X-ray TDI camera C10650 series - X-ray NDT | Hamamatsu ... · High S/N ratio with 12 bit / 16 bit...
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High S/N ratio with 12 bit / 16 bit output Camera Link interface (Base configuration) Single power supply (+15 V) operation Real time dark current / shading correction function Frame readout mode for easy installation alignment 10.7 m/min. 2x2 binning 586 mm Detection area 48 μm Pixel size TDI technology X-ray TDI camera C10650 series is useful for in-line applications requiring high-speed operation with high sensitivity. TDI imaging is appropriate for applications where it is desired to record a linear movement, or where the aspect ratio of the subject being imaged is significantly asymmetric. Low brightness under high resolution usage, a problem with conventional line sensor cameras, is improved with this X-ray TDI camera, making it suitable for applications which require high resolution. Vertical X-ray TDI cameras that can be installed in narrow spaces are new additions to the series. Printed circuit board ( PCB ) inspection Surface-mounted component inspection Lithium-ion battery inspection High-resolution in-line non-destructive inspection High speed readout Large field of view High sensitivity High resolution High quality image output with high resolution achieved by TDI technology High speed readout Max. TDI sensor Signal intensity X-ray TDI camera Object X-ray source Shield box Conveyor belt Object motion Time Delay Integration is a scanning technology in which a frame transfer device produces a continuous video image of a moving object by means of a stack of linear arrays aligned with and synchronized to the motion of the object to be imaged in such a way that, as the image moves from one line to the next, the integrated charge moves along with it, providing higher resolution at lower light levels than is possible with a line-scan camera. Features Features X-ray TDI camera C10650 series
Transcript of X-ray TDI camera C10650 series - X-ray NDT | Hamamatsu ... · High S/N ratio with 12 bit / 16 bit...
High S/N ratio with 12 bit / 16 bit outputCamera Link interface (Base configuration)
Single power supply (+15 V) operationReal time dark current / shading correction functionFrame readout mode for easy installation alignment
10.7m/min.
2x2 binning
586mm
Detection area
48μm
Pixel size TDI technology
X-ray TDI camera C10650 series is useful for in-line applications requiring high-speed operation with high sensitivity. TDI imaging is appropriate for applications where it is desired to record a linear movement, or where the aspect ratio of the subject being imaged is significantly asymmetric. Low brightness under high resolution usage, a problem with conventional line sensor cameras, is improved with this X-ray TDI camera, making it suitable for applications which require high resolution. Vertical X-ray TDI cameras that can be installed in narrow spaces are new additions to the series.
Printed circuit board (PCB) inspection
Surface-mounted component inspection
Lithium-ion battery inspection
High-resolution in-line non-destructive inspection
High speed readout Large field of view High sensitivityHigh resolution
High quality image output with high resolution achieved by TDI technologyHigh speed readout
Max.
TDI sensor
Signal intensity
X-ray TDI camera
Object
X-ray sourceShield box
Conveyor belt
Object motion
Time Delay Integration is a scanning technology in which a frame transfer device produces a continuous video image of a moving object by means of a stack of linear arrays aligned with and synchronized to the motion of the object to be imaged in such a way that, as the image moves from one line to the next, the integrated charge moves along with it, providing higher resolution at lower light levels than is possible with a line-scan camera.
FeaturesFeatures
X-ray TDI cameraC10650 series
PRODUCT LINEUP
High speed readout Large field of view High sensitivityHigh resolution
High-resolution, High-speed Camera with a Large Field of View for In-line100 % X-ray Inspection
High speed readout
Large field of view
Detect dark sample with high sensitivity
High resolutionimage acquisition
X-ray TDI Camera
X-ray Source
Object
TDI technology offers all four elements simultaneously.
