TKT-3500

Microcontroller

systems

Lec 6 – Hardware design

Teemu Laukkarinen

Department of Computer Systems

Tampere University of Technology

Fall 2011

#2/42

Sources

Original slides by Erno Salminen

Robert Reese, Microprocessors: From Assembly

to C with the PIC18Fxx2, Charles River Media,

2005

Northwestern University mechatronics design wiki

http://hades.mech.northwestern.edu/wiki/index.php/Mai

n_Page

Wikipedia

#3/42

Contents

Recap: Basic electronics

Current, voltage, power

Ohm’s law, Kirchoff’s law

Resistor, capacitance, inductance

Semiconductors: diode, transistor, IC

Others: fuse, regulator, op. amp.

(Meters: multimeter, oscillator, signal

analyzer)

Packages and assembly

Circuit board design

#5/42

Current I

Current measures how many charge carriers

(electrons) flow through a conductor

Conductor is material that can conduct electrical current,

usually some metal such as aluminum or copper

Symbol I; unit Ampere, A

microcontroller systems operate with e.g. 10 mA – 500 mA

Current may flow only in a closed circuit

from positive voltage to negative

Direct current (DC) flows always in one direction

whereas alternating current (AC) varies

The origin of current is also called source whereas

the destination is called sink or drain

#6/42

Voltage U/V

Voltage means electrical potential –

difference in amount electrical charge –

between two points of a circuit

Symbol U (sometimes V); unit Volt, V

microcontrollers use e.g. 2-5 V

Voltage source Vs is a device that provides

current with (ideally) fixed voltage level

single AA battery provides 1.5 V, car battery 12 V

wall outlet 230V, 50Hz alternating current (AC)

In practice, large current causes voltage drop

#7/42

Ohm’s law

The relation between voltage and current

U = R * I

Current I that flows through resistance R, causes

a voltage difference V

Or R = U/I, or I = U/R

Current causes voltage drop

Voltage difference causes current

VR

I

+

- Vs

R

Vs = VR = R * I

I = Vs / R

#8/42

Power P and energy E

Power measures the amount of work done in unit time Rate of energy consumption

Symbol P; unit Watt, W

Product of voltage and current: P = U * I = U * (U/R)

PIC uses <1 W of power

Energy E means the total work Symbol E; unit Joule, J

E = P * t = (U*I) *t, where t denotes time

Sometimes given in Watt-hours, Wh or volt-Ampere-hours VAh

Battery stores some amount of energy E that is spent at certain rate P One AA battery contains 1000-3000 mAh

#9/42

Kirchoff’s law

Electrical current

1. cannot disappear anywhere

2. cannot originate out of nowhere

More formally, sum of currents flowing into a

circuit node equals the sum of leaving

currents

Σ Ii = Σ Io

Current flows also in the ground wire

although its voltage is (almost) zero

so called ground loop

I1 I2

Is= I1+ I2

Basic passive

components

#11/42

Resistance R

Property of a conductor defining the how much is

prevents the current from flowing

Symbol R; unit Ohm, Ω

1 Ω = 1V / 1A

Ideal conductor has R= 0 Ω

Ideal insulator has R= ∞ Ω

Passive component (does not need supply voltage to

operate)

Unpolarized – no matter which way you connect it

Basic microcontroller system utilizes resistors e.g. in

the range 50Ω -500 kΩ

Drawing symbols:

#12/42

Resistances in series

Current flows through all resistors – large

resistance

Rtot = Σ Ri

Voltage division so that sum of voltages

across resistors equals the source voltage

Vs = VR1 + VR2

Vs = I * Rtot

Vs = I * (R1 + R2)

VR2 = R2/Rtot * Vs

VR2

I

+

- Vs

R2

R1

VR1

#13/42

Resistances in parallel

Current has more paths – low resistance

Same voltage across all Ri

VR1 = VR2 = Vs

Rtot =

Is= Vs / Rtot

Current divider:

