RT/duroid and TMM Microwave Laminatesf6csx.free.fr/techni/notes_d'application/rogers.pdf ·...

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RT/duroid ® and TMM ® Microwave Laminates Dielectric constant and tolerance 2.20±0.020 2.33±0.020 2.40 ±2.60 2.94±0.040 6.15±0.150 10.2±0.250 3.27 4.50 6.00 9.20 9.80 @10 GHz 0.040 ±0.030 ±0.045 ±0.080 ±0.230 ±0.245 Dissipation factor (Loss tangent) @10 GHz. Typ. 0.0009 0.0012 0.0019 0.0012 0.0019 0.0023 0.0020 0.0020 0.0023 0.0023 0.0020 Thermal coeff. of ε r 0° to100 °C ppm/ °C -125 -115 -100 +16 -410 -425 (4) +39 (4) -10 (4) -38 (4) -43 (Typical) Volume resistivity Mohm•cm 2x10 7 2x10 7 2x10 7 10 6 2x10 7 5x10 5 3x10 9 6x10 8 1x10 8 2x10 7 (Minimum) Surface resistivity Mohm 3x10 8 2x10 8 4x10 7 10 7 7x10 7 5x10 6 >9x10 9 1x10 9 1x10 9 4x10 7 (Minimum) X 156(1076) 189(1340) 1700(11,730) 120(828) 74(511) 135(932) (1) 1916 (1) 2000* (1) 2200 (1) 2400 (13,210) (13,790) (15,168) (16,547) Y 125(863) 185(1277) 1300(8970) 120(828) 91(628) 81(559) (1) 1916 (1) 2000* (1 ) 2200* (1) 2400 (Typical) (13,210) (13,790) (15,168) (16,547) Compressive modulus-Z axis 136 120 360* 155 311 742 752 736 575 Kpsi (MPa) (938) (828) (2482) (1070) (2146) (5116) (5185) (5075) (3964) (Typical) Moisture absorption 0.015 0.015 0.03 0.1 0.05 0.6 (2) 0.04 (2) 0.010 (2) 0.06 (2) 0.09 (2) 0.16 D23/24 % (LM 0.05) (Maximum) Thermal (5) conductivity 0.20 0.22 0.24 0.60 0.49 0.78 0.70 0.70 0.72 0.76 0.76 W/m/°K (Typical) X 31 22 15 16 47 24 16 14 16 16 16* Y 48 28 15 16 34 24 16 14 16 16 16* (Typical) Z 237 173 200 24 117 24 20 20 20 20 20* Specific gravity 2.2 2.2 2.2 2.1 2.7 2.9 1.78 2.07 2.37 2.77 2.77 (Typical) *estimated 1) Young's Modulus 2) Testing conditions: 50 C, 48 hours, 0.50" (12.7mm) thick samples 3) Values represent a linear approximation of CTE for the temperature ranges given, except for RT/duroid 6002 and TMM, which do have a linear behavior. 4) Tested by IPC-TM-650 method 2.5.5.5. 5) Tested by ASTM C518 10i TMM ® Temperature Stable Microwave Laminates 4 6 10 3 RT/duroid ® 6006 RT/duroid ® 6002 PROPERTY Tensile modulus Kpsi (MPa) RT/duroid ® 5880 (GR,GP) RT/duroid ® 5870 (GR,GP) ULTRALAM ® 2000 (GT,GX) RT/duroid ® 6010, 6010LM Coefficient (3) of thermal expansion 0°to 100°C ppm/°C

Transcript of RT/duroid and TMM Microwave Laminatesf6csx.free.fr/techni/notes_d'application/rogers.pdf ·...

