XC9141-XC9142-ETR04018-002aD 3.0MHz ⑤⑥-⑦(*1) Packages (Order Unit) MR-G SOT-25 (3,000pcs/Reel)...

1/34

XC9141/XC9142 Series Load Disconnection Function, 0.8A Step-up DC/DC Converters

TYPICAL APPLICATION CIRCUIT

ETR04018-002

GreenOperation-compatible

TYPICAL PERFORMANCE CHARACTERISTICS

GENERAL DESCRIPTION XC9141/XC9142 series are synchronous step-up DC/DC converters with a 0.3Ω(TYP.) N-channel driver transistor and a

0.3Ω(TYP.) synchronous P-channel switching transistor built-in. A highly efficient and stable current can be supplied up to 0.8A by reducing ON resistance of the built-in transistors.

The series are able to start operation under the condition which has 0.9V input voltage to generate 3.3V output voltage with a 100Ω load resistor, suitable for mobile equipment using only one Alkaline battery or one Nickel metal hydride battery.

The output voltage can be set from 1.8V to 5.5V (±2.0%) in steps of 0.1V.With the built-in oscillator, either 1.2MHz or 3.0MHz can be selected for suiting to your particular application.

During the devices enter stand-by mode, A, D types prevent the application malfunction by CL Discharge Function which can quickly discharge the electric charge at the output capacitor (CL). B, E types is able to drive RTC etc. by Bypass Switch Function to maintain continuity between the input and output. C, F types is able to connect in parallel with other power supplies by Load Disconnection Function which breaks continuity between the input and output.

FEATURESInput Voltage Range : 0.65V～6.0V Fixed Output Voltage : 1.8V～5.5V (0.1V increments) Oscillation Frequency : 1.2MHz (±15%), 3.0MHz (±20%) Input Current : 0.8A Output Current : 500mA @VOUT=5.0V, VBAT=3.3V (TYP.)

350mA @VOUT=3.3V, VBAT =1.8V (TYP.) Control Mode Selection Load Transient Response

: PWM (XC9141 Series) or Auto PWM/PFM (XC9142 Series) : 100mV@VOUT=3.3V, VBAT =1.8V, IOUT=1mA→200mA(tr=5μs)

Protection Circuits : Over-current limit Integral latch method (D,E,F type)

Output short-circuit protection (D,E,F type) Functions : Soft-start Load Disconnection Function (A,C,D,F type) CL Auto Discharge Function (A,D type)

Bypass Switch Function (B,E type) Output Capacitor : Ceramic Capacitor Operating Ambient Temperature : -40～+85 Package : SOT-25,USP-6C,WLP-6-01 Environmentally Friendly : EU RoHS Compliant, Pb Free

APPLICATIONS Portable equipment Beauty & health equipment Wearable devices Game & Hobby PC Peripherals Devices with 1~3 Alkaline,

1~3 Nickel Hydride, 1 Lithium and 1 Li-ion

L=4.7μH(LQH5BPN4R7NT0L)CIN=10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)

XC9141A33C / XC9142A33C

0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Effic

ienc

y : E

FFI

[%]

Output Current : IOUT [mA]

VBAT=0.9VVBAT=1.2VVBAT=1.8VVBAT=2.5V

solid line : XC9141dotted line : XC9142

CIN=10μF

CL=10μF

L=4.7μH

VOUT

GNDBAT

CE

Lx

VBAT

CE

VOUT

2/34

XC9141/XC9142 Series BLOCK DIAGRAM XC9141A/XC9142A type * Diodes inside the circuits are ESD protection diodes and parasitic diodes. * XC9141 series chooses only PWM control. XC9141B/XC9142B type * Diodes inside the circuits are ESD protection diodes and parasitic diodes. * XC9141 series chooses only PWM control.

XC9142C type * Diodes inside the circuits are ESD protection diodes and parasitic diodes.

OSCRAMP WaveGenerator

Phase Compensation

Buffer Driver

Vref withSoft Start

CE ControllerLogic

Load disconnectController

Error Amp. PWM comparator

CLDischarge

CE

VOUT

GND

Lx

RFB1

RFB2

FB

PWM/PFMController Logic

BATVDD MAX

VOUT

VDD

CFB Current senseVOUT


Phase Compensation

Buffer Driver

Vref withSoft Start

CE ControllerLogic



CE

VOUT

GND

Lx

RFB1

RFB2

FB


BATVDD MAX

VOUT

VDD

CFB Current sense

Bypass SW

VOUT


Phase Compensation

Buffer Driver

Vref withSoft Start

CE ControllerLogic



CE

VOUT

GND

Lx

RFB1

RFB2

FB


BATVDD MAX

VOUT

VDD

CFB Current senseVOUT

3/34

XC9141/XC9142Series

BLOCK DIAGRAM (Continued) XC9141D/XC9142D type

* Diodes inside the circuits are ESD protection diodes and parasitic diodes.

* XC9141 series chooses only PWM control. XC9141E/XC9142E type * Diodes inside the circuits are ESD protection diodes and parasitic diodes.

* XC9141 series chooses only PWM control. XC9142F type * Diodes inside the circuits are ESD protection diodes and parasitic diodes


Phase Compensation

Buffer Driver

Vref withSoft Start

CE ControllerLogic



CLDischarge

CE

VOUT

GND

Lx

RFB1

RFB2

FB


BATVDD MAX

VOUT

VDD

CFB

VOUTCurrent senseShort-circuit protect ion

Latch Timer


Phase Compensation

Buffer Driver

Vref withSoft Start

CE ControllerLogic



CE

VOUT

GND

Lx

RFB1

RFB2

FB


BATVDD MAX

VOUT

VDD

CFB

Bypass SW


Latch Timer


Phase Compensation

Buffer Driver

Vref withSoft Start

CE ControllerLogic



CE

VOUT

GND

Lx

RFB1

RFB2

FB


BATVDD MAX

VOUT

VDD

CFB


Latch Timer

4/34

XC9141/XC9142 Series PRODUCT CLASSIFICATION Ordering Information XC9141①②③④⑤⑥-⑦ PWM control

(*1) The ”-G” suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant. XC9142①②③④⑤⑥-⑦ PWM/PFM automatic switching control

(*1) The ”-G” suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant.

