Thermofluid Control of a Microscale Cell Culture Platform Project Report Team Members: Naomi Alandt,...
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Thermofluid Control of a Microscale Cell Culture Platform Project Report Team Members: Naomi Alandt, Paul Andrews, Jeremiah Zimmerman Industry Advisor: Sean S. Kohles PhD Academic Advisor: Derek C. Tretheway PhD
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Transcript of Thermofluid Control of a Microscale Cell Culture Platform Project Report Team Members: Naomi Alandt,...
Thermofluid Control of a Microscale Cell Culture Platform
Project Report
Team Members: Naomi Alandt, Paul Andrews, Jeremiah Zimmerman
Industry Advisor: Sean S. Kohles PhD
Academic Advisor: Derek C. Tretheway PhD
-μPIV: micron Resolution Particle Image VelocimetryMeasurement of fluid flow and flow induced stresses
-OT: Optical TweezersCapture, suspend, and manipulate single cells
The μPIVOT
Background Analysis Final Design Manufacturing
•50µm X 500 µm channel to heat to 37°C
•Biologically compatible
•Cell temperature extremities (4°C < T < 54°C)
•Flow path unobstructed and full range of flowrates
•Compatibility with Various Chip Designs
Schematic of the OT laser with flow though the PDMS
Background Analysis Final Design Manufacturing
Thermal Modeling AnalysisComputational Fluid Dynamics (CFD) and Finite Element Analysis (FEA)
Background Analysis Final Design Manufacturing
•Constant Surface Temperature •Counter Flow Heat Exchanger•Peltier Junctions•Resistive Wire Heating
Thermal Modeling AnalysisComputation Fluid Dynamics (CFD) and Finite Element Analysis (FEA)
Background Analysis Final Design Manufacturing
←CFD model of microfluidic chip with constant inlet temperature
CFD model of constant glass surface temperature outside a 4mm diameter region of interest.
Thermal Modeling AnalysisComputation Fluid Dynamics (CFD) and Finite Element Analysis (FEA)
•0.5mm width of heat flux
•0.5mm wall spacing between heat source and channel
•514 W/m2 heat flux
•Max temperature 46.8°C (FEA) validates Mathematical at 47.7°C
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Resistive Heating Analysis
Expected ΔT Graphs Material Selection
Background Analysis Final Design Manufacturing
Dimensional Optimization
Thickness (μm)
Width (mm)
Current (mA)
ΔT (oC)
10 0.5 185 0.182
5 0.5 125 0.272
2 0.5 80 0.419
1 0.5 57 0.601
0.2 0.5 26 1.347
0.2 1 51 0.676
0.2 1.5 75 0.446
0.2 2 103 0.334
Background Analysis Final Design Manufacturing
Temperature Monitoring and Control
Front Back
Background Analysis Final Design Manufacturing
Electrical Circuit Schematic
LabView->DAQ-> Thermocouple->Electrical Circuit
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Conclusions
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Mask
Background Analysis Final Design Manufacturing
Background Analysis Final Design Manufacturing
Questions?