Standard type
Horizontal chassis / Overlapped type
C10650-2212
145.9 mm
C10650-3213
221.1 mm
Type numberSensor numberX-ray sensitive area
C10650-2612
146.9 mm
C10650-3613
220.2 mm
C10650-4614
293.4 mm
Type numberSensor numberX-ray sensitive area
Vertical chassis / Overlapped typeC10650-261V
2146.9 mm
C10650-361V3
220.2 mm
C10650-461V4
293.4 mm
Type numberSensor numberX-ray sensitive area
Vertical chassis / Overlapped type (2 cameras output)C10650-261W
6439.9 mm
C10650-361W7
513.2 mm
C10650-461W8
586.4 mm
Type numberSensor numberX-ray sensitive area
SPECIFICATIONSType numberScintillatorWindowEffective X-ray tube voltage rangeCCD pixel sizeNumber of pixelsX-ray sensitive areaLine speedTDI line rate
A/D converterDigital interfaceInterface (Camera Link)Pixel clock (Camera Link) Output signals (Image data) Power supplyPower consumption
C10650-221
3040 (H) × 128 (V) 145.9 mm (H) × 6.1 mm (V)
C10650-321
4608 (H) × 128 (V)221.1 mm (H) × 6.1 mm (V)
C10650-461W
6144(H)×128(V)+6144(H)×128(V)586.4 mm (H) × 6.1 mm (V)
Approx. 30 VA + Approx. 30 VA
CsI ScintillatorFOS (Fiber optic plate with scintillator)
Approx. 25 kV to 90 kV48 μm × 48 μm
0.178 m/min to 6.073 m/minMax. 2.109 kHz (6.073 m/min)Max. 1.858 kHz (10.702 m/min)
Camera LinkBase Configuration
16.0 MHz
DC +15 V
1 × 1Binning 2 × 2
12 bit
12 bit digital output
6144 (H) × 128 (V) 293.4 mm (H) × 6.1 mm (V)
*1
*2 *2
*2 *2
*1 Usable range of X-ray strength may vary depending on the tube current, the tube voltage and the distance.
*2 "Active CCD pixel number" is all outputting pixel number including overlapped pixel. When the overlapped pixels are deleted, actual pixel numbers will vary. And also, X-ray sensitive area will vary.
*3 2 units of the power supply unit and the power cable are necessary for C10650-461W.
C10650-461 C10650-461V
16 bit
16 bit digital output
*3Approx. 30 VA
MEASUREMENT EXAMPLES
Internal shape inspection of lithium-ion battery (LiB)
With the development of communication technology and the automobile industry, the demand for PCBs has expanded, and they have become an indispensable part of supporting people's comfortable lives.The X-ray TDI camera enables non-destructive inspection of defects such as voids, cracks, and uneven coating that occur in the soldering of electronic components on the PCB. The C12300 series contributes to the improvement of tact time for in-line inspection by achieving both high sensitivity and high line speed.For example, in soldering inspection of the back fillet, it is possible to perform a high-speed inspection of defective parts by performing 3D analysis using a brightness profile acquired with high sensitivity.
The overlapped type offers a wide detection area with no dead areas due to its staggered sensors.
10 pixels(Min. 4 pixels, Max. 16 pixels)
15.1
±0.5
(Unit: mm)
C10650-461
Wide detection width with no dead areas
Normal solderingSoldering failureLine scanLine scan
Profile
3D display
Standard type has a following dead space between chips.Dead space between chips
C10650-221
C10650-321
Dead space 2
Edge pixel
Dead space 1:250 μm min.350 μm max.
Left chip Center chip
±50
μm M
AX.
Dead space 1
Edge pixel
Dead space 2:130 μm min.200 μm max.
Right chipCenter chip
±50
μm M
AX.
X-ray image intensifier (I.I.) camera : X-ray TDI camera :
Slack of rolling
Short of the solutionCondition of the connection on electrode
Inspection by X-ray TDI cameraInspection by 2D sensorLithium-ion batteries (LiB) are used in various fields, including smartphones and electric vehicles.The X-ray TDI camera enables in-line inspection for defects such as electrode mispositioning and stacking errors inside the LiB. In the case of X-ray inspection using a two-dimensional detector, the image is distorted due to the angle of the X-rays incident on the object, except for the irradiation center of the X-ray source. It may be necessary to adjust the position of each imaging site to perform a precise inspection. On the other hand, the X-ray TDI camera irradiates X-rays perpendicular to the transport direction and integrates the images obtained continuously to perform imaging, so it is possible to obtain images without distortion. This enables in-line precision inspection of large objects.
The image is distorted on the corner areas in thickness direction, and the dimensional measurement cannot be implemented correctly.
Since the object is moved vertically to the detector, it is possible to capture an image without distortion in the transport direction, and accurate dimensional measurement is possible.
Inspection for soldering defects of the printed circuit board (PCB)
Not necessary to relocate the samples and possible to inspect the long length object with no distortion.
