– 1 –

MICROFILM

MZ-E60SERVICE MANUAL

PORTABLE MINIDISC PLAYER

SPECIFICATIONS

US ModelCanadian Model

AEP ModelE Model

SystemAudio playing systemMiniDisc digital audio systemLaser diode propertiesMaterial: GaAlAsWavelength: λ = 790 nmEmission duration: continuousLaser output: less than 44.6 µW(This output is the value measured at a distanceof 200 mm from the objective lens surface on theoptical pick-up block with 7 mm aperture.)Revolutions800 rpm to 1,800 rpmError correctionAdvanced Cross Interleave Reed SolomonCode (ACIRC)Sampling frequency44.1 kHzCodingAdaptive TRansform Acoustic Coding (ATRAC)Modulation systemEFM (Eight to Fourteen Modulation)Number of channels2 stereo channels1 monaural channelFrequency response20 to 20,000 Hz ± 3 dBWow and FlutterBelow measurable limitOutputsHeadphones: stereo mini-jack,maximum output level 5 mW + 5 mW, loadimpedance 16 ohms

GeneralPower requirementsOne LR6 (size AA) battery (not supplied)Battery operation timeYou can check the battery condition with thebattery indication which is displayed while usingthe player.t Battery power decreasingvr Weak batteryve The battery has gone out. “LOW BATT”

flashes in the display on the remote control,and the power goes off.

Battery LifeApproximately 12 hours of playback can beexpected with one LR6 (size AA) alkaline battery(not supplied).NoteThe battery life may shorter depending onoperating conditions and temperature of thelocation.

– Continued on next page –

US and foreign patents licensed from DolbyLaboratories Licensing Corporation.

Model Name Using Similar Mechanism MZ-E90

MD Mechanism Type MT-MZE60-169

Optical Pick-up Mechanism Type LCX-2E

(Photo: Silver)

– 2 –

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITHMARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTSLIST ARE CRITICAL TO SAFE OPERATION.REPLACE THESE COMPONENTS WITH SONY PARTS WHOSEPART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR INSUPPLEMENTS PUBLISHED BY SONY.

Flexible Circuit Board Repairing• Keep the temperature of the soldering iron around 270°C

during repairing.• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).• Be careful not to apply force on the conductor when soldering

or unsoldering.

Notes on chip component replacement• Never reuse a disconnected chip component.• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Precautions for Laser Diode Emission CheckWhen checking the emission of the laser diode during adjust-ments, never view directly downwards as this may lead toblindness.

Precautions for Using Optical Pick-up (LCX-2E)As the laser diode inside the optical pick-up damages by staticelectricity easily, solder the laser tap of the Optical pick-upflexible board when handling. Also take the necessary measuresto prevent damages by static electricity. Handle the Optical pick-up flexible board with care as it breaks easily.

Laser tap

Optical Pick-up flexible board

CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardousradiation exposure.

IN NO EVENT SHALL SELLER BELIABLE FOR ANY DIRECT,INCIDENTAL OR CONSEQUENTIALDAMAGES OF ANY NATURE, ORLOSSES OR EXPENSES RESULTINGFROM ANY DEFECTIVE PRODUCTOR THE USE OF ANY PRODUCT.

“MD WALKMAN” is a trademark of SonyCorporation.

This MiniDisc player is classi-fied as a CLASS 1 LASERproduct.The CLASS 1 LASERPRODUCT label is located onthe bottom exterior.

DimensionsApprox. 81 × 25 × 74 mm (w/h/d)(3 1/4 × 1 × 3 in.) not including projectingparts and controlsMassApprox. 95 g (3.4 oz.) the player onlyApprox. 136 g (4.8 oz.) incl. a premastered MDand a LR6 (size AA) alkaline batterySupplied accessoriesHeadphones with a remote control (1)Carrying pouch (1)

Design and specifications are subject to changewithout notice.

ATTENTION AU COMPOSANT AYANT RAPPORT À LA SÉCURITÉ!!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LESDIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCESSONT CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT.NE REMPLACER CES COMPOSANTS QUE PAR DES PIÈCESSONY DONT LES NUMÉROS SONT DONNÉS DANS CE MANUELOU DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

– 3 –

1. SERVICING NOTE ......................................................... 4

2. GENERAL ......................................................................... 5Playing an MD right away! ................................................... 5

3. DISASSEMBLY ............................................................... 73-1. Panel Assy, Upper ................................................................. 73-2. Holder Assy ........................................................................... 73-3. Mechanism Deck .................................................................. 83-4. Main Board ........................................................................... 83-5. Service Assy, OP ................................................................... 9

4. TEST MODE ................................................................... 104-1. General ................................................................................ 104-2. Setting the Test Mode ......................................................... 10

4-2-1. How to Set the Test Mode ........................................... 104-2-2. Operations when the Test Mode is Set ........................ 104-2-3. How to Release the Test Mode .................................... 10

4-3. Test Mode Structure ............................................................ 104-4. Manual Mode ...................................................................... 11

4-4-1. Outline of the Function ............................................... 114-4-2. How to Set the Manual Mode ...................................... 11

4-5. Overall Adjustment Mode ................................................... 114-5-1. Outline of the Function ............................................... 11

5. ELECTRICAL ADJUSTMENTS .............................. 125-1. General ................................................................................ 125-2. Notes for Adjustment .......................................................... 12

5-2-1. Jigs ............................................................................... 125-2-2. Adjustment Sequence .................................................. 125-2-3. Power ........................................................................... 12

5-3. Reset NV ............................................................................. 125-3-1. How to Reset NV ........................................................ 12

5-4. Overall Adjustment Mode ................................................... 125-4-1. Overall Adjustment Mode Structure ............................ 125-4-2. Overall CD and MO Adjustment Method ................... 125-4-3. Overall CD and MO Adjustment Items ....................... 13

TABLE OF CONTENTS

6. DIAGRAMS ..................................................................... 146-1. IC Pin Description .............................................................. 14

6-1-1. IC801 RU6915MF-0006 (System Control) ................. 146-2. Block Diagrams .................................................................. 17

6-2-1. MD Block Diagram ..................................................... 176-2-2. Servo, System Control Block Diagram ....................... 19

6-3. Printed Wiring Boards and Schematic Diagrams ................ 216-3-1. Printed Wiring Board – Main Board – ........................ 216-3-2. Schematic Diagram – Main Board (1/4) – .................. 256-3-3. Schematic Diagram – Main Board (2/4) – .................. 276-3-4. Schematic Diagram – Main Board (3/4) – .................. 296-3-5. Schematic Diagram – Main Board (4/4) – .................. 31

6-4. IC Block Diagrams ............................................................. 33

7. EXPLODED VIEWS ..................................................... 377-1. Main Unit Section ............................................................... 377-2. Mechanism Deck Section ................................................... 38

8. ELECTRICAL PARTS LIST ...................................... 39

– 4 –

1) When repairing this device with the power on, if you removethe main board or open the upper panel assy, this device stopsworking.In this case, you can work without the device stopping byfastening the hook of the OPEN/CLOSE switch (MAIN boardS809) with tape.

2) This set is designed to perform automatic adjustment for eachadjustment and write its value to EEPROM. Therefore, whenEEPROM (MAIN board IC802) has been replaced in service,be sure to perform automatic adjustment and write resultantvalues to the new EEPROM.Refer to section 4 Test Mode (page 10) for details.

SECTION 1SERVICING NOTE

MAIN board S809

– 5 –

SECTION 2GENERAL This section is extracted from

instruction manual.

– 6 –

– 7 –

Note : This set can be disassemble according to the following sequence.

SECTION 3DISASSEMBLY

3-1. PANEL ASSY, UPPER

3-2. HOLDER ASSY

Note : Follow the disassembly procedure in the numerical order given.

Set Panel Assy, Upper Holder Assy Mechanism Deck

Service Assy, OP

Main Board

4 screws(1.4),MI

3 screws(1.4),MI

5 panel assy, upper

1

2

2 shaft

3 holder assy

1 shaft

– 8 –

3-3. MECHANISM DECK

3-4. MAIN BOARD

7 mechanism deck

1 sheet (BLIND)

6 CN551

5 CN501

claw

2 screw (MD), step

3

4

3

2 screws(1.7x2.5)

1 screws(1.7x2.5)

4 MAIN board

knob (HOLD)

S808S806

S807

knobs (MB)

Note : When installing, fit the knobs (HOLD, MB) and the switchs (S806, 807, 808).

