9000 wedge-bonder overview

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David Rasmussen General Manager Palomar Technologies, Inc. Sept 2, 2015 9000 Wedge Bonder Automated High-Speed Fine Wire Wedge & Ribbon Bonder

Transcript of 9000 wedge-bonder overview

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David RasmussenGeneral Manager

Palomar Technologies, Inc.Sept 2, 2015

9000 Wedge BonderAutomated High-Speed Fine Wire Wedge & Ribbon Bonder

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WIRE SIZES (Au & Al)• Au 17.5μm to 75μm (0.7mil to 3mil)• Al 17.5μm to 75μm (0.7mil to 3mil)

RIBBON SIZES (Au)• 12.7μm x 50.8μm up to 25.4 x 254μm

(0.5mil x 2mil up to 1mil x 10mil)

WIRE FEED ANGLE• 45 to 60 degree (Standard 45/60 clamp)• 90 degree (Optional clamp)

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9000 Wedge Bonder At a Glance

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9000 Wedge Bonder At a GlanceCYCLIC RATE• Up to 6 wires per second• Up to 10 loops per second

LOOPING• 70μm to 20mm lengths• Standard forward and reverse• Constant wire length• Jumpers• Chain wires (bond – loop – bond – loop – bond)• Orthogonal bonding (B1 and B2 with separate bond foot angles)

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www.palomartechnologies.com 4© Palomar Technologies, Inc.

9000 Wedge Bonder At a Glance

2mil Al Wire Length: 55-200 mils / Wire Pitch: 6.3 mils / 188 wires

LM2 LM3 Constant Wire Length

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9000 Wedge Bonder At a Glance

2mil Al Wire Length: 60-75 mils / Wire Pitch: 7.25-15.3mils / Length 60-75mil

Fan Out Fan Out + Orthogonal Bond 1

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9000 Wedge Bonder At a Glance

2mil Al Wire Length: 60-75 mils / Wire Pitch: 7.25-15.3mils / Length 60-75mil

Fan Out Fan Out + Orthogonal Bond 1 (To Fit on fine pitch die pads)

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9000 Wedge Bonder At a Glance

2mil Al Wire RFSOE Pattern Wires and Chains

Chain

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9000 Wedge Bonder At a Glance

2mil Al Wire Length: 50 mils Wire Pitch: 8 mils Loop Height 8 mil

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1x10mil Au on Au

9000 Wedge Bonder At a Glance

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PRECISION• 1μm, 3σ, repeatability1

• High-precision touchdown without time delay**Programmable search speed and touch sense threshold values similar to the 8000 Wire Bonder. The system will search from the search tolerance above the part at the programmed search speed until the tool touches the surface according to the programmed threshold. There is no delay between sensing touch and continuing the rest of the bond and wire sequence.

• Precise control of bond force (voice coil)

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9000 Wedge Bonder At a Glance

HIGH THROUGHPUT• Continuous bond technology (CBT)• 2+ smaller bond stations for

efficient handling of smaller products or substrates, eliminating indexing time and maximizing throughput

1 Vision Test

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9000 Wedge Bonder At a Glancei2GI (Intelligent Interactive Graphical Interface)• Interactive wedge bond control via Program Tree

Display (PTD)• Video Graphic Display (VGD), Man-Machine Interface

(MMI) and Part Graphic Display (PGD)• Cognex 8500 Series Vision Processing engine for

real-time video• Loop process view camera on Ѳ rotary enabling side

view of wire at all times (390-degree max Ѳ rotation)(view wire formation)

• Set-up wizards for simplified calibration, setup, and programming

• Microsoft® Windows 7® software platform

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9000 Wedge Bonder At a GlanceQUALITY CONTROL• Real-time bond monitoring and process

control software• Robust, low maintenance voice coil bond

headBOND DATA MINER™ -

comprehensive and centralized data management and analysis system

• Aggregates run data and timestamp data sets

• Process tool analysis• Machine and process trends monitoring

for increased yields and predictive maintenance

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View Cameras

VISION TARGETING • Programing and Rework Target• Runtime referencing• Operator wire inspection

PROCESS VIEW• Operator Real-time bond

viewing of wires• Quick check for wire in tool

without a microscope• Operator rethread guide

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25+ Years of Legacy Wedge Bond Technology

© Palomar Technologies, Inc.

90002470-V2470-III2470-II2470-I 3470-I 3470-II

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Unique, Versatility and Flexibility

© Palomar Technologies, Inc.

9000 Wedge Bonder

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Large Work Area with Unobstructed Accessibility

© Palomar Technologies, Inc.

