Report - Flip-Chip (6 bumps) package · 2 4 s2lp_q fn24 s2-lpq tr x1 cry stal a gpio 0_1 gpio 1_1 gpio 2_1 gpio 3_1 gpio 0_1 gpio 1_1 gpio 2_1 gpio 3_1 0vba t_1 csn sclk sdi sdo jp3 open jp4

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