RT/duroid ® and TMM ® Microwave Laminates

Dielectricconstant andtolerance 2.20±0.020 2.33±0.020 2.40±2.60 2.94±0.040 6.15±0.150 10.2±0.250 3.27 4.50 6.00 9.20 9.80@10 GHz 0.040 ±0.030 ±0.045 ±0.080 ±0.230 ±0.245

Dissipationfactor (Losstangent)@10 GHz. Typ. 0.0009 0.0012 0.0019 0.0012 0.0019 0.0023 0.0020 0.0020 0.0023 0.0023 0.0020

Thermalcoeff. of εεεεεr0° to100°Cppm/ °C -125 -115 -100 +16 -410 -425 (4)+39 — (4)-10 (4)-38 (4)-43(Typical)

VolumeresistivityMohm•cm 2x107 2x107 2x107 106 2x107 5x105 3x109 6x108 1x108 2x107 —(Minimum)

SurfaceresistivityMohm 3x108 2x108 4x107 107 7x107 5x106 >9x109 1x109 1x109 4x107 —(Minimum)

X 156(1076) 189(1340) 1700(11,730) 120(828) 74(511) 135(932) (1)1916 (1) 2000* (1)2200 (1)2400(13,210) (13,790) (15,168) (16,547)

Y 125(863) 185(1277) 1300(8970) 120(828) 91(628) 81(559) (1) 1916 (1)2000* (1 )2200* (1)2400 —(Typical) (13,210) (13,790) (15,168) (16,547)

Compressivemodulus-Z axis 136 120 — 360* 155 311 742 752 736 575 —Kpsi (MPa) (938) (828) (2482) (1070) (2146) (5116) (5185) (5075) (3964)(Typical)

Moistureabsorption 0.015 0.015 0.03 0.1 0.05 0.6 (2)0.04 (2)0.010 (2)0.06 (2)0.09 (2)0.16D23/24 % (LM 0.05)(Maximum)

Thermal (5)

conductivity 0.20 0.22 0.24 0.60 0.49 0.78 0.70 0.70 0.72 0.76 0.76W/m/°°°°°K(Typical)

X 31 22 15 16 47 24 16 14 16 16 16*

Y 48 28 15 16 34 24 16 14 16 16 16*

(Typical) Z 237 173 200 24 117 24 20 20 20 20 20*

Specificgravity 2.2 2.2 2.2 2.1 2.7 2.9 1.78 2.07 2.37 2.77 2.77(Typical)

*estimated1) Young's Modulus2) Testing conditions: 50 C, 48 hours, 0.50" (12.7mm) thick samples3) Values represent a linear approximation of CTE for the temperature ranges given, except for RT/duroid 6002 and TMM, which do have a linear behavior.4) Tested by IPC-TM-650 method 2.5.5.5.5) Tested by ASTM C518

10i

TMM®

Temperature Stable Microwave Laminates

4 6 103

RT/d

uroi

6006

RT/

duro

id®

6002

PROPERTY

TensilemodulusKpsi(MPa)

RT/du

roid

®

5880

(GR,G

P)RT

/dur

oid

®

5870

(GR,G

P)U

LTR

ALAM

®20

00(G

T,G

X)

RT/

duro

id®

6010

, 60

10LM

Coefficient (3)

of thermalexpansion0°to 100°Cppm/°°°°°C

a) References: Internal T.R.'s 1430, 2224, 2854. Tests at 23°C unless otherwise noted. Typical value should not be used for specifi-cation limits.

b) The nominal dielectric constant of an 0.060" thick RO3003 laminate as measured by the IPC-TM-650, 2.5.5.5 will be 3.02, due tothe elimination of biasing caused by air gaps in the test fixture. For further information refer to Rogers T.R. 5242.

RO3000™/ RO4000® Series High Frequency Laminates

RT/duroid, DUROID, TMM, and ULTRALAM are registered trademarks RO3003, RO3006, RO3010, RO4003, and RO4350 are trademarks of Rogers Corporation for their microwave laminates.