DESIGNATOR ITEM SYMBOL DESCRIPTION

① Type

A

Refer to Selection Guide B D E

②③

Output Voltage (XC9141A,B Type)

18～55 Output voltage options e.g. 1.8V → ②=1, ③=8

Output Voltage (XC9141D,E Type)


④ Oscillation Frequency C 1.2MHz D 3.0MHz

⑤⑥-⑦(*1) Packages (Order Unit) MR-G SOT-25 (3,000pcs/Reel) ER-G USP-6C (3,000pcs/Reel) 0R-G WLP-6-01 (5,000pcs/Reel)

DESIGNATOR ITEM SYMBOL DESCRIPTION

① Type

A

Refer to Selection Guide

B C D E F

②③

Output Voltage (XC9142A,B,C Type)


Output Voltage (XC9142D,E,F Type)


④ Oscillation Frequency C 1.2MHz D 3.0MHz

⑤⑥-⑦(*1) Packages (Order Unit) MR-G SOT-25 (3,000pcs/Reel) ER-G USP-6C (3,000pcs/Reel) 0R-G WLP-6-01 (5,000pcs/Reel)

5/34

XC9141/XC9142Series

PRODUCT CLASSIFICATION (Continued)

Selection guides

TYPE OUTPUT

VOLTAGE CHIP

ENABLE SOFT- START

CURRENT LIMIT

SHORT PROTECTION WITH LATCH

CL AUTO- DISCHARGE

SHUTDOWN OPTIONS AT CE=L

A Fixed Yes Fixed Yes

(without latch ) No Yes

Complete Output Disconnect(*2)

B Fixed Yes Fixed Yes

(without latch ) No No

Input-to-Output Bypass(*2)

C(*1) Fixed Yes Fixed Yes

(without latch ) No No


D Fixed Yes Fixed Yes

(with integral latch)Yes Yes


E Fixed Yes Fixed Yes

(with integral latch)Yes No

Input-to-Output Bypass(*2)

F(*1) Fixed Yes Fixed Yes

(with integral latch)Yes No


(*1) Type C,F is available for the XC9142 series only. (*2) VOUT pin can not be connected to the different output pin such as another supply (AC adaptor). (*3) VOUT pin can be connected to the different output pin such as another supply (AC adaptor).

6/34

XC9141/XC9142 Series PIN CONFIGURATION

PIN ASSIGNMENT

FUNCTION CHART PIN NAME SIGNAL STATUS

CE L Stand-by

H Active * Do not leave the CE pin open.

ABSOLUTE MAXIMUM RATINGS Ta=25

PARAMETER SYMBOL RATINGS UNITS

BAT Pin Voltage VBAT -0.3～+7.0 V

Lx Pin Voltage VLx -0.3～+7.0 V

VOUT Pin Voltage VOUT -0.3～+7.0 V

CE Pin Voltage VCE -0.3～+7.0 V

Power Dissipation SOT-25

Pd 600 (PCB mounted)

mW USP-6C 1000 (PCB mounted) WLP-6-01 700 (PCB mounted)

Operating Ambient Temperature Topr -40～+85

Storage Temperature Tstg -55～+125

PIN NUMBER PIN NAME FUNCTIONS

SOT-25 USP-6C WLP-6-01 1 3 3 CE Chip Enable 2 2 2 GND Ground 3 1 1 BAT Power Input 4 6 6 VOUT Output Voltage 5 5 5 Lx Switching - 4 4 GND Ground

*The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the GND (No.2, 4) pin.

*GND are standard voltage for all of the voltage.

1 32

5 4VOUTLx

CE GND BAT USP-6C（BOTTOM VIEW）

2 GND

1 BAT

3 CE

VOUT 6

Lx 5

GND 4

SOT-25（TOP VIEW）

2 GND

1 BAT

3 CE

VOUT 6

Lx 5

GND 4

WLP-6-01（BOTTOM VIEW）

7/34

XC9141/XC9142Series

ELECTRICAL CHARACTERISTICS XC9141/XC9142 Series

Ta=25

PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT

Input Voltage VBAT - - 6.0 V ①

Output Voltage VOUT Voltage to start oscillation while VOUT=VOUT(T) ×1.03→VOUT(T) ×0.97

<E-1> <E-2> <E-3> V ⑤

Operation Start Voltage VST1 RL=1kΩ - - 0.90 V ①

Operation Hold Voltage VHLD RL=1kΩ - 0.65 - V ①

Quiescent Current (XC9142)

Iq VOUT=VBAT= VOUT(T)+0.5V fOSC=1.2MHz - 17.0 30.0

μA ③

fOSC=3.0MHz - 26.0 40.0

Supply Current IDD VOUT=VBAT= VOUT(T)-0.2V fOSC=1.2MHz - <E-4> 1.500

mA ③ fOSC=3.0MHz - <E-5> 3.000

Oscillation Frequency fOSC VBAT= VOUT(T)×0.5 IOUT=100mA

fOSC=1.2MHz 1.02 1.20 1.38 MHz ①

fOSC=3.0MHz 2.40 3.00 3.60

Maximum Duty Cycle DMAX VBAT=1.2V, VOUT= VOUT(T)-0.2V

fOSC=1.2MHz 85 93 98 % ⑤

fOSC=3.0MHz 88 93 98

Minimum Duty Cycle DMIN VOUT=VBAT= VOUT(T)+0.5V - - 0 % ⑤

PFM Switching Current IPFM VBAT=1.5V, RL is selected with VOUT(T), Refer to Table 1.

- 165 230 mA ①

Efficiency （XC9142）

EFFI VBAT= VOUT(T)×0.6, RL is selected with VOUT(T), Refer to Table 1.

- 86(*3) - %

①

Efficiency EFFI VBAT= VOUT(T)×0.6, IOUT= 100mA - 90(*3) - ①

Stand-by Current ISTB VBAT=VLx=6.0V,VCE=0.0V(*1)

A,B,D,E Type

- 0.0 1.0 μA

⑦

C,F Type - 1.0 2.4 ⑧

Lx SW "Pch" ON Resistance

RLXP VBAT=VLx= 6.0V, IOUT=200mA - 0.3(*2) - Ω ④

Lx SW "Nch" ON Resistance

RLXN - 0.3(*3) - Ω ①

Lx SW”H” Leakage Current

ILXLH VBAT=6.0V,VCE=0.0V, VLx=6.0V(*1)

A,B,D,E Type - 0.0 1.0 μA

⑦

C,F Type ⑧

Lx SW”L” Leakage Current （XC9142C/F）

ILXLL VBAT=0.0V,VCE=0.0V,VLx=0.0V,VOUT=6.0V - 0.0 1.0 μA ②

Current Limit ILIM VBAT= VOUT(T)-0.2V, RLx=1Ω <E-6> <E-7> <E-8> A ⑥

Integral Latch Time (D,E,F Type)

tLAT VBAT= VOUT(T)-0.2V, RLx=1Ω, Time from current limit start to stop Lx oscillation

fOSC=1.2MHz 45 300 725 μs ⑥

fOSC=3.0MHz 25 100 365 μs ⑥

Latch Release Voltage (D,E,F Type)

VLAT_R After the integral latch was operated, RL is selected with VOUT(T), Refer to Table 1 VBAT=VOUT(T)-0.2V→0.9V

0.9 1.2 1.5 V ①

Short-circuit Protection Threshold Voltage

(D,E,F Type) VSHORT VBAT=VOUT(T)-0.2V, RL=0Ω - VBAT

(*3) - V ①

8/34

XC9141/XC9142 Series ELECTRICAL CHARACTERISTICS (Continued)

PARAMETER SYMBOL CONDITIONS MIN. TYP. MAX. UNITS CIRCUIT

Soft-Start Time tSS

VBAT= VOUT(T)×0.6, VOUT=VOUT(T)× 0.9, After "H" is fed to CE, the time by when clocks are generated at Lx pin.

fOSC=1.2MHz 0.6 1.0 2.5

ms ⑤

fOSC=3.0MHz 0.2 0.5 1.0

CL Discharge Resistance (A Type)

RDCHG VBAT= 3.3V,VOUT=3.3V,VCE=0.0V 100 180 400 Ω ②

Bypass SW Resistance (B Type)

RBSW VBAT= 3.3V,VOUT=0.0V,VCE=0.0V 100 180 400 Ω ②

CE ”H” Voltage VCEH VOUT= VOUT(T)-0.15V, Applied voltage to VCE, Voltage changes Lx to be generated.