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9000 Wedge Bonder At a GlanceLARGE BONDING AREA• 305 x 150 mm (12” x 6”)AUTOMATED ASSEMBLY• Material handler options

available for full production line assembly

• Unheated and heated work stages available

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Large Bonding Area = More Flexibility305mm x 150 mm (12” x 6”): X-Y bond area minimizes index time and improves throughput time

Large area ideal for:• Large parts• Multiple parts• Wafers• Low wire counts

© Palomar Technologies, Inc.

12”

6”

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Three Work Area Access Points1: Front Access Door• Designed as dominant entry• Load and unload parts

(manual process)• Wire threading

(possible with use of process camera)

• Tooling change

© Palomar Technologies, Inc.

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Three Work Area Access Points2: HoodUnobstructed access to entire

work envelope• Microscope• Tooling change• System maintenance• Wire threading

(also possible with use of process camera or microscope)

© Palomar Technologies, Inc.

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Three Work Area Access Points3: Bottom Door• Access to tools and

bonding stage(s)• More rarely used, but

available for flexibility in accessibility of entire large work area

© Palomar Technologies, Inc.

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Ergonomics• The keyboard and

monitor move a unit together in Z

• The keyboard height is adjusted from 32.3” to 47.2” from the floor

• Microscope glides easily for viewing

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Wire Sizes, Materials, Types & Clamp Feed Angles

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Wire Specifications• Materials: Au & Al• Wire Type Sizes

– Wire: 17.5µm – 75µm (0.7mil – 3mil)• Ribbon: 12.7μm x 50.8μm up to 25.4μm x 254μm

(0.5mil x 2mil up to 1mil x 10mil)• Feed Angles

– 45 °to 60°– 90°deep access

© Palomar Technologies, Inc.

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Bond HeadAt a Glance

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The de-spooler rides on theta so that wire and ribbon will not get twisted during bonding. This is unique to Palomar Technologies. 

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Bond HeadAt a Glance• Bond force is applied

using a robust, low maintenance voice coil bond head Force range: 3 gram to 200 gram

• Maximum Ѳ rotation range: 390 degree

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Axis Resolution • XYZ are all 0.1um• Theta 0.01125 degree

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Process View Camera• Used for many different functions since it rides on theta which

is carried by Z-coarse• View the bond tool at all theta angles• Simply check the wire and tail position under the tool without

the need for a microscope• Although, we do have a microscope, it is much more efficient

and faster to just look in the process view camera• Other functions

– Watching loop formation during bonding– Viewing wires from an angle to see wire profile, and

inspecting wires at backside orientations that a microscope cannot see

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Process View Camera• Example of the lookdown

targeting camera on the left and the process view camera on the right

• These two images are available at the same time and allow the operator to inspect the bonds from the top down using the targeting camera and to also see if the wire is in the tool using the process view camera

• Note: The process view camera can also be used to thread the tool. The image shows the wire just after rethreading

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Changing Clamp Angles

No need for an expensive bond head change! Simply change the clamp.• Loosen screw for angle adjust and adjust

for position of clamp relative to tool• The rest of the bond head remains the

same

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Wire Clamp Clearance - 60°

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* inches*750mil tool

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Wire Clamp Clearance - 45°

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* inches*750mil tool

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Close-up Tool View

Left of Tool – 45-Deg Feed Left of Tool – 60-Deg Feed

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The 9000 0.472” clearance near the 0.750” wedge tool and 0.446 to bottom of head..

A 1.078” tool will allow .780” clearance.

Wire Clamp Clearance - 90°

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Common Applications•RF-SOE•Disk Drives•Large Complex Hybrids•RF and Microwave Devices•COB•Compact Hybrids•Fine Pitch Devices•High Frequency Passive and

Active Components•MCM Power Connections•Fine Pitch Devices•Running Stitch Interconnects (die-to-die)•Ribbon Bonding•Low Profile Wire Bonds *partial list

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Ribbon Bonding

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1x10mil Au on Au

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Loop Bonding

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3mil Au on Au

1mil Au on Au

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Chain Bonding

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The World’s FIRST Interactive Wedge Bonder i2GI (Intelligent Interactive Graphical Interface)

Touch-Screen Computer Screen

Process Camera

Programming Specificationswww.palomartechnologies.com© Palomar Technologies, Inc.

