Advanced LCPSubstrates for HF &Microwave ApplicationsHIGHLIGHTS

• Liquid Crystal Polymer (LCP) substrates with excellent high frequency properties• Fine line patterning (down to 25 μm)• Precise cavity generation• Air bridges• Application of heat sinks and lids • DYCONEX is EN 9100 certified

High power density application

Direct bonding to heat sink

Operating temperature up to 180°C

Gold wire bondable surface: ENEPIG

RF tracks covered by metal lid

Laser blind vias 50 or 75 μm

Lines / spaces: > 25 / 25 μm

Lid sealing for near-hermetic package

Heat dissipation via metal insert and thermal vias

LCP Substrate with Heat Sink LCP BGA Package

Very flexible thermoplast

Excellent high frequency properties: εr = 2.9, tan θ = 0.0025

High temperature stability: Tg > 280°C, Td > 320°C

Very low water absorption: < 0.04%

Low weight: 1.4 g / cm3

LCP Base Material

Directly bondable to a variety of materials to control CTE

Wire bondable cavity ledges to access inner layers without lossy vias

Air bridges

Thermal vias for heat dissipation

Application of heat sinks and metal lids

LCP Substrate Features

Advanced LCP Substrates for HF & Microwave Applications

Liquid Crystal Polymer (LCP) is a superior organic multilayer material for RF applications with stable electrical and mechanical characteristics across a range of frequencies up to 100 GHz. Due to its very low water absorption, LCP properties remain nearly constant regardless of the presence of moisture, allowing its use for near-hermetic packages.

Metal lidPatch antenna

Metal plate as heat sink

LCP

Metal insert

LCP

Metal lid

Dissipation factor variation with moisture

LCP, Polyimide (PI) and FR4 laminates

Signal Attenuation

LCP HF Properties LCP HF Properties

0.000

0.005

0.010

0.015

0.020

0.025

0.030

0.035

0.040

Frequency, GHz

Diss

ipat

ion

fact

or

FR-4: 50°C ImmersionFR-4: 23°C, 50%RHPI: 50°C ImmersionPI: 23°C, 50%RHLCP: 50°C ImmersionLCP: 23°C, 50%RH0 2 4 6 8 10TE

CHN

OLO

GIE

SAP

PLIC

ATIO

NS

120

5

4.5

4

3.5

3

2.5

1.5

1

0

2

0.5

0 20 40 60 80 100

Frequency (GHz)

Att

en

ua

tio

n (

dB

)

LCP

GaAs

Si

10/2020 All data given in this document are for information purposes only and are not binding. The data are subject to change without notice. All rights reserved by DYCONEX. Copying, even in extracts, is only allowed by licence of DYCONEX.

Based in Switzerland, DYCONEX has been in the PCB business for more than 50 years and delivers leading edge interconnect solutions in flex, rigid-flex and rigid technology. DYCONEX core competence lies in the production of highly complex HDI, high-frequency and high-reliability circuit boards for medical, defense, aerospace, industrial and semiconductor applications. DYCONEX is an MST company.

Micro Systems Technologies Management GmbH Sieversufer 7-9 DE–12359 Berlin, GermanyPhone +49 (30) 68905-4001 info@mst.com www.mst.com

DYCONEX AGGrindelstrasse 40CH–8303 Bassersdorf, SwitzerlandPhone +41 (43) 266 11 00Fax +41 (43) 266 11 01mail.dyconex@mst.comwww.mst.com