0.80 - 6.00 V ⑤

CE ”L” Voltage VCEL VOUT= VOUT(T)-0.15V, Applied voltage to VCE, Voltage changes Lx to“H” level.

GND - 0.20 V ⑤

CE ”H” Current ICEH VBAT=6.0V,VOUT=6.0V, VLx=6.0V, VCE=6.0V -0.1 - 0.1 μA ②

CE ”L” Current ICEL VBAT=6.0V,VOUT=6.0V, VLx=6.0V, VCE=0.0V -0.1 - 0.1 μA ②

VOUT(T) = Target voltage Test Conditions: unless otherwise stated, VBAT=1.5V, Vce=3.3V, Lx: OPEN, RLx=56Ω (*1) XC9141A/D,XC9142A/D,XC9142C/F type: VOUT=0V,

XC9141B/E,XC9142B/E type: VOUT=OPEN (*2) Design value for the XC9142C/F type. (*3) Designed value

Table 1. External Components RL Table

VOUT(T) RL

UNITS:V UNITS：Ω

1.8≦VOUT(T)<2.1 150

2.1≦VOUT(T)<3.1 220

3.1≦VOUT(T)<4.3 330

4.3≦VOUT(T)≦5.5 470

9/34

XC9141/XC9142Series

ELECTRICAL CHARACTERISTICS (Continued)

Table 2: SPEC Table NOMINAL OUTPUT

VOLTAGE

VOUT IDD

ILIM fOSC=1.2MHz fOSC=3.0MHz

<E-1> <E-2> <E-3> <E-4> <E-5> <E-6> <E-7> <E-8> UNITS V V V mA mA A A A VOUT(T) MIN. TYP. MAX. TYP. TYP. MIN. TYP. MAX.

1.8 1.764 1.800 1.836 0.263 0.583 - 0.96 2.30 1.9 1.862 1.900 1.938 0.279 0.614 - 1.00 2.30 2.0 1.960 2.000 2.040 0.296 0.644 - 1.04 2.30 2.1 2.058 2.100 2.142 0.312 0.675 - 1.07 2.30 2.2 2.156 2.200 2.244 0.328 0.705 - 1.11 2.30 2.3 2.254 2.300 2.346 0.344 0.736 - 1.14 2.30 2.4 2.352 2.400 2.448 0.360 0.767 - 1.17 2.30 2.5 2.450 2.500 2.550 0.376 0.797 - 1.19 2.30 2.6 2.548 2.600 2.652 0.393 0.828 - 1.22 2.30 2.7 2.646 2.700 2.754 0.409 0.858 - 1.24 2.30 2.8 2.744 2.800 2.856 0.425 0.889 - 1.26 2.30 2.9 2.842 2.900 2.958 0.441 0.919 - 1.28 2.30 3.0 2.940 3.000 3.060 0.457 0.950 0.96 1.30 2.30 3.1 3.038 3.100 3.162 0.474 0.981 0.97 1.30 2.30 3.2 3.136 3.200 3.264 0.490 1.011 0.97 1.30 2.30 3.3 3.234 3.300 3.366 0.506 1.042 0.98 1.30 2.30 3.4 3.332 3.400 3.468 0.522 1.072 0.98 1.30 2.30 3.5 3.430 3.500 3.570 0.538 1.103 0.99 1.30 2.30 3.6 3.528 3.600 3.672 0.554 1.134 0.99 1.30 2.30 3.7 3.626 3.700 3.774 0.571 1.164 1.00 1.30 2.30 3.8 3.724 3.800 3.876 0.587 1.195 1.00 1.30 2.30 3.9 3.822 3.900 3.978 0.603 1.225 1.01 1.30 2.30 4.0 3.920 4.000 4.080 0.619 1.256 1.01 1.30 2.30 4.1 4.018 4.100 4.182 0.635 1.286 1.02 1.30 2.30 4.2 4.116 4.200 4.284 0.652 1.317 1.02 1.30 2.30 4.3 4.214 4.300 4.386 0.668 1.348 1.03 1.30 2.30 4.4 4.312 4.400 4.488 0.684 1.378 1.03 1.30 2.30 4.5 4.410 4.500 4.590 0.700 1.409 1.04 1.30 2.30 4.6 4.508 4.600 4.692 0.716 1.439 1.04 1.30 2.30 4.7 4.606 4.700 4.794 0.732 1.470 1.05 1.30 2.30 4.8 4.704 4.800 4.896 0.749 1.501 1.06 1.30 2.30 4.9 4.802 4.900 4.998 0.765 1.531 1.06 1.30 2.30 5.0 4.900 5.000 5.100 0.781 1.562 1.07 1.30 2.30 5.1 4.998 5.100 5.202 0.797 1.592 1.07 1.30 2.30 5.2 5.096 5.200 5.304 0.813 1.623 1.08 1.30 2.30 5.3 5.194 5.300 5.406 0.829 1.653 1.08 1.30 2.30 5.4 5.292 5.400 5.508 0.846 1.684 1.09 1.30 2.30 5.5 5.390 5.500 5.610 0.862 1.715 1.09 1.30 2.30

10/34

XC9141/XC9142 Series

TEST CIRCUITS

< Circuit No.① >

BAT CE

Lx VOUT

GND

Wave Form Measure Point

RLx=56Ω

BAT CE

Lx VOUT

GND


RLx=1Ω

< Circuit No.② >

< Circuit No.③ > < Circuit No.④ >

< Circuit No.⑤ > < Circuit No.⑥ >

※External Components　CIN : 10μF( ceramic )　CL : 10μF( ceramic )XC914xxxxC (fOSC = 1.2MHz)　L : 4.7μHXC914xxxxD (fOSC = 3.0MHz)　L : 2.2μH

BAT CE

Lx VOUT

GND

AA ICEH

ICEL

ILXLL

A

BAT CE

Lx VOUT

GND

IST B

A BAT CE

Lx VOUT

GND

IST B

A

BAT CE

Lx VOUT

GND

AIOUTBAT CE

Lx VOUT

GND

A

< Circuit No.⑦ > < Circuit No.⑧ >


BAT CE

Lx VOUT

GND

CIN

A

L

RLCL

A


IOUT

V

V

A

V

AILXLH

AILXLH

11/34

XC9141/XC9142Series

TYPICAL APPLICATION CIRCUIT

【Typical Examples】fOSC=1.2MHz

MANUFACTURER PRODUCT NUMBER VALUE

L

murata LQH5BPN4R7NT0L 4.7μH

TDK LTF5022T-4R7N2R0-LC 4.7μH

Coilcraft XFL4020-472MEC 4.7μH

CL(*1) murata GRM188R60J106ME84 10μF/6.3V(*2)

murata GRM188D71A106MA73 10μF/10V(*2)

【Typical Examples】fOSC=3.0MHz


L TDK LTF5022T-2R2N3R2-LC 2.2μH

Coilcraft XFL4020-222MEC 2.2μH

CL(*1) murata GRM188R60J106ME84 10μF/6.3V(*2)

murata GRM188D71A106MA73 10μF/10V(*2) 【Typical Examples】fOSC=1.2MHz, fOSC=3.0MHz


CIN(*1) murata GRM188R60J106ME84 10μF/6.3V

murata GRM188D71A106MA73 10μF/10V (*1) Select components appropriate to the usage conditions (ambient temperature, input & output voltage).

