PCB PCB Fabrication Design Rule Manual (DRM)cis/PCB/doc/DRM_PCB.pdf · Ver.5.0 40 2017/12 5. Board...
Transcript of PCB PCB Fabrication Design Rule Manual (DRM)cis/PCB/doc/DRM_PCB.pdf · Ver.5.0 40 2017/12 5. Board...
Ver.5.0 0 2017/12
PCB
PCB Fabrication Design Rule Manual (DRM)
Ver.5.0 1 2017/12
1.0 2013.06.20
1.1 2013.08.01
A. 2.1-1 2.1-1
B. 2.2-1 2.2-1
C. 2.3-1 2.3-1
1.2 2013.09.03
A. 2.1-1
B. 2.2-1
C. 2.3-1
D. 4.5 PCB PCB
2.0 2013.10.04
A. 3-2 δ Loss tangent 0.021 0.0021
0.027 0.0027
B. Mechanical 1 Keepout (KO)
Mechanical 2 Mechanical 1(ME)
C.
D.
E. A PCB Altium
3.0 2013.12.05
A. 4.1.2 4.1.3
B. A PCB Altium
PCB
Altium
C. 4.3.1
D. 4.4
E. 4.5.2 - _
F. 4.6.1 NPTH
KO.H.2 NPTH
3.1 2014.02.11
A. 4.1.2 4.2.2
=0.22mm FR4 =0.22mm RO
=0.17mm
3.2 2014.06.12
A. 4.6.1 (b)
B. 4.6.2 ME1
Ver.5.0 2 2017/12
KO 1.5 mm
C. 4.6.2 PCB
4.0 2015.03.20
A.
B. RO4003 RO4003C
C. Mechanical 1 Mechanical
D. Au Ni/Au
4.1 2016.03.15 A. 2.4 RO4003C 0.73 mm
0.81 mm
5.0 2017.12.19
A. FR4
B. RO-FR4
C. 4.1.2 4.2.2
(FR4) = 0.22mm 0.18 mm
D. 4.1.2 4.5.1 = 2.0
mm 0.15 mm
Ver.5.0 3 2017/12
1. .............................................................................................................. 1
2. PCB ................................................................................................ 2
2.1 FR4 ............................................................................................... 3
2.2 FR4 ............................................................................................... 5
2.3 RO4003C .............................................................................. 7
2.4 RO-FR4 ................................................................................ 9
2.5 PCB ........................................................................................ 11
3. .................................................................................................... 13
3.1 .................................................................................................. 13
3.2 ...................................................................................................... 15
4. PCB ...................................................................................... 17
4.1 .................................................... 17
4.1.1 .................................................................. 17
4.1.2 .............................................................................. 18
4.1.3 ...................................................................... 20
4.2 ....................................................................................................... 22
4.2.1 ........................................................................ 22
4.2.2 ............................................................................ 23
Ver.5.0 4 2017/12
4.3. .......................................................................................... 24
4.3.1 (PTH) ............................................ 24
4.3.2 (NPTH) ................................................... 26
4.3.3 (PTH NPTH) .......................................... 27
4.4 .................................................................................................. 28
4.4.1 ........................................................................ 28
4.4.2 ........................................................................ 30
4.5 .................................................................................................. 32
4.5.1 ......................................................................... 32
4.5.2 PCB ....................................................................... 34
4.6 ............................................................................................ 35
4.6.1 KO .............................................. 35
4.6.2 ME .............................................................. 37
5. ............................................................................................. 40
6. .................................................................................................... 41
Ver.5.0 1 2017/12
1.
