Optics for EUV Lithography · Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL Workshop June 13. th,...

Optics for EUV Lithography

June 13th, 2018 · Berkeley, CA, USA

Dr. Sascha Migura, Carl Zeiss SMT GmbH, Oberkochen, Germany2018 EUVL Workshop

2Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL Workshop June 13th, 2018

Ernst Abbe in 1873

k1 is process factorλ is wavelength

NA is numerical aperture

Moore’s Law drives the requirements on the optical system.

The resolution of the optical system determines theminimum feature size on a chip.

80060035025018013090654532221611

86 88 90 92 94 96 98 00 02 04 08 12 14 161006 17 18Des

13.5nm

The sequence λ down NA up k1 down has been repeated several times during the last 25 years.

intermediate focus

collector

reticle (mask)

plasma

illuminator

field facet mirror

pupil facet mirror

projectionoptics

source

EUV optical train (schematic).

design scheme

High-NA EUV Lithography will provide further shrink.

The EUV Program at ZEISS has enabled serial production.1

Agenda.

2006 2009 2012 20182003 2015

EUV program at ZEISS: Continuously improving resolution.

First shipment

Small Field Tool MET

Since mid-1999 developed in cooperation with Lawrence Livermore National Lab and Lawrence Berkeley National Laboratories.

NA 0.30Field 0.6 x 0.2 mm²MAG 5x

Resolution 20 nm

Micro Exposure Tool

Starlith® 3100

2009 2012 20182003 2015

Prototypes

Pre-Production

First shipment

Small Field Tool NA = 0.3020 nm

Alpha Demo Tool

NA 0.25Field 26 x 33 mm²MAG 4x

Resolution 27 nm

Starlith® 3100

The 1st EUV full field system: Optics for ASML ADT / NXE:3100.

Starlith® 3100

2009 2012 20182003 2015

Starlith® 33x0 Starlith® 3400

ADT 3100

Prototypes

Pre-Production

Serial Production

NA = 0.2532…27 nm

First shipment

Alpha Demo Tool

NA 0.33Field 26 x 33 mm²MAG 4x

Resolution 13 nm

Starlith® 3400

The solution for serial production: Optics for ASML NXE:3400B.

Source: ASML

The ZEISS Starlith® 3400 optics delivers excellent imaging...

Scanner capabilityHP = Half Pitch

…for the ASML NXE:3400B scanner.

Source: ASML

Intel Core i7 layout

Displaying the information of one NXE:3400B field, requires a TV screen of 780m x 1370m.

The Starlith® 3400 projection optics performs with improved aberrations – consistent for shipped systems.

ZEISS inhouse EUV qualification

WavefrontRMS

Distortion

The optical performance translates into world record breaking Matched Machine Overlay of 1.2nm for NXE:3400B.

6 wafers (BMMO v4.2), 76 fields (full wafer, 3 mm edge clearance), 7x7 points per field, WEC, REC corrections, ATP model applied

Matched Machine OVL [nm]

wafers

A robust transmission trend for the Starlith® 3400 optics supports increased throughput.

Factor 3

ZEISS inhouse EUV qualification

The Starlith® 3400 illuminator is fully qualified @EUV and consistently meets specification for shipped systems.

Actual EUV measurement of 22 illuminationsettings during system qualification

slit intensity @reticle for dipole setting

ideal UNICOM correction appliedZEISS inhouse EUV qualification

0.5 mm

…roughness defects must not be taller than 0.4mm.

A mirror surface is polished down to ~50pm rms.

Inflated to the size of the contiguous United States...

Mount Whitney 4421m

From Wikipedia

Computer ControlledPolishing

Ion Beam Figuring forAtomic Level Figure Control

Interferometric Surface Metrology forSpheres and Aspheres

Repeatability: ~10pm rmsReproducibility: ~20pm rms

Manufacturing technologies and metrology are closing theloop for figure control on sub-atomic level.

Polishing: Key performance parameters have improvedsignificantly over time.

Mid Spatial Frequency Roughness (MSFR) improved significantly…

All MSFR values here are based onthe same definition as for 3100/3300.

original flare target

flare challenge by customer

… and reduced system flare to satisfying levels –meeting a challenging target.

Alpha Demo Tool

Starlith® 3100

2009 2012 20182003 2015

Starlith® 33x0 Starlith® 3400

ADT 3100 3400

High-NA EUV

Prototypes

Pre-Production

Serial Production

Development

NA = 0.2532…27 nm

NA = 0.3318…13 nm

NA = 0.55< 8 nm

First shipment

High-NA EUV Lithography will provide further shrink.

The EUV Program at ZEISS has enabled serial production.1

Agenda.

Ernst Abbe in 1873

NA>0.5 is needed to achieve sub 8 nanometer resolution.

High-NA

NA 0.25 0.33 … 0.45 0.50 0.55

Resolution @ k1=0.3single exposure / nm 16.2 12.3 … 9.0 8.1 7.4

intermediate focus

collector

reticle (mask)

plasma

illuminator

field facet mirror

pupil facet mirror

projectionoptics

source

EUV optical train (schematic).

design scheme

Increased openings of

the light cones lead to bigger mirrors and

bigger optics

NA 0.25 NA 0.33 NA 0.55

Design examplesWafer level

Reticle level

We have designs for such High-NA optics available.

Extreme aspheres enablingfurther improved wavefront / imaging performance

Big last mirror driven byHigh NA

Large overallsize of opticalsystem

Tight surface specifications enablinglow straylight / high contrast imaging

Challenge to optics technology and manufacturing No fundamental limits

These are big optical systems with very large mirrors and extreme aspheres at increased accuracy requirements.

The High-NA optics design supports a considerable reduction of the wavefront aberrations.

projected

Half pitch 7.8nm

f pitc

Half pitch 16.5nm

f pitc

With its superior resolution and highest productivity potential the High-NA EUV system offers the chance to be the ultimate lowest cost/pixel printing machine!

High-NA EUV: Ultimate resolution power.

Extensions for High-NA EUV optics manufacturing are under construction.

Oberkochen, Germany

High-NA EUV Optics

High-NA EUV Testing

Coating

Extensions for High-NA

Constructionstatus

October 2017

Extensions for High-NA EUV optics manufacturing are under construction.

Conclusions.

Optics for EUV Lithography have evolved over three decadesto a level where excellent imaging is demonstrated.

Right now, the Starlith® 3400 Optics extends EUV Lithography to 13nm single-shot resolution with high productivity for serial production.

High-NA EUV Lithography enables further shrink for the semiconductor industry to continue Moore’s Law.

Acknowledgements.

EUVL Teams at ASML & ZEISS and at our partners

Federal Ministry of Education and Research (Germany)DG Connect of the European Commissionfor funding of the BMBF project „ETIK“ (16N12256K)and the projects „E450LMDAP“ (621280), “SeNaTe” (662338),“TAKE5” (692522) and “TAKEMI5” (737479)within the framework of the ENIAC and ECSEL programs.

Optics for EUV Lithography · Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL Workshop June 13. th,...

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