I1 = (R2 / Rtot) * Is

I2 = (R1 / Rtot) * Is

I1 I2

Is= I1+ I2

+

- Vs

VR1

1

+ 1 1 R1 R2

VR2 R2 R1

Is

#14/42

Fuse

A fuse is just a thin wire, enclosed in a

casing, that plugs into the circuit so that all

charge flows through the fuse wire

If the current climbs too high, it burns up the

wire

Protects the circuit against excess current

due to, for example, a short-circuit

Fuse must be of right size

Does not burn accidentally

Will be burn before other circuitry

Size measured in tolerated amperes

#15/42

Capacitance C

Symbol C; unit Farad, F

Component is called capacitor (’kondensaattori’)

Commonly used capacitors are in picofarad range

Stores electrical charge into electrical field

Two metal plates very close to each other with

insulator in between

”Resists the change in voltage”

used for filtering and as a temporary voltage

source

Drawing symbols:

Basic, unpolarized Polarized

+

#16/42

Capacitance C (2)

Capacitors in parallel Ctot = Σ Ci

Capacitors in series Ctot = 1 / (Σ 1/Ci)

Current depends on the change in voltage

Does not conduct if voltage is stable

Voltage across the capacitor is integral of

current

i.e. how much charge have flown into the capcitor

i(t) = C dv dt

v(t) = i dt 1

C

#17/42

Charging/discharging a capacitor

Large, abrupt voltage difference

when switch opens/closes

Large current immediately after

that

Current decays as C gets

charged/discharged

i(t) +

- Vs

R1

vC(t) vC(t)

t1a

Vs

C R2

t2a t1b

switch1

switch2

0) both

switches

open

1) close

switch1

2) open

switch1

3) close

switch2

Charge C ”Hold” Discharge

i(t)

R1 > R2

time

time

#18/42

Capacitor for filtering

+

- vs

R1

vC(t)

C

switch1 v(t)

vs

time

vc

+

- vs

vo(t)

C

switch1 v(t) vs = vAC+DC

time

vAC

RC circuit filters high frequencies (sharp edges)

Capacitor does not conduct when voltage is

constant, i.e. it does not pass DC component

through. Hence, vo has Only the AC component.

#19/42

Inductance L

Symbol L; unit Henry, H

Commonly used inductors are in mH range

”Resists the change in current”

Coils are used for filtering

Stores electrical charge into magnetic field

Even when current is turned off, magnetic field

induces a current

This may create voltage spikes that cause noise

problems and may break other components

Inductors in series/parallel act like resistors

Drawing symbols:

#20/42

Inductance and magnetic field

Current flowing through

wire creates a magnetic

field around it

”Right-hand rule” gives

the direction of field

Magnetic fields sum

together in the ”core” of

the coil

Antennas are based on

induction phenomena

current

direction of

magnetic field

#21/42

Impedance

How much an electrical entity impedes (slows down) the flow of current

Symbol Z; unit Ohm, Ω

Same unit with resistance

Sum of resistance and reactance

Reactance is frequency-dependent part Applies to capacitors and coils

ZC = 1 /ωC = 1 / (2 * π * f * C)

ZL = ωL = 2 * π * f * L

On high frequency, impedance of C is low whereas impedance of L is high

#22/42

Input and output impedance

When voltage is applied to circuit’s inputs, a current will flow

Input impedance defines its magnitude

In many cases, input resistance is accurate enough

When output circuit is closed, a current will flow

Output voltage is not constant, Vout, loaded < Vout, open-circuit

Small load takes large current

Creating a short-circuit to outputs, defines the maximum I and,

hence, the circuits’ output resistance

Ideally, Zin=∞Ω and Rout = 0 Ω

Input will not draw current from the driver / ouput will not resist

current flow

circuit

internal

structur

e

Vin Vout

circuit

Vin Zin

Rout

Vout

Iin

Example circuit Equivalent circuit

Zload

Iout

VOC

#23/42

Basic passive filters – RC filters

vo(t)

C

vi(t)

vo(t) C vi(t)

Gain = Vout/Vin

freqeuncy

Gain = Vout/Vin

freqeuncy

1.0

1.0

f0

f0

Low-pass filter

In both cases f0 = 1 / ( 2 * π * RC)

High-pass filter

Exam

ple

uasge: push b

utton

#24/42

Basic passive filters – LC filters (2)

vo(t) C L vi(t)

vo(t)

C

L vi(t)

Gain = Vout/Vin

frequency

Gain = Vout/Vin

frequency

1.0

1.0

f0

f0

Band-pass filter, at f0 the impedance Z → 0

In both cases f0 = 1 / ( 2 * π * LC)

