IC Matching information STM32F417 - Geyer...

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Reference Design 32bit Micro controller STM32 F4 series STM32F417IG STM32F417IG Core ARM® 32-bit Cortex™-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memory Up to 1 MB of Flash memory Up to 192+4 KB of SRAM including 64-KB of CCM (core coupled memory) data RAM Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories Clock, reset and supply management 1.8 V to 3.6 V application supply and I/O POR, PDR, PVD and BOR 4-to-26 MHz crystal oscillator Internal 16 MHz factory-trimmed RC (1% accuracy) 32 kHz oscillator for RTC with calibration Internal 32 kHz RC with calibration Sleep, Stop and Standby modes VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM ARM, Cortex and ART Accelerator are trademarks or registered trademarks of ARM Limited. Other brand name and product name belong to each company. Details of Matching Test Test IC: STM32F417 1.Circuit Diagram IC STM32F417GH6 VDD +3.3V Geyer Crystal Model: KX-327NHT Frequency: 32.768kHz Load capacitance: CL=7pF ESR: <70k Part No.: 12.87147, 12.87148, 12.87153 1

Transcript of IC Matching information STM32F417 - Geyer...

Page 1: IC Matching information STM32F417 - Geyer Electronicgeyer-electronic.de/.../service/IC_Matching_information_STM32F417.… · 2. Circuit characteristics for recommended circuit parameters.

Reference Design

32bit Micro controller STM32 F4 series STM32F417IG

STM32F417IG

Core ARM® 32-bit Cortex™-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions

Memory Up to 1 MB of Flash memory

Up to 192+4 KB of SRAM including 64-KB of CCM (core coupled memory) data RAM

Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories

Clock, reset and supply management

1.8 V to 3.6 V application supply and I/O

POR, PDR, PVD and BOR

4-to-26 MHz crystal oscillator

Internal 16 MHz factory-trimmed RC (1% accuracy)

32 kHz oscillator for RTC with calibration

Internal 32 kHz RC with calibration

Sleep, Stop and Standby modes

VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM

ARM, Cortex and ART Accelerator are trademarks or registered trademarks of ARM Limited. Other brand name and product name belong to each company.

Details of Matching Test

Test IC: STM32F417

1.Circuit Diagram IC STM32F417GH6 VDD +3.3V Geyer Crystal Model: KX-327NHT Frequency: 32.768kHz Load capacitance: CL=7pF ESR: <70k Part No.: 12.87147, 12.87148, 12.87153

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Page 2: IC Matching information STM32F417 - Geyer Electronicgeyer-electronic.de/.../service/IC_Matching_information_STM32F417.… · 2. Circuit characteristics for recommended circuit parameters.

2. Circuit characteristics for recommended circuit parameters. (Rd=0Ω, Cin=4.7pF, Cout=4.7pF)

VDD [V] Frequency Deviation dF/F(×10-6) Negative Resistance R(Ω) Drive Level DL(uW)

3.3V +11ppm 370Ohm 0.01uW

Note

• Negative Resistance The recommended oscillation margin based on empirical results which is necessary to ensure the oscillator’s ability to start and maintain stable oscillation.

• Drive Level Electric-power or current level under the specified conditions of a crystal unit. If the specified maximum drive level of the crystal is exceeded, this may result in the occurrence of unstable oscillation and increase of equivalent series resistance (ESR).

• Load capacitance Effective series capacitance measured from the terminals of a crystal unit to the oscillation circuit and determined as a condition when using a crystal unit in an oscillation circuit. The operating frequency is determined by the electrical characteristics of a crystal unit and the load capacitance.

Caution

The evaluation results above should be used as a reference during the crystal selection. Depending on the actual board layout, frequency used, and other related factors the circuit characteristics may differ, therefore selection of the crystal should be done based on evaluation results of the actual circuit board. Please contact us for recommendations of crystal specifications which will work best for your applications.

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