Optics for EUV Lithography · Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL Workshop June 13. th,...
Transcript of Optics for EUV Lithography · Carl Zeiss SMT GmbH, Sascha Migura 2018 EUVL Workshop June 13. th,...
Optics for EUV Lithography
June 13th, 2018 · Berkeley, CA, USA
Dr. Sascha Migura, Carl Zeiss SMT GmbH, Oberkochen, Germany2018 EUVL Workshop
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Ernst Abbe in 1873
k1 is process factorλ is wavelength
NA is numerical aperture
Moore’s Law drives the requirements on the optical system.
The resolution of the optical system determines theminimum feature size on a chip.
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1000
80060035025018013090654532221611
86 88 90 92 94 96 98 00 02 04 08 12 14 161006 17 18Des
ign
rule
/ R
esol
utio
n(n
m)
Incr
easi
ng P
erfo
rman
ce
Year
248nm
193nm
13.5nm
365nm
436nm
The sequence λ down NA up k1 down has been repeated several times during the last 25 years.
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intermediate focus
collector
reticle (mask)
wafer
plasma
illuminator
field facet mirror
pupil facet mirror
projectionoptics
source
EUV optical train (schematic).
design scheme
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High-NA EUV Lithography will provide further shrink.
The EUV Program at ZEISS has enabled serial production.1
2
Agenda.
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2006 2009 2012 20182003 2015
EUV program at ZEISS: Continuously improving resolution.
First shipment
Small Field Tool MET
Since mid-1999 developed in cooperation with Lawrence Livermore National Lab and Lawrence Berkeley National Laboratories.
NA 0.30Field 0.6 x 0.2 mm²MAG 5x
Resolution 20 nm
Micro Exposure Tool
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2006
Starlith® 3100
2009 2012 20182003 2015
EUV program at ZEISS: Continuously improving resolution.
Prototypes
Pre-Production
First shipment
MET
Small Field Tool NA = 0.3020 nm
MET
ADT
Alpha Demo Tool
NA 0.25Field 26 x 33 mm²MAG 4x
Resolution 27 nm
Starlith® 3100
The 1st EUV full field system: Optics for ASML ADT / NXE:3100.
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2006
Starlith® 3100
2009 2012 20182003 2015
Starlith® 33x0 Starlith® 3400
ADT 3100
EUV program at ZEISS: Continuously improving resolution.
Prototypes
Pre-Production
Serial Production
NA = 0.2532…27 nm
First shipment
MET
Small Field Tool NA = 0.3020 nm
MET
Alpha Demo Tool
NA 0.33Field 26 x 33 mm²MAG 4x
Resolution 13 nm
Starlith® 3400
The solution for serial production: Optics for ASML NXE:3400B.
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Source: ASML
The ZEISS Starlith® 3400 optics delivers excellent imaging...
Scanner capabilityHP = Half Pitch
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…for the ASML NXE:3400B scanner.
Source: ASML
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One
Wor
ld T
rade
Cen
ter
541
mFr
omW
ikip
edia
Intel Core i7 layout
Displaying the information of one NXE:3400B field, requires a TV screen of 780m x 1370m.
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The Starlith® 3400 projection optics performs with improved aberrations – consistent for shipped systems.
ZEISS inhouse EUV qualification
WavefrontRMS
Distortion
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The optical performance translates into world record breaking Matched Machine Overlay of 1.2nm for NXE:3400B.
6 wafers (BMMO v4.2), 76 fields (full wafer, 3 mm edge clearance), 7x7 points per field, WEC, REC corrections, ATP model applied
Matched Machine OVL [nm]
wafers
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A robust transmission trend for the Starlith® 3400 optics supports increased throughput.
Factor 3
ZEISS inhouse EUV qualification
Spec
Spec
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The Starlith® 3400 illuminator is fully qualified @EUV and consistently meets specification for shipped systems.
Actual EUV measurement of 22 illuminationsettings during system qualification
slit intensity @reticle for dipole setting
ideal UNICOM correction appliedZEISS inhouse EUV qualification
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0.5 mm
…roughness defects must not be taller than 0.4mm.
