MXD-D400 - Minidisc...SERVICE MANUAL COMPACT DISC MINIDISC DECK US Model SPECIFICATIONS MXD-D400 US...
Transcript of MXD-D400 - Minidisc...SERVICE MANUAL COMPACT DISC MINIDISC DECK US Model SPECIFICATIONS MXD-D400 US...
SERVICE MANUAL
COMPACT DISC MINIDISC DECK
US Model
SPECIFICATIONS
MXD-D400
US and foreign patents licensed from DolbyLaboratories.
CD player sectionSystem Compact Disc digital
audio systemLaser Semiconductor laser
(λ=780 nm) Frequency response 20 Hz – 20 kHz (±0.5 dB)Wow and flutter Below measureable limit
(±0.001% W.PEAK)
MD deck sectionSystem MiniDisc digital audio systemDisc MiniDiscLaser Semiconductor laser
(λ=780 nm) Emission duration: continuous
Sampling frequency 44.1 kHzFrequency response 20 Hz – 20 kHz (±0.5 dB)
Inputs
Jack type Input impedance
Rated input
Minimum input
ANALOG IN Pin jack 47 kilohms 500 mVrms 250 mVrms
DIGITAL OPTICAL IN
Squqre optical connector jack
Optical wave length:660 nm
– –
Outputs
GeneralPower requirements 120 V AC, 60 HzPower consumption 19 watts
Less than 1 watt (at the power saving mode)
Dimensions (w/h/d) incl. projecting parts and controls Approx. 430 × 108 × 399 mm
Mass Approx. 5.4 kg
Supplied accessories
Design and specifications are subject to change without notice.
Jack type Rated output Load impedance
ANALOG OUT Pin jack 2 Vrms (at 47 kilohms)
Over 10 kilohms
DIGITAL OPTICAL OUT
Squqre optical connector jack
-18 dBm Optical wave length:660 nm
PHONES Stereo phone jack
10 mW 32 ohm
• Audio connection cords (2)
• Remote commander (remote) (1) • Sony R6 (size-AA) batteries (2)
Ver 1.0 2003.05
9-877-241-01 Sony Corporation2003E05-1 Home Audio Company
C 2003.5 Published by Sony Engineering Corporation
Model Name Using Similar Mechanism NEW
MD Mechanism Type MDM-7S2C
Optical Pick-up Name KMS-262E
Model Name Using Similar Mechanism NEW
CD Mechanism Type CDM66C-30B61M
Base Unit Name BU-30BD61B
Optical Pick-up Name OP Assy (A-MAX.4T)
MD
Section
CD
Section
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MXD-D400
SELF-DIAGNOSIS FUNCTIONThe self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur, and error codeswhich show the error history in the test mode during servicing. For details on how to view error codes for the customer, refer to thefollowing box in the instruction manual. For details on how to check error codes during servicing, refer to the following “Procedure forusing the Self-Diagnosis Function (Error History Display Mode)”.
PROCEDURE FOR USING THE SELF-DIAGNOSIS FUNCTION (ERROR HISTORY DISPLAY MODE)Note: Perform the self-diagnosis function in the “error history display mode” in the test mode. The following describes the least required procedure. Be
careful not to enter other modes by mistake. If you set other modes accidentally, pull out the AC cord to turn the power off and retry to enter the testmode.
1. Press the ?/1 button to turn he power on.2. Press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD) knob to display “SYS
version”.3. Turn the [ AMS ] (CD) knob and when “MD Test” is displayed, press the [ AMS ] (MD) knob.4. Turn the [ AMS ] (MD) knob and when “[Service]” is displayed, press the [YES] button.5. Turn the [ AMS ] (MD) knob to display “Err Display”.6. Press the [YES] button to sets the error history mode and displays “op rec tm”.7. Select the contents to be displayed or executed using the [ AMS ] (MD) knob.8. Press the [ AMS ] (MD) knob to display or execute the contents selected.9. Press the [ AMS ] (MD) knob another time returns to step 6.10. Press the [MENU/NO] button to display “Err Display” and release the error history mode.11. To release the test mode, press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD)
knob.12. Press the ?/1 button to turn the power off.
