uClamp3306P Low Voltage TVS for ESD Protection · Circuit Diagram Package ... % of Rated Power or I...
Transcript of uClamp3306P Low Voltage TVS for ESD Protection · Circuit Diagram Package ... % of Rated Power or I...
PROTECTION PRODUCTS
1 www.semtech.com
PROTECTION PRODUCTS - MicroClampTM
uClamp3306PLow Voltage TVS
for ESD Protection
Description Features
Circuit Diagram Package
Revision 01/17/2007
The μClampTM series of TVS arrays are designed toprotect sensitive electronics from damage or latch-updue to ESD, lightning, and other voltage-inducedtransient events. Each device will protect up to six linesoperating at 3.3 volts.
The μClampTM3306P is a solid-state device designedspecifically for transient suppression. It is constructedusing Semtech’s proprietary EPD process technology.The EPD process provides low standoff voltages withsignificant reductions in leakage currents and capaci-tance over traditional pn junction processes. They offerdesirable characteristics for board level protectionincluding fast response time, low clamping voltage andno device degradation.
The μClamp3306P may be used to meet the immunityrequirements of IEC 61000-4-2, level 4 (±15kV air,±8kV contact discharge). It is packaged in an ultrasmall SLP1616P6 package with a low profile of only0.58mm. The leads are spaced at a pitch of 0.5mmand are finished with lead-free NiPd. The small packagemakes it ideal for use in portable electronics such as cellphones, digital still cameras, and notebook computers.
Applications
Mechanical Characteristics
Cellular handsets and accessoriesNotebooks and handheldsMP3 PlayersDigital camerasPortable instrumentation
Transient protection for data lines toIEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)Small package for use in portable electronicsProtects Six I/OWorking voltage: 3.3VLow leakage currentLow operating and clamping voltagesSolid-state silicon-avalanche technology
SLP1616P6 packageRoHS/WEEE CompliantNominal Dimensions: 1.6 x 1.6 x 0.58 mmLead Pitch: 0.5mmLead Finish: NiPdMarking : Orientation Mark and Marking CodePackaging : Tape and Reel per EIA 481
6 Pin SLP package (Bottom Side View)1.6 x 1.6 x 0.58mm (Nominal)
Device Schematic
Center Tab (GND)
2 3 4 5 61
0.6
1.6
1.6
1
0.5
6
2© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3306P
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
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3© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3306P
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - TA (oC)
% o
f Rat
ed P
ower
or I
PP
Power Derating Curve
Clamping Voltage vs. Peak Pulse Current
Normalized Capacitance vs. Reverse VoltageESD Clamping
(8kV Contact per IEC 61000-4-2)
0.01
0.1
1
0.1 1 10 100 1000
Pulse Duration - tp (µs)
Peak
Pul
se P
ower
- P
PP (k
W)
Forward Voltage vs. Forward Current
0
1
2
3
4
5
6
7
8
0 1 2 3 4 5 6Forward Current - IF (A)
Forw
ard
Volta
ge -
V F (V
)
Waveform Parameters:
tr = 8μstd = 20μs
0
0.2
0.4
0.6
0.8
1
1.2
0 0.5 1 1.5 2 2.5 3 3.5Reverse Voltage - VR (V)
CJ(
V R) /
CJ(
V R=0
)
f = 1 MHz
Line-Ground
Line-Line
0
2
4
6
8
10
0 1 2 3 4 5 6Peak Pulse Current - IPP (A)
Cla
mpi
ng V
olta
ge -
V C (V
)
Waveform Parameters:
tr = 8μstd = 20μs
4© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3306P
Insertion Loss S21 - LtoL (I/O to I/O) Insertion Loss S21 -LtoG (I/O to Pin 2)
2 3
4
1
START . 030 MHz 3 STOP 000 . 000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -3.0155 dB 260 MHz 2: -7.4637 dB
900 MHz 3: -9.2053dB
1.8 GHz 4: -9.9280 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB 1
GHz 100 MHz
3 GHz
10 MHz
1 MHz
2 3
4
1
START . 030 MHz 3 STOP 000 . 000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -3.0041 dB 532 MHz 2: -4.0655 dB
900 MHz 3: -6.1405dB
1.8 GHz 4: -8.0944 dB
2.5 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB 1 GHz
100 MHz
3 GHz
10 MHz
1 MHz
Crosstalk S21 (I/O to Pin 4)
START . 030 MHz 3 STOP 000 . 000 000 MHz
CH1 S21 LOG 20 dB / REF 0 dB
5© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3306P
Device Connection Options
The μClamp3306P is designed to protect 6 signal lineswith an operating voltage of 0 to 3.3V. It will present ahigh impedance to the protected line up to 3.3 volts. Itwill “turn on” when the line voltage exceeds 3.5 volts.The device is unidirectional and may be used on lineswhere the signal polarity is above ground.