A mirror surface is polished down to ~50pm rms.
Inflated to the size of the contiguous United States...
Mount Whitney 4421m
From Wikipedia
0.4mm
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Computer ControlledPolishing
Ion Beam Figuring forAtomic Level Figure Control
Interferometric Surface Metrology forSpheres and Aspheres
Repeatability: ~10pm rmsReproducibility: ~20pm rms
Manufacturing technologies and metrology are closing theloop for figure control on sub-atomic level.
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Polishing: Key performance parameters have improvedsignificantly over time.
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Mid Spatial Frequency Roughness (MSFR) improved significantly…
All MSFR values here are based onthe same definition as for 3100/3300.
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original flare target
flare challenge by customer
… and reduced system flare to satisfying levels –meeting a challenging target.
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2006
Alpha Demo Tool
Starlith® 3100
2009 2012 20182003 2015
Starlith® 33x0 Starlith® 3400
ADT 3100 3400
High-NA EUV
33x0
EUV program at ZEISS: Continuously improving resolution.
Prototypes
Pre-Production
Serial Production
Development
NA = 0.2532…27 nm
NA = 0.3318…13 nm
NA = 0.55< 8 nm
First shipment
MET
Small Field Tool NA = 0.3020 nm
MET
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High-NA EUV Lithography will provide further shrink.
The EUV Program at ZEISS has enabled serial production.1
2
Agenda.
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Ernst Abbe in 1873
NA>0.5 is needed to achieve sub 8 nanometer resolution.
High-NA
NA 0.25 0.33 … 0.45 0.50 0.55
Resolution @ k1=0.3single exposure / nm 16.2 12.3 … 9.0 8.1 7.4
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intermediate focus
collector
reticle (mask)
wafer
plasma
illuminator
field facet mirror
pupil facet mirror
projectionoptics
source
EUV optical train (schematic).
design scheme
Increased openings of
the light cones lead to bigger mirrors and
bigger optics
NA
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NA 0.25 NA 0.33 NA 0.55
Design examplesWafer level
Reticle level
We have designs for such High-NA optics available.
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Extreme aspheres enablingfurther improved wavefront / imaging performance
Big last mirror driven byHigh NA
Large overallsize of opticalsystem
Tight surface specifications enablinglow straylight / high contrast imaging
Challenge to optics technology and manufacturing No fundamental limits
These are big optical systems with very large mirrors and extreme aspheres at increased accuracy requirements.
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The High-NA optics design supports a considerable reduction of the wavefront aberrations.
Wav
efro
ntR
MS
projected
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Half pitch 7.8nm
Hal
f pitc
h 7.
8nm
Half pitch 16.5nm
Hal
f pitc
h 9.
5nm
With its superior resolution and highest productivity potential the High-NA EUV system offers the chance to be the ultimate lowest cost/pixel printing machine!
High-NA EUV: Ultimate resolution power.
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Extensions for High-NA EUV optics manufacturing are under construction.
Oberkochen, Germany
High-NA EUV Optics
High-NA EUV Testing
Coating
Extensions for High-NA
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Constructionstatus
October 2017
Extensions for High-NA EUV optics manufacturing are under construction.
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Conclusions.
Optics for EUV Lithography have evolved over three decadesto a level where excellent imaging is demonstrated.
Right now, the Starlith® 3400 Optics extends EUV Lithography to 13nm single-shot resolution with high productivity for serial production.
High-NA EUV Lithography enables further shrink for the semiconductor industry to continue Moore’s Law.
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Acknowledgements.
EUVL Teams at ASML & ZEISS and at our partners
Federal Ministry of Education and Research (Germany)DG Connect of the European Commissionfor funding of the BMBF project „ETIK“ (16N12256K)and the projects „E450LMDAP“ (621280), “SeNaTe” (662338),“TAKE5” (692522) and “TAKEMI5” (737479)within the framework of the ENIAC and ECSEL programs.
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