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  • TPS737xx

    GNDEN FB

    IN OUTVIN VOUT

    Optional

    1.0 Fm

    OFFON

    Product

    Folder

    Sample &Buy

    Technical

    Documents

    Tools &

    Software

    Support &Community

    TPS737SBVS067Q JANUARY 2006REVISED MAY 2015

    TPS737xx 1-A Low-Dropout Regulator With Reverse Current Protection1 Features 3 Description

    The TPS737xx family of linear low-dropout (LDO)1 Stable With 1-F or Larger Ceramic Output

    voltage regulators uses an NMOS pass element in aCapacitorvoltage-follower configuration. This topology is

    Input Voltage Range: 2.2 V to 5.5 V relatively insensitive to output capacitor value and Ultralow Dropout Voltage: 130 mV Typical at 1 A ESR, allowing a wide variety of load configurations.

    Load transient response is excellent, even with a Excellent Load Transient ResponseEven Withsmall 1-F ceramic output capacitor. The NMOSOnly 1-F Output Capacitortopology also allows very low dropout.

    NMOS Topology Delivers Low Reverse LeakageThe TPS737xx family uses an advanced BiCMOSCurrentprocess to yield high precision while delivering very 1% Initial Accuracy low dropout voltages and low ground pin current.

    3% Overall Accuracy Over Line, Load, and Current consumption, when not enabled, is less thanTemperature 20 nA and ideal for portable applications. These

    devices are protected by thermal shutdown and Less Than 20 nA Typical IQ in Shutdown Modefoldback current limit. Thermal Shutdown and Current Limit for Fault

    Protection For applications that require higher output voltageaccuracy, consider TI's TPS7A37xx family of 1% Available in Multiple Output Voltage Versionsoverall accuracy, 1-A low-dropout voltage regulators. Adjustable Output: 1.20 V to 5.5 V

    Custom Outputs Available Using Factory Device Information(1)Package-Level Programming PART NUMBER PACKAGE BODY SIZE (NOM)

    VSON (8) 3.00 mm 3.00 mm2 Applications TPS737xx SOT-223 (6) 6.50 mm 3.50 mm Point-of-Load Regulation for DSPs, FPGAs, WSON (6) 2.00 mm 2.00 mm

    ASICs, and Microprocessors(1) For all available packages, see the orderable addendum at

    Post-Regulation for Switching Supplies the end of the data sheet. Portable and Battery-Powered Equipment

    space

    Typical Application Circuit

    1

    An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,intellectual property matters and other important disclaimers. PRODUCTION DATA.

    http://www.ti.com/product/TPS737?dcmp=dsproject&hqs=pfhttp://www.ti.com/product/TPS737?dcmp=dsproject&hqs=sandbuysamplebuyhttp://www.ti.com/product/TPS737?dcmp=dsproject&hqs=tddoctype2http://www.ti.com/product/TPS737?dcmp=dsproject&hqs=swdesKithttp://www.ti.com/product/TPS737?dcmp=dsproject&hqs=supportcommunityhttp://www.ti.com/product/tps737?qgpn=tps737http://www.ti.com/product/tps7a3721

  • TPS737SBVS067Q JANUARY 2006REVISED MAY 2015 www.ti.com

    Table of Contents8.1 Application Information............................................ 161 Features .................................................................. 18.2 Typical Applications ................................................ 162 Applications ........................................................... 18.3 Do's and Don'ts....................................................... 183 Description ............................................................. 1

    9 Power Supply Recommendations ...................... 184 Revision History..................................................... 210 Layout................................................................... 195 Pin Configuration and Functions ......................... 4

    10.1 Layout Guidelines ................................................. 196 Specifications......................................................... 510.2 Layout Example .................................................... 196.1 Absolute Maximum Ratings ...................................... 510.3 Power Dissipation ................................................. 196.2 ESD Ratings ............................................................ 510.4 Thermal Protection................................................ 206.3 Recommended Operating Conditions....................... 510.5 Estimating Junction Temperature ........................ 206.4 Thermal Information .................................................. 6

