Platamid presentation - Arkema .4 Major Advantages 100% Solid Content No Water or Solvent to...

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Transcript of Platamid presentation - Arkema .4 Major Advantages 100% Solid Content No Water or Solvent to...

  • PLATAMID® COPOLYAMIDES

    SPECIALTY HOT MELT ADHESIVE

    2014

  • 2

    Adhesive – Basic Definition

    ADHEREND #1

    ADHEREND #2

    ADHESIVE

    Adhesive

    Joint

    or

    Adhesive

    Bond

    Assembly Parameters

    Time, T°C, Pressure

    Surface Bonding

    & Wetting

    -Adhesion-

    Internal Strength

    – Cohesion -

    =

  • Polyethylene (PE)

    Styrene Bloc Copolymer (SBC)

    Amorphous Poly αααα-Olefins (APAO)

    Ethylene Vinyl Acetate (EVA)

    CoPolyamide

    CoPolyester (CoPES)

    PolyUrethane (TPU)

    RHM

    3

    Volume-Type ~ 90-95% of Total Vol.

    EVA & SBC ~ 80 % of Total

    Used mostly on Non Polar Surface

    Heavily Formulated (*)

    Moderate growth rate

    (*) Typically contains > 50% of additives (tackifiers, oils, waxes, fillers, etc)

    Specialty-Type

    Molecular Design (Not Formulated)

    Most Effective on Polar Surface

    Higher Service T°C than PO

    Platamid® CoPolyamides HMA

    R = Reactive

    Reaction � � T°C Class

    Reaction � � Creep Resistance

  • 4

    Major Advantages

    100% Solid Content � No Water or Solvent to Eliminate

    No VOC concern + Worker Acceptance

    Processable as One Component System

    Short Setting Times � High Production Rate

    Recycling & Reduce Waste

    Amenable to Bio Based Formulation

    Limitations

    Creep

    T°C stability

    Advantages & Limitations

    Development ongoing for a “Crosslinkable Grade”

    Platamid® HX 2632

  • 5

    Random Copolymers of Polyamides

    ● Diamines & Diacids

    ● Lactams & Amino-Acids

    Random Copolymerization disturbs polymer Crystallinity

    ���� Lower the Melting Point to the level required by the application

    ● Typical Platamid® Melting Point: from 85 to 150C (and above)

    What are Platamid® CoPolyamides ?

  • 6

    Monomer type dictates end-use properties

    ● Short Chain or Long Chain

    ● Aliphatic, Cycloaliphatic or Aromatic

    ● Bio-based or Fossil-based

    Monomer Composition

    ���� Right balance between Melting Point, Crystallinity & Crystallization Speed

    ● Mechanical Properties

    ● Chemical resistance

    ● Open Time (Long or Short)

    ● Productivity

    What are Platamid® CoPolyamides ?

     Crystallinity

     Crystallization Speed

  • 7

    Physical Properties & Processing

    Thermoplastic

    Good Transparency, Low Yellow Index

    Heat (Re)Activable

    Low Density (vs. CoPES or TPU) – 1.05 to 1.10

    Melting Point from 85 to 150°°°°C (and above)

    Melt Viscosity from 40 Pa.s up to 4000 Pa.s at 160°°°°C

    Adjustable Crystallization Speed & Open Time

    Major properties

  • 8

    Mechanical Properties

    Good Strength (Green / Cohesive / Adhesive)

    High Specific Adhesion = [Adhesion] / [Weight]

    Chemical & Environmental Resistance

    Very Good Laundry & Dry Cleaning Resistance

    Good Chemical Resistance (esp. to hydrocarbons)

    Good Hydrolysis Resistance

    Good Heat Resistance (vs. Olefin CoPolymers)

    Good UV Resistance (vs. CoPES)

    Major properties

  • 9

    Specific Properties (Grade Dependent)

    Crosslinkable (E-Beam, UV, Peroxyde)

    Tailored Bio Based Content up to 100%

    Elastic / Soft (Bloc CoPolymer Technology)

    Low VOC

    Solubility in Mild Alcohols

    Steam Activable

    Major properties

  • 10

    Main Processing Options

    Solution

    POWDER

    Extrusion

    Varnish Varnish & Coating& Coating

    Melt Print PasteScatter

    Textile InterliningTextile InterliningSolvtSolvt. . Based Based

    AdhesiveAdhesive

    FilmFilm WebWebCoated Coated FilmFilm

    NetNet

    Low Pressure Molding

    OvermoldingOvermolding

    Note : Platamid® are generally not amenable to Injection Molding (will adhere onto metal mold !)

    Fiber & Fiber & FilamentFilament

    PELLET

  • 11

    Main Applications

    Technical Textile

    Masterbatch ElectronicsAutomotive Textile

    Floor Covering

  • 12

    Platamid® Product Offer

    10 Main grades

  • 13

    Platamid® Product Offer

    Low � Melt Print, Low Pressure Molding

    Medium � Extrusion

    Low � T°C Sensitive Substrates

    Medium � General Purpose

    Fusing Fusing

    RangeRange

    Melt Melt

    ViscosityViscosity

    Standard � General Purpose

    Universal � Difficult-to-Bond Substrates ChemistryChemistry

    Normal � General Purpose

    Fast � High Productivity

    Crystal. Crystal.

    SpeedSpeed

  • 14

    Products recommendation

  • 15

    Products recommendation

    C o tt

    o n &

    W o o l

    P o ly

    e st

    e r

    P o ly

    a m

    id

    P o ly

    a c ry

    lo n it

    ri le

    P o ly

    o le

    fi n s

    A B S / S A N

    P V C R

    ig id

    / S o ft

    P C

    P U

    E p o x ie

    s

    P h e n o li c s

    M e ta

    l

    L e a th

    e r

    G F R

    e in

    fo rc

    e d

    C o m

    p o si

    te s

    HX 2544 � � � � � � � � � � � � � �

    M 2468 � � � � � � � � � � � � � �

    M 1657 � � � � � � � � � � � � � �

    M 1757 � � � � � � � � � � � � � �

    H 106 � � � � � � � � � � � � � �

    H 005 � � � � � � � � � � � � � �

    H 2513 � � � � � � � � � � � � � �

    HX 2592 � � � � � � � � � � � � � �

    M 1276 � � � � � � � � � � � � � �

    H 2519 � � � � � � � � � � � � � �

    OthersTextiles Thermoplastics (incl. Foams) Thermosets

    ���� �������� Preferred Recommended Not Adapted

  • 16

    PLATAMID® COPOLYAMIDES

    For more information, please contact:

    Richard CHAIGNEAU Market Development Leader

    richard.chaigneau@arkema.com