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This deck has a Self-diagnosis display function to let you know if there is a deck malfunction. The display shows a code made up of three or five letters and a message alternately to show you the problem. To solve the problem refer to the following list. If any problem persists, consult your nearest Sony dealer.
C11/ProtectedThe MD is protected against erasure.
cRemove the MD and slide the tab to close the slot.
C12/Cannot CopyYou tried to record a CD with a format that the deck does not support, such as a CD-ROM or MD data.
cReplace the playable disc.
C13/REC ErrorRecording could not be performed properly.
cMove the deck to a stable place, and start recording over from the beginning.
The MD is dirty or scratched, or the MD does not meet the standards.
cReplace the MD and start recording over from the beginning.
C13/Read ErrorThe MD deck cannot read the disc information properly.
cRemove the MD once, then insert it again.
C41/Cannot CopyThe digitally dubbed material cannot be recorded digitally.
C71/Din UnlockThe digitally dubbed material cannot be recorded digitally.
A moment’s lighting is due to the signals of the digital program being recorded. This does not affect the recorded material.
The digital optical cable is disconnected, or the power of the connected component is turned off while recording the digital audio from the component connected to the DIGITAL OPTICAL IN jack.
cConnect the digital optical cable, or turn on the power of the connected component.
E0001/MEMORY NGThe component has internal problem.
cConsult your nearest Sony dealer.
E0101/LASER NGThere is a problem with the laser pickup.
cThe laser pickup may be damaged. Consult your nearest Sony dealer.
E0201/LOADING NGThere is a problem with the loading.
cThe loading may be failed. Consult your nearest Sony dealer.
C14/TOC ErrorThe MD deck cannot read the disc information properly.
cReplace the MD.
cErase all the recorded contents of the MD using the All Erase Function.
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MXD-D400
ITEMS OF ERROR HISTORY MODE ITEMS AND CONTENTSSelecting the Test Mode
Display Details of History
op rec tm Cumulative recording time is displayed.When cumulative recording time is over 1 minute, the hour and minute are displayed as they are.When it is under 1 minute, “Under 1 min” is displayed.The displayed time shows how long the laser is in high power state.It is about one fourth the actual recording time.
op play tm Cumulative playing time is displayed.When cumulative playing time is over 1 minute, the hour and minute are displayed as they are.When it is under 1 minute, “Under 1 min” is displayed.
spdl rp tm Cumulative spindle motor running time is displayed.When cumulative spindle motor run time is over 1 minute, the hour and minute are displayed as they are.When it is under 1 minute, “Under 1 min” is displayed.
retry err Displays the total number of retries during recording and number of retry errors during play.Displayed as “rss pss”.“r” indicates the retries during recording while “p” indicates the retry errors during play.The number of retries and retry errors are displayed in hexadecimal digits from 00 to FF.
total err Displays the total number of errors.Displayed as “total ss”.The number of errors is displayed in hexadecimal digits from 00 to FF.
err history Displays the 10 latest errors.Displayed as “0s ErrCd@@”.s indicates the history number. The smaller the number, the more recent is the error. (00 is the latest).@@ indicates the error code.Refer to the following table for the details. The error history can be switched by turning the [ AMS ](MD) knob.
retry adrs Displays the past five retry addresses.Displays “ss ADRS ssss”, ss is the history number, ssss is the cluster with the retry error.Select the error history number using the [ AMS ] (MD) knob.
er refresh Mode to clear the error history and retry address history.[Operating method]1) Press [ AMS ] (MD) knob when “er refresh” is displayed.2) The display will change to “er refresh?”, and then press [YES] button.The operation is over if “Complete!” is displayed.After this mode was executed, check the following:• The data have been cleared.• Perform the recording and playing to check that the mechanism operates normally.