While selecting a part, please concern about capacitance reduction and voltage durability. (*2) In the case of fosc=1.2MHz: If VOUT(T)≧3.5V and the load current rises above 200mA, use two or more in a parallel connection.

In the case of fosc=3.0MHz: If VBAT≧2V, VOUT(T)≧3.5V and the load current rises above 200mA, use two or more in a parallel connection. For the actual load capacitance, use a ceramic capacitor that ensures a capacitance equivalent to or greater than the GRM188R60J106ME84 (Murata).

If using tantalum or low ESR electrolytic capacitors please be aware that ripple voltage will be higher due to the larger ESR (Equivalent Series Resistance) values of those types of capacitors. Please also note that the IC’s operation may become unstable with such capacitors so that we recommend to test on the board before usage.

If using electrolytic capacitor for the CL, please connect a ceramic capacitor in parallel.

BAT CE

Lx VOUT

GNDCIN

VBA T

L

CL

VOUT

CE

12/34


OPERATIONAL EXPLANATION The XC9141/XC9142 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation

circuit, N-channel driver transistor, P-channel synchronous rectification switching transistor and current limiter circuit.

BLOCK DIAGRAM

The error amplifier compares the internal reference voltage with the resistors RFB1 and RFB2. Phase compensation is performed on the resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time of the N-channel driver transistor during PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to ensure stable output voltage. The current feedback circuit monitors the N-channel driver transistor’s turn-on current for each switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback loop even when a low ESR capacitor, such as a ceramic capacitor, is used, ensuring stable output voltage. <Reference voltage source, soft start function> The reference voltage forms a reference that is used to stabilize the output voltage of the IC. After “H” level is fed to CE pin, the reference voltage connected to the error amp increases linearly during the soft start interval. This allows the

voltage divided by the internal RFB1 and RFB2 resistors and the reference voltage to be controlled in a balanced manner, and the output voltage rises in proportion to the rise in the reference voltage. This operation prevents rush input current and enables the output voltage to rise smoothly. <Ramp Wave Circuit>

The ramp wave circuit determines switching frequency. The frequency is fixed internally at 1.2MHz/3.0MHz. The Clock generated is used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.

<Error Amplifier> The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by

the internal resistors (RFB1 and RFB2). When the FB is lower than the reference voltage, output voltage of the error amplifier increases. The gain and frequency characteristics of the error amplifier are optimized internally. <VDDMAX>

VDD MAX circuit compares the input voltage and the output voltage then it will select the higher one as the power supply for the IC. <Shutdown function, load disconnection function>

The IC enters chip disable state by applying low level voltage to the CE pin. At this time, the N-channel and P-channel synchronous switching transistors are turned OFF. With XC9142C type, the load disconnection function activates even during shutdown, and because the input voltage VBAT and output voltage VOUT are compared to optimally control the orientation of the parasitic diode of the P-channel synchronous switching transistor, a parallel connection with other power supplies is possible. With the XC9141 series and XC9142A/B types, the orientation of the parasitic diode of the P-channel synchronous switching transistor is fixed at anode: VOUT and cathode: Lx during shutdown to break conduction from the input side to the output side by the parasitic diode of the P-channel synchronous switching transistor.

<PWM/PFM control circuit> When PFM operates, the N-channel driver transistor turns on at the timing of the signal sent from the PWM comparator. The N-channel driver

transistor remains on until the current in the coil reaches a constant current (IPFM). The PWM/PFM control circuit compares the signal sent from the PWM comparator to the time it takes the current in the coil to reach a constant current (IPFM), and outputs the pulse that results in a longer on-time of the N-channel driver transistor. This enables smooth switching between PWM and PFM. The XC9141 series directly outputs the signal that is sent from the PWM comparator.


Phase Compensation

Buffer Driver

Vref withSoft Start

CE ControllerLogic



CLDischarge

CE

VOUT

GND

Lx

RFB1

RFB2

FB


BATVDD MAX

VOUT

VDD

CFB Current sense

Bypass SW

VOUT

13/34

XC9141/XC9142Series

OPERATIONAL EXPLANATION (Continued) <Maximum current limit function, short-circuit protection>

The maximum current limit function of XC9141A/B types and XC9142A/B/C types constantly monitors the current flowing in the N-channel driver transistor connected to the Lx pin, and if the current in the N-channel driver transistor exceeds the current limit, the function turns off the N-channel driver transistor. (Please refer to Fig. ILIM①) ① If the current flowing in the N-channel driver transistor exceeds the current limit value (equivalent to the peak coil current), the N-channel

driver transistor turns off, and remains off during the clock interval. ② At the next clock, the N-channel driver transistor turns on.

If overcurrent continues, ① and ② are repeated. Note that the current in the internal N-channel driver transistor is not the same as the output current IOUT.

The maximum current limit function of XC9141D/E and XC9142D/E/F types monitors the current that flows in the N-channel driver transistor connected to the Lx pin, and consists of both maximum current limiting and a latch function. (Please refer to Fig.ILIM②) Short-circuit protection is a latch-stop function that activates when the output voltage drops below the short-circuit protection threshold voltage in the overcurrent state. (Please refer to Fig.ILIM③) ① If the current flowing in the N-channel driver transistor exceeds the current limit value (equivalent to the peak coil current), the N-channel

driver transistor turns off, and remains off during the clock interval. In addition, an integral latch timer starts the count. ② The N-channel driver transistor turns on at the next pulse. If in the overcurrent state at this time, the N-channel driver transistor turns off as

in (1). The integral latch timer continues the count. ③ If the count of the integral latch timer continues for 300μs typ.(@fosc=1.2MHz), a function that latches the N-channel driver transistor and P-

channel synchronous switching transistor to the off state activates. ④ If no longer in the overcurrent state at the next pulse, normal operation resumes. The integral latch timer stops the count. ⑤ If the output voltage VOUT drops below the short-circuit protection threshold voltage VSHORT during the count of the integral latch timer, a

function that latches the N-channel driver transistor and P-channel synchronous switching transistor in the off state activates. The short-circuit protection threshold voltage VSHORT is a threshold voltage that is linked to the input voltage VBAT.

⑥ In the latched state, either restart by shutting down once with the CE pin, or resume operation by lowering the input voltage VBAT below the latch release voltage VLAT_R(1.2V typ.). The soft start function operates during restart. During the soft-start interval tSS, the integral latch timer and latch function are stopped.

⑦ When the input voltage VBAT is below the latch release voltage VLAT_R(1.2V typ.), the integral latch timer and latch function stop, but the current limiting function continues operating.

