PCB PCB Fabrication Design Rule Manual (DRM) cis/PCB/doc/DRM_PCB.pdf · Ver.5.0 40 2017/12 5. Board

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Transcript of PCB PCB Fabrication Design Rule Manual (DRM) cis/PCB/doc/DRM_PCB.pdf · Ver.5.0 40 2017/12 5. Board

  • Ver.5.0 0 2017/12

    PCB

    PCB Fabrication Design Rule Manual (DRM)

  • Ver.5.0 1 2017/12

    1.0 2013.06.20

    1.1 2013.08.01

    A. 2.1-1 2.1-1

    B. 2.2-1 2.2-1

    C. 2.3-1 2.3-1

    1.2 2013.09.03

    A. 2.1-1

    B. 2.2-1

    C. 2.3-1

    D. 4.5 PCB PCB

    2.0 2013.10.04

    A. 3-2 Loss tangent 0.021 0.0021

    0.027 0.0027

    B. Mechanical 1 Keepout (KO)

    Mechanical 2 Mechanical 1(ME)

    C.

    D.

    E. A PCB Altium

    3.0 2013.12.05

    A. 4.1.2 4.1.3

    B. A PCB Altium

    PCB

    Altium

    C. 4.3.1

    D. 4.4

    E. 4.5.2 - _

    F. 4.6.1 NPTH

    KO.H.2 NPTH

    3.1 2014.02.11

    A. 4.1.2 4.2.2

    =0.22mm FR4 =0.22mm RO

    =0.17mm

    3.2 2014.06.12

    A. 4.6.1 (b)

    B. 4.6.2 ME1

  • Ver.5.0 2 2017/12

    KO 1.5 mm

    C. 4.6.2 PCB

    4.0 2015.03.20

    A.

    B. RO4003 RO4003C

    C. Mechanical 1 Mechanical

    D. Au Ni/Au

    4.1 2016.03.15 A. 2.4 RO4003C 0.73 mm

    0.81 mm

    5.0 2017.12.19

    A. FR4

    B. RO-FR4

    C. 4.1.2 4.2.2

    (FR4) = 0.22mm 0.18 mm

    D. 4.1.2 4.5.1 = 2.0

    mm 0.15 mm

  • Ver.5.0 3 2017/12

    1. .............................................................................................................. 1

    2. PCB ................................................................................................ 2

    2.1 FR4 ............................................................................................... 3

    2.2 FR4 ............................................................................................... 5

    2.3 RO4003C .............................................................................. 7

    2.4 RO-FR4 ................................................................................ 9

    2.5 PCB ........................................................................................ 11

    3. .................................................................................................... 13

    3.1 .................................................................................................. 13

    3.2 ...................................................................................................... 15

    4. PCB ...................................................................................... 17

    4.1 .................................................... 17

    4.1.1 .................................................................. 17

    4.1.2 .............................................................................. 18

    4.1.3 ...................................................................... 20

    4.2 ....................................................................................................... 22

    4.2.1 ........................................................................ 22

    4.2.2 ............................................................................ 23

  • Ver.5.0 4 2017/12

    4.3. .......................................................................................... 24

    4.3.1 (PTH) ............................................ 24

    4.3.2 (NPTH) ................................................... 26

    4.3.3 (PTH NPTH) .......................................... 27

    4.4 .................................................................................................. 28

    4.4.1 ........................................................................ 28

    4.4.2 ........................................................................ 30

    4.5 .................................................................................................. 32

    4.5.1 ......................................................................... 32

    4.5.2 PCB ....................................................................... 34

    4.6 ............................................................................................ 35

    4.6.1 KO .............................................. 35

    4.6.2 ME .............................................................. 37

    5. ............................................................................................. 40

    6. .................................................................................................... 41

  • Ver.5.0 1 2017/12

    1.

    (NARLabs CIC) FR4

    FR4 RO4003C RO4003C-FR4 PCB

    PCB (Stacking)

    (Layout Design Rules)

    PCB 6

  • Ver.5.0 2 2017/12

    2. PCB

    FR4 RO4003C

    (Cu) 1oz (0.035 mm)

    PTH

    Plating through Hole 0.2 mm

    NPTH

    non- Plating through Hole PTH

    Solder Pad

    ( ENIG Ni/Au

    )

    PCB

    2-1

  • Ver.5.0 3 2017/12

    2.1 FR4

    2.1-1 FR4 ( )

  • Ver.5.0 4 2017/12

    ( mm)

    0.017

    0.025

    _Top 0.035 1 oz

    FR4 1.430

    _Bottom 0.035 1 oz

    0.025

    0.017

    1.550

    _ 10%

    2.1-1FR4

  • Ver.5.0 5 2017/12

    2.2 FR4

    2.2-1 FR4 ( )

  • Ver.5.0 6 2017/12

    ( mm)

    0.017

    0.025

    _Top 0.035 1 oz

    FR4 PP 0.200

    _Inner_1 0.035 1 oz

    FR4 1.030

    _Inner_2 0.035 1 oz

    FR4 PP 0.200

    _Bottom 0.035 1 oz

    0.025

    0.017

    1.620

    _ 10%

    2.2-1 FR4

  • Ver.5.0 7 2017/12

    2.3 RO4003C

    2.3-1 RO4003C ( )