(NARLabs CIC) FR4
FR4 RO4003C RO4003C-FR4 PCB
PCB (Stacking)
(Layout Design Rules)
PCB 6
Ver.5.0 2 2017/12
2. PCB
FR4 RO4003C
(Cu) 1oz (0.035 mm)
PTH
Plating through Hole 0.2 mm
NPTH
non- Plating through Hole PTH
Solder Pad
( ENIG Ni/Au
)
PCB
2-1
Ver.5.0 3 2017/12
2.1 FR4
2.1-1 FR4 ( )
Ver.5.0 4 2017/12
( mm)
0.017
0.025
_Top 0.035 1 oz
FR4 1.430
_Bottom 0.035 1 oz
0.025
0.017
1.550
_ 10%
2.1-1FR4
Ver.5.0 5 2017/12
2.2 FR4
2.2-1 FR4 ( )
Ver.5.0 6 2017/12
( mm)
0.017
0.025
_Top 0.035 1 oz
FR4 PP 0.200
_Inner_1 0.035 1 oz
FR4 1.030
_Inner_2 0.035 1 oz
FR4 PP 0.200
_Bottom 0.035 1 oz
0.025
0.017
1.620
_ 10%
2.2-1 FR4
Ver.5.0 7 2017/12
2.3 RO4003C
2.3-1 RO4003C ( )
Ver.5.0 8 2017/12
( mm)
0.017
0.025
_Top 0.035 1 oz
RO 0.810
_Bottom 0.035 1 oz
0.025
0.017
0.930
_ 10%
2.3-1 RO4003C
Ver.5.0 9 2017/12
2.4 RO-FR4
2.4-1 RO-FR4 ( )
Ver.5.0 10 2017/12
( mm)
0.017
0.025
_Top 0.035 1 oz
RO core 0.203
_Inner_1 0.017 ½ oz
FR4 PP 0.203
_Inner_2 0.017 ½ oz
FR4 core 0.203
_Bottom 0.035 1 oz
0.025
0.017
0.763
_ 0.1
2.4-1 RO-FR4
Ver.5.0 11 2017/12
2.5 PCB
Top
L1 L2 Bottom
CIC DRC
CIC
DRC
DRC
Top Top
MT
Inner_1 ( ) L1
Inner_2 ( ) L2
Bottom Bottom
Solder_top _top
SO
Solder_bottom _bottom
Silkscreen_top _top
SK
Silkscreen _bottom _bottom
Nc_drill DR
KeepOut
*
KO
Ver.5.0 12 2017/12
Mechanical # ME
2.5-1 PCB
* PCB
# PCB
Ver.5.0 13 2017/12
3.
@*
3.1
FR4
FR4 FR4 PP
4.4 4.4 3.63
_ ±10% ±10% ±10%
δ Loss tangent@ 0.017 0.017 0.0266
(Tg*)
140 140 -
Tg_ +15% +15% -
3.1-1 FR4
@ loss tangent: =DF (Dissipation factor),
http://en.wikipedia.org/wiki/Fr4 ,
http://en.wikipedia.org/wiki/Dissipation_factor
*Tg: glass transition temperature, or glass temperature < Tm (melting T)
(http://en.wikipedia.org/wiki/Glass_transition_temperature )
*RO-FR4 FR4 Tg=180
Ver.5.0 14 2017/12
RO4003C #
RO4003C RO4003C PP
3.55 3.55 3.63
_ ±10% ±10% ±10%
δ Loss tangent
@2.5GHz/23 0.0021 0.0021 0.0266
δ Loss tangent
@10GHz/23 0.0027 0.0027 -
(Tg)
280 280 -
Tg_ +15% +15%
3.1-2 RO4003C
# RO4003C
http://www.rogerscorp.com/acm/products/54/RO4003C-Laminates.aspx
Ver.5.0 15 2017/12
3.2