Band-pass filter, at f0 the impedance Z → ∞

Some semiconductor

devices

#27/42

Semiconductor devices

Semiconductor – material which conducts

varying electrical current depending on the

conditions, e.g. voltage or light

Diode

simplest semiconductor device, two terminals

conducts in one direction

Transistor

three-terminal devices

conductivity is controlled with one of the terminals

Integrated circuits

#28/42

Diode

Conducts current in one

direction only

Conducts only when forward

biased

Vanode - Vcathode > Vthreshold

Usually Vthreshold = 0.7 V

Often used for protecting other

circuitry

Also used for rectifying (AC to

DC)

symbol:

real component:

#29/42

Diode (2)

When voltage in forward direction rises above

threshold, the diodes R approaches zero

Current is limited by other circuitry

Diode causes constant

voltage drop, usually 0.7V

Voltage in backwards

direction, prevents

conduction

Unless diode breaks with

large voltage...

+

- Vs

Vd

Vd

I

#30/42

Some diode types

1. basic – most comon

2. light-emitting diode (LED) – produces light (infrared-visible-ultraviolet) relative to current laser diode – used e.g. optical

communication

3. photodiodes – conductivity depends on the luminance

4. Schottky – hysteresis prevents spurious changes of diode output

5. zener (and avalanche)– conduct backwards (see voltage regulators)

6. And many more...

symbol:

real component:

#31/42

#32/42

Diode usage for clamping

Clamping limits voltage into desired range

Useful when we need to protect circuits from high

voltages at their inputs

We specify the maximum and minimum voltage we

want by applying voltages across a diode.

If Vin > Vmax, diode D1 becomes forward biased and conducts, thus forcing Vout to stay at Vmax.

If Vin < Vmin, diode D2 conducts and prevents the Vout from dropping any lower

Often Vmax = Vdd, Vmin = GND

#33/42

Rectifying circuits (tasasuuntaus)

ACin

ACin

DC out

DC out

time

time

Direction of

current when

AC in is positive

Half-wave (above) and full-wave (right) rectifiers

load Cfilt

#34/42

Transistor

Amplifies or switches electronic signals

Sometimes considered as ”the greatest

invention of 20th century”

Three terminals

current in

current out

control terminal

The last defines the conductivity between the

two others

#35/42

Transistor (2)

Many different flavors Controlling quantity (current vs. voltage)

Control polarity: positive/negative

+ Depletion/enhancement type FETs

The polarity of terminals: doped with n-type or p-type

The main categories 1. bipolar junction transistor (BJT): current-controlled

2. field-effect transistor (FET): voltage-controlled

we won’t go into details...

gate

drain

source

base

collector

emitter

Slightly different

symbols and naming of

terminals

VGS

BJT FET

IB

I I

drain = nielu

gate = hila

source = lähde

IB ≈0

0.7V

#36/42

Transistor (3)

a) Transistor off – not conducting – when

control voltage (or current) is zero

b) Transistor on – starts conducting – when

control voltage increases

1. Conductivity increases with control

2. When control increases enough, transistor

becomes saturated – it cannot conduct more

current

When conducting, base-emitter voltage (or

gate-source) is constant

Similar p-n junction as in diode

#39/42

Example usages of

transistor

1. As a switch

FET closes the electrical circuit and let’s the current flow

Practically zero current goes from PIC to FET

Specific power-FETs can handle large currents

2. As inverting AC amplifier

This BJT has DC current gain hFE = β = 100

IB = (Vcc- 0.7V)/RB = 10.2 uA

IC = β * IB = 1.02 mA

quiescent Vo = Vcc – IC * RC = 5.2V

Vin > 0, increases IB and Vout will drop

With few additional R, the gain can be controlled regardless of β

g

d

s VGS

I

Device that takes

larger current than

available from PIC

Vdd

PIC

GPIO

IB

IC

0.7V

Vin

Vcc = 10V

Rb= 910 kΩ

b

c

e Vout

Rc= 4.7 kΩ

0V

C

#40/42

Integrated circuits

An integrated circuit (IC) combines many

components into single chip

Example ICs

microprocessor

memory

Ethernet controller

operational amplifier

74xx series, e.g. 8 * 2AND gates

Require larger package with more pins than

previously introduced components

Using ICs reduces the number of components on the

circuit board and increase their performance

#41/42

Operational amplifier

High-gain voltage amplifier

Very popular active component

Needs power supply and ground

Amplifies the difference between the two

input terminals An op-amp in a DIP

package

+

-

Vs+

Vs-

V+

V-.

