Traction Inverter

ST New Solutions

System Block diagram 2

• SPC58NN

• GTM V3 for fully programmable and flexible

timer system designed to unload the CPU

• SAR ADC & Σ-Δ ADC support Software

Resolver in evaluation

• SBC L9396

• Multiple Power Supply IC

• SIC/ IGBT

• 750V SiC MOSFETs

Gen 2 High Voltage Product Family

• 1200V SiC MOSFETs

Gen 2 High Voltage High Performance

Product

• L9502

• Single isolated Gate Driver (6kV)for TRACTION

With protection, diagnostics and communication

• Designed for ISO26262 compliance

• Kit Solution approach

LVBAT

VCUVoltage

regulator

Power supply protection

Can interface

Analog input

SPC58

VDD-HSVDD-LS

SPIINTWDIRST

ERROR

Driver temp*3Phase current UVW

Power supply

protectionHVBAT

ASC

SPI

Gate signal

Motor temp

Currentsensor

Over current protection

Voc

Vref

Buffercircuit

Exc+Exc-

S1S2S3S4

HV

conn

ecto

r

U V W

Supplymonitor

VB

STV

CC

VC

C5

VP

RE

RE

G

VCORE

VCC5

VDD30VCC

VCC

Isolate

Low voltage

High voltage

Boost

L9396

Flyback

Three-phase bridgeSIC Mosfet & IGBT

InverterTemp

Sensor

Tsen

Gate signal

VDD-HSVDD-LS

Resolver & Temp sensor

conn

ector

L9502*6Capacitive Isolation

Phase current UVW

Isen

Digital input Air bagASC

VDD30

M

HV

conn

ecto

r

conn

ector

Ain

FSNASC

Backup PowerBrake

DISADC_OUT

AD

C_O

UT

H-bridge

VNHD7008

/

VNHD7012

Parking locker

IGBT: STGYA120M65DF2AG/

STG200M65F2D8AG

SiC module: ADP86012W2/ ADP50075W2

ST Automotive Microcontroller 10.03.2020

3

Debug

JTAG

Nexus

Memory Protection Unit

Crossbar Switch

6M

4x 64k

FLASH

64K

SRAM

3*

LIN

Fle

x

4*D

SP

I

1* SENT

45

*DS

PI

49

* L

INF

lex

MEMU

64K

SRAM

HSM

1* PSI5

ASILDSEooC

1* SENT

4*

CA

N-F

D

4*

MC

AN

1* PSI5

Product / Application Specific Memory ConnectivitySystem / Platform

supervisor

˙˙˙

ADC2xSAR12

1xSAR10

3xΣΔ

˙˙˙

ADC2xSAR12

1xSAR10

3xΣΔ

1 * PIT 1 * PIT CRCCRC TSENS

INTCPower Architecture™

e200z4d

VLE

INTC

STM

SWT

16k-i

Cache

FPU

CMPU

128k-dTCM

STM

SWT

128k-dTCM

32k-iTCM

32k-iTCMLSP

Power Architecture™

e200z4d

16k-i

Cache

CMPU

8k-d

Cache

VLE FPU

Periph.

Bridge

Memory Protection Unit

Crossbar Switch

1* PSI5-S

FMPLL

IRC

x21 LS

GTM48x IC

96x OC

5x MCS

1*

Eth

ern

et

Zip

wir

e

SIP

I

32

eD

MA

1*F

lexR

ay

64

eD

MA

Periph.

Bridge

Cal Bus

1*I

2C

Core

• 3x 200 MHz Power Architecture™ ISA e200z4d Core (VLE)• Dual Issue Core with Floating Point Unit &

LSP(DSP)• 3x (16k-Instruction Cache, 8k-Data

Cache)• 3x (32k Local i-RAM, 128k Local d-RAM) • 2x Lock Step configuration

Memory

• 6M byte RWW Flash with ECC • +4x64k+2x16k Data Flash with ECC

• 512k RAM (128k SRAM, 384k Local d-RAM) with ECC• +61k SRAM on Timer Module• +32k Overlay RAM

I/O

• Generic Timer Module (High-End Version)

• Dual Channel FlexRay (10MB/s), 128 buffers

• 7 x (FD)M-CAN, 1 x (FD)M-TTCAN

• 7 x LINFlex, 8 x DSPI including 2 x μSB

• 1 x Ethernet, 1 x I2C

• 15 x SENT, 2 x PSI5, 1 x PSI5-S

• 61/84 channel ADC (QFP176/BGA292)• 4 SAR ADC, 12-bit, TUE ±4LSB• 1 Supervisor ADC, 12-bit, TUE ±4LSB• 3 SAR ADC, 10-bit, TUE ±1.5LSB• 6 Σ-Δ ADC with OSR x32-64

System

• Security Module (HSM)