tm refresh Mode to clear the “op rec tm” and “op play tm” histories.These histories serve as approximate indications of when to replace the optical pick-up. If the optical pick-uphas been replaced, perform this operation and clear the history.[Operating method]1) Press [ AMS ] (MD) knob when “tm refresh” is displayed.2) The display will change to “tm refresh?”, and then press [YES] button.The operation is over if “Complete!” is displayed.After this mode was executed, check the following:• The data have been cleared.• Perform the recording and playing to check that the mechanism operates normally.
op change Mode to clear cumulative time of “op rec tm” and “op play tm”.These historical data are used to determine the timing when the optical pick-up is to be replaced. When theoptical pick-up was replaced, perform this operation to clear historical data.[Operating method]1) Press [ AMS ] (MD) knob when “op change” is displayed.2) The display will change to “op chang?”, and then press [YES] button.The operation is over if “Complete!” is displayed.
spdl change Mode to clear cumulative time of “spdl rp tm”.This historical data is used to determine the timing when the spindle motor is to be replaced. When the spindlemotor was replaced, perform this operation to clear historical data.[Operating method]1) Press [ AMS ] (MD) knob when “spdl change” is displayed.2) The display will change to “spdl chang?”, and then press [YES] button.The operation is over if “Complete!” is displayed.
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MXD-D400
Error Code Details of Error
10 Loading failed
12 Loading switch combination is illegal
20 Head of PTOC could not be read within thespecified time
21 Head of PTOC could be read but its content iserroneous
22 Access to UTOC could not be made within thespecified time
23 UTOC could be not read within the specified3time
24 Content of UTOC is erroneous
30 Playing could not start
31 Content of sector is erroneous
40 Cause of retry occurred during normal recording
41 D-RAM overflowed and retry was executed
42 Retry was executed during the writing to TOC
43 S.F editing was interrupted by retry
50 Address could not be read except in accessprocessing
51 Focusing failed and it is out of control
60 Unlock retry
Table of Error Codes
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MXD-D400
SELF-DIAGNOSIS FUNCTION ........................... 2
1. SERVICING NOTES ............................................... 7
2. GENERAL ................................................................... 16
3. DISASSEMBLY3-1. Disassembly Flow ........................................................... 173-2. Case (409538) ................................................................. 183-3. Loading Panel (CD) ........................................................ 183-4. MD Mechanism Deck (MDM-7S2C) ............................. 193-5. CD Mechanism Deck (CDM66C-30B61C) ................... 193-6. Transformer Board .......................................................... 203-7. Main Board ...................................................................... 203-8. Front Panel Block Section .............................................. 213-9. Holder Section ................................................................. 213-10. Over Write Head (HR901) .............................................. 223-11. Optical Pick-up (KMS-262E) ......................................... 223-12. BD (MD) Board .............................................................. 233-13. Loading Motor Assembly (M103), Spindle Motor
Assembly (M101), Sled Motor Assembly (M102) ........ 233-14. Tray (66) .......................................................................... 243-15. BD (CD) Board ............................................................... 253-16. Optical Block Section ..................................................... 25
4. TEST MODE .............................................................. 26
5. ELECTRICAL ADJUSTMENTSMD Section ..................................................................... 32CD Section ...................................................................... 44
6. DIAGRAMS6-1. Block Diagram – CD Section – ..................................... 466-2. Block Diagram – MD Section – .................................... 476-3. Block Diagram – MAIN Section – ................................ 486-4. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 496-5. Printed Wiring Board – BD (CD) Section – .................. 506-6. Schematic Diagram – BD (CD) Section – .................... 516-7. Schematic Diagram – BD (MD) Board (1/2) – ............. 526-8. Schematic Diagram – BD (MD) Board (2/2) – ............. 536-9. Printed Wiring Board – BD (MD) Board – ................... 546-10. Printed Wiring Board