Vout.

For any input voltages the ideal op-amp has infinite open-loop gain (i.e.

without feedback)

infinite bandwidth and slew rate

infinite input impedances (resulting in zero input currents),

zero offset voltage,output impedance, and noise

Circuit symbol of an op. amp.

#42/42

Operational amplifier (2)

Usually utilizes negative feedback (Fraction of) Vout is connected to input V-

Input signal is fed to input V+

Consequently, op.amp drives the output so that there is no voltage difference between V- and V+

Does not load Vinput (practically no current) but high current available at output

+

- R1

R2

Vinput Vout

Vout * R2/(R1+R2) = Vinput

Note! 0 V

Vout = Vinput * (R1+R2)/R2 negative

feedback

I ≈ 0 A

Amplification is controlled with external resistors R1 and R2!

Mikko Kohvakka - Nov 2009

TKT-3500

Microcontroller

systems

Lec 6 – PCB design

Mikko Kohvakka

Department of Computer Systems

Tampere University of Technology

Fall 2009

#44/42

Following slides

Originally presented and made by Mikko

Kohvakka

He has designed most of the TUTWSN main

boards, including the one used in practices

PhD in area of Wireless Sensor Network PHY

and MAC

#45/42 Mikko Kohvakka - Nov 2009

Contents

Electronic components

Printed Circuit Board (PCB) Design 1. schematic design

2. placement

3. routing

4. verification

5. manufacturing

6. testing

Example schedule and prices

Electromagentic Compatibility (EMC) issues Emission types: radiated adn conducted

Electrostatic discharge (ESD)

Mikko Kohvakka - Nov 2009

Electronic components

#47/42 Mikko Kohvakka - Nov 2009

Real-life components

All real component have parasitics R, C and L Also the wires!

In many cases, these parasitics can be neglected, for example, at low frequencies

Real-life components are not 100% accurate e.g. a nominally 100 Ω resistor may actually be

90 Ω or 110 Ω, or something in between

Components come with x% tolerance e.g. 1%, 5%, 10% tolerance

Smaller the tolerance, the more expensive

Very HIFI devices may use manually picked components

#48/42 Mikko Kohvakka - Nov 2009

Real-life components (2)

Component’s value

may be

a) written if package is

large enough

b) coded (see fig)

Components are

attached to printed-

circuit board with

soldering, either as

a) via-mounted

b) surface-mounted

a)

b)

PCB

soldering via (=hole)

component

#49/42 Mikko Kohvakka - Nov 2009

Through-hole components

Resistors (above) and

potentiometer (below)

Capacitors Coils (inductors)

#50/42 Mikko Kohvakka - Nov 2009

Surface-mounted components

Usually these are too small to be assembled and soldered manually.

#51/42 Mikko Kohvakka - Nov 2009

Ordering

Small quantitites can be purchased from Minimum order: 1 pcs

Lead time: 0 - 1 week

Highest price

Bebek (www.bebek.fi), Farnell (www.farnell.fi), Mouser (www.mouser.com), Digikey (www.digikey.fi), etc.

Medium quantities can be purchased from distributors Minimum order: 1 reel = 1000 – 5000 pcs

Lead time: ~ 4 weeks

Arrow electronics, Future electronics, Avnet Memec, etc.

High volumes can be purchased from component manufacturers Minimum order: ~ 100 000 pcs per year

Lead time: ~ 8 weeks

Lowest price

Custom components, custom marking, preprogramming etc. possible

Mikko Kohvakka - Nov 2009

Printed Circuit Board

(PCB) Design

#53/42 Mikko Kohvakka - Nov 2009

Example Schedule of PCB Design

Week 1 2 3 4 5 6 7 8 9 10 11

1. Specification

2. Component selection

3. Schematic design

(logical connections)

4. PCB design

(layout)

5. Verification

(schematic == layout)

6. Component orders

7. PCB manufacturing

8. Component

assembly

9. Testing, (application

development/debug…)

6 – 8 weeks

1 – 8 weeks

1 person

~50-100 components, 5-10 of which

are ICs

#54/42 Mikko Kohvakka - Nov 2009

Specification and component selection

Specify the a) functional and b) non-functional properties Performed operations / required functionality

Min. performance level

Max. power consumption

Operation voltage range

Operation temperature range

PCB footprint

Required certifications and regulations, e.g. CE mark

Target Bill Of Material (BOM)

Etc.