(Metal Layer Properties)
Top L1
L2 Bottom
- Cu
mm 0.035
σ (at 20 )# S m-1 5.96x107
ρ (at 20 )# Ω m 1.68x10-8
3.2-1
# http://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivity
PTH (Plating Through Hole Properties)
- Cu
mm 0.025
σ (at 20 ) # S m-1 5.96x107
ρ (at 20 ) # Ω m 1.68x10-8
3.2-2 PTH
# http://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivity
Ver.5.0 16 2017/12
-
μm 3
σ (at 20 ) # S m-1 1.43×107
ρ (at 20 ) # Ω m 6.99×10−8
3.2-3
-
μm 0.025~0.05
σ (at 20 ) # S m-1 4.10×107
ρ (at 20 ) # Ω m 2.44×10−8
3.2-4
# http://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivity
Ver.5.0 17 2017/12
4. PCB
4.1
4.1.1
L1. L2. R. N
(A) (B) (C) (D)
(A) L1 (Original Layer)
(B) L2 (Destination Layer (if any))
(C) R
L Length
W Width
S Spacing
E Enclosure
4.1.1-1
(D) N
Ver.5.0 18 2017/12
4.1.2
(mm)
Must /
Optional
1 MT.W.1 MW 0.12 M
2 MT.S.1 MS 0.12 M
3 MT.KO.E.1 MB 0.40 M
4 MT.S.2 MC
(FR4) 0.18 M
(RO) 0.17 M
5 MT.KO.E.1 CB 0.40 M
(PTH)
6 DR.W.1 D1 0.20 M
7 DR.W.2 D1 6.00 M
8 DR.DR.S.1 D4 0.30 M
9 DR.MT.S.1 D5 0.30 M
10 DR.KO.E.1 D6 0.50 M
11 MT.W.2 D2
0.12 M
12 MT.SO.E.1 D3 0.12 O
(NPTH)
13 DR.W.3 N1 NPTH 0.50 M
14 DR.W.4 N1 NPTH 6.00 M
15 DR.DR.S.2 N2 NPTH 0.30 M
16 DR.RU.S.2 N3 NPTH 0.50 M
17 DR.SO.E.2 N4 NPTH
0.12 O
(PTH
NPTH)
18 DR.W.5 O1 0.55 M
19 DR.W.6 O1 6.00 M
20 DR.DR.S.3 O2 > O1 M
21 DR.DR.S.4 O3 0.5 M
22 DR.RU.S.3 O4 0.8 M
Ver.5.0 19 2017/12
23 MT.SO.E.1
S1
=D3 PAD 0.12 O
24 SO.W.1 S2 0.12 O
25 SK.W.1 SkW 0.15 O
26 SK.H.1 SkH 1.00 O
27 SK.MT. S.1 SkM PAD 0.20 O
KO
28 KO.W.1 KOW 0.12 O
29 KO.H.1 KH 1.00 M
30 KO.H.2 KH NPTH M
ME
31 ME.W.1 MEW 0.12 O
32 ME.S.1 MES 1.50 M
4.1.2-1
Ver.5.0 20 2017/12
4.1.3
1 PAD PAD via
PAD via
2 PAD
DR.W.1
warning zero hole size
3
Ring
PAD
MT.W.2
4
Ver.5.0 21 2017/12
5 PAD
PAD
6 via
via
7
net name
8 Paste Gerber ?
Paste paste
SMT
(reflow) paste
Gerber
4.1.3-1
Ver.5.0 22 2017/12
4.2
4.2.1
PCB Top Bottom
MT.W.1 MW 0.12 mm
MT.S.1 MS 0.12 mm
MT.KO.E.1 MB 0.40 mm
4.2.1-1
4.2.1-1
Ver.5.0 23 2017/12
4.2.2
MT.S.2 MC
(FR4) 0.18 mm
(RO) 0.17 mm
MT.KO.E.1 CB 0.40 mm
4.2.2-1
4.2.2-1
Ver.5.0 24 2017/12
4.3.