* Note that the current in the internal N-channel driver transistor is not the same as the output current IOUT.

ILIM

ILx

VBAT

VOUT

LatchTimer

VSHORT=VBAT

Limit<300μs Typ.(@fosc=1.2MHz)

VLAT_R

RL

Latch

⑤ ⑥①

② ⑦

Fig. ILIM ③

0Ω

RL

①② ①

tSS

VOUT

VOUT(T)

VBAT

ILx

CE

ILIM

②

Fig. ILIM

14/34


OPERATIONAL EXPLANATION (Continued) <CL Discharge> The XC9141A/D type and XC9142A/D type can discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which

enables a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the VOUT pin and the GND pin. When the IC is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time of the output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant of a CL auto-discharge resistance value [RDCHG] and an output capacitor value (CL) as τ (τ = CL x RDCHG), discharge time of the output voltage after discharge via the N channel transistor is calculated by the following formulas. However, the CL discharge resistance [RDCHG] is depends on the VBAT or VOUT. We recommend that you fully check actual performance.

V = VOUT x e -t / τ or t = τ x ln (VOUT / V)

V : Output voltage after discharge VOUT(T) : Target voltage

t : Discharge time τ : CL×RDCHG

CL : Capacitance of Output capacitor (CL) RDCHG : CL Discharge resistance, it depends on supply voltage

Output Voltage Discharge characteristics

RDCHG = 180Ω(TYP) CL=10μF

<Bypass switch> At shutdown, XC9141B/E type and XC9142B/E type conduct between the BAT pin and VOUT pin by means of a bypass switch. If the output is shorted to ground, the current is limited by the resistance (RBSW) of the bypass switch.

0.00.51.01.52.02.53.03.54.04.55.05.56.0

0 2 4 6 8 10 12 14 16 18 20

Outp

ut

Voltag

e: V

OU

T(V

)

Discharge Time: t(ms)

VOUT(T) = 1.8V,VBAT=1.0V



15/34

XC9141/XC9142Series

NOTE ON USE 1) For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used

beyond the absolute maximum ratings. 2) Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component

selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed, verification with actual components should be done.

3) The DC/DC converter performance is greatly influenced by not only the ICs' characteristics, but also by those of the external components.

Care must be taken when selecting the external components. Especially for CL load capacitor, it is recommended to use type B capacitors (JIS regulation) or X7R, X5R capacitors (EIA regulation).

4) Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause the IC

operation to become unstable, so reinforce the area around the GND pin of the IC in particular. 5) Please mount each external component as close to the IC as possible. Also, please make traces thick and short to reduce the circuit

impedance. 6) With regard to the current limiting value (ILIM), the actual coil current may at times exceed the electrical characteristics due to propagation

delay inside the product. 7) The CE pin is a CMOS input pin. Do not use with the pin open. If connecting to the BAT pin or ground pin, use the resistor which is 1MΩ or

less. To prevent malfunctioning of the device connected to this product or the input/output due to short circuiting between pins, it is recommended that a resistor be connected.

8) In case of connecting to another power supply as shown in below circuit diagram, please use the XC9142C/F type. Connecting another

external power supply to the output of any other type may destroy the IC. 9) The maximum current limiter controls the limit of the N-channel driver transistor by monitoring current flow. This function does not limit the

current flow of the P-channel synchronous transistor. When used with the condition VBAT > VOUT (input voltage higher than the output voltage), the IC may be destroyed if overcurrent flows to the P-channel synchronous switching transistor due to short-circuiting of the load or other reason.

10) When the device is used in high step-up ratio, the current limit function may not work during excessive load current. In this case, the

maximum duty cycle limits maximum current. In this event, latching may not take place on XC9141D/E types and XC9142D/E/F types (“latch types” below) because the maximum current limit cannot be detected.

11) On latch types, some board conditions may cause release from the maximum current limit, and the integrated latch time may become longer or latching may not take place.

12) If the status heavy load and large output capacitor is connected or the input voltage is low, the output voltage may overshoot, on XC9141A/B

types and XC9142A/B/C types(“non-latch types” below). On a latch type, the maximum current limit may be detected, and this will cause the latch function to activate and stop operation after the soft start time elapses. In particular, note that the soft start time becomes shorter when the IC is used at high temperatures.

13) When the step-up voltage difference is small, the XC9141 series for PWM control may oscillate intermittently. 14) When the voltage boost difference is small, the current limiting function may not operate if the on time of the N-channel driver transistor is

shorter than the propagation delay time of the current limit circuit. In this case, latching may not take place on a latch type because the maximum current limit is not detected.

15) When an XC9142C/F type is used with VBAT > VOUT(T) (input voltage higher than the set output voltage), the P-channel synchronous switching

transistor turns off but current flows to the parasitic diode. This causes excessive heat generation in the IC. Test using the actual equipment and note the power dissipation and heat dissipation of the package. During voltage boosting with a voltage drop due to VF of the parasitic diode, the output voltage may become unstable. On the XC9141 series and XC9142A/B/D/E types, the P-channel synchronous switching transistor turns on and the output voltage becomes equal to the input voltage. In environments where VBAT > VOUT（T）, the XC9141 series and XC9142A/B/D/E types are recommended.

16) When input voltage and output voltage are low, integral latch function and short-circuit protection may not operate. We recommend that you fully check actual performance.

17) TOREX places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.

16/34


NOTE ON USE (Continued) Instructions for pattern layouts

1. In order to stabilize VBAT voltage level, we recommend that a by-pass capacitor CIN is connected as close as possible to the BAT and GND pins.

2. Please mount each external component as close to the IC as possible. 3. Place external components as close to the IC as possible and use thick and short traces to reduce the circuit impedance. 4. Make sure that the PCB GND traces are thick and wide as possible. GND voltage level fluctuation created by high ground current at

the time of switching may cause instability of the IC. 5. The internal driver transistors bring on heat because of the IIN current and ON resistance of the driver transistors.

＜Example of pattern layout＞

SOT-25 PCB mounted 1st layer 2nd layer

USP-6C PCB mounted 1st layer 2nd layer

WLP-6-01 PCB mounted 1st layer 2nd layer

6. Note on mounting (WLP-6-01) 6-1. Mount pad design should be optimized for user's conditions. 6-2. Sn-AG-Cu is used for the package terminals. If eutectic solder is used, mounting reliability is decreased. Please do not

use eutectic solder paste. 6-3. When underfill agent is used to increase interfacial bonding strength, please take enough evaluation for selection. Some

underfill materials and applied conditions may decrease bonding reliability. 6-4. The IC has exposed surface of silicon material in the top marking face and sides so that it is weak against mechanical

damages. Please take care of handling to avoid cracks and breaks. 6-5. The IC has exposed surface of silicon material in the top marking face and sides. Please use the IC with keeping the circuit

open (avoiding short-circuit from the out). 6-6. Semi-transparent resin is coated on the circuit face of the package. Please be noted that the usage under strong lights may

affects device performance.