The information and guidelines contained in this document are intended to assist you in designing with RT/duroid, TMM, ULTRALAM, RO3003, RO3006, RO3010, RO4003 and RO4350 laminates. Theyare not intended to and do not create any warranties, express or implied including any warranty of merchantability or fitness for a particular application. Failure to follow these guidelines may negate anywarranties that may otherwise exist. Results may vary as conditions and equipment may vary. The user should determine the suitability of Rogers materials for each specific application.

These products may require a validated export license issued by the U.S. Department of Commerce for export of these materials from the United States or Canada.

Dielectricconstant and tolerance 3.0 ± 0.04(b) 6.15± 0.15 10.2 ± 0.30 3.38± 0.05 3.48± 0.05

@10 GHz

Dissipation Factor (Loss tangent) 0.0013 0.0025 0.0035 0.0022 .004@ 10 GHz

Thermal coefficient of εεεεεr 13 -160 -280 +40 +50ppm/°°°°°C

Volume resistivity 106 103 103 1.7 x 1010 1.2 x1010

(Mohm•cm)

Surface resistivity 107 103 103 4.2 x 109 5.7 x 109

(Mohm)

Tensile modulusKpsi (MPa) X-Axis 300 (2068) 300 (2068) 300 (2068) 3700 (25,510) Y-Axis 300 (2068) 300 (2068) 300 (2068) 3900 (26,889) 1664 (11,473)

Moisture absorptionD23/4 (%) <0.1 <0.1 <0.1 0.06 0.06

Copper peel strength 1.05 1.05 1.05 0.88 1.05KN/m (lbs/in) (6) (6) (6) (5) (6)

Thermal conductivity (6) 0.50 0.61 0.66 0.64 0.62(W/m/°°°°°K)

Coefficient of thermalexpansion0°°°°° to 100°°°°°C X-Axis 17 17 17 11 14(ppm/ ° ° ° ° °C) Y-Axis 17 17 17 14 16 Z-Axis 24 24 24 46 50

Specific gravity 2.1 2.6 3.0 1.8 1.9

Flammability rating, UL94V-0 Yes Yes Yes No Yes

PROPERTY(Typical)

RO40

03®

RO30

06TM

RO

3010

TM

RO

3003

TM

RO43

50®

Aluminum 6061 70 Poor 20 2.7 180 24 5(1.8) (138)

Brass 70/30 70 Good 45 8.5 120 20 6cartridge (1.8) (311)

Copper 110 70 Fair to Poor 35 8.9 390 17 2(1.8) (242)

Cladding Metals

Volu

me

Res

istiv

ityM

icro

hm•c

m

PLATES Allo

y

Surfa

ceR

ough

ness

µµµµµin

( µµµµµm

)

Mac

hina

bilit

y

Tens

ile S

treng

th

Kpsi

(MPa

)

Spec

ific

Gra

vity

Ther

mal

Con

duct

ivity

W/m

/°KC

oeffi

cien

t of

Ther

mal

Expa

nsio

npp

m/°C R

esis

tivity

mic

rohm

•cm

1/4 oz (9 µm) 70 15 — — 1.87 Fair 0.4 11ED (1.8) (0.4) (1.93)

1/2 oz (17.5 µm) 75 15 33.0 20.0 1.82 Fair 0.7 12ED (1.9) (0.4) (228) (2.10)

1 oz (35 µm) 95 15 30.0 28.0 1.78 Fair 1.4 16ED (2.4) (0.4) (207) (2.80)

2 oz (70 µm) 115 15 32.0 42.0 1.78 Fair 2.8 18ED (2.9) (0.4) (221) (3.15)

1/2 oz (17.5 µm) 55 12 20.0 8.0 1.78 Excellent 0.7 9Rolled (1.4) (0.3) (138) (1.58)

1 oz (35 µm) 55 12 22.0 13.0 1.74 Excellent 1.4 10Rolled (1.4) (0.3) (152) (1.75)