CIC
Top Bottom (PTH
Plating Through Hole) (NPTH non-Plating Through
Hole)
PAD via
4.3.1 (PTH)
PTH ±
0.075 mm
DR.W.1 D1 0.20 mm
DR.W.2 D1 6.00 mm
DR.DR.S.1 D4 0.30 mm
DR.MT.S.1 D5 0.30 mm
DR.KO.E.1 D6 0.50 mm
MT.W.2 D2 0.12 mm
Ver.5.0 25 2017/12
MT.SO.E.1 D3 0.12 mm
SO.W.1 S2 0.12 mm
4.3.1-1 PTH
4.3.1-1 PTH
Ver.5.0 26 2017/12
4.3.2 (NPTH)
NPTH
± 0.05 mm
DR.W.3 N1 NPTH 0.50 mm
DR.W.4 N1 NPTH 6.00 mm
DR.DR.S.2 N2 NPTH 0.30 mm
DR.RU.S.2 N3 NPTH 0.50 mm
DR.SO.E.2 N4 NPTH 0.12 mm
4.3.2-1 NPTH
4.3.2-1 NPTH
N1 N2
N3
N4
Ver.5.0 27 2017/12
4.3.3 (PTH NPTH)
± 0.075 mm PTH NPTH
DR.W.5 O1 0.55 mm
DR.W.6 O1 6.00 mm
DR.DR.S.3 O2 > O1
DR.DR.S.4 O3 0.5 mm
DR.RU.S.3 O4 0.8 mm
4.3.3-1
4.3.3-1
Ver.5.0 28 2017/12
4.4
4.4.1
(Solder PAD)
(PAD)
( ) 4.4-3
MT.SO.E.1 S1
=D3 PAD 0.12 mm
SO.W.1 S2 0.12 mm
4.4.1-1
Ver.5.0 29 2017/12
4.4.1-1
Ver.5.0 30 2017/12
4.4.2
(PAD)
4.4.2-1 S2
Ver.5.0 31 2017/12
S2
4.4.2-2 S2
Ver.5.0 32 2017/12
4.5
4.5.1
0.25 mm
CIC
SK.W.1 SkW 0.15 mm
SK.H.1 SkH 1.00 mm
SK.MT. S.1 SkM PAD 0.20 mm
4.5.1-1
Ver.5.0 33 2017/12
4.5.1-1
Ver.5.0 34 2017/12
4.5.2 PCB
PCB
_ _
2L_ 102A_ 4
4.5.2-1 PCB
2L_102A_1A2B
Ver.5.0 35 2017/12
4.6
KeepOut (KO) PCB
PCB
Mechanical (ME) PCB
4.6.2-1 KO
4.6.1 KO
(a) KeepOut KO
(b)
(c) 1mm NPTH (
PTH )
KH
4.6.1-1 KO KH
Ver.5.0 36 2017/12
KO.W.1 KOW 0.12 mm
KO.H.1 KH 1.0 mm
KO.H.2 KH NPTH
4.6.1-1 KO
4.6.1-2 KO
Ver.5.0 37 2017/12
4.6.2 ME
PCB KO ME
KO 1.5 mm ME
PCB 4.6.2-1
ME KO
4.6.2-1 PCB ME KO
KO
KH
ME
5N cm
5P cm
KH
Ver.5.0 38 2017/12
PCB
ME PCB
N, P
PCB
PCB
(cm) (cm)
(cm×cm)
(cm×cm)
PCB_2L FR4 5P 5N 5 x 5 20 x 30
PCB_4L FR4 5P 5N 5 x 5 20 x 30
PCB_2LHF RO 5.2 P 4.75 N 5.2 x 4.75 20.8 x 28.5
PCB_4LMX RO-FR4 5.2 P 4.75 N 5.2 x 4.75 20.8 x 28.5
4.6.2-1 ME PCB
PCB
4.6.2-1
PCB
ME PCB PCB
PCB =(PCB / )X (PCB / )
PCB ME KO 4.6.2-1
FR4 4L PCB 9 cm X 6 cm (ME )
=(9/5)*(6/5) >> = 2* 2 = 4
Ver.5.0 39 2017/12
ME
ME.W.1 MEW 0.12 mm
ME.S.1 MES 1.50 mm
4.6.2-2 ME
4.6.2-2 ME
PCB
Ver.5.0 40 2017/12
5.
Board Outline
σ Conductivity
DRC Design Rule Check
DRM Design Rule Manual
εr Dielectric constant
ENIG Electroless Nickel Immersion
Gold
δ Loss Tangent
NPTH Non- Plating Through Hole
Peripheral Outline
PCB Printed Circuited Board
PP Prepreg
PTH Plating Through Hole
ρ Resistivity
Solder pad
Stacking
TPCA Taiwan Printed Circuit
Assocation
Ver.5.0 41 2017/12
6.
6.1 PCB http://www.cheer-time.com/
6.2 TPCA (2012)
6.3 TPCA
6.4 TPCA
6.5 2009 TPCA (2009)
6.6 PCB
http://www.youtube.com/watch?v=yZFfIKUd9pE