– MAIN Board (Component Side) – .............................. 566-11. Printed Wiring Board
– MAIN Board (Conductor Side) – ................................ 576-12. Schematic Diagram – MAIN Board (1/4) – .................. 586-13. Schematic Diagram – MAIN Board (2/4) – .................. 596-14. Schematic Diagram
– MAIN (3/4)/LOADING Boards – ............................... 606-15. Schematic Diagram – MAIN Board (4/4) – .................. 616-16. Printed Wiring Boards – Panel Section – ...................... 626-17. Schematic Diagram – Panel Section – .......................... 636-18. Printed Wiring Board – TRANSFORMER Board – ..... 646-19. Schematic Diagram – TRANSFORMER Board – ........ 656-20. IC Pin Function Description ........................................... 74
7. EXPLODED VIEWS7-1. Overall Section ................................................................ 837-2. Front Panel Section ......................................................... 847-3. Chassis Section ............................................................... 857-4. MD Mechanism Deck Section-1 (MDM-7S2C) ............ 867-5. MD Mechanism Deck Section-2 (MDM-7S2C) ............ 877-6. CD Mechanism Deck Section (CDM66C-30B61M) ..... 88
7-7. Base Unit Section (BU-30BD61M) ................................ 89
8. ELECTRICAL PARTS LIST ............................... 90
TABLE OF CONTENTS
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MXD-D400
SAFETY CHECK-OUTAfter correcting the original service problem, perform the follow-ing safety check before releasing the set to the customer:Check the antenna terminals, metal trim, “metallized” knobs,screws, and all other exposed metal parts for AC leakage.Check leakage as described below.
LEAKAGE TESTThe AC leakage from any exposed metal part to earth ground andfrom all exposed metal parts to any exposed metal part having areturn to chassis, must not exceed 0.5 mA (500 microamperes.).Leakage current can be measured by any one of three methods.1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use theseinstruments.
2. A battery-operated AC milliammeter. The Data Precision 245digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of aVOM or battery-operated AC voltmeter. The “limit” indica-tion is 0.75 V, so analog meters must have an accurate low-voltage scale. The Simpson 250 and Sanwa SH-63Trd are ex-amples of a passive VOM that is suitable. Nearly all batteryoperated digital multimeters that have a 2 V AC range aresuitable. (See Fig. A)
Fig. A. Using an AC voltmeter to check AC leakage.
1.5 kΩ0.15 µFACvoltmeter(0.75 V)
To Exposed MetalParts on Set
Earth Ground
CAUTIONUse of controls or adjustments or performance of proceduresother than those specified herein may result in hazardous ra-diation exposure.
Notes on chip component replacement• Never reuse a disconnected chip component.• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).• Be careful not to apply force on the conductor when soldering
or unsoldering.
This appliance is classified as a CLASS 1LASER product. The CLASS 1 LASERPRODUCT MARKING is located on therear exterior.
The following caution label is locatedinside of the apparatus.
UNLEADED SOLDERBoards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead.(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARKUnleaded solder has the following characteristics.• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.Ordinary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slightly longer time.Soldering irons using a temperature regulator should be set toabout 350 ˚C.Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)than ordinary solder so use caution not to let solder bridges oc-cur such as on IC pins, etc.
• Usable with ordinary solderIt is best to use only unleaded solder but unleaded solder mayalso be added to ordinary solder.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTEDLINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMSAND IN THE PARTS LIST ARE CRITICAL TO SAFEOPERATION. REPLACE THESE COMPONENTS WITHSONY PARTS WHOSE PART NUMBERS APPEAR ASSHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-LISHED BY SONY.
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MXD-D400SECTION 1
SERVICING NOTES
The laser diode in the optical pick-up block may suffer electro-static break-down because of the potential difference generatedby the charged electrostatic load, etc. on clothing and the humanbody.During repair, pay attention to electrostatic break-down and alsouse the procedure in the printed matter which is included in therepair parts.The flexible board is easily damaged and should be handled withcare.
