Option Technologies
Transcript of Option Technologies
Option TechnologiesVentec International GroupOffshore Masslam Solutions
From Prototype To Volume
Drilled Masslam from Taiwan
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Manufacturing Capabilities
CapabilitiesMaximum Layer Count 34Maximum Panel Size 760 x 610mm / 30” x 24” (Circuit Size: 710 x 558mm / 28" x 22")Minimum Panel Size 381 x 330mm / 15" x 13"Minimum Line and Space 2.5mil / 63μmMinimum Core Thickness 2mil / 50μmFinished Panel Thickness Min - 0.4mm - 4mm / 0.016" - 0.157"Inner Layer Copper Weight 1/2oz - 4oz (minimum line for 4oz 10mil / 0.25mm) plus imbalanced coppersOuter Layer Copper Weight Min – 5μm / 1/7oz Max – 210μm / 6ozMaterials Tg 140, Tg 150, Tg 175, Polyimides and other materials available upon request
DrillingMinimum Hole Size 0.15mm / 6milMaximum Hole Size up to 10mm / 0.254”Blind Via
Working to IPC Standards
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• ISO-9001• ISO-14001• UL• QA reports generated with all jobs• All inner-layers are 100% AOI• SPC is implemented throughout the manufacturing operation• Individual processes demonstrate detailed QA procedures• A detailed “Skills Matrix” is displayed in all departments
Quality and Approvals
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Planning Engineering in the UK
Polar Instruments Speedstack Software for precise build & impedance calculations
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CAM Department
Genesis & ParCam Software. Department runs 24-hrs per day 7 days a week, average throughputs 10 new parts per day. Data receiving from Option – TW CAM add etch compensation & apply scaling factors to data.
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Photography
Orbotech LP 9008 Photoplotter 8000DPI. Artwork inspection & Measuring. Artwork punching. Cleanroom garments are worn in this department
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Chemical Clean
Sulphuric Peroxide solution. Four stage cascade rinses with extensive drying section. Etch rate 0.6µm, etch rate samples are conducted every shift.
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Photomech – Dry Film Lamination
Automatic cut sheet laminator with thin core capability. Pre-heat & hold station. Eternal dry film 20µm. Class 10,000 cleanroom.
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Photomech – Imaging (Bacher)
Fully automated Exposure unit throughput 130 panels per hour. Camera aligned registration accuracy < 15µm.
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Photomech – Imaging (ORC)
Fully automated Exposure unit maximum throughput 135 per hour. Camera aligned registration accuracy < 15µm. Automated with load & unloading equipment.
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Photomech Imaging (Orbotech)
LDI for inner layers with tight registration features such as micro BGA’s and spaces <2.5 mil
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Develop Etch & Strip
Cupric Etch solution. Average track width reduction is approximately 15%. All inner-layers are interleaved as they exit the stripper. First article inspection is conducted and repeated after every 50 panels.
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First Article Inspection
“First off” procedure at AOI, the inner-layer is measured for dimensional stability in X & Y, Line widths are checked for impedance using the Mach-vision gauge, Average line width reduction 15%.
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AOI Process Orbotech & Screen P18000
A total of 7 AOI machines, 7 offline verification stations. Orbotech Discovery 8 is pictured below with load & unload facility. Inner layersare scanned, barcoded, interleaved and then sent for fault verification.
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AOI
All inner-layers are cleaned prior to AOI with a tacky roller. AOI machine is a P18000 Screen from Japan, minimum line width detection capability is 35µm.
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AOI Fault Verification
Inner-layers with faults are verified and repaired offline, all repairs are interleaved and re-scanned through AOI.
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Alternative Oxide
Three converyorised lines, line speed 3 metres/minute. Cobra Bond Chemistry, Etch rate 1.5µm +/-0.3µm, cores interleaved before and after processing, exotic materials are baked at 120°C prior to lay up.
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Build Up
All inner-layers are visually inspected at build up, layers are built up with small rivetsand flattened, all multilayers are then 100% inspected on the x-ray machine, any panels showing mis-registration will be rejected, all operators wear cleanroom garments.
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Lay Up Stations
All panels are built on large format stainless steel plates, panels are built free with oversize foil, for example a 24” x 21” panel would be built four panels per page.
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Presses & Press Capacity
Large format presses with auto-load & unload facility, five presses all with 8-openings, capacity is 5,000 panels per day based on a 24 x 18" 1.6mm panel, 320 panels per press load.
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Presses Controls
All presses have chart recorders for each individual press and platen, the data is available from each press cycle recording both platen & product temperature Buffering used is 140 gsm kraft paper this is not reused.
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Breakdown / De-stack
Panels are trimmed down and then interleaved with a soft material, After each press cycle all press plates are then cleaned through the brushing machine.
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X-ray Drilling
Four X-ray drill machines, one Seiko and three ADT. All four machines optimise in both X & Y. All panels are interleaved before and after drilling.
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Routing
Three route machines all with three spindles. Programs all ensure radius corners. Typical stack height is 5 high for a 1.6mm panel.
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Edge Milling
All panels are edge milled, four individual “v” blades for cutting each edge, maximum panel thickness for edge milling is 3.2mm.
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Bonding Inspection
All panels are 100% inspected for surface defects including pits, dents, resin spots or creases. A thickness check is also performed using deep throat micrometer. Tooling holes diameters are verified using a plug gauge. Outer copper is verified using a copper scope. All panels are interleaved prior to drilling to prevent surface damage.
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Drilling
360 drill spindles, capacity is 15,000 panels per day.Process runs 24-hrs per day 7 days per week.
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Drilling
A first off x-ray inspection is carried out prior to batch processing, for batch inspection the bottom panel off each stack is x-ray inspected.
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Spindle Accuracy Check
All spindles are checked for accuracy twice per week. Reports are available for drill accuracy, hole positional checks are verified by AOI inspection.
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Hole Checking
After drilling all panels are processed through a high pressure rinse and then inspected through the automatic hole inspector, for missing/blocked holes.
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