Select suitable components Start from IC (most complex parts)

voltage and current ratings

Temperature stability

Tolerance

Speed

Price

#55/42 Mikko Kohvakka - Nov 2009

Schematic and Layout Design

Schematic design 1. Define utilized components

2. Define connections between components

Layout design 1. Place components

First critical components (connectors, ICs, capacitors)

2. Design wiring between components First critical signals (high frequency and sensitive signals)

Design grounding and supply voltage nets

3. Verify design and compatibility with manufacturing Clearances, and wire widths

Automatic verification between schematic and design

#56/42 Mikko Kohvakka - Nov 2009

Component Definition

Define component footprint in layout

Define component symbol in schematic

Footprint Schematic symbol

#57/42 Mikko Kohvakka - Nov 2009

Schematic

Schematic is

divided into

regions, e.g.

controller, radio,

power supply etc.

Off-page

connections used.

The same names

are used

elsewhere to

define connection.

No need to draw it.

#58/42 Mikko Kohvakka - Nov 2009

Layout Design

Connections between components are

presented as “elastic bands” between pads

#59/42 Mikko Kohvakka - Nov 2009

Component Placement

Use the link between schematic and PCB

A components are selected in schematic they become

selected in layout too

Divide components in blocks, e.g. regulator block,

MCU block, sensor block etc.

Easy by using the link and selecting the block in schematic

Design layout first for blocks, then place the blocks in

the design in correct places

Critical components first, e.g. ICs and crystals

Critical signals first (clk, analog)

Capacitors near to ICs

Try to minimize routing lengths

#60/42 Mikko Kohvakka - Nov 2009

Capacitor Placement

Digital circuits consume current in peaks

PCB traces and wires have always some impedance

causing noise and instability in supply voltage

Capacitors are used for supplying energy for current peaks

Every IC needs bypass capacitor

Actually, every power supply pin of an IC

Power

input

Protection circuits

(over voltage,

over current,

polarity etc.)

Large capacitor for “energy buffer”

IC

VCC1 area

Regulator

Smaller

capacitors

voltage in voltage out

time

I

time

V

w/o C

w/ C

#61/42 Mikko Kohvakka - Nov 2009

Capacitor Placement (2)

Different capacitor types have different frequency response

Small ceramic capacitors are best for high frequency (up to GHz) Low Equivalent Series Resistance (ESR), low inductance

Electrolytic capacitors operate best at very low frequency, around 100 Hz

Use combination of capacitor sizes

It is critical to place capacitors at correct places

Smallest capacitors nearest to ICs

Power

input

Protection circuits

(over voltage,

over current,

polarity etc.)

Large electrolyte or tantalum capacitor for

“energy buffer”, ~10 – 1000 uF

IC

Supply power

Ceramic decoupling

capacitor (~100 nF, low

ESR)

VCC1 area

Regulator

Ceramic

capacitors

Decoupling capacitor

stabilizes the supply

voltage.

voltage in voltage out

#62/42 Mikko Kohvakka - Nov 2009

Component Placement

Components in filters and analog parts should be placed similarly as in schematic Example: C3, C4 and L2 in the same order

Example: Y1, C5, C6 and R1

Correct order shown in the data sheet, if necessary

#63/42 Mikko Kohvakka - Nov 2009

Routing

Keep routes as short as possible

Route critical signals first, e.g. high frequency signals

Adjust trace width according to current level Power and ground must have wide traces

Use 45 angles in tracks Looks nice

Over 90 degrees angles may have manufacturing implications in copper etching (over-etching)

45

#64/42 Mikko Kohvakka - Nov 2009

PCB Copper Layers

2-layer design is cheapest Only top and bottom layers

Suitable for DIY

Problems with grounding and EMC

4-layer design is common Signals in top and bottom layers

Ground and supply voltage (VCC) in inner layers improve the stability of ground and VCC

capacitance between signal and ground/VCC reduces EMC problems

More layers can be used if Area for routing is not adequate in top and bottom layers