Pins 1, 2, 3, 4, 5, and 6 are connected to I/O signals.The center tab is connected to system ground. Allsignal lines and ground should be made with the lowestimpedance and inductance path as possible. This willimprove signal quality of the lines and keep theclamping voltage as low as possible during a fasttransient.
EPD TVS Characteristics
These devices are constructed using Semtech’sproprietary EPD technology. The structure of the EPDTVS is vastly different from the traditional pn-junctiondevices. At voltages below 5V, high leakage currentand junction capacitance render conventional ava-lanche technology impractical for most applications.However, by utilizing the EPD technology, these devicescan effectively operate at 3.3V while maintainingexcellent electrical characteristics.
The EPD TVS employs a complex nppn structure incontrast to the pn structure normally found in tradi-tional silicon-avalanche TVS diodes. The EPD mecha-nism is achieved by engineering the center region ofthe device such that the reverse biased junction doesnot avalanche, but will “punch-through” to a conduct-ing state. This structure results in a device with supe-rior DC electrical parameters at low voltages whilemaintaining the capability to absorb high transientcurrents.
Applications InformationFigure 1 - Circuit Diagram
IPP
ISB
IPTIR
VRWM VV PT VC
VF
IF
SB
Figure 3 - EPD TVS IV Characteristic Curve
Figure 2 - Layout Example
Center Tab (GND)
2 3 4 5 61
6© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3306P
Figure 3 - μClamp3306P Spice Model
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M -- 632.0
N -- 1.1
GE Ve 11.1
I/O
Applications Information - Spice Model
7© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3306P
Outline Drawing - SLP1616P6
Land Pattern - SLP1616P6
bxN
E/2LxN
E1
D1A2
A
E
D
1.701.50.067.059
1.50 1.70.067.059
INCHES
.020 BSC
b .008
bbbaaaN
D1
Le
D
.010
.041
DIM
A1A2
AMIN
0.00.020
0.300.20.012 0.25.010
0.40
1.30
0.25
1.05
.004
.0036
.013
.063
.047
.016
.051
0.080.10
60.33
1.601.20
0.50 BSC
MILLIMETERSMAX
0.050.65
DIMENSIONS
MIN
0.00
NOM
(.005)
.023
.001
MAX
.002
.026NOM
0.500.03
(0.13)
0.58
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
NOTES:
2.
1.
E1 .010 .016 .020 0.25 0.40 0.501.60.063E
AB
A1
SEATING PLANE
C
aaa C
1 2
N
e
PIN 1INDICATOR
(LASER MARK)
bbb C A B
D/2
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).1.
FUNCTIONAL PERFORMANCE OF THE DEVICE.FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD3.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
XY
P
GC
MILLIMETERSINCHES1.52
.012
.025
.035
.020
.060
0.300.63
0.50
0.89
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.15.085Z
.018H 0.45
X
Z
P
Y
G(C)H
K
K .051 1.30
8© 2007 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp3306P
Marking Ordering Information
MicroClamp, uClamp and μClamp are marks of SemtechCorporation
Tape and Reel Specification
Device Orientation in Tape
epaThtdiW
)xaM(,B D 1D E FK
)XAM(P 0P 2P )XAM(T W
mm8mm2.4)561.(
mm1.0+5.1mm0.0-
500.+95.0()000.-
mm8.050.0±)130.(
01.±057.1mm
)400.±960.(
50.0±5.3mm
)200.±831.(
mm4.2)490.(
1.0±0.4mm
-00.±751.()4
1.0±0.4mm
-00.±751.()4
-m50.0±0.2m
)200.±970.(
mm4.0)610.(
mm0.8mm3.0+mm1.0-
)210.±213.(
Contact Information
Semtech CorporationProtection Products Division
200 Flynn Rd., Camarillo, CA 93012Phone: (805)498-2111 FAX (805)498-3804
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Mouser Electronics
Authorized Distributor
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