PHENIX Silicon Vertex Tracker
PHENIX Silicon Vertex Tracker
Mechanical Requirements
Stability requirement, short and long 25 µm
Low radiation length <0.5%
Low CTE
High stiffness-to-weight ratio
Room temperature operation -- desirable
Cooling – H2O desirable
Kinematically mounted off Central Magnet
PHENIX Silicon Vertex Tracker
Mechanical SpecificationsCentral Barrel
layer radius 2.5,6,8,10 cm
layer length 30 cm
pixel size 50 μm x 425 μm
strips 80 μm x 3cm
pixels( 1st layer) ~1.9M
strips(2,3,4 layer) ~165k
azimuthal coverage 320 deg
End caps(each)
inner radius 2.5 cm
outer radius 18cm
disk z position(at z= 2.5cm) 20,26,32,38 cm
pixel size 50 μm x 4 mm
total pixels ~2.0M
azimuthal coverage 360 deg
PHENIX Silicon Vertex TrackerSimulated Performance
Barrel
occupancy
1st layer 1%
2nd layer 11.5%
3rd layer 7.2%
4th layer 4.8%
resolution
DCA <100 µm
Endcaps
occupancy
all disks <3%
resolution <100 µm
PHENIX Silicon Vertex Tracker
Integration
Designed to coexist with TPC < 20 cm radius.Clam shell design to fit around beam pipe.Radiation length ~ 1% per layer goalBarrel and end cap sections are separate units ( i.e. ATLAS type)
Staging Option 1
Phase One --year 1Design for barrel with strips first – no pixels or end caps
Phase Two - after year 1Second design for complete barrel and end caps
Option 2Design for barrel with option to add pixels, add end caps later
N-type single-sided strip sensor developed by BNL (Z. Li)• Thickness : 400um (0.43 % X0), 250um (0.26% X0) for mass prod.
• Size : 3cm*6cm, Pitch : 80um, 2-dim readout : x- and u-direction
• #ch per sensor : 384 ch/dir * 4 dir =1536 ch
Drawn by Yuji Goto
Silicon Strip Sensor
x
u
x
u
Prototype Sensor ModulePrototype module development is on going.• Performance of the sensor will be tested w/ cosmic ray and beam at KEK.
• Readout chip : VA2 (Viking 128 ch CMOS, analog multiplexer, 1us peaking time)
DraftOnly this
Toward Ladder Structurein Vertex Tracker
• Barrel layer length: ~30cm
• #chip : 12 readout chip/sensor
• #sensor : 4 or 5 sensor/ladder
• Cooling : dependent on readout chip
Ex. SVX3D : 3.5mW/ch * 128ch/chip * 60sensor/ladder = 27 W/ladder
Liquid cooling will be required.
• Cabling : Cu(Al) / Polyimide hybrid for low material budget
• Ladder material : ex. CFRP (Carbon Reinforced Polymer)
• Total material budget goal : 1% X0 per layer
Mock-up of Barrel Support StructureMaterial : CFRP (Carbon-Fiber Reinforced Polymer)
Pictures and drawings : http://rarfaxp.riken.go.jp/~tojo/20020729/mockup20020729.htm
Precision, strength, deformation and material budget will be measured.
ATLAS Vertex Detector• Support and cooling structures for ATLAS vertex detectors• Thermo-mechanical design
- dimensional stability, low Z, high stiffness, heat removal capacity
B-layer services
end section (2)
center frame sectiondisks (10)
internal end-cone (2)
interior barrel layers
0 50cm
ATLAS: Support Frame
• Support Frame End Section– All GFRP Construction
• XN80/CE Facings• XN50/CE Honeycomb
– High dimensional accuracy (<.001”)
Finished Prototype
Load Test (Prism)
Prototype Frame During Fabrication
ATLAS: Silicon Detector Backplanes• Pixel detector support & cooling
– Extreme stability ( < 10 µm @ -15ºC)– High heat flux (10,000 W/m2), active cooling circuit– Low mass ( < 2 kg/m2)
– High stiffness ( > 100 Hz)
all carbon-carbon tube~3.2 mm ID
0.25 mm wall thickness
facing overhang
tube extensions
mountingpoints
0
10
cm
PHENIX Silicon Vertex Tracker
PHENIX Silicon Vertex Tracker
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