For CD
NOTES ON LASER DIODE EMISSION CHECKThe laser beam on this model is concentrated so as to be focusedon the disc reflective surface by the objective lens in the opticalpick-up block. Therefore, when checking the laser diode emis-sion, observe from more than 30 cm away from the objective lens.
LASER DIODE AND FOCUS SEARCH OPERATIONCHECKCarry out the “S curve check” in “CD section adjustment” andcheck that the S curve waveforms is output three times.
For MD
NOTES ON LASER DIODE EMISSION CHECKNever look into the laser diode emission from right above whenchecking it for adjustment. It is feared that you will lose your sight.
NOTES ON HANDLING THE OPTICAL PICK-UPBLOCK OR BASE UNIT
HOW TO OPEN THE LOADING PANEL (CD) WHEN POWER SWITCH IS OFF
(Figure A)
CLEANING OBJECTIVE LENS OF OPTICAL PICK-UP• In cleaning the objective lens of optical pick-up, be sure the
following below.
1. In cleaning the lens, do not apply an excessive force.As the optical pick-up is vulnerable, application of excessiveforce could damage the lens holder.
2. In cleaning, do not use a cleaner other than exclusive cleaningliquid (KK-91 or isopropyl alcohol).
3. Wipe the objective lens spirally from center toward outside.(See Figure A)
4. Eject the disk, if loaded.5. Disconnect the power cord from the socket to shut off the power
supply.
A
1 Turn the cam (66) in the direction of arrow A.
2 Pull out the loading panel (CD).
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MXD-D400
main board
– Front panel block section –
front panel block section
SERVICE POSITION
– Main board –
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MXD-D400
– MD mechanism deck –
– CD mechanism deck –
BD (MD) board
MD mechanism deck(MDM-7S2C)
CD mechanism deck(CDM66C-30B61M)
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MXD-D400
cable (4P)
lead pin
main board
transformer board
power transformer(TR651)
Fix the cable (4P) between the transformer board and the main board with a lead pin keeping the cable from the powertransformer (TR651).
NOTE FOR POSITION OF THE CABLE (4P)
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MXD-D400
I+3VIOPGNDTEFEVCRF
I+3VIOP
GNDTEFEVCRF
1
7
forMDM-7S2C
I+3V
CN105
IOPTE
VC
GNDFE
RF
MD SECTION
JIG FOR CHECKING BD (MD) BOARD WAVEFORM
The special jig (J-2501-196-A) is useful for checking the waveform of the BD (MD) board. The names of terminals and the checking itemsto be performed are shown as follows.
GND : GroundI+3V : For measuring IOP (Check the deterioration of the optical pick-up laser)IOP : For measuring IOP (Check the deterioration of the optical pick-up laser)TE : Tracking error signal (Traverse adjustment)VC : Reference level for checking the signalRF : RF signal (Check jitter)FE : Focus error signal
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MXD-D400
IOP DATA RECORDING AND DISPLAY WHEN OPTICAL PICK-UP AND NON-VOLATILE MEMORY (IC195 OFBD (MD) BOARD) ARE REPLACED
The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory. By recording the value, it will eliminate the needto look at the value on the optical pick-up label. When replacing the optical pick-up or non-volatile memory (IC195 of BD (MD) board),record the IOP value on the optical pick-up according to the following procedure.
Record Procedure:1. Press the ?/1 button to turn on the power.2. Press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD) knob to display “SYS
version”.3. Turn the [ AMS ] (CD) knob and when “MD Test” is displayed, press the [ AMS ] (MD) knob.4. Turn the [ AMS ] (MD) knob to display “[Service]”, and press the [YES] button.5. Turn the [ AMS ] (MD) knob to display “Iop Write” (C05), and press the [YES] button.6. The display becomes “Ref=@@@.@” (@ is an arbitrary number) and the numbers which can be changed will blink.7. Input the IOP value written on the optical pick-up label.
To select the number : Turn the [ AMS ] (MD) knob.To select the digit : Press the [ AMS ] (MD) knob.