– 9 –

3-7. SERVICE ASSY, OP

4 M 1.4

3 M 1.4

1 washer

2 gear (SA)

5 service assy, OP

– 10 –

• Press and hold down PLAY MODE to hold the current displaywhile the key is being pressed.

4-2-3. How to release the TEST MODEWhen method 1 was used:

Turn off the power and open the solder bridge on TAP801 on themain board.Note: The solder should be removed clean. The remaining

solder may make a short with the chassis and other part.When method 2 was used:

Turn off the power.

4-3. TEST MODE STRUCTURE

SECTION 4TEST MODE

4-1. GENERAL• When entered in the TEST MODE, this set provides the Overall

Adjustment mode which allows CD and MO discs to be auto-matically adjusted. In the Overall Adjustment mode , the systemdiscriminates between CD and MO discs, performs adjustmentsin sequence automatically, and displays the faulty location if anyfault is found. In the Manual mode, selected adjustments can beperformed automatically.

• The attached remote control is used to operate the TEST MODE.Unless otherwise specified in the text, the key means that on theremote control.

4-2. SETTING THE TEST MODE

4-2-1. How to set the TEST MODETo set the TEST MODE, two methods are available.1 Solder bridge and short TAP801 (TEST) on the main board.

Then turn on the power.

2 In the normal mode, operate the keys on the set and those on theremote control as specified below:Turn on HOLD switch on the set. Holding down x (STOP)key on the set, press the keys on the remote control in thefollowing sequence:

> N t > N t . t . t > N

t . t > N t . t X t X

4-2-2. Operations when the TEST MODE is setWhen the TEST MODE is entered, the system switches to thedisplay check mode within the TEST MODE. From this mode, theother Test modes can be accessed.When the TEST MODE is set, the LCD repeats a cycle of thefollowing displays:

Remote control LCD

L501

C518

CN551

8 15

TP518

CN50

1

1

5

10

15

20

TAP801

TAP801

MAIN BOARD (SIDE B)

888 u

004 V1.100

All on

All off

Microprocessorversiondisplay

Test Mode(Display Check Mode)

Manual Mode

Servo Mode

Audio Mode

Power Mode

OP Alignment Mode

key

key

+

key+

key

x

x

key

key

Overall Adjustment Mode

– 11 –

Note: In the Power mode, the power adjustment value is onlydisplayed.

4. During each test, press and hold down > N key or .key for a while to move the optical pickup on the sled outer orinner perimeter.

5. To terminate the Manual mode and return to the TEST MODE,press x key.

4-5. OVERALL ADJUSTMENT MODE

4-5-1. Outline of the functionThis mode is designed to adjust the servo system automatically bygoing through all the adjustment items.Usually, this mode is used to perform automatic adjustments whenservicing the set.

For further information, refer to section 5. ELECTRICAL ADJUST-MENTS (page 12).

4-4. MANUAL MODE

4-4-1. Outline of the functionThe Manual mode is designed to perform adjustments andoperational checks on the set’s operation according to eachindividual function.Usually, no adjustments are made in this mode.However, the Manual mode is used to clear the memory beforeperforming automatic adjustments in the Overall Adjustment mode.

4-4-2. How to set the Manual mode1. Set the TEST MODE and press + key to set the Manual mode.

Remote control LCD display

3. During each test mode, the display is changed from one toanother each time DISPLAY key is pressed.

2. Each test item is assigned with a three-digit item number. Thethird digit stands for a major item, the second digit for a middleitem, and the first digit for a moniro item.

000 AAASCC

Change Major Item

Change Middle Item

Change Minor Item

Change Adjustment Value

Write Adjustment Value

.

key : Up+

key : Down

key : Up+

key : Down

key : Up+

key : Down

key : Write

keykey x

keyx

> N

key> N

key : Upkey : Down

> N

X

011 XXXSXX

011 XX BXX

011 XX AXX

011 XXXJXX

011 XX RXX

731 XX VXX

Address Value & Adjustment Value

Block Error Value & Adjustment Value

ADIP Error Value & Adjustment Value

Jitter Value & Adjustment Value

Asy Mmetry Feed Back Gain Value & Adjustment Value

Power Adjustment Value

XXX: Each ValueXX: Adjustment Value

for Item number

Memory Monitor Mode

LCD display

LCD display

LCD display

LCD display

LCD display

LCD display

– 12 –

5-4. OVERALL ADJUSTMENT MODE

5-4-1. Overall adjustment mode structure

Note: The overall adjustments should be always performed in thesequence of CD t MD adjustments.

5-4-2. Overall CD and MO adjustment method1. Set the TEST MODE (see page 10) and press – key to set the

Overall Adjustment mode.

LCD display

2. Insert CD disc in the set, and press . key to set the OverallCD Adjustment mode.Automatic adjustments are made.

LCD display

XXX: Item No. for which an adjustment is being executed.

3. If NG in the overall CD adjustments, return to Reset NV andperform the adjustment again.

LCD display

XXX: NG item No.

4. If OK through the overall CD adjustments, then perform overallMO adjustments.

LCD display

5. Insert MO disc in the set, and press > N key to set theOverall MO Adjustment mode. Automatic adjustments are made.

LCD display

XXX: Item No. for which an adjustment is being executed.

Overall CD Adjustment

Overall Adjustment Mode

Overall MO Adjustment

key> N

key> N

. key

. key

keyx

keyx

044 Assy ?

XXX XXXSXX

Display on Adjustment state for Each Items.

XXX NGXX

Adjustment Value becomed to NG.

XXX End-OK

XXX XXXSXX

SECTION 5ELECTRICAL ADJUSTMENTS

5-1. GENERALIn this set, CD and MO discs can be automatically adjusted by set-ting the Overall Adjustment mode within the TEST MODE,Before performing these automatic adjustments, it is necessary toclear the memory and adjust the power in the Manual mode.

5-2. NOTES FOR ADJUSTMENT

5-2-1. Jigs• CD disc TDYS-1 (part code: 4-963-646-01)• MO disc PTDM-1 (part code: J-2501-054-A)

or commercially available MO disc (recorded)• Digital voltmeter

5-2-2. Adjustment sequenceThe adjustments should be always performed in the followingsequence:

5-2-3. PowerA stablized power supply is used to supply 1.5 V DC to the batteryterminal.Otherwise, an AA alkali battery with the remaining level of 1.5 VDC or more is used. (In this case, make sure that the batteryindication on the remote control is “FULL”)

5-3. RESET NV

5-3-1. How to reset NV1. Set the TEST MODE. (See page 10)

2. Set the Manual mode and set the item No. 021, Reset NV.

LCD display

1 Reset NV (Clear the memory)

2 Overall CD adjustments

3 Overall MO adjustments Overall adjustment mode

Manual mode

3. Press X key on the remote control.

LCD display

4. Press X key on the remote control again.

LCD display

5. Press x key to terminate the Manual mode and return to theTEST MODE.

021 AAASCC

021 AAASCCNote: CC is blink.

021 AAASCCNote: CC blink. t Finish the CC light on.

– 13 –

6. If NG in the overall MO adjustments, return to Reset NV andperform the adjustment again.

LCD display

XXX: NG item No.

7. If OK through the overall MO adjustments, press x key toreturn to the TEST MODE and terminate the Overall Adjust-ment mode.

LCD display

XXX NGXX

XXX End-OK

5-4-3. Overall CD and MO adjustment items1. Overall CD adjustment items

Item No. Contents

312

313 CD electrical offset adjustment

314

321 CD TE gain adjustment

328 CD TWPP gain adjustment

323 CD TE offset adjustment

336 CD ABCD gain adjustment

344 CD focus gain adjustment

345 CD tracking gain adjustment

521CD two-axis sensitivity adjustment

522

341 CD focus bias adjustment

2. Overall MO adjustment items

Item No. Contents

112

113 MO electrical offset adjustment

114

221 Low reflective CD TE gain adjustment

223 Low reflective CD TE offset adjustment

236 Low reflective CD ABCD gain adjustment

244 Low reflective CD focus gain adjustment

245 Low reflective CD tracking gain adjustment

121 MO TE gain adjustment

122 MO TE offset adjustment

144 MO focus gain adjustment

145 MO tracking gain adjustment

131MO TWPP offset adjustment

132

136 MO ABCD gain adjustment

134 MO TWPP gain adjustment

141 MO focus bias adjustment

– 14 –

Pin No. Pin Name I/O Description1 S MON I S-MON monitor signal input from the µPD63732GC (IC601)