Multiple VCC levels are used

Layers 1 & 2

Layers 3 & 4

Core

Solder mask

Solder mask

#65/42 Mikko Kohvakka - Nov 2009

Vias

Vias connect signals between different layers

by copper plated holes

Through-hole vias are common and “cheap”

Partial vias and blind vias are possible, but

typically increase expenses

Vias connect supply power to routing layers

IC

capacitor

Vias to vcc and

gnd layers

Incorrect way to connect

supply power to IC

IC

capacitor

Vias to vcc and

gnd layers

Correct way to connect

supply power to IC

#66/42 Mikko Kohvakka - Nov 2009

Layout Design Example

Minimize wire length between

decoupling capacitor and IC Use wide wires for

supply voltage and

ground Minimize the length of critical

wires, e.g. crystal wires

Vias to ground (brown) / supply voltage (pink)

layers close to decoupling capacitor

crystal

radio

#67/42 Mikko Kohvakka - Nov 2009

Layout (4–layer design example)

1st layer (routing) 2nd layer (supply voltage) 3rd layer (ground) 4th layer (routing)

Cut prevents

heat flow into

temperature

sensor

#68/42 Mikko Kohvakka - Nov 2009

PCB Verification

Design rules set minimum trace (wire) width and clearance between wires and component pads Automated design rule checking (DRC)

Defined according to manufacturing capabilities Typically minimum values are 0.10 mm

If possible, use 0.15 mm – 0.20 mm values More manufacturers available

Cheaper

For Self-made PCBs

use e.g. ≥0.5 mm

#69/42 Mikko Kohvakka - Nov 2009

PCB Verification

Clearance error

#70/42 Mikko Kohvakka - Nov 2009

PCB Manufacturing (DIY)

1. Print copper layers in transparent slides by a laser printer

2. Buy PCB material (FR4) with UV-sensible lacquer

3. Expose PCB material through the slide in UV light

4. Dissolve exposed areas of lacquer in NaOH + water

5. Etch copper areas not having lacquer in Ferric Chloride acid

1. Layout on a slide

4. Dissolving lacquer 3. UV exposure

#71/42 Mikko Kohvakka - Nov 2009

PCB Manufacturing (Industrial)

Perform panelization Duplicate multiple boards into one PCB panel

Reduces unit price in assembly

Required files by PCB manufacturer: Gerbers

A separate file for each copper layer, silkscreens, solder masks, paste masks, drills and board outline

PCB specification Specification of PCB material, board and copper thickness, used layers, min. copper

trace width, min. clearance, tolerances etc.

Required files by component assembler Part list

Specification of each component

x-y file (assembly file) Accurate position and rotation of each component

(Gerbers)

PCBs and components can be delivered

directly to the assembler company

#72/42 Mikko Kohvakka - Nov 2009

Examples of Gerber Files

Standard file format for PCB manufacturing Each layer has own file (like a photo plot)

10 paneled PCBs

Gerber viewer program shows certain layers.

Designer can check their relative placement.

Gerber

file

#73/42 Mikko Kohvakka - Nov 2009

Some Typical Prices for PCBs

PCB panels Non-Recurring Engineering (NRE) costs ~ 250 – 500 €

In addition, price per PCB ~ 0.20– 1.00 €

Assembly NRE costs around 1000 €

Include stencils and assembly line programming

Manual assembly without NRE

Typical assembly price per PCB 0.50 – 20 € in automatic assembly

20 – 100 € in manual assembly

Typical component prices Passives (resistors, capacitors) : 0.005 – 0.10 €

ICs: 0.10 – 10 €

Crystals: 0.20 – 2 €

PCB material e.g. 7 € per 100*160mm2 (for DIY)

#74/42 Mikko Kohvakka - Nov 2009

PCB Price Optimization

Compare component prices and lead times

Minimize the number of different components Reduces assembly and component costs

Define the needed tolerances Do not select 1% resistors, if 5% is adequate

Use only SMD components surface-mounted devices are cheaper to assemble

Minimize board area (and needed wiring layers) Reduces PCB cost

Define the needed PCB manufacturing accuracy Higher clearance, trace width reduces PCB cost

If possible, use only one side of PCB for components Reduces assembly cost

#75/42 Mikko Kohvakka - Nov 2009

Testing the First PCB

1. Connect supply voltage from adjustable power source

Set current limit!