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9000 Tool Kit• Windows 7®• Intuitive Touch-Screen

Graphical User Interface• Bond Data Miner™• Repair and Maintenance

Statistics (RAMS)• Process Control Software• Cognex® On-Screen

Video for real-time viewing• PC Back-Up & Recovery

• Auto Bond-Set Layout for bond pad programming efficiency

• CAD Interface• Adaptive Bond

Deformation• Auto Focus for material

variances and bond height compensation = high quality & high throughput

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i2GI Enables Intuitive & Interactive Wedge Bond Control • Program Tree Display

– Hierarchal tree controls– Intuitive wizards simplify calibration, set-up, and

programming– Parent-child relationship of the build program and materials

• Natural navigation flow and intuition• Interactive live graphical display• Man-Machine Interface for familiar jog and program capabilities

for 8000 Wire Bonder users**Operator experiences real-time bonding and quality validation

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Part Tree Display(PTD)• Familiar hierarchal tree infrastructure

displaying parent-child part relationships

• “Who caries who” – clear understanding of which materials/wires/bond pads are dependent upon others

• Intuitive wizard to simplify calibration, set-up and programming

• New element are graphically displayed in real-time on the Part Graphic Display

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Part Graphical Display(PGD)

• “You are here” aspect of the program and build design

• True, graphical representation of build

• Excellent reference for a manufacturing document

Ex: export number or wires in seconds rather than manual counting from tree structure

• Interactive approach to ease the reference points between program tree structure and MMI

Can toggle between PGD to corresponding wire in tree structure“Lock” view to zoom in/outHighlight parent-child related parts

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• Video Graphical Display (VGD) is an overlay on the Man-Machine Interface (MMI) view from the Cognex Vision System

• Graphical representation of the build based upon the Part Tree Display

• Images/elements are to-scale within this view

• Program creation support and accuracy check– Program set-up assistance– Ability to lay graphics on top of live video to

double check, for example, on correct bond pad

– “Step Mode” step through program check• Master reference between PTD and PGD• Familiar jogging capabilities for 8000 Wire Bonder

users

Video Graphical Display(VGD)

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Touch Screen• i2GI supports both traditional track-

ball control and a bright, large touch screen

• Glove-touch compatible• Crisp, clear high fidelity graphics in

multiple dynamic panes in a single view

• Vertical orientation– Enhances user control– Minimizes need for archaic hardware,

such as joysticks– Efficient, clean and reduced machine

footprint– 22 to 24” diagonal monitor

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Program Compatibility• 8000 programs can be transferred to the 9000 operating platform

– The parts with references and bond sets are direct mapping matches– The user then creates wedge wire sets with proper bond and loop

parameters• For example, a program may have many components in a package that share

die that have both ball bond and wedge bond wires on the same die– This would mean that you could generate a program structure with all of

the parts– This program could then be used as a starting point for the 8000 and 9000– On each machine, the process engineer would then add bonds sets and

wire sets specific to the machine—there would be no reason to then share the programs across machines any longer

Process Development Consulting offers in-house process advancements and decades of expertise in machine, process and materials for seamless program transfers

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Bond Data MinerTM “Smart” Bonder

• Monitors machine and process trends providing yields and predictive maintenance

• Links together system and bonding parameters

• Proven improvement of yield, process development time, and repair time

• Familiarity for 8000 Wire Bond users

• Three levels of capability through BDM software system

Level 1: Data collection, archiving & analysis– Traceable data

Level 2: Process monitoring– Set upper & lower control

limitsLevel 3: Closed-loop automatic

process control – “Smart” system

© Palomar Technologies, Inc.

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BDM = The Ultimate Analytical Tool

• BDM collects electrical and robotic data from extensive array of sensors– Analyzes, time-stamps and archives data– Provides clear picture of process, machine performance

and stability– Allows traceability of bond parameters and system state

for individual bonds– Data can be viewed across multiple systems and

platforms, including third-party equipment• Powerful tool to improve yield and utilization

© Palomar Technologies, Inc.

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BDM = Unparalled Process Control

© Palomar Technologies, Inc.

RAM Statistics

Wedge-Off Monitoring

Bond Deformation Monitoring(process control)

Adaptive Bond Deformation

Bond Data Miner (BDM)Data Acquisition & Analysis Tool

Third-Party Equipment BDM

Level 1

Level 3

Level 2

Calibration & Validation Data

Factory BDM

Trending

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Repair and Maintenance Statistics (RAMS)

© Palomar Technologies, Inc.

• Tracks uptime statistics per SEMI E10-0701 & E58-0301• Tracks accumulated bond statistics

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Process Control Software

© Palomar Technologies, Inc.