2 UREG MON I Un-regulator power supply voltage monitor input terminal (A/D input)

3 NC — Not used. (open)

4 VREF I Input terminal for power supply voltage adjustment reference voltage (+2 V) (A/D input)

5 DVDD MON I Not used. (Fixed at “H”.)

6 NC — Not used. (open)

7 RMC KEY I Remote commander with headphone key input terminal (A/D input)

8 SET KEY I Set key input terminal (A/D input) S801 to S804 (x, >/N, ., +/– VOLUME keys input)

9 MRST ISystem reset signal input “L”: reset

For several hundreds msec. after the power supply rises, “L” is input, then it change to “H”

10 AVDD — Power supply pin (+2.4 V or +2.8 V)

11 AVSS — Ground terminal (for A/D converter)

12 – 15 TYPE0 – 3 I Setting terminal for model discrimination (bit 0 to bit 3) Fixed at “L” in this set

16 XOUT O Main system clock output terminal (16.9344 MHz)

17 XIN I Main system clock input terminal (16.9344 MHz)

18 SX OUT O Sub system clock output terminal Not used. (open)

19 SXIN I Sub system clock input terminal Not used. (fixed at “L”)

20 COUT O Not used. (open)

21 VDD — Power supply terminal (+2 V) (digital system)

22 VSS — Ground terminal (digital system)

23 HOLD SW I HOLD switch (S808) input terminal “L”: hold off, “H”: hold on

24 VG CON O Power supply control signal output to each ICs

25 XCLK OSystem clock supply output terminal (16.934 MHz) to the µPD63732GC (IC601) or AK4352

(IC302)

26 KEY EN O Ground control output terminal of remote control

27 AVLS SW I AVLS switch (S803) input terminal “L”: LIMIT “H”: NORM

28 DSP SINT I Interruption status input from the µPD63732GC (IC601)

29, 30 DBB0, DBB1 I DIGITAL MEGABASS switch (S806) input terminal *1

31 OPR LED O OPERATE LED (D802) drive signal output terminal “H”: LED on

32 OPEN CLS SW IUpper panel open/close detect switch (S801) input terminal

“L”: upper panel close, “H” : upper panel open

33 XWAKE RMC I Wake up signal input from remote control key

34 XWAKE SET I Wake up signal input from this set key

35 SBUS CLK O SSB serial clock signal output terminal

36 SBUS DATA I/O SSB serial data input/output terminal

37 XRST O Reset signal output terminal to each ICs

38 SLD 1 MON I Sled servo timing signal input from the TLC372CPW (IC552)

39 SLD 2 MON I Sled servo timing signal input from the TLC372CPW (IC552)

40 VDD — Power supply terminal

41 VPP — Test terminal (fixed at “L”)

42 CLV VCON OSpindle servo drive voltage control signal output to the BD6602KUT (IC551) or µPD63732GC

(IC601)

43 APC REF O Laser power control signal output terminal

44 RM VCON O Remote control power voltage select signal output to power circuit “L”:2.4 V, “H”: 2.8 V

45 CLV U MON I Spindle servo (U) timing signal input from the BD6602KUT (IC551)

46 CLV V MON I Spindle servo (V) timing signal input from the BD6602KUT (IC551)

47 CLV W MON I Spindle servo (W) timing signal input from the BD6602KUT (IC551)

48 CLV U CON I Spindle servo (U) drive signal input from the BD6602KUT (IC551)

49 CLV V CON I Spindle servo (V) drive signal input from the BD6602KUT (IC551)

SECTION 6DIAGRAMS

6-1. IC PIN DESCRIPTION

6-1-1. IC801 RU6915MF-0006 (SYSTEM CONTROL)

– 15 – – 16 –

Pin No. Pin Name I/O Description50 CLV W CON I Spindle servo (W) drive signal input from the BD6602KUT (IC551)

51 DRV VCON O Driver output control terminal to the DB6602KUT (IC551) “L”: prohibited, “H”: permission

52 NC — Not used. (open)

53 SLED 1R CON O Sled motor control signal output to the BD6602KUT (IC551)

54 SLED 1F CON O Sled motor control signal output to the BD6602KUT (IC551)

55 SLED 2R CON O Sled motor control signal output to the BD6602KUT (IC551)

56 SLED 2F CON O Sled motor control signal output to the BD6602KUT (IC551)

57 – 60 NC — Not used. (open)

61 VSS — Ground terminal (digital system)

62 NC — Not used. (open)

63 RMC DTCK I/O TSB serial communication data input/output terminal for remote commander with headphone

64 S0 O PD-IC mode select signal output

65 S1 O PD-IC mode select signal output

66, 67 NC — Not used. (open)

68 SLD VCON O Sled servo control PWM signal output to the BD6602KUT (IC551)

69 NC — Not used. (open)

70 HP MUTE O Muting on/off control signal output to the headphone amplifier (IC301) “H”: muting on

71 HP STBY OStandby on/off control signal output to the headphone amplifier (IC301)

“L”: standby mode, “H”: amplifier on

72 NC — Not used. (open)

73 NV DI I Serial data input from the EEPROM (IC802)

74 NV DO O Serial data output from the EEPROM (IC802)

75 NV CLK O Serial clock signal output to the EEPROM (IC802)

76 NV CS1 O Chip select signal output to the EEPROM (IC802)

77 ADJUST I Test mode institution input terminal “L”: test mode (Normally, fixed at “H”)

78 XREBOOT O System reboot control output terminal

79 VDD — Power supply terminal (+2 V) (digital system)

80 VSS — Ground terminal (digital system)

6-2. BLOCK DIAGRAMS6-2-1. MD BLOCK DIAGRAM

– 17 – – 18 –

+–

+–

+–

+–

+–

+–

+–

+–

+–

ly

lx

Jx

Jy

AA

B

C

D

MON

Jx Jy Jx

lx ly lx

a b c d

F

MINIDISCOPTICAL PICK-UP BLOCK

(LCX-2E)

BCD

MON

LD-A

JyJxlxly

VREF

161514109

6

1778

18

5

12

2

1

LD-K13

AVCC20

CN501

LD

AVCCS0

1119

S0S1

S1

TRACKINGCOIL

AVCC (Q907)

LASERAUTO POWER

CONTROLQ501

PD-DRV

XRSTSCK

S BUS

LD-VDDPD-NI

DCBAJyJxIxIy

VREF

D-CA-C

LD-EMITAPC

AVCC(Q907)

TPP/WPP

RF AMP,FOCUSERROR,

TRACKINGERROR

DFCT

OFTRK

RF OUT

82V

DFCT

OFTRK

ABCDFETE

S MON

PD-I

PD-O

T COUNT

ADIP INADIP

ADIP T-COUNT

SERIALI/F

54131110987

3

33

27

26

30

AVCC 38DVDD 21

39404441

612

RF AMP, FOCUS/TRACKING ERROR AMPIC501

B+(Q907)

B+(Q907)

16

17

28

4342

242322

27 XRESET

9 ADIP

12 T COUNT

5 TEMCLK

3 FE4 ABCD

14 OFTRK

13 DEFECT

7 RF

ID4ID3MCK I/O

VDD

989747

XRAS

DRD0|

DRD3

D0|

D3

A0|

A11DRA0

|DRA11

63XOE 60

XCAS 59XWE

XRAS

54

XOEXCAS

VSSVSS

LRCK 39AUDATA 40

BCK 41

XWE

MCLK 50

BICKSDATALRCK

FF OUT 24

SINT 30SCK 29

S BUS 28

FR OUT 23TR OUT 22TF OUT 21

VDD ADJ1

VREF2

20•

37•

51•

75•

87

52•

53•

58•

57

71

74•

70

66•

62•

65•

64

IC60116M DRAM

IC602

9

12•

15

19•

21•8•6

2•3•

24•

25

52223

1426

VSSVSS

113

4

B+(Q907)

SERIALINPUT

INTERFACE

8XINTERPOLATOR LPF

∆ Σ MODULATOR

8XINTERPOLATOR

CLOCKDIVIDER

LPF∆ Σ

MODULATOR

1

345

14

13

AOUTL

AOUTR

11VREF

16CKS

10VDD

2PD

18BIT D/A CONVERTERIC302

B+(Q907)

AOUTL

AOUTR

TF1TR1FR1FF1

VREFMCLKSINT

XRSTS MONPDSSB CLKSSB DATA

S0S1

SERVO,SYSTEM CONTROL

SECTION2

SERVO,SYSTEM CONTROL

SECTION3

SERVO,SYSTEM CONTROL

SECTION4

18

19

2015

TRK+

TRK–

4

3

FOCUSCOIL

FCS+

FCS–

SERVO,SYSTEM CONTROL

SECTION1

04

MAIN BOARD (1/2) MD SECTION

• Signal path: MD

DIGITAL SERVOATRAC

MZ-E60

(Page 19)