2 oz (70 µm) 55 12 28.0 27.0 1.74 Excellent 2.8 11Rolled (1.4) (0.3) (193) (1.93)

COPPERFOILS

Surface Roughnessµµµµµin (µµµµµm)

TreatedSide

UntreatedSide

Elon

gatio

n%Te

nsile

Stre

ngth

Kpsi

(M

Pa)

Stre

ssC

rack

Res

ista

nce

Thic

knes

sm

il

Peel

Stre

ngth

RT/

duro

id®

5000

Ser

ies

lbs/

in (

KN/m

)

ORDERING INFORMATION

Rogers circuit laminates can be purchased by contacting your customer servicerepresentative at (602) 961-1382 or one of our overseas offices listed below.

To ensure you receive the right material for your application, please include orderinformation for each of the categories listed below. For more detailed productinformation, refer to the charts in this product selector guide.

GRADE: TMM 3,4,6,10, and 10i Ceramic Thermoset Polymer Composite Circuit BoardMaterials, RT/duroid 5870 and 5880 Glass Microfiber ReinforcedPolytetrafluoroethylene Composite Materials, ULTRALAM 2000 Woven GlassReinforced Polytetrafluoroethylene Material, RT/duroid 6002Polytetrafluoroethylene Composite Material, RT/duroid 6006, 6010 and 6010LMCeramic Polytetrafluoroethylene Composite Materials. RO3003, RO3006,RO3010, RO4003 and RO4350 High Frequency Circuit Materials.

THICKNESS ANDTOLERANCE: Dielectric is the thickness without copper. Refer to the price list(s) for standard

thicknesses and tolerances. Custom thicknesses and tolerances are available onRT/duroid laminates and TMM laminates upon request.

TYPE OF FOIL ANDCLADDING: RT/duroid, laminates - ¼, ½, 1, and 2 ounce electrodeposited copper,

½, 1, and 2 ounce rolled copper or unclad.ULTRALAM, - ½, 1, and 2 ounce electrodeposited copper,

½, 1, and 2 ounce rolled copper.TMM laminates - ¼, ½, 1, and 2 ounce electrodeposited copper

foil two sides. TMM may also be supplied unclad.*RO3003, RO3006,RO3010 laminates - ½ and 1, 2 ounce electrodeposited copper two sides.

*RO4003 laminates - ½ and 1 ounce electrodeposited copper two sides.*RO4350 laminates - 1 ounce electrodeposited copper two sides.

Thick aluminum, copper and brass claddings are also available ina range of thicknesses and thickness tolerances. Other thick metal backingsare available upon request.*Thick metal backing is not available on RO3000 series and RO4000 laminates.

PANEL SIZE: See price list for standard panel sizes. Custom panel sizes are available uponrequest.

SPECIFICATIONREQUIREMENTS: Standard specifications are Rogers material specification, or

MIL-S-13949H for qualified products. Certificates of conformance are available.

All other specification requirements must be identified at the time the order isplaced. If special testing or data generation is required, additional costs may beincurred.

Rogers CorporationMicrowave and Circuit Materials Division,100 S. Roosevelt Avenue, Chandler, AZ 85226-3415602-961-1382FAX: 602-961-4533 Website: http://www.rogers-corp.com

ISO 9002 CERTIFIED

In Japan:Rogers Japan Inc.7th Floor, ST Bldg.2-26-9 Nishi-nipporiArakawa-kuTokyo 116 Japan03 3807 6430FAX: 03 3807 6319

In Hong Kong:Rogers Southeast Asia21st Floor, 2102 Yat ChauInternational Plaza118 Connaught Road WestSheung Wan, Hong Kong852-1549-7806FAX: 852-2549-8615

In Europe:Rogers N.V.Afikalaan 188B-9000 GentBelgium32-9-2353611FAX: 32-9-2353658

© 1996 Rogers Corporation Printed in U.S.A. Revised 12/96 9255-1096-10.0ON