• Collects real-time Bond 1 / Bond 2 deformation data

• User can set upper & lower deformation control limits– Bonder stops

bonding if limits exceeded

– Prevents yield loss

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Production Line Automation & Handler Options

Full Production Lines

Inline and Small Islands of Automation

Solutions for Phased Approach to Production Ramping

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SMEMA Compatible

• SMEMA compatible inline factory integration (production line automation solution)

• Compact design promotes efficient clean room layout in stand-alone installation or integrated into a full line

• Innovative handling systems eliminate indexing to create non-stop bonding (zero-wait state)

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Handler Options for Factory AutomationInline Configuration

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• 1 = preheat, 2 = bond site, 3 = cooling (output buffer)• Design to handle Auer boat (12” x [2.95, 3.1, 4.3, 5.4”])

or substrates with similar size

1 2 3

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Handler Workcells

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Stand-Alone Magazine Handler (mag-to-mag)

• Multi-magazine capacity• Ability of removable for in-line integration

1 2 3SMEMA SMEMA

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Handler Workcells

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Attached Magazine Handlers (mag-to-mag)

• Single magazine capacity• Attached to Orion for single system leveling

1 2 3SMEMA SMEMA

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Handler Workcells

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Auto Continuous

• Designed to handle substrates (square & rect.)

1 2

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Islands of Automation

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9000 Wedge Bonder Magazine HandlerMagazine Handler

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In-Line Assembly for Automated Production Lines

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Magazine

HandlerGPD

Dispense

3800 Die Bonder

Curing Oven

Buffer Conveyor

Plasma Cleaner

9000 Wedge Bonder Magazine

HandlerBuffer Conveyor

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Summary

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• Modern wedge bond requirements demand an automated, large bonding area system with scalability to increase production capacity without limiting performance

• Programmers and operators should experience real-time build and production feedback to increase efficiency and decrease costs

• Lab managers should have peace of mind that their bonder is fully supported by a highly trained team of field service and process development consultants

• Precision, reliability and consistency should be inherent to the system’s capabilities

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Wedge Bond Basics

Technology Overview

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Anatomy of a Wedge Bond Sequence

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Anatomy of a Wedge Bond

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Anatomy of a Wedge Bond

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i2Gi & MMI & Process camera & Microscope

Technology Overview 1

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Process Inspection

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Combination Camera Views• Minimize Microscope use• Minimize cover opening• Maximize operator efficiencyInspection• Targeting camera checks

– Wire / bonds on package• Process View Camera

– Wire in tool & under foot– Wire loop formation real time

Targeting View Process View

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Bond Deformation (Capture, Monitor/Control, Adaptive Control)

Technology Overview 2

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Bond Deformation

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Deformation & Height Tracking per bond• Time stamped for every bond• Accessible with bond data miner• Process inputs / Machine Cal Tracked

Monitor using Process Control per Bond (Missing Wire Detect)• Deformation Limit UCL & LCL• Bond Height Limit UCL & LCL

Deformation Control (Adaptive Bond Deformation)• Deformation Target UCL & LCL• Bond Time Target UCL & LCL

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Bond Deformation

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Process Setup• Start with baseline bond parameters for wires• Capture deformation data (Max, Min, Avg)• Set Process Control Limits (Missing Wire Detect)• Validate missing detection

Optional Deformation Control (Adaptive Bond Deformation)• Deformation Target UCL & LCL• Bond Time Target UCL & LCL

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Bond Deformation(BDEFn)

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1mil Au Wire

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BOND 1 Deformation

Process Limit UCL

Process Limit LCL

ABD Limit UCL

ABD Limit LCL

Machine prompts operator if outside Process Limits

Adaptive Bond Deformation (ABD) tries to control deformation to within ABD Limits

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1mil Au Wire

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BOND 2 Deformation

Process Limit UCL

Process Limit LCL

ABD Limit UCL

ABD Limit LCL

Machine prompts operator if outside Process Limits

Adaptive Bond Deformation (ABD) tries to control deformation to within ABD Limits

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2mil Al Wire

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Process Control Setup ImagesBond 1 and Bond 2

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2mil Al Wire

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c c

Process Limit UCL

Process Limit LCL

Double Bond or other Errors

Missing Wires

Over bonding above UCL can occur if bonding over another wire.

Under bonding below LCL generally indicates a missing wire.