17/34

XC9141/XC9142Series

TYPICAL PERFORMANCE CHARACTERISTICS

(1) Efficiency　vs.　Output Current

L=4.7μH(LQH5BPN4R7NT0L) L=2.2μH(LQH5BPN2R2NT0L)

CIN=10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M) CIN=10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)

L=4.7μH(LQH5BPN4R7NT0L) L=2.2μH(LTF5022T2R2)


L=4.7μH(LTF5022T4R7) L=2.2μH(LTF5022T2R2)

CIN=10μF(GRM188R60J106M),CL=20μF(GRM188R60J106M x 2) CIN=10μF(GRM188R60J106M),CL=20μF(GRM188R60J106M x 2)

XC9141x50C / XC9142x50C XC9141x50D / XC9142x50D



0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Effic

ienc

y : E

FFI

[%]



VBAT=0.9VVBAT=1.2VVBAT=1.5V

0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000Ef

ficie

ncy

: EFF

I [%

]Output Current : IOUT [mA]



0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Effic

ienc

y : E

FFI

[%]


0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Effic

ienc

y : E

FFI

[%]






0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Effic

ienc

y : E

FFI

[%]


0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Effic

ienc

y : E

FFI

[%]


VBAT=1.2VVBAT=1.8V

VBAT=2.5VVBAT=3.7V

VBAT=4.2V

VBAT=1.2VVBAT=1.8V

VBAT=2.5VVBAT=3.7V

VBAT=4.2V



18/34


TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(2) Output Voltage　vs.　Output Current








XC9141x50D / XC9142x50D XC9141x50C / XC9142x50C


1.70

1.72

1.74

1.76

1.78

1.80

1.82

1.84

1.86

1.88

1.90

0.1 1 10 100 1000

Out

put V

olta

ge :

VO

UT

[V]


1.70

1.72

1.74

1.76

1.78

1.80

1.82

1.84

1.86

1.88

1.90

0.1 1 10 100 1000O

utpu

t Vol

tage

: V

OU

T[V


VBAT=0.9, 1.2, 1.5V VBAT=0.9, 1.2, 1.5V



3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

0.1 1 10 100 1000

Out

put V

olta

ge :

VO

UT

[V]


3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

0.1 1 10 100 1000

Out

put V

olta

ge :

VO

UT

[V]


VBAT=0.9, 1.2, 1.8, 2.5V VBAT=0.9, 1.2, 1.8, 2.5V



4.90

4.92

4.94

4.96

4.98

5.00

5.02

5.04

5.06

5.08

5.10

0.1 1 10 100 1000

Out

put V

olta

ge :

VO

UT

[V]


4.90

4.92

4.94

4.96

4.98

5.00

5.02

5.04

5.06

5.08

5.10

0.1 1 10 100 1000

Out

put V

olta

ge :

VO

UT

[V]


VBAT=1.2, 1.8, 2.5, 3.7V VBAT=1.2, 1.8, 2.5, 3.7V



19/34

XC9141/XC9142Series


(3) Ripple Voltage vs. Output Current








XC9141x50D / XC9142x50D XC9141x50C / XC9142x50C

XC9141x18D / XC9142x18DXC9141x18C / XC9142x18C

0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Ripp

le V

olta

ge :

Vr[m

V]


0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000Ri

pple

Vol

tage

: V

r[mV




VBAT=1.5VVBAT=1.2VVBAT=0.9VVBAT=0.9, 1.2, 1.5V

VBAT=1.5VVBAT=1.2VVBAT=0.9VVBAT=0.9, 1.2, 1.5V

01020

30405060

708090100

0.1 1 10 100 1000

Ripp

le V

olta

ge :

Vr[m

V]


0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Ripp

le V

olta

ge :

Vr[m

V]




VBAT=2.5VVBAT=1.8V

VBAT=1.2VVBAT=0.9V

VBAT=0.9, 1.2, 1.8, 2.5V

VBAT=2.5VVBAT=1.8V

VBAT=1.2VVBAT=0.9V

VBAT=0.9, 1.2, 1.8, 2.5V

0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Ripp

le V

olta

ge :

Vr[m

V]


0

10

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Ripp

le V

olta

ge :

Vr[m

V]




VBAT=4.2VVBAT=3.7V

VBAT=2.5VVBAT=1.8V

VBAT=1.2VVBAT=1.2, 1.8, 2.5, 3.7, 4.2V

VBAT=4.2VVBAT=3.7V

VBAT=2.5VVBAT=1.8V

VBAT=1.2VVBAT=1.2, 1.8, 2.5, 3.7, 4.2V

20/34



(4) Output Voltage vs. Ambient Temperature



(6) Supply Current vs. Output voltage

XC9141x50D / XC9142x50DXC9141x50C / XC9142x50C

XC9142x18C XC9142x18D

XC9141x18C/XC9142x18C XC9141x33C/XC9142x33C

(5) Quiescent Current vs. Output Voltage

0

5

10

15

20

25

30

35

40

1 2 3 4 5 6

Qui

esce

nt C

urre

nt :

Iq[μ

A]

Output Voltage : VOUT[V]

0

5

10

15

20

25

30

35

40

1 2 3 4 5 6

Qui

esce

nt C

urre

nt :

Iq[μ

A]


Ta=-40Ta= 25Ta= 85

Ta=-40Ta= 25Ta= 85

0.0

0.5

1.0

1.5

2.0

2.5

3.0

1 2 3 4 5 6

Supp

ly C

urre

nt :

I DD[m

A]


0.0

0.5

1.0

1.5

2.0

2.5

3.0

1 2 3 4 5 6

Supp

ly C

urre

nt :

I DD[m

A]


Ta=-40, 25, 85

Ta=-40Ta= 25Ta= 85

1.70

1.72

1.74

1.76

1.78

1.80

1.82

1.84

1.86

1.88

1.90

-50 -25 0 25 50 75 100

Out

put V

olta

ge :

VO

UT

[V]

Ambient Temperature : Ta[ ]

3.20

3.22

3.24

3.26

3.28

3.30

3.32

3.34

3.36

3.38

3.40

-50 -25 0 25 50 75 100O

utpu

t Vol

tage

: V

OU

T[V

]Ambient Temperature : Ta[ ]

21/34

XC9141/XC9142Series


(7) Stand-by Current vs. Ambient Temperature

(8) CL Discharge Resistance vs. Ambient Temperature (9) Bypass SW Resistance vs. Ambient Temperature

(10) Lx SW "Pch" ON Resistance vs. Ambient Temperature (11) Lx SW "Nch" ON Resistance vs. Output Voltage

XC9141A / XC9142A

XC9141E / XC9142E

XC9141D / XC9142D XC9141E / XC9142EXC9141A / XC9142A

XC9141 / XC9142XC9141 / XC9142

XC9141B / XC9142B XC9142C / XC9142F

XC9141B / XC9142B

XC9141D / XC9142D

0.0

1.0

2.0

3.0

4.0

5.0

-50 -25 0 25 50 75 100St

and-

by C

urre

nt :

I STB[μ

A]


0.0

1.0

2.0

3.0

4.0

5.0

-50 -25 0 25 50 75 100

Stan

d-by

Cur

rent

: I ST

B[μ

A]




0

50

100

150

200

250

300

350

400

-50 -25 0 25 50 75 100

C LDi

scha

rge

Resi

stan

ce : R

DC

HG[Ω

]