• FM-PLL

• MPU

• AMU

• 96 Channel eDMA Controller

• 2 x CRC Unit

• Fault Collection & Control Unit (incl. error pin)

• 8 x PIT

• 1x LFAST (Interprocessor bus)

• Nexus Class 3+

• EBI only for Calibration (High speed debug interface)

• Designed for eLQFP176, LFBGA292 and KGD

8k-d

Cache

LSP

FCCU

ADCQ

SPC58 xN - BerninaSuperset Block Diagram

Qualified

4

FAULT

WDTDIS

Voltage

Monitor

Wake-up

Monitor

IGN

Boost

Controller

9V

300mA

2MHzGNDBST

BSTSW

VBG

VBM

VBST

CPCharge Pump

GN

DA

ResetRESET

GN

D1

Control & Logic

Blocks

SPI

Ctrl/

Status

Reg.

Temp

Mon

Oper

Modes

Fail-

Safe OpFSN

WD

CSN

SDISDO

CLK

Int. analog

3V3 supply

Int. digital

3V3 supply

POR &

Osc.

Buck

6.5V / 7.2V

1000mA

465KHz

BCKSW

VPREREG

LDO VCC5

5.0V

250mA VCC5

LDO VCC

3.3V / 5.0V

100mA VCC

VCCSEL

VCORE

0.8V / 3.3V

1000mA

Buck w/ext FET

500mA

Lin w/ext. FET

VCOREFDBK

Fail Safe

FET

HS predr

Pump Motor FET

HS+LS pre driver

(PWM control)

PD

S

VDBATTWSS / TrackRegRSU0H/L

WS

O0

WS

O1

WS

O2

WS

O3

AI[0..4]

HV Mux +

ADC Converter

Battery protected

switch

VB VB_SW

Decoding

GCORE

VC1 VC2

PD

G

VDSVDG

SCORE

System

Voltages

LS GPO driver

(PWM control)

GPOD0

Voltage

regulation

Motor turn

counter in Low

Power Mode

VC3 VC4

I_CORE_SH

I_CORE_SL

VCORE

PRN

RSU1H/LRSU2H/LRSU3H/L

PR

S

PR

G

PR

I

PD

I PDBATT

• Boost Converter, 9V, up to 0.3A - 2MHz with spread spectrum

• Buck Converter, 6.5V/7.2V, up to 1.0A – 465KHz with spread

spectrum

• LDO VCC5 (5V +/-2%, 250mA), LDO VCC (3.3V / 5V +/-2%,

100mA), VCORE (0.8V / 5V +/-2% - µC core supply, max

1000mA in switching mode, max 750mA in linear mode)

• 4 WSS regulated interface /2 tracking regulators (120mA)

• Integrated 10-bit ADC

• HS pre-drivers for fail safe relay and for motor pump

• Configurable Watchdog (Time-out / Window / Periods) &

configurable Fail-Safe Functionality

• Fail-Safe Output (FSN), Wake-up input

• Voltage monitoring UV/OV on all regulated rails

• Temp. monitoring and Thermal Shutdown

• Commercial samples : available

• In production

Technical information

Timing information

Key Value• Designed for ISO26262 compliance

• Flexible solution to 3 configurable voltage rails

• Boost - Buck topology for low battery functionality for Start/Stop systems

• BOM selection optimized on output current needs

• Low emission design

TQFP64EP

Application Note

Demo board w/ GUI

Safety Manual

FMEDA / DFA

Automotive Multiple Power Supply IC

SBC L9396

L9502B / L9502Isolated Gate Driver for Traction Inverter

5

• 15A driver sink/source current capability

• Miller clamp

• Advanced Diagnostic and Protection

• 10-bit A/D Converter with 2 exteranl inputs

• BRAKE pin with programmable safe state

• 5MHz SPI interface with enhanced safety

• Output flyabck voltage 23V (-5V 18V; -8V 15V) on L9502

Single channel isolated gate driver

AEC-Q100 Grade 1

ASIL D systems ready

6kV galvanic isolation

Flyback controller on L9502

IGBT

In development

Is

ol

at

io

n

Driver Controller

(Flyback Contr.)