8. When the [YES] button is pressed, the display becomes “Measu=@@@.@” (@ is an arbitrary number).9. As the adjustment results are recorded for the 4 value. Leave it as it is and press the [YES] button.10. “Complete!” will be displayed momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop
Write (C05)”.11. Press the [MENU/NO] button to display “MD Test”.12. Press the ?/1 button to turn the power off.
Display Procedure:1. Press the ?/1 button to turn on the power.2. Press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD) knob to display “SYS
version”.3. Turn the [ AMS ] (CD) knob and when “MD Test” is displayed, press the [ AMS ] (MD) knob.4. Turn the [ AMS ] (MD) knob to display “[Service]”, and press the [YES] button.5. Turn the [ AMS ] (MD) knob to display “Iop Read” (C26), and press the [YES] button.6. “@@.@/##.#” is displayed and the recorded contents are displayed.
@@.@: indicates the IOP value on the optical pick-up label.##.# : indicates the IOP value after adjustment
7. To end, press the [MENU/NO] button to display “Iop Read” (C26).8. Press the [MENU/NO] button to display “MD Test”.9. Press the ?/1 button to turn the power off.
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MXD-D400
CHECKS PRIOR TO PARTS REPLACEMENT AND ADJUSTMENTS IN MD
Before performing repairs, perform the following checks to determine the faulty locations up to a certain extent.Details of the procedures are described in “5 Electrical Adjustments”.
• 0.93 mW powerSpecified value : 0.84 to 0.92 mW (KMS-262A)
0.90 to 0.96 mW (KMS-262E)• 8.65 mW power
Specified value : 8.1 to 8.7 mW (KMS-262A)8.4 to 8.9 mW (KMS-262E)
• Iop (at 8.65mW)Labeled on the optical pick-upIop value ± 10mA
• Unsatisfactory if displayed as “NG: XXXX”NG(XXXX is arbitrary number)
• Unsatisfactory if displayed as “T=@@ (##) [NG]”NG(@@, ## are both arbitrary numbers)
Laser power check(5-7-2 : See page 36)
Auto check(5-7-4 : See page 37)
Temperaturecompensationoffset check(5-7-1 : See page 36)
Criteria for Determination(Unsatisfactory if specified value is not satisfied)
• Clean the optical pick-up• Adjust again• Replace the optical pick-up
• Replace the optical pick-up
• Replace the optical pick-up
• Check for disconnection of the circuits aroundD101 (BD (MD) board)
• Check the signals around IC101, IC151, CN102,CN103 (BD (MD) board)
Measure if unsatisfactory:
Note:The criteria for determination above is intended merely to determine if satisfactory or not, and does not serve as the specified value for adjustments.When performing adjustments, use the specified values for adjustments.
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MXD-D400
CD SECTION
CD-TEXT TEST DISC
This unit is able to display the test data (character information) written in the CD on its fluorescent indicator tube.The CD-TEXT TEST DISC (TGCS-313:4-989-366-01) is used for checking the display.To check, perform the following procedure.
Checking Method:1. Turn ON the power, set the disc to the disc table with the “test disc” label facing up, and chuck the disc.2. Press the H (CD) button and play back the disc.3. The following will be displayed on the fluorescent indicator tube.
Display : 1KHZ 0DB4. Rotating [ AMS ] (CD) knob, select the track. The text data of each track will be displayed.
For details of the displayed contents for each track, refer to “Table 1 : CD-TEXT TEST DISC TEXT Data Contents” and “Table 2 : CD-TEXT TEST DISC Recorded Contents and Display”.
Restrictions in CD-TEXT DisplayIn this unit, some special characters will not be displayed properly. These will be displayed as a space or a character resembling it. Fordetails, refer to “Table 2 : CD-TEXT DISC Recorded Contents and Display”.