    11 Device and Documentation Support ................. 226.5 Electrical Characteristics........................................... 711.1 Device Support...................................................... 226.6 Typical Characteristics .............................................. 811.2 Documentation Support ....................................... 227 Detailed Description ............................................ 1311.3 Community Resources.......................................... 227.1 Overview ................................................................. 1311.4 Trademarks ........................................................... 227.2 Functional Block Diagrams ..................................... 1311.5 Electrostatic Discharge Caution............................ 227.3 Feature Description................................................. 1411.6 Glossary ................................................................ 237.4 Device Functional Modes........................................ 15

    12 Mechanical, Packaging, and Orderable8 Application and Implementation ........................ 16 Information ........................................................... 23

    4 Revision HistoryNOTE: Page numbers for previous revisions may differ from page numbers in the current version.

    Changes from Revision P (July 2013) to Revision Q Page

    Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementationsection, Power Supply Recommendations section, Layout section, Device and Documentation Support section, andMechanical, Packaging, and Orderable Information section ................................................................................................. 1

    Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement ................... 5 Changed "free-air temperature" to "junction temperature" in Recommended Operating Conditions condition

    statement ............................................................................................................................................................................... 5 Changed Internal Reference parameter (VFB) typical values from 1.2 V to 1.204 V.............................................................. 7

    Changes from Revision O (June 2012) to Revision P Page

    Added last paragraph to Description section.......................................................................................................................... 1

    Changes from Revision N (June 2011) to Revision O Page

    Changed Thermal Information table data and footnote 2b..................................................................................................... 6 Changed VFB Internal reference parameter in Electrical Characteristics table....................................................................... 7 Changed title of Figure 6 ........................................................................................................................................................ 8

    Changes from Revision M (October, 2010) to Revision N Page

    Added footnote (3) to Thermal Information table.................................................................................................................... 7 Added footnote to Figure 39................................................................................................................................................. 21

    2 Submit Documentation Feedback Copyright 20062015, Texas Instruments Incorporated

    Product Folder Links: TPS737

    http://www.ti.com/product/tps737?qgpn=tps737http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SBVS067Q&partnum=TPS737http://www.ti.com/product/tps737?qgpn=tps737

  • TPS737www.ti.com SBVS067Q JANUARY 2006REVISED MAY 2015

    Changes from Revision L (August, 2010) to Revision M Page

    Corrected typo in Figure 39.................................................................................................................................................. 21

    Copyright 20062015, Texas Instruments Incorporated Submit Documentation Feedback 3

    Product Folder Links: TPS737

    http://www.ti.com/product/tps737?qgpn=tps737http://www.ti.comhttp://www.go-dsp.com/forms/techdoc/doc_feedback.htm?litnum=SBVS067Q&partnum=TPS737http://www.ti.com/product/tps737?qgpn=tps737

  • IN

    N/C

    EN

    6

    5

    4

    OUT

    NR/FB

    GND

    1

    2

    3

    1 2 3 4 5

    IN

    OUT

    GND

    NR/FB

    EN

    TAB IS GND6IN

    N/C

    N/C

    EN

    8

    7

    6

    5

    OUT

    N/C

    NR/FB

    GND

    1

    2

    3

    4

    TPS737SBVS067Q JANUARY 2006REVISED MAY 2015 www.ti.com

    5 Pin Configuration and Functions

    6-Pin SOT-223 8-Pin VSONDCQ Package DRB Package

    Top View Top View

    6-Pin WSONDRV Package(1)

    Top View

    (1)Power dissipation may limit operating range. Check Thermal Information table.

    Pin FunctionsPIN

    I/O DESCRIPTIONNAME SOT-223 WSON VSON

    IN 1 8 6 I Unregulated input supplyGND 3, 6 4, Pad 3, Pad Ground

    Driving the enable pin (EN) high turns on the regulator. Driving this pin lowputs the regulator into shutdown mode. Refer to the Enable Pin andEN 5 5 4 I Shutdown section