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Wire Clamp Configurations and Clearances

Cost EffectivenessEase of change over

Technology Overview 3

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Clamp 45/60

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• Clamp adjustable between 45 and 60 degree• Clamp supports 0.7mil round to 1x10 ribbon

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Loop Modes – LM0, LM1, LM2, LM3, LM4Tail Modes – TM0, TM1, TM2 (Tuck)Loop formation views per wire (Examples images of loop motions)Orthogonal bonding

Technology Overview 4

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Loop Modes

• LM0 – Simplified up-over-down• LM1 – Formed loop with clamp open• LM2 – Formed loop with clamp close• LM3 – Constant wire length• LM4 – Low jumps (Very fast)

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Loop Mode 2 and 3

2mil Al Wire Length: 55-200 mils / Wire Pitch: 6.3 mils / 188 wires

LM2 LM3 Constant Wire Length Loop Height 17 to 40 mil Loop Height 10-26 mils

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Fan Out Bonding

2mil Al Wire Length: 60-75 mils / Wire Pitch: 7.25-15.3mils / Length 60-75mil

Fan Out Fan Out + Orthogonal Bond 1

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Fan Out & Orthogonal Bonding

2mil Al Wire Length: 60-75 mils / Wire Pitch: 7.25-15.3mils / Length 60-75mil

Fan Out Fan Out + Orthogonal Bond 1 (To Fit on fine pitch die pads)

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9000 Wedge Bonder At a Glance

2mil Al Wire RFSOE Pattern Wires and Chains

Chain

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9000 Wedge Bonder At a Glance

2mil Al Wire Length: 50 mils Wire Pitch: 8 mils Loop Height 8 mil

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1x10mil Au on Au

9000 Wedge Bonder At a Glance

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2mil Al Wire 45 Degree

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4.2.1LM1

Parallel Wires Forward Bonding  

 

Ordinal Directions

12 wires per side

Wire Pitch: 7.25 mils

Wire Length: 60 mils

Direction: Forward

 

Typical layout for small packages.

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2mil Al Wire 45 Degree

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4.2.2LM1

Parallel Wires Reverse Bonding  

 

Ordinal Directions

12 wires per side

Wire Length: 60 mils

Direction: Reverse

Wire Pitch: 7.25 mils

 

Reverse bonding is used where the package edge is too close to allow normal tear-off motions.

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2mil Al Wire 45 Degree

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4.2.3LM1

Fanned Wires, All Angles  

 

Wire Length: 60 - 75 mils

Wire Pitch: 7.25 mils/ 15.3 mils

12 wires per side

Bonding Direction: Forward

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2mil Al Wire 45 Degree

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4.2.4LM1O

Short Fanned Orthogonal B1  

 

Fanned Wires, All Angles, Orthogonal B1

Wire Length: 60 - 75 mils

Wire Pitch: 7.25 mils/15.3 mils

12 wires per side

Bonding Direction: Forward

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2mil Al Wire 45 Degree

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4.2.9LM2LM3Chain

RFSOE Vertical  

 

Demonstrates chain wires, loop control, and bond placement critical in high frequency applications.

 

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2mil Al Wire 45 Degree

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4.2.16 Varying Wire Span LM1 keeps loop height consistent  

 

Wire Length: 55-200 mils

Wire Pitch: 6.3 mils

188 wires

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2mil Al Wire 45 Degree

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4.2.15 Varying Wire Span LM2 keeps loop height consistent  

 

Wire Length: 55-200 mils

Wire Pitch: 6.3 mils

188 wires

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4.2.14 LM3 Constant Wire Length causes varying Wire Span to vary height  

 

Wire Length: 55-200 mils

Wire Pitch: 6.3 mils

188 wires

Loop height from 10-26 mils

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4.2.17 LM4 Row Wires are fast and low loop for jumpers  

 

Link Length: 50 mils

Wire Pitch: 8 mils

648 wires per row

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4.2.18 LM4 Chain Wires  

 

Link Length: 50mils

Wire Pitch: 8mils

27 wires per chain

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Segment 12 – Shrinking Spiral LM2  

 

Wire Length: 30-95 mils

40 wires per side

Direction: Forward

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Segment 13 – Shrinking Spiral LM3 Constant length  

 

Wire Length: 30-95 mils

40 wires per side

Direction: Forward

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Height Learning and AdaptationOptical Autofocus

Real-time TouchingAdaptive Search Tolerance

Technology Overview 5

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Height learning and running• Height learning – Competitors have to touch onto

the die surfaces to measure the expected heights during programming or editing. (Customers do not like this)

• Palomar learns height automatically when focused

• Runtime automatic touching and search tolerance optimization

• Autofocus and part height update adjust expected height based on a autofocus

www.palomartechnologies.com 101© 2011 Palomar Technologies, Inc.