  • Ver.5.0 8 2017/12

    ( mm)

    0.017

    0.025

    _Top 0.035 1 oz

    RO 0.810

    _Bottom 0.035 1 oz

    0.025

    0.017

    0.930

    _ 10%

    2.3-1 RO4003C

  • Ver.5.0 9 2017/12

    2.4 RO-FR4

    2.4-1 RO-FR4 ( )

  • Ver.5.0 10 2017/12

    ( mm)

    0.017

    0.025

    _Top 0.035 1 oz

    RO core 0.203

    _Inner_1 0.017 oz

    FR4 PP 0.203

    _Inner_2 0.017 oz

    FR4 core 0.203

    _Bottom 0.035 1 oz

    0.025

    0.017

    0.763

    _ 0.1

    2.4-1 RO-FR4

  • Ver.5.0 11 2017/12

    2.5 PCB

    Top

    L1 L2 Bottom

    CIC DRC

    CIC

    DRC

    DRC

    Top Top

    MT

    Inner_1 ( ) L1

    Inner_2 ( ) L2

    Bottom Bottom

    Solder_top _top

    SO

    Solder_bottom _bottom

    Silkscreen_top _top

    SK

    Silkscreen _bottom _bottom

    Nc_drill DR

    KeepOut

    *

    KO

  • Ver.5.0 12 2017/12

    Mechanical # ME

    2.5-1 PCB

    * PCB

    # PCB

  • Ver.5.0 13 2017/12

    3.

    @*

    3.1

    FR4

    FR4 FR4 PP

    4.4 4.4 3.63

    _ 10% 10% 10%

    Loss tangent@ 0.017 0.017 0.0266

    (Tg*)

    140 140 -

    Tg_ +15% +15% -

    3.1-1 FR4

    @ loss tangent: =DF (Dissipation factor),

    http://en.wikipedia.org/wiki/Fr4 ,

    http://en.wikipedia.org/wiki/Dissipation_factor

    *Tg: glass transition temperature, or glass temperature < Tm (melting T)

    (http://en.wikipedia.org/wiki/Glass_transition_temperature )

    *RO-FR4 FR4 Tg=180

    http://en.wikipedia.org/wiki/Fr4http://en.wikipedia.org/wiki/Dissipation_factorhttp://en.wikipedia.org/wiki/Glass_transition_temperature

  • Ver.5.0 14 2017/12

    RO4003C #

    RO4003C RO4003C PP

    3.55 3.55 3.63

    _ 10% 10% 10%

    Loss tangent

    @2.5GHz/23 0.0021 0.0021 0.0266

    Loss tangent

    @10GHz/23 0.0027 0.0027 -

    (Tg)

    280 280 -

    Tg_ +15% +15%

    3.1-2 RO4003C

    # RO4003C

    http://www.rogerscorp.com/acm/products/54/RO4003C-Laminates.aspx

    http://www.rogerscorp.com/acm/products/54/RO4003C-Laminates.aspx

  • Ver.5.0 15 2017/12

    3.2

    (Metal Layer Properties)

    Top L1

    L2 Bottom

    - Cu

    mm 0.035

    (at 20 )# S m-1 5.96x107

    (at 20 )# m 1.68x10-8

    3.2-1

    # http://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivity

    PTH (Plating Through Hole Properties)

    - Cu

    mm 0.025

    (at 20 ) # S m-1 5.96x107

    (at 20 ) # m 1.68x10-8

    3.2-2 PTH

    # http://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivity

    http://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivityhttp://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivity

  • Ver.5.0 16 2017/12

    -

    m 3

    (at 20 ) # S m-1 1.43107

    (at 20 ) # m 6.99108

    3.2-3

    -

    m 0.025~0.05

    (at 20 ) # S m-1 4.10107

    (at 20 ) # m 2.44108

    3.2-4

    # http://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivity

    http://en.wikipedia.org/wiki/Electrical_resistivity_and_conductivity

  • Ver.5.0 17 2017/12

    4. PCB

    4.1

    4.1.1

    L1. L2. R. N

    (A) (B) (C) (D)

    (A) L1 (Original Layer)

    (B) L2 (Destination Layer (if any))

    (C) R

    L Length

    W Width

    S Spacing

    E Enclosure

    4.1.1-1

    (D) N

  • Ver.5.0 18 2017/12

    4.1.2

    (mm)

    Must /

    Optional

    1 MT.W.1 MW 0.12 M

    2 MT.S.1 MS 0.12 M

    3 MT.KO.E.1 MB 0.40 M

    4 MT.S.2 MC

    (FR4) 0.18 M

    (RO) 0.17 M

    5 MT.KO.E.1 CB 0.40 M

    (PTH)

    6 DR.W.1 D1 0.20 M

    7 DR.W.2 D1 6.00 M

    8 DR.DR.S.1 D4 0.30 M

    9 DR.MT.S.1 D5 0.30 M

    10 DR.KO