0

50

100

150

200

250

300

350

400

-50 -25 0 25 50 75 100

Bypa

ss S

W R

esis

tanc

e : R

BS

W[Ω

]


VBAT=1.8V

VBAT=5.0VVBAT=3.3V

VBAT=1.8V

VBAT=5.0VVBAT=3.3V

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

-50 -25 0 25 50 75 100

Lx S

W "P

ch" O

N Re

sist

ance

: R L

XP[Ω

]


0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

0 1 2 3 4 5 6

Lx S

W "N

ch" O

N Re

sist

ance

: R L

XN[Ω

]

Output Voltage : VOUT(V)

Ta=-40Ta= 25Ta= 85

VBAT=1.8V

VBAT=5.0VVBAT=3.3V

22/34


TYPICAL PERFO RMANCE CHARACTERISTICS (Continued)

(12) CE "H" Voltage vs. Ambient Temperature (13) CE "L" Voltage vs. Ambient Temperature

(14) Lx SW "H" Leakage Current　vs.　Ambient temperture (15) Lx SW "L" Leakage Current　vs.　Ambient temperture

(16) Oscillation Frequency vs. Ambient temperture



XC9141xxxD / XC9142xxxDXC9141xxxC / XC9142xxxC

XC9142C / XC9142FXC9141B / XC9142B

XC9141E / XC9142EXC9141D / XC9142D

XC9141 / XC9142XC9141 / XC9142

XC9141A / XC9142A

0.2

0.3

0.4

0.5

0.6

0.7

0.8

-50 -25 0 25 50 75 100

CE "

H" V

olta

ge :

VC

EH[V

]

Ambient Temperature : Ta()

0.2

0.3

0.4

0.5

0.6

0.7

0.8

-50 -25 0 25 50 75 100CE

"L"

Vol

tage

: V

CE

L[V]

Ambient Temperature : Ta()

VOUT=1.0, 1.8, 3.0, 5.0VVOUT=1.0, 1.8, 3.0, 5.0V

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

-50 -25 0 25 50 75 100

Osc

illatio

n Fr

eque

ncy

: fO

SC[M

Hz]


1.8

2.0

2.2

2.4

2.6

2.8

3.0

3.2

3.4

3.6

3.8

-50 -25 0 25 50 75 100

Osc

illatio

n Fr

eque

ncy

: fO

SC[M

Hz]


VOUT=5.0VVOUT=3.3V

VOUT=1.8V

VOUT=5.0VVOUT=3.3V

VOUT=1.8V

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

-50 -25 0 25 50 75 100

Lx S

W "H

" Le

akag

e Cu

rren

t : I L

XLH

[μA

]


0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

-50 -25 0 25 50 75 100

Lx S

W "L

" Lea

kage

Cur

rent

: I LX

LL[μ

A]


VLx=6.0V

VLx=6.0V

23/34

XC9141/XC9142Series


(17) Maximum Duty Cycle vs. Ambient temperture

(18) Soft-Start Time vs. Ambient temperture

(19) PFM Switching Current vs. Input Voltage



XC9142x50D

XC9141xxxC / XC9142xxxC

XC9142x50C

XC9141xxxD / XC9142xxxD

XC9141xxxD / XC9142xxxDXC9141xxxC / XC9142xxxC

80

85

90

95

100

-50 -25 0 25 50 75 100

Max

imum

Dut

y Cy

cle

: DM

AX[%

]


80

85

90

95

100

-50 -25 0 25 50 75 100M

axim

um D

uty

Cycl

e : D

MA

X[%

]


VOUT=5.0VVOUT=3.3V

VOUT=1.8V VOUT=5.0VVOUT=3.3V

VOUT=1.8V

0.0

0.5

1.0

1.5

2.0

2.5

3.0

-50 -25 0 25 50 75 100

Soft-

Star

t Tim

e : t

SS[m

s]


0.0

0.5

1.0

1.5

2.0

2.5

3.0

-50 -25 0 25 50 75 100

Soft-

Star

t Tim

e : t

SS[m

s]


VOUT=1.8, 5.0V

VOUT=5.0VVOUT=1.8V

100

125

150

175

200

225

250

0.0 1.0 2.0 3.0 4.0 5.0 6.0

PFM

Sw

itchi

ng C

urre

nt :

I PFM[m

A]

Input Voltage : VBAT[V]

100

125

150

175

200

225

250

0.0 1.0 2.0 3.0 4.0 5.0 6.0

PFM

Sw

itchi

ng C

urre

nt :

I PFM[m

A]

Input Voltage : VBAT[V]

Ta= -40Ta= 25Ta= 85

Ta= -40Ta= 25Ta= 85

24/34



(20) Operation Start Voltage　vs. Ambient temperture (21) Operation Hold Voltage　vs. Ambient temperture

(22) Current Limit vs. Ambient temperture

XC9141xxxC / XC9142xxxC XC9141xxxD / XC9142xxxD

XC9141 / XC9142 XC9141 / XC9142

0.0

0.2

0.4

0.6

0.8

1.0

-50 -25 0 25 50 75 100

Ope

ratio

n St

art V

olta

ge :

VS

T1[V

]


0.0

0.2

0.4

0.6

0.8

1.0

-50 -25 0 25 50 75 100

Ope

ratio

n Ho

ld V

olta

ge :

VH

LD[V

]Ambient Temperature : Ta[ ]

VOUT=1.8, 3.3V

VOUT=5.0V

VOUT=5.0V

VOUT=3.3VVOUT=1.8V

1.0

1.2

1.4

1.6

1.8

2.0

2.2

-50 -25 0 25 50 75 100

Curr

ent L

imit

: ILI

M[A

]


1.0

1.2

1.4

1.6

1.8

2.0

2.2

-50 -25 0 25 50 75 100

Curr

ent L

imit

: ILI

M[A

]

Ambient Temperature : Ta[]

VOUT=3.3V

VOUT=5.0V

VOUT=5.0V

VOUT=3.3V

25/34

XC9141/XC9142Series


(23) Integral Latch Time vs. Ambient temperature

(24) Latch Release Voltage vs. Ambient temperature

200

240

280

320

360

400

‐50 ‐25 0 25 50 75 100

Integral Latch Tim

e : tLAT[μs]


VOUT=5.0V

VOUT=3.3V

0.9

1.0

1.1

1.2

1.3

1.4

1.5

‐50 ‐25 0 25 50 75 100

Latch Re

lease Vo

ltage : V L

AT_R[V]

Ambient Temperture : Ta[]

XC9141DxxC / XC9142DxxC XC9141ExxC / XC9142ExxC

XC9142FxxC L=4.7μH(LTF5022T4R7)

CIN=10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)

XC9141DxxC / XC9142DxxC XC9141ExxC / XC9142ExxC

XC9142FxxC L=4.7μH(LTF5022T4R7)

CIN=10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)

30

60

90

120

150

180

‐50 ‐25 0 25 50 75 100Integral Latch Tim

e : tLAT[μs]


VOUT=5.0V

VOUT=3.3V

XC9141D / XC9142D XC9141E / XC9142E

XC9142F

26/34



(25) Load Transient Response

27/34

XC9141/XC9142Series


(25) Load Transient Response

28/34


PACKAGING INFORMATION SOT-25 (unit: mm) USP-6C (unit: mm) WLP-6-01 (unit: mm)