(Page 19)

(Page 19)

(Page 19)

– 19 – – 20 –

MZ-E60

MAIN BOARD (2/2)

VREFMCLK

AOUTLAOUTR

SINT

VCC

PE

CSSKDODI

1234

8

7

B+(Q907)

EEPROMIC802

XRSTS MON

PDSSB CLK

SSB DATA

S0S1

SLEDVOLTAGE MONITOR

IC552

FOCUS/TRACKING COIL DRIVE,SPINDLE/SERVO MOTOR DRIVE

IC551

+–

56

7

+–

32

42

1

PREDRIVE

4340413839

10

PREDRIVE

PREDRIVE

11896

6160

7

62

PREDRIVE5250

3334

32

16151413

4

17

46

51

56

5554

5857

3

2

1

64

45

PREDRIVE24262928

23

DECODER

+–

36+–

35+–

VG

OE

VCC2B+

(Q907)

B+(Q907)

B+(UNREG)

TRK+

TRK–

FCS+

FCS–

MDSECTION 4

MDSECTION 2

MDSECTION 1

5

7

68

1

2

3

4

SLED2–SLED2+

SLED1–

SLED1+

CLVU

CLVN

CLVV

CLVW

CN551M902(SLED)

M901(SPINDLE)

MINIDISCMECHANISM

BLOCK

STANDBY

BIAS

VCC1

VCC2

TO EACHBLOCK

TO BEMFCOMPARATOR

31

30

VCC1

TF1

TR1

FF1

FR1

MDSECTION3

X60116.9344MHz

76 NV CS175 NV CLK74 NV DI73 NV DO

4 VREF25 XCLK28 DSP SINT

37 XRST1 S MON43 APC REF35 SBUS CLK36 SBUS DATA

64 S065 S1

39 SLD 2 MON

38 SLD 1 MON

17 XIN

16 XOUT

53 SLD 1R CON54 SLD 1F CON68 SLD VCON

55 SLD 2R CON56 SLD2F CON

OUT

VOUT

46 CLV V MON

45 CLV W MON

48 CLV U CON49 CLV V CON50 CLV W CON42 CLV V CON

51 24DRV VCON

VG

VG CON

44RM VCOM

2UNREG MON

78XREBOOT9MRST

VDD

VSS

47 CLV W MON

31OPR LED7732

ADJUSTOPEN CLS SW

34XWAKE SET8SET KEY

2327

HOLD SWAVLS SW

30DBB129DBB0

63RMC DTCLK

33XWAKE RMC

B+(UNREG)

RESETIC803

D802OPERATE

TAP801 TAP803S809OPEN/CLOSE

S805–

S801

S804+

S803.

S802>N

VOL

34

5

B+(D901)

POWER SUPPLYVOLTAGE CONTROL

SWITCHQ906

1

VDD2EXT

B+

VGB+

5

PWM/PFM CONTROLIC903

EXT5

VDD2VOUT 1

PWM/PFM CONTROLIC901

CE3

VDD2FB1 EXT 5

PWM/PFM CONTROLIC902

B+D903

D901

Q905

Q901

Q903

Q908

Q907

Q904(1/2)

Q904(2/2)

B+(UNREG)

B+ SWITCHQ902

DIGITAL MEGABASSS806

0 1 2AVLSS807

NORM LIMITHOLDS808

Q801

7RMC KEY26KEY EN

71HP STB70HP MUTE

10AVDD

21•

40•

79VDD

Q802

B+(D903)

5DVDD MON

B+(Q907)

B+(D901)SYSTEM

CONTROLIC801

REFERENCEVOLTAGE

SWITCHINGQ301

VREF

PWSW

MUTE

VCC

B+

22

20

21

12

13

1

17

18

4

2

PW A

GNDKEYDATAVDD

J301

PW B

HEADPHONEAMPIC301

B+(UNREG)

B+(Q907)

B+(D903)

SERVO, SYSTEM CONTROL SECTION

DRY BATTERYSIZE "AA"

(IEC DESIGNATION R6)1PC, 1.5V

04

i

• Signal path: MD

6-2-2. SERVO, SYSTEM CONTROL BLOCK DIAGRAM

(Page 18)

(Page 18)

(Page 18)(Page 17)

MZ-E60

– 21 – – 22 –

1-676-495- 11

MAIN BOARD (SIDE A)

C952

C911

C610

C305

C303

C201

C101

C302

L903

C609

C524

L601

L502

C909

R919

R922 D802OPERATE

R920 R921

R925

R923

R924R816

R827

R837 R825

C812

R822

R835

FB80

3R8

04

C805

C611

C605

R813

C607

C851 TP811

TP810

GND2

GND1

TP812

TP813

TP302

TP103

TP203

C852

C853

C854

D354

D352

D351

D353

D855

R817 Q802

RB802

FB801

R818

FB802

C351

C304

R101

R102

TP825 TP826

R821C809

IC802

C813R806

C801

C612

R809IC803

R201

R202

04

R301

(CHASSIS)

C814

R819

R802

R801

C815

R556

C558

C559

RB55

2RB

551

C552

C551

C608

C502

C515

R814

C511

C603

C602

C604

R513

R507

R508

R501

C501

C512

R509

R812

R811

C601

C614

C557

R553

R554

R555

R832

R601

R823

C806

R833 R810

R836

R826

Q801

Q906

IC90

3Q9

05

C811

TP530

VOL

TP531

TP529

X601

C

C

ED

G

4

5

321

123

5

4

SB

E

B

CE

B R824

S G

D

Q908

4

1

5

8

S808

HOLD S801x

S803.

S802> N

S804S805

S806DIGITAL MEGABASS

2 1 0

S807AVLS

LIMIT NORM

R903

D903

C910

8075706561

212530354041

169

8 1

IC30245

50

55

60

20

15

10

5

1

IC801

4

3

1

2

70 7565605551

5 11015202526

30

35

40

45

50

100

95

90

85

80

76

IC601

IC602

16813

26211914

1510152022

44

IC501

4035302523

11( )

1

A

B

C

D

E

F

G

H

I

2 3 4 5 6 7 8 9 10 11 12 13 14

6-3. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS6-3-1. PRINTED WIRING BOARD — MAIN BOARD —

D351 F-2D352 F-3D353 F-3D354 E-3D802 C-5D855 F-3D903 B-4

IC302 F-4IC501 B-9IC601 E-9IC602 F-11IC801 G-6IC802 H-6IC803 G-7IC903 C-4

Q801 D-4Q802 D-3Q905 C-4Q906 D-4Q908 B-5

• SemiconductorLocation

Ref. No. Location

Note:• Y : parts extracted from the conductor side.• f : internal component.• b : Pattern from the side which enables seeing.

(The other layer’s patterns are not indicated.)

Caution:Pattern face side: Parts on the pattern face side seen from the(Side B) pattern face are indicated.Parts face side: Parts on the parts face side seen from the(Side A) parts face are indicated.

• Main board is four-layer printed board.However, the patterns of layers 2 and 3 have not been in-cluded in this diagrams.

MZ-E60

– 23 – – 24 –

C510

R505

R929

C912

R504

R503

R514

R506

R926 R902

R913

C906

R914

R912

R917

C903

C904

L901 C901

D902

C951

C908IC901

IC902

D901

C907

R928

R915

R203C203

C103

C307

Q301

Q501

IC301

C306

R103

C102

C202

R204

R916 Q9

04

R803

C803

R104

C310

R302

C308

C309C554

C553

R911

L553

L554

L551

L552

C503

C505

C513

C521

C516

C504

C517

C613 C561

L501

L902

C518

R551

C555

C556

IC552

R552

C509

R502

1

6

18

13712

2419

3316

10

5

1

35

40

45

4849556064

30 32252017

1-676-495- 11

MAIN BOARD (SIDE B)

J301

S809(OPEN/CLOSE)

B

C

5

1 2 3

4

E

Q902

Q901

B

EC

GBE

CS

D

CN551

8 15

TP511

E B

C

321

1

4

5

6

7 VDD

DATA

KEY

GND

J301

23

4 5

456

14

85

04

i

TP804

TP526

MINI-DISCOPTICAL

PICK-UP BLOCK(LCX-2E)