Gate

driver

6

VIPowerTM H-Bridges Solution for High Power

VNHD7008AY / VNHD7012AY

• Optimized Standby current

• PWM operations up to 20kHz

• Tailored and compact full bridges in combination with latest

dual-channel F7 technology PowerMOS

• STL64DN4F7AG 8mΩmax

• STL76DN4LF7AG 6mΩmax

• Charge Pump Out for reverse polarity protection

• Drain and Source voltage Monitoring of external PMOSFETs

• Gate Slope Control throgut external Resistor To Optimize

EMI

• PSSO36 Package

Improved Performance

VDS

Monitor

INX PWM SELx MultiSense MS_EN

Vcc clamp

Undervoltage

Logic, Diagnostic and Protections

Power Limitation

HS Over Temperature

HS Current Limit

Short circuit protection

Vcc

Monitor

OFF state

Outputs Monitoring

KSOURCE_LSA

OUT A OUT_B

HS_B

Tchip MonitorCurrent

Sense

Gate

Driver

Gate

Driver

MUX

VREGVREGCPCharge

Pump

GATE LSA GATE_LSB

GND

VREF_OVL

_LSA

VDS

Monitor

KSOURCE_LSB

VREF_OVL_

LSB

HS_A

VccVbatt

Gate

Driver

Gate

Driver

Power & Discrete Group (PDG) Wide Power Product Portfolio

7

From Discrete to Power Modules, ST leads the innovation

Typical Power: 3 kW ÷ > 30 kW

ACEPACK™ Power ModulesSLLIMM™ IPM

Typical Power: 20 W ÷ 3 kW

Discrete & Drivers & SIP

Typical Power: 10 W ÷ 10 kW

ACEPACK™ modulesAdaptable, Compact and Easier PACKage

• 100% controlled by ST for silicon

(SiC, MOSFET, IGBT and Diodes)

• Compact design and cost-effective system

approach for a plug & play system solution

• Configuration flexibility

• 2500Vrms electrical isolation

1 & 2

SMIT

DRIVE

• 100% controlled by ST for silicon

(SiC, MOSFET, IGBT and Diodes)

• 2500Vrms electrical isolation

• SMD assembly

• Top side cooling

• Low thermal resistance

• 750 - 1200V SiC MOSFET based switch

• Improved light load power losses for extended

EV driving ranges

• AMB frame for better thermal dissipation

• 3 different lead configuration options

• Extreme low conduction losses

• Direct Cooled Cu Base Plate with pin fins

• CIB

• Six-pack

• Three level Boost

• ….

• Bridge rectifier

• Half Bridge

• Boost

• ….

• Six-pack

ConfigurationsKey featuresOutlook Target ApplicationsACEPACK

8

ACEPACK DRIVEDirect liquid cooled high performance power module

9

Traction inverter for (H)EV, Trucks, Bus

Press FIT connections for high reliable and long lasting connection

SiC-MOSFET based, 750V and 1200V

Pin-fin for direct cooling

Dedicated NTC for each single substrate

Unequalled RDS(on)

ACEPACKTM DRIVE

Internal layout optimized for minimized stray inductace

High reliability and robustness: Dice sintered to substrate

Different bus bar available to fit welding or screwing connection methods.

AMB substrates for better thermal managment

Incredible high power density

10

• Multi Sintering Package: STPAK™

• Very good thermal resistance, no TIM material needed

• Very high current capability

• Top Side Cooling Package: ACEPACK™ SMIT

• Customazible and versatile insulated power module

• In both cases several devices in parallel has to be connecteed to realize an high power system

• connections introduces stray inductance which will limit speed• Inverter room occupation will increase accordingly

• ACEPACK DRIVE

• Represents an easy-to-use solutions, with direct coolign thanks to pin-fin structure integrated in base plate

• Several device are connected in parallel in the same substrate, minimizing stray inductances and boosting speed capabilities

• Thanks to small footprint, power module can be easily integrated in motor chassis

• No soldering or sintering needed, improved manufacturability:

• Press fit avoids soldering process

• Need only to be screwed onto a waterjacked for liquid cooling

• Differnt bus bar options for final used convenience, compatible wiht Hall-effect current

• Sintering needed to get best thermal perfomances

• PCB must be designed to deal with very high current level

ST solutions for traction inverterFrom scalable solutions to ACEPACK DRIVE

ACEPACK DRIVE case selection 11

Possibility to use an Hall-current sensor thanks to longer tabs

AC bus bar to be welded to motor connections

Long tab optionShort tab option Long tab w/o AC bar holes

1200V Si based

HybridPACKTM2 (*)

Gen 2 SiC 1200V

AMB Si3N4

including coming Gen 3

1200V SiC MOSFET

120kW(240kWpeak)

160kW

(320kWpeak)

Topology: Three phase inverter

DC-link : 750Vdc

PWM Strategy: Bipolar

Switching frequency: 12kHz

TJ < 80% of Tjmax at any condition

Peak Power for 10 sec

MI = 1, Cos(phi) = 0.8

Tfluid = 70°C

85kW(170kWpeak)

Power

Six-pack Module at 750V DC-link1200V Si IGBT vs. SiC MOSFET

(*) HybridPACK 2 is 30% bigger than ACEPACK DRIVE

600mm2 IGBT+Diode each switch

ACEPACK™ DRIVE

2 times higher power with the first Silicon Carbide

module version based on SiC MOSFET Gen 3

12

ACEPACK™ DRIVE