1 3

2.9±0.2

0.4+0.1-0.05

1.9±0.2

0.15+0.1-0.05

0～0.1

2

5 4

(0.95)

1pin INDENT

(0.290)

(0.5)

1.08±0.03

3

2

6

4

5

1

29/34

XC9141/XC9142Series

PACKAGING INFORMATION (Continued)

USP-6C Reference Pattern Layout (unit: mm) USP-6C Reference Metal Mask Design (unit: mm)

WLP-6-01 Reference Pattern Layout / Reference Pattern Layout detail (unit: mm)

WLP-6-01 Reference Metal Mask Design (unit: mm)

0.20

0.32

レジスト

PCB

(0.5)

resist

30/34

XC9141/XC9142 Series SOT-25 Power Dissipation Board Mount (Tj max = 125)

Ambient Temperature（） Power Dissipation Pd（mW） Thermal Resistance (/W)

25 600 166.67

85 240

Power dissipation data for the SOT-25 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition.

1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side)

Copper (Cu) traces occupy 50% of the board area in top and back faces Package heat-sink is tied to the copper traces (Board of SOT-26 is used.)

Material: Glass Epoxy (FR-4) Thickness: 1.6 mm Through-hole: 4 x 0.8 Diameter

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient temperature

Pd-Ta特性グラフ

0

100

200

300

400

500

600

700

25 45 65 85 105 125

周辺温度Ta（）

許容

損失

Pd（m

W）

Pd vs. Ta

Ambient Temperature Ta ()

Pow

er D

issi

patio

n P

d (m

W)

31/34

XC9141/XC9142Series

USP-6C Power Dissipation Power dissipation data for the USP-6C is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data)

Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Board: Dimensions 40mm×40mm (1600mm2 in one side)

Copper (Cu) traces occupy 50% of the board area

in top and back faces

Package heat-sink is tied to the copper traces

Material: Glass Epoxy (FR-4)

Thickness: 1.6mm

Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient temperature

Board Mount (Tj max=125)

Ambient Temperature () Power Dissipation Pd (mW) Thermal Resistance (/W) 25 1000

100.00 85 400


Pd-Ta特性グラフ

0

200

400

600

800

1000

1200

25 45 65 85 105 125

周辺温度Ta（）

許容

損失

Pd（

mW

）

Pd vs. Ta

Pow

er D

issi

patio

n P

d (m

W)


32/34

XC9141/XC9142 Series WLP-6-01 Power Dissipation Power dissipation data for the WLP-6-01 is shown in this page. The value of power dissipation varies with the mount board conditions. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data)

Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Board: 40mm×40mm (1600mm2 in one side

Metal Area: 1st Metal Layer about 50%

2nd Inner Metal Layer about 50%

3rd Inner Metal Layer about 50%

4th Metal Layer about 50%

Material: Glass Epoxy (FR-4)

Thickness: 1.6mm

Through-hole: 4 x 0.8 Diameter 2. Power Dissipation vs. Ambient temperature

Board Mount (Tj max=125)

Ambient Temperature () Power Dissipation Pd (mW) Thermal Resistance (/W) 25 700

142.86 85 280


Pow

er D

issi

patio

n P

d (m

W)

Pd vs. Ta


33/34

XC9141/XC9142Series

MARKING RULE

① represents products series

② represents products series, Oscillation Frequency, and output voltage range

SERIES OSCILLATION FREQUENCY

OUTPUT VOLTAGE RANGE [V]PRODUCT SERIES

1.8～3.7 3.8～5.5

XC9141A

1.2MHz

0 1 XC9141AxxCxx-G XC9141B 2 3 XC9141BxxCxx-G XC9141D 8 9 XC9141DxxCxx-G XC9141E A B XC9141ExxCxx-G XC9141A

3.0MHz

4 5 XC9141AxxDxx-G XC9141B 6 7 XC9141BxxDxx-G XC9141D R U XC9141DxxDxx-G XC9141E C D XC9141ExxDxx-G XC9142A

1.2MHz

A B XC9142AxxCxx-G XC9142B C D XC9142BxxCxx-G XC9142C E F XC9142CxxCxx-G XC9142D V X XC9142DxxCxx-G XC9142E E F XC9142ExxCxx-G XC9142F H K XC9142FxxCxx-G XC9142A

3.0MHz

H K XC9142AxxDxx-G XC9142B L M XC9142BxxDxx-G XC9142C N P XC9142CxxDxx-G XC9142D Y Z XC9142DxxDxx-G XC9142E L M XC9142ExxDxx-G XC9142F N P XC9142FxxDxx-G

③ represents output voltage MARK OUTPUT VOLTAGE [V] MARK OUTPUT VOLTAGE [V]

0 1.8 3.8 A 2.8 4.8 1 1.9 3.9 B 2.9 4.9 2 2.0 4.0 C 3.0 5.0 3 2.1 4.1 D 3.1 5.1 4 2.2 4.2 E 3.2 5.2 5 2.3 4.3 F 3.3 5.3 6 2.4 4.4 H 3.4 5.4 7 2.5 4.5 K 3.5 5.5 8 2.6 4.6 L 3.6 - 9 2.7 4.7 M 3.7 -

④,⑤ represents production lot number 01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded) * No character inversion used.

MARK PRODUCT SERIES

Y XC9141/42A/B/C/D/Sxxxxx-G Z XC9141/42E/Fxxxxx-G

Enlarge

④⑤

②③

①1

2

3

6

5

4

USP-6C WLP-6-01

1 2 3

③①

②④⑤

6 5 4

SOT-25 (Under dot)

34/34


1. The product and product specifications contained herein are subject to change without notice to improve performance characteristics. Consult us, or our representatives before use, to confirm that the information in this datasheet is up to date.

2. The information in this datasheet is intended to illustrate the operation and characteristics of our

products. We neither make warranties or representations with respect to the accuracy or completeness of the information contained in this datasheet nor grant any license to any intellectual property rights of ours or any third party concerning with the information in this datasheet.

3. Applicable export control laws and regulations should be complied and the procedures required by

such laws and regulations should also be followed, when the product or any information contained in this datasheet is exported.

4. The product is neither intended nor warranted for use in equipment of systems which require

extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human life, bodily injury, serious property damage including but not limited to devices or equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other transportation industry and 5) safety devices and safety equipment to control combustions and explosions. Do not use the product for the above use unless agreed by us in writing in advance.

5. Although we make continuous efforts to improve the quality and reliability of our products;

nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or property damage resulting from such failure, customers are required to incorporate adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention features.

6. Our products are not designed to be Radiation-resistant.

7. Please use the product listed in this datasheet within the specified ranges.

8. We assume no responsibility for damage or loss due to abnormal use.

9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex

Semiconductor Ltd in writing in advance.

TOREX SEMICONDUCTOR LTD.

XC9141-XC9142-ETR04018-002aD 3.0MHz ⑤⑥-⑦(*1) Packages (Order Unit) MR-G SOT-25 (3,000pcs/Reel)...

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