M901SPINDLEMOTOR

M902SLED

MOTOR5

1NU

V

W

2

3

4

6

87

TP558

TP555 TP502

TP503TP504

TP564

TP565

TP559

TP557

TP560

TP563

TP501

TP567

TP552 TP551

TP803

TP562

TP553TP801

TP561

TP814

TP569

TP615 TP602

TP911

TP952

TP528

TP523

TP809 TP610

TP607TP613

TP608

TP609TP606 TP603

TP604 TP605

TP601

TP612 TP611

TP524

TP505

TP566

TP568

TP518

TP570TP573TP575TP577

TP512TP576

TP574

TP522

TP572

TP527

TP507TP514

TP519TP516

TP520

TP525

TP508

TP509 TP510 TP515

CN50

1

1

5

10

15

20

TP554

TP802

TP556TP202TP102

TP808

TP517

TP301

TP806

TP951

TAP803

TAP801

S

GD

TP513

IC551

DRY BATTERYSIZE"AA"

(IEC DESIGNATION R6)1PC,1.5V

R927

Q907

TP805TP903

TP571

Q903

TP506

C514

MOTOR FLEXIBLE BOARD 1-675-668-

11

12

11( )

1

A

B

C

D

E

F

G

H

I

234567891011121314

D901 C-5D902 D-5

IC301 H-5IC551 G-10IC552 G-13IC901 B-5IC902 D-4

Q301 H-6Q501 C-7Q901 B-4Q902 B-3Q903 D-4Q904 E-4Q907 C-6

• SemiconductorLocation

Ref. No. Location

– 25 – – 26 –

6-3-2. SCHEMATIC DIAGRAM — MAIN BOARD (1/4) — • Refer to page 33 for IC Block Diagrams.

MZ-E60

Note:• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolyticsand tantalums.

• All resistors are in Ω and 1/4 W or less unless otherwisespecified.

Note:The components identi-fied by mark 0 or dottedline with mark 0 are criti-cal for safety.Replace only with partnumber specified.

Note:Les composants identifiés parune marque 0 sont critiquespour la sécurité.Ne les remplacer que par unepiéce portant le numérospécifié.

• A : B+ Line.• Power voltage is dc 1.5V and fed with regulated dc power

supply from battery terminal.• Voltage and waveforms are dc with respect to ground

under no-signal conditions.no mark : PB

∗ : Impossible to measure• Voltages are taken with a VOM (Input impedance 10 MΩ).

Voltage variations may be noted due to normal produc-tion tolerances.

• Waveforms are taken with a oscilloscope.Voltage variations may be noted due to normal produc-tion tolerances.

• Circled numbers refer to waveforms.• Signal path.

F : PB

(Page 29)

(Page27)

(Page31)

1

IC501 r; (FE) (TP525)

2

IC501 7890

Approx.10mVp-p

Approx.180mVp-p

3

IC501 ed (RF OUT) (TP528)

Approx.0.8Vp-p

• Waveforms (MODE:PLAY)

4

IC501 rf (TE) (TP523)

Approx.12mVp-p

100mV/div 5µs/div 0.5V/div 5µs/div 5mV/div 1µs/div 5mV/div 1µs/div

– 27 –

6-3-3. SCHEMATIC DIAGRAM — MAIN BOARD (2/4) — • Refer to page 34 for IC Block Diagrams.

– 28 –

MZ-E60

(OPEN/CLOSE)

Note:• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolyticsand tantalums.

• All resistors are in Ω and 1/4 W or less unless otherwise

specified.• % : indicates tolerance.• C : panel designation.• A : B+ Line.• Power voltage is dc 1.5V and fed with regulated dc power

supply from battery terminal.• Voltage is dc with respect to ground under no-signal

condition.no mark : PB

∗ : Impossible to measure• Voltages are taken with a VOM (Input impedance 10 MΩ).

Voltage variations may be noted due to normal produc-tion tolerances.

• Signal path.F : PB

(Page26)

(Page 31)

– 29 – – 30 –

6-3-4. SCHEMATIC DIAGRAM — MAIN BOARD (3/4) — • Refer to page 34 for IC Block Diagrams.

MZ-E60

TOTAL CURRENTPLAY : 40mAPAUSE : 36mAFF/REW : 60mA

Note:• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolyticsand tantalums.

• All resistors are in Ω and 1/4 W or less unless otherwise

specified.• % : indicates tolerance.• A : B+ Line.• Power voltage is dc 1.5V and fed with regulated dc power

supply from battery terminal.• Voltage is dc with respect to ground under no-signal

condition.no mark : PB

∗ : Impossible to measure• Voltages are taken with a VOM (Input impedance 10 MΩ).

Voltage variations may be noted due to normal produc-tion tolerances.

(Page 31)

(Page 31)

(Page 26)

6-3-5. SCHEMATIC DIAGRAM — MAIN BOARD (4/4) — • Refer to page 35 for IC Block Diagrams.

– 31 – – 32 –

MZ-E60

Note:• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolyticsand tantalums.

• All resistors are in Ω and 1/4 W or less unless otherwisespecified.

• A : B+ Line.

• Power voltage is dc 1.5V and fed with regulated dc powersupply from battery terminal.

• Voltage and waveforms are dc with respect to groundunder no-signal conditions.no mark : PB

• Voltages are taken with a VOM (Input impedance 10 MΩ).Voltage variations may be noted due to normal produc-tion tolerances.

• Waveforms are taken with a oscilloscope.Voltage variations may be noted due to normal produc-tion tolerances.

• Circled numbers refer to waveforms.

(Page 27)

(Page 30)

(Page 26)

(Page 30)

5

IC801 qj (XIN)

0.46Vp-p

16.9344MHz

• Waveform (MODE:PLAY)

0.2V/div 0.05µs/div

– 33 – – 34 –

IC501 SN761056DBT

IC301 TA2131FL

IC302 AK4352VT-E2

6-6. IC BLOCK DIAGRAMS

CLOCK DIVIDER

LPF

SERIALINPUT

INTERFACE

∆ΣMODULATOR

8XINTERPOLATOR

LPF∆ΣMODULATOR

8XINTERPOLATOR

DE-EMPHASISCONTROL

1

2

3

4

5

6

7

8

15

14

12

11

10

9

13

16MCLK

PD

BICK

SDATA

LRCK

DIF0

DIF1

DEM

CKS

VCML

AOUTL

AOUTR

VCMR

VREF

VDD

VSS

1REXT

Wpp-LPFVREF 1.1

C

D

D-C

Iy

Ix

Jx

Jy

A

A-C

B

TE

FE

ABCDAVCC

OFC C1OFC C2

OFC C3

OFC C4

RFOUTAGNDLP

DGNDRESETSCK

82VTPP LPFT COUNT

DFCT

OFTRK

ADIP IN

TON-CPD-NI

PD-I

DVDDSBUS

PD-OLD-DRV

LD-EMIT

43ADIP42

S MONIT41

44

40

36

3534

31302928

27

26

252423

37

3938

23

4

5

6

7

8

9

10

11

12

13

141516171819

LD-VDD 20

2122

820mVALFA B

IJ BTE C

TON CTWpp CAwDw C

TON PEAKTON BOTM

3332

S-MONITOR

FE

APC

ADIP

TON-C

SERIALI/F

ABCD

Tpp/Wpp

OFTRK

DFCT

RF

T COUNT

TE

V REFMTSW

BSTSW

BEEP

19

20

21

22

23

24

18 17 16 15 14 13

PWSW 12

11

10

8

7

BST1

9

BST2

654321

BSTAGC

PWB

PWA

ADD

TC MT

VCC1

VINR

VINL

BEEPOUTB

BEEPOUTA

+B

LOUT

PWR

GND

ROUT DE

T

AGC

IN

BST OUT

BST NF2

LPF2

BST NF1

LPF1

VREF

VREF

IN

GND

BEEP

IN

RST

SW

MUT

E

PWST

B

+–

+–

VREF WITHSOFT START,

CE

RAMP WAVEGENERATOR,

OSC

PWM/PFMCONTROLAR

PHASECOMPENSATION

3CE

2VDD

1FB

5EXT

4GND

BUFFER,DRIVER

IC902 XC6368B101MR

IC601 UPD63731GC-9EU

2122232425

26 27 28 29 30

23

54

6

7

8

9

10

1

11

12

131415

1617181920

31 32 33 34 35 36 37 38 39 40

5152535455565758596061626364656667686970

41 42 43 44 45 46 47 48 49 50

7172737475

767778798081828384858687868990100 919293949597 969899

ADC

ADIP

RF

FEABCD

TEDSSP

ADIPPLL

EFMPLL

SUBQ/ADIPDECODER

EFM ACIRCDECODER

SECTORDECODER

SSB CONTROLMONITOR I/O etc.