Set voltage according to specified supply voltage

Measure output voltage of regulators by a multi-meter

Measure the current consumption by a multi-meter

2. If current is much higher than specified in component

data sheets

Check if some component warms up

Check schematic and component assembly

3. Test code

Test each component separately

Use LEDs and/or RS-232 for diagnostics

Use oscilloscope and logic analyzer for testing and debugging

Mikko Kohvakka - Nov 2009

EMC Issues

#77/42 Mikko Kohvakka - Nov 2009

ElectroMagnetic Compatibility

EMC = ElectroMagnetic Compatibility

Conformity with EMC regulations is required for CE mark Guarantees that products operate correctly near to each other

EMC studies two kinds of issues: 1. Emission: unwanted generation of electromagnetic interferences

2. Immunity: correct operation in the presence of electromagnetic interferences

In addition, Electrostatic Discharge (ESD) issues are typically included in EMC Ability of withstand short-duration pulses of high voltage and high

current levels

The best-known symbol, above, was

made in order to show that the device is

sensitive to ESD and you should not touch

it. The triangle itself tells people to take

caution of whatever it is, it is essentially a

universal symbol. The hand with the slash

through it clearly means, "do not touch".

#78/42 Mikko Kohvakka - Nov 2009

Emissions: radiated

Caused by high current loops

Use decoupling capacitors near to

ICs

Minimize the area of loops

Minimize the rise time of I/O signals

Reduces the current peaks

Use ferrite beads or inductors

Reduces the rise time of currents

Ferrite beads better for EMC, since

they do not have a resonant

frequency

Caused by unshielded inductors

For switch-mode regulators, use

always shielded inductors!

Inductor or

ferrite bead

Yes

No

#79/42 Mikko Kohvakka - Nov 2009

Emissions: conducted

Caused by

Galvanic connections between systems

Common impedances, e.g. common grounding

Basically, all external connections must be protected against conducted emissions

Serial ports, data busses, etc.

Protection methods:

Common-mode chokes

Only differential-mode currents through the choke

Ferrite cores (e.g. in USB cables)

Common-mode

choke

External power

connection

Ferrite bead Zener

#80/42 Mikko Kohvakka - Nov 2009

Conducted Emissions by Common Grounding

Ground plane may cause problems with conducted emissions High current circuits may interfere sensitive low current circuits

Problem reduced by slotting the plane Design different ground current paths for high current and noisy circuits and

low current and sensitive circuits

Still, minimize current loops

High

current

circuit

Low

current

circuit

GND

Common

ground

impedance

Current

Ground

voltage

Interferences

in ground

voltage

High current and

noisy path

Common and

stable ground point Low current path

Supply

voltage

VCC

#81/42 Mikko Kohvakka - Nov 2009

Immunity for Interferences

A product must be able to operate correctly in the presence of electromagnetic field E.g. near a mobile phone or microwave oven

The design guidelines for eliminating emissions apply also for immunity Loops etc. act as antennas and induce current to the

PCB

Effects are reduced by ground planes Fill unused PCB area with copper connected to

ground

Use ground between critical signals

System packaging prevents radiated emissions Metal cage, minimal holes, safety ground

#82/42 Mikko Kohvakka - Nov 2009

Tolerance Against ESD

Devices must tolerate short peaks of high voltages

E.g. wool clothes easily generate up to thousands of voltages

The maximum voltage of ICs is typically < 10V

Design must have ESD protection

Diode clamping

Zener diodes

Special ESD protection ICs

Shielding and grounding

VCC (supply voltage)

Protected

signal

Protected

signal

Diode clamping

Zener diode

#83/42 Mikko Kohvakka - Nov 2009

PCB Design Example for ESD Immunity

Surround all copper layers with ground

Vias at the edges of PCB to connect the “rings” together

Zeners for each external signal

-> ESD discharges always to ground

Supply voltage layer Ground layer

Ground ring Vias (x) connecting the

grounds together

Ground “floods” over routing layer

Top layer

#84/42 Mikko Kohvakka - Nov 2009

Conclusion

More information available from

Internet

http://www.alternatezone.com/electronics/pcbdesign.htm

Courses at TUT

PCB manufacturers

Component assemblers

#85/42

CONCLUSIVE QUICK GUIDE

TO A HOBBYIST

By Teemu Laukkarinen (this is the core understanding of HW in this

course)