Table 1 : CD-TEXT TEST DISC TEXT Data Contents (TRACKS No. 1 to 41:Normal Characters)
1 1kHz/0dB/L&R 22 1kHz/–90dB/L&R
2 20Hz/0dB/L&R 23 Infinity Zero w/o emphasis//L&R
3 40Hz/0dB/L&R 24 Infinity Zero with emphasis//L&R
4 100Hz/0dB/L&R 25 400Hz+7kHz(4:1)/0dB/L&R
5 200Hz/0dB/L&R 26 400Hz+7kHz(4:1)/–10dB/L&R
6 500Hz/0dB/L&R 27 19kHz+20kHz(1:1)/0dB/L&R
7 1kHz/0dB/L&R 28 19kHz+20kHz(1:1)/–10dB/L&R
8 5kHz/0dB/L&R 29 100Hz/0dB/L*
9 7kHz/0dB/L&R 30 1kHz/0dB/L*
10 10kHz/0dB/L&R 31 10kHz/0dB/L*
11 16kHz/0dB/L&R 32 20kHz/0dB/L*
12 18kHz/0dB/L&R 33 100Hz/0dB/R*
13 20kHz/0dB/L&R 34 1kHz/0dB/R*
14 1kHz/0dB/L&R 35 10kHz/0dB/R*
15 1kHz/–1dB/L&R 36 20kHz/0dB/R*
16 1kHz/–3dB/L&R 37 100Hz Squer Wave//L&R
17 1kHz/–6dB/L&R 38 1kHz Squer Wave//L&R
18 1kHz/–10dB/L&R 39 1kHz w/emphasis/–0.37dB/L&R
19 1kHz/–20dB/L&R 40 5kHz w/emphasis/–4.53dB/L&R
20 1kHz/–60dB/L&R 41 16kHz w/emphasis/–9.04dB/L&R
21 1kHz/–80dB/L&R
TRACK
No.Displayed Contents
Note: The contents of Track No. 1 to 41 are the same as those of the current TEST DISC-their titles are displayed.
TRACK
No.Displayed Contents
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MXD-D400
Table 2: CD-TEXT TEST DISC Recorded Contents and Display(In this unit, some special characters cannot be displayed. This is not a fault)
T All the same
T All the same
T All the same
T All the same
T All the same
T All the same
T All the same
T All the same
T All the same
T All the same
T All the same
T All the same
(A0h to A7h) 8859-1
(A8h to AFh)
(B0h to B7h)
(B8h to BFh)
A A A A A A C (C0h to C7h)
E E E E I I I I (C8h to CFh)
D N O O O O O (D0h to D7h)
O U U U U Y (D8h to DFh)
a a a a a a c (E0h to E7h)
e e e e i i i i (E8h to EFh)
d n o o o o o (F0h to F7h)
o u u u u y y (F8h to FFh)
T All the same
T All the same
to
T All the same
TRACKNo.
Recorded contents
´
′
*
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
to
99
! ” # $ % & ´ (21h to 27h)1kHz 0dB L&R
( ) + , – . / (28h to 2Fh)
0 1 2 3 4 5 6 7 (30h to 37h)
8 9 : ; < = > ? (38h to 3Fh)
@A B C D E F G (40h to 47h)
H I J K L M N O (48h to 4Fh)
P Q R S T U V W (50h to 57h)
X Y Z [ ¥ ] ^ _ (58h to 5Fh)
a b c d e f g (60h to 67h)
h i j k l m n o (68h to 6Fh)
p q r s t u v w (70h to 77h)
x y z I (78h to 7Fh)
i ¢ £ ¤ ¥ § (A0h to A7h) 8859-1
C ª ¬PR– (A8h to AFh)• ± 2 3 µ ¶ • (B0h to B7h)
† 1 º ¿ (B8h to BFh)
À Á Â Ã Ä ÅÆÇ (C0h to C7h)
È É Ê Ë Ì Í Î Ï (C8h to CFh)
D Ñ Ò Ó Ô Õ Ö (D0h to D7h)
Ø Ù Ú Û Ü Y ß (D8h to DFh)
à á â ã ä å æ ç (E0h to E7h)
è é ê ë ì í î ï (E8h to FFh)
∂ ñ ò ó ô õ ö ÷ (F0h to F7h)
ø ù ú û ü y ÿ (F8h to FFh)
No.66
No.67
to
No.99
˙
~
′14
12
34
Display
16
MXD-D400SECTION 2GENERAL
This section is extracted frominstruction manual.