DRAM

& P

ERIP

HERA

L CO

NTRO

L AD

DRES

S GE

NERA

TOR

ACWDCK

S DATA

8

8

16

16

8

8

12

10

CLOCKGENERATOR

ATRACDECODER

FLAG

AC LRCKAC WDCK

AC BYCK

AC DATA

EFM DATA A/BECC DATA

EBA

WR REQ etc.RD DT ECC

ATDT

XATWEDREQ

XBUSY

58

8

SBD

SBA

SBW

SBR

SQRE

Q

2nd

MSB

EFM

PLCK

3 4

8

VDD ADCVREF

FEABCD

TEVRT1

RF

VRT2

ADIP

VRT3

VSS ADC

T COUNT

DEFECT

OF TRX

VSS

NC

NC

NC

NC

VDD

TFOUT

TROUT

FROUT

FFOUT

CK176

VDDDRA3DRA2DRA1DRA0DRA4DRA5DRA6DRA7DRA8DRA10DRA11XRASDRA9XOE2XOEXCASDRD2DRD3VSSXWE2XWEDRD1DRD0VDD

NCXR

ESET

SBUS SC

KSI

NTXB

SYDA

-AVD

DAO

VTR

VCON

AOUT

LDA

AGN

DVD

DEM

PLR

CKAU

DATA

BCK

VSS

DOUT

PMCK

MCK

/2VS

SM

CK I-

O X1 X0M

CK

IO0

IO1

IO2

IO3

FOK

FON

ERFL

AGCR

CFTE

STAD

IP–D

ATA

ADPL

CKEF

MPL

CKVD

DM

O3M

O2M

O1M

O0M

OCK

MIC

KM

I3M

I2M

I1M

I0VS

S

– 35 –

IC602 MN41X17400CTT-10T1

IC552 TLC372CPWIC903 S-8328E20MC-EYA-T2

ROWADDRESSBUFFERS

COLUMNADDRESSBUFFERS

4MARRAY

4MARRAY

4MARRAY

4MARRAY

COLUMNDECODER

ROW

DEC

ODER

I/OBUFFER

TIMING AND CONTROL

24 D225 D3

26 VSS

23 XCAS22 XOE

8A10

6A11

5XRAS4

321

XWE

D1D0

VCC

7NC

9A010A111A212A3

13VCC

21 A920 NC19 A818 A717 A616 A515 A414 VSS

+ –

VREF

PWMCONTROLCIRCUIT

SOFTSTART

CIRCUIT

3NC

2VDD

1VOUT

5EXT

4VSS

2 3

5

4

678

1

V+

V–

VREF

1NC

2VSS

3 OUT

4 VDD

+–

IC803 S-8081ANNP-EDF-T2

– 36 –

IC551 BD6602KUT

PRE-DRIVE

PRE-DRIVE

PRE-DRIVE

PRE-DRIVE

DECODER

PRE-DRIVE

BIAS

STANDBYTO

EACHBLOCK

TOBEMF

COMPARATOR

+ –+ –+ –VCC2

1

RI3

2

FI1

3

RI1

4

VG

5

H1PG

1

6

FO1

7

FO1

8

H1VM

H1VM

9

H1PG

2

12

PWM

13

WI

14

VI

15

UI

1610

RO1

RO1

11

4950

51

5253

54

H4PG2RO4

H4VM

FO4H4PG1

RI455FI4

57RI258FI2

59H2PG260RO2

61H2VM

62FO263H2PG164FI3

56PWM24

33343536373839404142434445464748NC NC VC

C2VC

C1

H3PG

1

FO3

FO3

H3VM

H3VM

RO3

RO3

H3PG

2

CPUI

CPVI

CPW

I

COM

25 NC

26 VO27 GNDUV

28 UO

29 VMU

CPUO31 CPVO32 CPWO

30

18

17

ASGND19 SGND20 NC21 NC22 GNDW

23 WO

24 VMVW

OE

VCC2

VCC1

1XCS

SK

DO

DI

VCC

XBUSY

RST

GND

2

INSTRUCTIONDECODE

CONTROLAND

CLOCKGENERATION

3

4

8

7

6

5INSTRUCTION

REGISTER

ADDBUFFERS

VPPGENERATOR

R/W AMPSAND

AUTO ERASEDATA

REGISTER

VREF

EEPROM

VPP SW

DECODER

IC802 AK93C55AV-L

– 37 –

SECTION 7EXPLODED VIEWS

NOTE:• The mechanical parts with no reference

number in the exploded views are not supplied.• Items marked “*” are not stocked since

they are seldom required for routine service.Some delay should be anticipatedwhen ordering these items.

• AbbreviationFR : French model

• -XX and -X mean standardized parts, sothey may have some difference from theoriginal one.

• Color Indication of Appearance PartsExample :

KNOB, BALANCE (WHITE) ... (RED)

Parts Color Cabinet’s Color• Accessories and packing materials are

given in the last of this parts list.

Ref. No. Part No. Description Remark

7-1. MAIN UNIT SECTION

Ref. No. Part No. Description Remark

1 4-225-573-01 KNOB (MB)2 4-225-574-01 BUTTON (OPEN)3 X-3378-853-1 CASE (REAR) ASSY (S1)

(SILVER)...(SILVER) (EXCEPT US)3 X-3378-854-1 CASE (REAR) ASSY (L1) (BLUE)...(BLUE)4 4-225-572-01 KNOB (HOLD)

5 X-3378-849-1 LID ASSY (S), BATTERY CASE(SILVER)...(SILVER) (EXCEPT US)

5 X-3378-850-1 LID ASSY (L), BATTERY CASE (BLUE)...(BLUE)6 4-225-566-01 FULCRUM (BATTERY CASE LID)

(SILVER)...(SILVER) (EXCEPT US)6 4-225-566-11 FULCRUM (BATTERY CASE LID)

(BLUE)...(BLUE)7 4-225-569-01 SHEET (BLIND)

8 4-218-229-17 SCREW (1.4), MI (SILVER)...(SILVER)(EXCEPT US)

8 4-218-229-19 SCREW (1.4), MI (BLUE)...(BLUE)

9 X-3378-851-1 PANEL ASSY, (S-S), UPPER (SILVER)...(SILVER)(EXCEPT US)

9 X-3378-852-1 PANEL ASSY, (S-L), UPPER (BLUE)...(BLUE)10 4-225-587-01 SCREW (MD), STEP11 X-4951-947-1 HOLDER ASSY12 3-318-382-91 SCREW (1.7X2.5), TAPPING

13 A-3323-416-A MAIN BOARD, COMPLETE (EXCEPT FR)13 A-3323-417-A MAIN BOARD, COMPLETE (FR)14 4-225-567-01 SPRING (CONTACT)15 4-225-568-01 SPRING, BATTERY COIL16 4-225-580-01 SPRING (POP UP L)

17 X-4952-479-1 CHASSIS ASSY, REAR18 4-225-581-01 SPRING (POP UP R)19 4-225-583-01 SHEET, INSULATING20 4-989-078-01 SPRING (OPEN), TENSION21 3-045-227-01 SPACER (HOOK)

22 3-045-576-01 SPACER (KNOB)23 3-045-221-01 RETAINER (REAR), SPACER CHASSIS

R R

1

2

21

3

45

6

7

8

8 9

10

11

12

12 13

12

14

15

16

23

18

19

20

22

17

A

A

MT-MZE60-169

The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.

Les composants identifiés par unemarque 0 sont critiques pourla sécurité.Ne les remplacer que par une piéceportant le numéro spécifié.

– 38 –

7-2. MECHANISM DECK SECTION(MT-MZE60-169)

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

51 1-675-668-11 MOTOR FLEXIBLE BOARD52 4-963-883-42 SCREW (M1.4), PRECISION PAN53 X-4951-926-1 CHASSIS ASSY54 4-222-206-01 SPRING, THRUST55 4-222-216-01 GEAR (SA)

56 3-338-645-31 WASHER (0.8-2.5)57 4-963-883-31 SCREW (M1.4), PRECISION PAN58 3-349-825-21 SCREW

59 4-222-208-01 GEAR (SB)60 4-222-204-01 BEARING61 4-222-203-01 SCREW, LEAD

062 X-4952-387-1 SERVICE ASSY, OP (LCX-2E)63 4-222-205-01 SPRING, RACK

M901 8-835-666-01 MOTOR, DC SSM-01C14A/C-NP (SPINDLE)M902 1-763-399-11 MOTOR, DC (SLED) (WITH PULLEY GEAR)

A

A

51

52

53

M901

M902

5455

5657

59

61

6257

63

60

60

58

5757

The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.

