmaxspeed

• (GTM669xandGTM679xonly)CDMA1xRTT/EV-DORev0/EV-DORevAat3.1MbpsFL/1.8MbpsRLmaxspeed

• (GTM67xonly)WiFiIEEE802.11b/g/nin2.4GHzbandwithaccesspointcapability

•gpsOneGen8,supportingS-GPS,A-GPS,gpsOneXtra™concurrentwithGlonass

661W(FS) 669W(FS)/ /671W(FS) 679W(FS)/

2. Module integration assistance

3. Device certification assistance

1. Additional module certifications

StandardcertificationstypicallyincludeGCF/PTCRB,countriescoveredbyCE/FCCandsomeofthemajoroperatorsinEUandUS.Extracertificationsinothercountriesorwithotheroperatorscanbedoneonrequest.

Standardservicesincludethedetailedintegrationmanual,driversandemailsupport.ExtraservicesthatOptioncanofferarepre-integrationdesignreviewandpost-integrationmeasurements.Premiumservicesareantennadesign,firmware/softwarecustomizationsandadvancedtestservices.

Standard servicesprovideyouwith theneces-sarymodulecertificationdocumentsanddocu-mentation on the device certification process.Extraservicesassistyouwiththecertificationpro-cessforyourdevice.Premiumservicesareneededforpre-certification testingoracquiringdevice re-gulatory/operatorapprovalsonyourbehalf.

* Standard services are available free of charge to all customers, extra services are free of charge for large customers only, premium services are always chargeable.As part of the continual product improvement process, OPTION reserves the right to alter the specifications of this product.© 2012 OPTION. Option and the Option logo are registered trademarks of OPTION. All third-party trademarks are the property of the respective owners.Option nv - Gaston Geenslaan 14 - 3001 Leuven Belgium - T +32 16 317 411 - F +32 16 207 164 - www.option.com Da

taSh

eet_

v1.2

Software

Services

Fromembedded firmware to a full-featured connectionmanager,Optionsupports the entire software chain for embedded modules. Being aQualcommandGobilicensee,OptionhasfullaccesstothefirmwarethatisrunningontheQualcommbasebandprocessor.ThisallowsOptiontomakecustomizations for its customers to support certain features or operator

requirements.Driversareavailableforthemostpopularoperatingsystems.ForsomeplatformssuchasAndroid™andWindows®Mobile,aRIL(RadioInterfaceLayer)canbeprovided.ForotherplatformsOptioncandelivertheSDKoracustomizableconnectionmanager.

Option offers two categories of services:• For new customer devices,Option can perform full device PCB designfrom scratch, perform the necessary certifications and assist with themanufacturing/testing/RF calibration of the device. For more detailedinformation about full-custom device development, please contactservices@option.com.

• ForexistingOptionmodules,Optionoffers3groupsofembedded module

services* :additionalmodulecertifications,assistancewiththedetailsofmoduleintegrationandhelpwithyourdevicecertification.Theseservicesfacilitate wireless 3G integration in a wide range ofmobile broadbandenableddevicessuchasthetraditionallaptopsandtablets,butalsoportablenavigationdevices,industrialhandhelds,smartphonesandcameras.SomeoftheseservicesarestandardandofferedfreeofchargewhenpurchasingmodulesfromOption,otherservicescanbeofferedagainstacertainfee.

Windows® XP 32 bits (SP3)/64

bits (SP2)

Windows® Vista 32/64 bits

(SP2)

Windows®  7 32/64 bits

(SP1)

Windows® 8 32/64 bits

Linux® (kernel version 2.6.26

or higher)

Android™ (2.3/3.2/4.0)

Google Chrome™

Windows® CE 5.2

Windows® Mobile 6.5

Windows® Embedded Compact 7

uCAN Connect 3.0 (data)

✓ ✓ ✓ ✓ ✓

GTM Connect (data, for GTM68x)

✓ ✓ ✓ ✓

RIL (data) ✓ ✓ ✓

HAL (GPS) ✓

HAL (voice) ✓

SDK (data) ✓ ✓ ✓ ✓ ✓ ✓

SDK (voice) ✓ ✓ ✓ ✓ ✓ ✓

MBIM 1.0 compli-ant firmware

✓

Sensor/location driver

✓ ✓

Mobile broadband driver

✓

GPS intermediate driver

✓ ✓

Legacy driver ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓ ✓

For MorE INForMATIoNaboutOptionandourproducts

PLEASE CoNTACTSALES@oPTIoN.CoM