#86/42

Very quick guide for MCU hobbyist (1)

MCU requires stable power supply, and a crystal for

clock (typically), (and some sensors and actuators)

Stable power typically requires a regulator

Couple different types: linear and switching most common

Linear produce very stable line and cause no harmful EM

emissions, but consume power / have higher heat

dissipation / ”bad” efficiency

Switching cause rippling line and high frequency EM

emission, better efficiency and cooler

Crystals / oscillators

Put very close to the IC, typically need some capacitors

and resistors in addition, see the IC’s data sheet

are sensitive to temperature, unless protected

#87/42

Very quick guide for MCU hobbyist (2)

MCUs cannot drive high currents

E.g. PIC18F8722 can drive 25mA with any I/O pin, but

at maximum it can drive only a sum of 200mA at the

same time

10 pins driving maximum current would toast it

Use transistors, relays etc. to drive high currents

Data sheets generally do have very good

example HW designs

Be a monkey and copy it, if you do not know what you

are doing

#88/42

Very quick guide for MCU hobbyist (2)

Put series resistor before/after LEDs to limit

drawn current

Consider also the bias voltage and maximum voltage

for the LED

Use (RC) filter on a switch for debounce, it’s

easier than using SW filteration with

enabling/disabling interrupts

Use (weak) pull-up resistors on switching lines

They keep the line as ’1’ and prevent it from floating

between ’0’ and ’1’

When line is 0, they consume energy…

#89/42

Debounce and pull-up examples

Vdd = 5V

Rpullup

= 10k

CRC

= 100n

switch

MCU input in hi-

impedance state

RRC = 100k

Vdd = 5V

switch

MCU sees ’1’, no

current flow

MCU sees ’0’

Current flow

(energy

consumed in

resistors

MCU input in hi-

impedance state

NOTE: this example

may toast your

MCU if the input is

accidently changed

to output and set ’1’

switch

MCU input in hi-

impedance state

Vdd = 5V

NOTE: RRC must be select so that voltage over it is

under the level of ’0’ logic state

In PIC18F8722, ’0’ is max 0.2 * Vdd == 1 V

With voltage division, using 100K pullup and 0.8V limit,

we get 20K for RRC

With 400nF we get ~20 Hz low pass filter

PRO TIP: Use online calculators!!

(20k @ 5V equals 25mA current, if the MCU input is

changed to output ’1’ by accident... For even more safety,

use higher resistors and calculate new capacitanse)

Rpullup

= 100k RRC = 20k

CRC

= 400n

Safer for the MCU

NOTE: this does

not actually filter in

’1’ -> ’0’ direction

very well, very bad

example!

#90/42

Very quick guide for MCU hobbyist (4)

PCB design:

Hobbyist are limited to 1 or 2 sided PCB

There’s no real harm of using 2 sided and connecting the useless side to the

ground, might save you from some EMC problems

Put capacitors close to the IC voltage input

see amount from the data sheet: small C fast (but not powerful), high C slow

(but powerful)

Put crystals close to the IC

See data sheet

Use as wide wires/tracks as possible on PCB, if high current is conducted

in them

Fast parallel bus? Try to put GND line between each parallel line to avoid

overhearing

Analog side? (e.g. audio applications), keep analog and digital GND plane

separate/as far apart as possible

However, common GND possible

#91/42

Very quick guide for MCU hobbyist (5)

Soldering

Beware of cold solders, heat pads and legs

The tin should molt with touch to the to-be-connected

surfaces, not to the tip of the solder

Beware of overheating (IC) components

For example conduct heat to pincers

Rest is practice, practice, practice

http://www.youtube.com/watch?v=exOxUAntx8I

Internet is full of great (and bad) tips for how to solder,

e.g. surface mounted ICs

Do a mess and solder everything together, then use

”tinaimusukka” to remove excess tin

Use flux (juoksute) on pins, it will make soldering easier