Les composants identifiés par unemarque 0 sont critiques pour lasécurité.Ne les remplacer que par une piéceportant le numéro spécifié.

– 39 –

SECTION 8ELECTRICAL PARTS LIST

NOTE:• Due to standardization, replacements in

the parts list may be different from theparts specified in the diagrams or thecomponents used on the set.

• -XX and -X mean standardized parts, sothey may have some difference from theoriginal one.

• RESISTORSAll resistors are in ohms.METAL:Metal-film resistor.METAL OXIDE: Metal oxide-film resistor.F:nonflammable

• Items marked “*” are not stocked sincethey are seldom required for routine service.Some delay should be anticipatedwhen ordering these items.

• SEMICONDUCTORSIn each case, u : µ, for example:uA.. : µA.. uPA.. : µPA..uPB.. : µPB.. uPC.. : µPC.. uPD.. : µPD..

• CAPACITORSuF : µF

• COILSuH : µH

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

A-3323-416-A MAIN BOARD, COMPLETE (EXCEPT FR)A-3323-417-A MAIN BOARD, COMPLETE (FR)

*********************

< CAPACITOR >

C101 1-135-181-21 TANTALUM CHIP 4.7uF 20% 6.3VC102 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10VC103 1-113-690-11 ELECT CHIP 220uF 20% 4VC201 1-135-181-21 TANTALUM CHIP 4.7uF 20% 6.3VC202 1-115-467-11 CERAMIC CHIP 0.22uF 10% 10V

C203 1-113-690-11 ELECT CHIP 220uF 20% 4VC302 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3VC303 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3VC304 1-164-156-11 CERAMIC CHIP 0.1uF 25VC305 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3V

C306 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC307 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3VC308 1-135-259-11 TANTAL. CHIP 10uF 20% 6.3VC309 1-135-181-21 TANTALUM CHIP 4.7uF 20% 6.3VC310 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3V

C351 1-164-156-11 CERAMIC CHIP 0.1uF 25VC501 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC502 1-110-563-11 CERAMIC CHIP 0.068uF 10% 16VC503 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25VC504 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V

C505 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC509 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25VC510 1-162-962-11 CERAMIC CHIP 470PF 10% 50VC511 1-164-156-11 CERAMIC CHIP 0.1uF 25VC512 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25V

C513 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3VC514 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3VC515 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50VC516 1-162-945-11 CERAMIC CHIP 22PF 5% 50VC517 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V

C518 1-117-720-11 CERAMIC CHIP 4.7uF 10VC521 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16VC524 1-117-920-11 TANTAL. CHIP 10uF 20% 6.3VC551 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC552 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V

C553 1-107-765-11 TANTAL. CHIP 3.3uF 20% 16VC554 1-107-765-11 TANTAL. CHIP 3.3uF 20% 16VC555 1-135-238-21 TANTAL. CHIP 6.8uF 20% 10VC556 1-135-238-21 TANTAL. CHIP 6.8uF 20% 10VC557 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16V

C558 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16VC559 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16VC561 1-164-156-11 CERAMIC CHIP 0.1uF 25VC601 1-164-156-11 CERAMIC CHIP 0.1uF 25VC602 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V

C603 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC604 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC605 1-164-156-11 CERAMIC CHIP 0.1uF 25VC607 1-164-156-11 CERAMIC CHIP 0.1uF 25VC608 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V

C609 1-119-750-11 TANTAL. CHIP 22uF 20% 6.3VC610 1-110-569-11 TANTAL. CHIP 47uF 20% 6.3VC611 1-164-156-11 CERAMIC CHIP 0.1uF 25VC612 1-164-156-11 CERAMIC CHIP 0.1uF 25VC613 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C614 1-164-156-11 CERAMIC CHIP 0.1uF 25VC801 1-162-962-11 CERAMIC CHIP 470PF 10% 50VC803 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC805 1-164-156-11 CERAMIC CHIP 0.1uF 25VC806 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V

C809 1-164-156-11 CERAMIC CHIP 0.1uF 25VC811 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC812 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3VC813 1-164-156-11 CERAMIC CHIP 0.1uF 25VC814 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C815 1-164-156-11 CERAMIC CHIP 0.1uF 25VC851 1-164-156-11 CERAMIC CHIP 0.1uF 25VC852 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50VC853 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50VC854 1-164-156-11 CERAMIC CHIP 0.1uF 25V

C901 1-119-749-11 TANTAL. CHIP 33uF 20% 4VC903 1-110-975-11 TANTAL. CHIP 47uF 20% 6.3VC904 1-110-975-11 TANTAL. CHIP 47uF 20% 6.3VC906 1-162-923-11 CERAMIC CHIP 47PF 5% 50VC907 1-109-982-11 CERAMIC CHIP 1uF 10% 10V

C908 1-119-749-11 TANTAL. CHIP 33uF 20% 4VC909 1-162-962-11 CERAMIC CHIP 470PF 10% 50VC910 1-162-923-11 CERAMIC CHIP 47PF 5% 50VC911 1-104-630-11 TANTAL. CHIP 33uF 20% 6.3VC912 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V

C951 1-164-156-11 CERAMIC CHIP 0.1uF 25VC952 1-125-976-11 TANTAL. CHIP 150uF 20% 2.5V

MAIN

• AbbreviationFR : France model

The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.

Les composants identifiés par unemarque 0 sont critiques pourla sécurité.Ne les remplacer que par une piéceportant le numéro spécifié.

When indicating parts by referencenumber, please include the board.

– 40 –

< CONNECTOR >

* CN501 1-778-168-11 CONNECTOR, FFC/FPC (ZIF) 20PCN551 1-784-228-21 CONNECTOR, FFC/FPC (ZIF) 8P

< DIODE >

D351 8-719-017-58 DIODE MA8068D352 8-719-056-72 DIODE UDZ-TE-17-2.4BD353 8-719-056-72 DIODE UDZ-TE-17-2.4BD354 8-719-056-80 DIODE UDZ-TE-17-5.1BD802 8-719-061-82 LED TLSU1002(TPX1,SONY) (OPERATE)

D855 8-719-066-17 DIODE FTZ6.8E-T148D901 8-719-072-27 DIODE MA2Z748001S0D902 8-719-049-09 DIODE 1SS367-T3SONYD903 8-719-049-09 DIODE 1SS367-T3SONY

< FERRITE BEAD >

FB801 1-414-228-11 FERRITE BEAD INDUCTORFB802 1-414-228-11 FERRITE BEAD INDUCTOR

< IC >

IC301 8-759-598-15 IC TA2131FL-ELIC302 8-759-665-50 IC AK4352VT-E2IC501 8-759-657-49 IC SN761055DBTIC551 8-759-657-50 IC BD6602KUTIC552 8-759-358-40 IC TLC372CPW-E20

IC601 8-759-657-48 IC uPD63732GC-9EUIC602 8-759-559-57 IC MN41X17400CTT-10T1IC801 8-759-659-63 IC RU6915MF-0006IC802 8-759-449-23 IC AK93C55AV-LIC803 8-759-665-49 IC S-80818ANNP-EDF-T2

IC901 8-759-665-47 IC S-8328B24MCIC902 8-759-657-26 IC XC6368B101MRIC903 8-759-665-48 IC S-8328E20MC-EYA-T2

< JACK >

J301 1-778-368-11 JACK, HEADPHONE (i)

< COIL >

L501 1-412-006-31 INDUCTOR CHIP 10uHL502 1-412-006-31 INDUCTOR CHIP 10uHL551 1-410-389-31 INDUCTOR CHIP 47uHL552 1-410-389-31 INDUCTOR CHIP 47uHL553 1-414-400-41 INDUCTOR 22uH

L554 1-414-400-41 INDUCTOR 22uHL601 1-412-006-31 INDUCTOR CHIP 10uHL901 1-419-478-11 COIL, CHOKE 22uHL902 1-412-064-11 INDUCTOR CHIP 100uHL903 1-412-064-11 INDUCTOR CHIP 100uH

< TRANSISTOR >

Q301 8-729-037-52 TRANSISTOR 2SD2216J-QRQ501 8-729-922-10 TRANSISTOR 2SA1577-QR

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

MAIN

Q801 8-729-905-35 TRANSISTOR 2SC4081-RQ802 8-729-046-48 FET FDV303NQ901 8-729-044-50 TRANSISTOR 2SD2153Q902 8-729-230-60 TRANSISTOR 2SA1586-YGQ903 8-729-046-48 FET FDV303N