Overlapped type measurement example
DIMENSIONAL OUTLINES (Unit: mm)
SYSTEM CONFIGURATIONOPTIONSModel nameA8206-60A13967-05
M8815-01
Product namePower supply unitPower cable 5 mAdditional function module 64 gain
Standard configurationOptions
X-ray source Shield box
Belt conveyor
Digital interface cablePower cable 5mA13967-05
X-ray TDI camera
Power supply unitA8206-60
PC
Frame grabber board
Test article
* Power supply unit and power cable and software API are available as the optional. The image display equipment (computer, frame grabber board and digital interface cable) and the X-ray source, etc. should be prepared separately. Contact us for more information.
●C10650-261, -361, -461 (Approx. 7 kg)
●C10650-221, -321 (Approx.5 kg)
●C10650-261W, -361W, -461W (Approx. 16 kg)
●C10650-261V, -361V, -461V (Approx. 7 kg)
●A8206-60 (Option) (Approx. 1.6 kg)
300 30360
50
64
112
11
10.7
134
32.9
145(Effective area : C10650-221)221(Effective area : C10650-321)
123
5.5
6
(Effe
ctive
area
)
4−Φ4.5
(38.264)
160160370
25
239
250
228
(Senso
r positio
n)
(Sens
or po
sition
)
(Sen
sor p
ositio
n)
50.0
5
293(Effective area : C10650-461)
220(Effective area : C10650-361)
146(Effective area : C10650-261)
5.5
10.6
11
15.1
6−Φ4.5
50
42.4
(Sen
sor p
ositio
n)
5
175
371
175
5
664
8.3
734
73.764 586(Effective area : C10650-461W)
130
8065
226
17 700
(15.
1)
10.6
2−Φ8.2
439(Effective area : C10650-261W)513(Effective area : C10650-361W)
39
16
80
65
390.
5 (Se
nsor
positi
on)
130
15.1
73.764
10.6
6
407441
172−Φ8.2
146(Effective area : C10650-261V)220(Effective area : C10650-361V)
293(Effective area : C10650-461V)
● DCAM-API https://www.dcam-api.com/ Software API Support (Microsoft Windows)
Software
270 16.1302.2
2-M4 D=6
32.5
66
147
Product and software package names noted in this documentation are trademarks or registered trademarks of their respective manufacturers.Subject to local technical requirements and regulations, availability of products included in this promotional material may vary. Please consult your local sales representative.Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.Specifications and external appearance are subject to change without notice.Please note the X-Ray images on this brochure are taken for test purpose, the images do not reflect actual qualities of the products on the market.2020 Hamamatsu Photonics K.K.©
HAMAMATSU PHOTONICS K.K.Systems Division812 Joko-cho, Higashi-ku, Hamamatsu City, 431-3196, Japan, Telephone: (81)53-431-0124, Fax: (81)53-433-8031, E-mail: [email protected].: Hamamatsu Corporation: 360 Foothill Road, Bridgewater, NJ 08807, U.S.A., Telephone: (1)908-231-0960, Fax: (1)908-231-1218 E-mail: [email protected]: Hamamatsu Photonics Deutschland GmbH.: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49)8152-375-0, Fax: (49)8152-265-8 E-mail: [email protected]: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: (33)1 69 53 71 00, Fax: (33)1 69 53 71 10 E-mail: [email protected] Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court,10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, UK, Telephone: (44)1707-294888, Fax: (44)1707-325777 E-mail: [email protected] Europe: Hamamatsu Photonics Norden AB: Torshamnsgatan 35 16440 Kista, Sweden, Telephone: (46)8-509 031 00, Fax: (46)8-509 031 01 E-mail: [email protected]: Hamamatsu Photonics Italia S.r.l.: Strada della Moia, 1 int. 6, 20020 Arese (Milano), Italy, Telephone: (39)02-93 58 17 33, Fax: (39)02-93 58 17 41 E-mail: [email protected]: Hamamatsu Photonics (China) Co., Ltd.: 1201 Tower B, Jiaming Center, 27 Dongsanhuan Beilu, Chaoyang District, 100020 Beijing, P.R. China, Telephone: (86)10-6586-6006, Fax: (86)10-6586-2866 E-mail: [email protected]: Hamamatsu Photonics Taiwan Co., Ltd.: 8F-3, No.158, Section 2, Gongdao 5th Road, East District, Hsinchu, 300, Taiwan R.O.C. Telephone: (886)3-659-0080, Fax: (886)3-659-0081 E-mail: [email protected]
www.hamamatsu.com
Cat. No. SFAS0025E11SEP/2020 HPKCreated in Japan
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