Q904 8-729-402-16 TRANSISTOR XN4608Q905 8-729-809-46 TRANSISTOR 2SD1935-CT6Q906 8-729-420-44 TRANSISTOR UN5210Q907 8-729-046-48 FET FDV303NQ908 8-729-046-48 FET FDV303N

< RESISTOR >

R101 1-216-833-11 RES-CHIP 10K 5% 1/16WR102 1-216-827-11 METAL CHIP 3.3K 5% 1/16WR103 1-216-797-11 METAL CHIP 10 5% 1/16WR104 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR201 1-216-833-11 RES-CHIP 10K 5% 1/16W

R202 1-216-827-11 METAL CHIP 3.3K 5% 1/16WR203 1-216-797-11 METAL CHIP 10 5% 1/16WR204 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR301 1-216-803-11 METAL CHIP 33 5% 1/16WR302 1-216-831-11 METAL CHIP 6.8K 5% 1/16W

R501 1-216-839-11 METAL CHIP 33K 5% 1/16WR502 1-216-853-11 METAL CHIP 470K 5% 1/16WR503 1-216-827-11 METAL CHIP 3.3K 5% 1/16WR504 1-216-821-11 METAL CHIP 1K 5% 1/16WR505 1-216-864-11 METAL CHIP 0 5% 1/16W

R506 1-216-793-11 RES-CHIP 4.7 5% 1/16WR507 1-216-843-11 METAL CHIP 68K 5% 1/16WR508 1-216-864-11 METAL CHIP 0 5% 1/16WR509 1-216-864-11 METAL CHIP 0 5% 1/16WR513 1-216-864-11 METAL CHIP 0 5% 1/16W

R514 1-216-864-11 METAL CHIP 0 5% 1/16WR551 1-216-833-11 RES-CHIP 10K 5% 1/16WR552 1-216-833-11 RES-CHIP 10K 5% 1/16WR553 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR554 1-216-829-11 METAL CHIP 4.7K 5% 1/16W

R555 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR556 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR601 1-216-803-11 METAL CHIP 33 5% 1/16WR801 1-218-895-11 METAL CHIP 100K 0.5% 1/16WR802 1-218-895-11 METAL CHIP 100K 0.5% 1/16W

R803 1-216-853-11 METAL CHIP 470K 5% 1/16WR804 1-216-853-11 METAL CHIP 470K 5% 1/16WR806 1-216-841-11 METAL CHIP 47K 5% 1/16WR809 1-216-833-11 RES-CHIP 10K 5% 1/16WR810 1-216-827-11 METAL CHIP 3.3K 5% 1/16W

R811 1-216-825-11 METAL CHIP 2.2K 5% 1/16WR812 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR813 1-216-831-11 METAL CHIP 6.8K 5% 1/16WR814 1-216-835-11 METAL CHIP 15K 5% 1/16WR816 1-216-825-11 METAL CHIP 2.2K 5% 1/16W

R817 1-216-809-11 METAL CHIP 100 5% 1/16W

– 41 –

Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark

R818 1-216-809-11 METAL CHIP 100 5% 1/16WR819 1-216-853-11 METAL CHIP 470K 5% 1/16WR821 1-216-857-11 METAL CHIP 1M 5% 1/16WR822 1-216-845-11 METAL CHIP 100K 5% 1/16WR823 1-216-864-11 METAL CHIP 0 5% 1/16W

R824 1-218-871-11 METAL CHIP 10K 0.5% 1/16WR825 1-218-887-11 METAL CHIP 47K 0.5% 1/16WR826 1-216-857-11 METAL CHIP 1M 5% 1/16WR827 1-216-857-11 METAL CHIP 1M 5% 1/16WR832 1-216-845-11 METAL CHIP 100K 5% 1/16W

R833 1-216-864-11 METAL CHIP 0 5% 1/16WR835 1-216-864-11 METAL CHIP 0 5% 1/16WR836 1-216-839-11 METAL CHIP 33K 5% 1/16WR837 1-216-864-11 METAL CHIP 0 5% 1/16WR902 1-216-853-11 METAL CHIP 470K 5% 1/16W

R903 1-216-857-11 METAL CHIP 1M 5% 1/16WR911 1-216-864-11 METAL CHIP 0 5% 1/16WR912 1-218-895-11 METAL CHIP 100K 0.5% 1/16WR913 1-218-911-11 METAL CHIP 470K 0.5% 1/16WR914 1-218-883-11 METAL CHIP 33K 0.5% 1/16W

R915 1-216-863-11 RES-CHIP 3.3M 5% 1/16WR916 1-216-851-11 METAL CHIP 330K 5% 1/16WR917 1-216-853-11 METAL CHIP 470K 5% 1/16WR919 1-216-829-11 METAL CHIP 4.7K 5% 1/16WR920 1-216-864-11 METAL CHIP 0 5% 1/16W

R921 1-218-879-11 METAL CHIP 22K 0.5% 1/16WR922 1-218-895-11 METAL CHIP 100K 0.5% 1/16WR923 1-218-911-11 METAL CHIP 470K 0.5% 1/16WR924 1-218-911-11 METAL CHIP 470K 0.5% 1/16WR925 1-218-891-11 METAL CHIP 68K 0.5% 1/16W

R926 1-216-853-11 METAL CHIP 470K 5% 1/16WR927 1-216-857-11 METAL CHIP 1M 5% 1/16WR928 1-216-857-11 METAL CHIP 1M 5% 1/16WR929 1-216-823-11 METAL CHIP 1.5K 5% 1/16W

< NETWORK RESISTOR >

RB551 1-233-965-11 RES, NETWORK (CHIP TYPE) 4.7KRB552 1-233-979-11 RES, NETWORK (CHIP TYPE) 1MRB802 1-233-977-11 RES, NETWORK (CHIP TYPE) 470K

< SWITCH >

S801 1-771-138-21 SWITCH, KEY BOARD (x)S802 1-771-138-21 SWITCH, KEY BOARD (> N)S803 1-771-138-21 SWITCH, KEY BOARD (.)S804 1-771-138-21 SWITCH, KEY BOARD (VOL +)S805 1-771-138-21 SWITCH, KEY BOARD (VOL –)

S806 1-762-079-11 SWITCH, SLIDE (DIGITAL MEGABASS)S807 1-762-078-11 SWITCH, SLIDE (AVLS)S808 1-762-078-11 SWITCH, SLIDE (HOLD)S809 1-762-342-11 SWITCH, PUSH (1 KEY) (OPEN/CLOSE)

< VIBRATOR >

X601 1-767-621-11 VIBRATOR, CERAMIC (16.9344MHz)*************************************************************

MISCELLANEOUS***************

51 1-675-668-12 MOTOR FLEXIBLE BOARD062 X-4952-387-1 SERVICE ASSY, OP (LCX-2E)

M901 8-835-666-01 MOTOR, DC SSM-01C14A/C-NP (SPINDLE)M902 1-763-399-11 MOTOR, DC (SLED) (WITH PULLEY GEAR)

*************************************************************

ACCESSORIES & PACKING MATERIALS********************************

1-418-493-71 REMOTE CONTROL UNIT (RM-MZ2N)3-043-288-11 MANUAL, INSTRUCTION (ENGLISH,SPANISH,

TRADITIONAL CHINESE) (E)3-043-288-21 MANUAL, INSTRUCTION (ENGLISH,FRENCH)

(US/CND/AEP)3-043-288-31 MANUAL, INSTRUCTION (GERMAN,ITALIAN)

(AEP)3-043-288-41 MANUAL, INSTRUCTION (DUTCH,PORTUGUESE)

(AEP)

3-043-288-51 MANUAL, INSTRUCTION (SWEDISH,FINNISH)(AEP)

3-043-288-61 MANUAL, INSTRUCTION (SPANISH,RUSSIAN)(AEP)

4-221-117-01 CASE, CARRYING8-953-278-90 HEADPHONE MDR-A34SP SET (US)8-953-304-90 RECEIVER MDR-E805SP SET (EXCEPT US)

MAIN

The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.

Les composants identifiés par unemarque 0 sont critiques pour lasécurité.Ne les remplacer que par une piéceportant le numéro spécifié.

– 42 –

MZ-E60

Sony CorporationPersonal Audio Division Company9-927-633-11 2000A0478-1

Printed in Japan C2000. 1Published by General Engineering Dept.