Main unit
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1 2 3 4 5 6 7 90qa
qsqdqfqgqhqjqkql
w;wawswdwfwhwjwk wg
8
ef
ALBUM wh AMS wa wg CD SYNCHRO NORMAL/HIGH 4CLEAR ws Disc tray 3 DISPLAY ql Display window wf EJECT 6 GROUP ON/OFF 9 GROUP SKIP 0 INPUT qa
MD slot 5 MDLP indicator 7 MENU/NO wd
OPEN/CLOSE 2PHONES jack esPHONE LEVEL edPLAY MODE qj wj REC LEVEL qdREC MODE 8REC z qs STANDBY indicator ef TIME qk wk YES w;
ALPHABETICAL ORDER
A – I
J – Z
?/1 (power/standby) 1 H (play) qf wlX (pause) qh e;x (stop) qg ea
BUTTON DESCRIPT
Remote control
NS
ALBUM/GROUP -/+ qf CD MD select wkCD SYNCHRO NORMAL/
HIGH wa CLEAR 8 DISPLAY wg FADER ws GROUP ON/OFF wd INPUT wj MENU/NO wf MUSIC SYNC 9
NAME EDIT/SELECT 6 number buttons 7PLAY MODE 3 REC MODE 2 REC-IT 0 REPEAT qh SCROLL wh SLEEP qg T.REC qdTIME 4 YES 5
ALPHABETICAL ORDER
A – M
N – Z
. / > (skip)qk ?/1 (power/standby) 1 m / M (search) qj H (play) w;X (pause) qax (stop) qsz (record) ql
BUTTON DESCRIPTIO
MXD-D400
17
SECTION 3DISASSEMBLY
• This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
3-4. MD MECHANISM DECK(MDM-7S2C)(Page 19)
3-8. FRONT PANEL BLOCKSECTION(Page 21)
3-9. HOLDER SECTION(Page 21)
3-12.BD (MD) BOARD(Page 23)
3-10.OVER WRITE HEAD(HR901)(Page 22)
3-11.OPTICAL PICK-UP(KMS-262E)(Page 22)
3-13.LOADING MOTOR ASSY (M103),SPINDLE NOTOR ASSY (M101),SLED MOTOR ASSY (M102)(Page 23)
3-3. LOADING PANEL (CD)(Page 18)
3-5. CD MECHANISM DECK(CDM66C-30B61M)(Page 19)
3-14.TRAY (66)(Page 24)
3-15.BD (CD) BOARD(Page 25)
3-16.OPTICAL BLOCKSECTION(Page 25)
3-2. CASE (409538)(Page 18)
SET
3-6. TRANSFORMER BOARD(Page 20)
3-7. MAIN BOARD(Page 20)
MXD-D400
18
3-3. LOADING PANEL (CD)
Note: Follow the disassembly procedure in the numerical order given.
3-2. CASE (409538)
1 two screws (case 3 TP2) 2 two screws
(case 3 TP2)
3 two screws (case 3 TP2)
3 case(409538)
3 four claws
4 loading panel (CD)
2
1 Rotate the cam (66) with a screwdriver.
cam (66)
MXD-D400
19
3-4. MD MECHANISM DECK (MDM-7S2C)
3-5. CD MECHANISM DECK (CDM66C-30B61M)
4 two step screws
5 two step screws
7 two insulators
8 two insulators
6
3 two harnesses
2 two screws (+BVTP3 × 8)
9 MD mechanism deck (MDM-7S2C)
1 two wires (flat type)(17 core : CN9, 27 core : CN10)
3 three screws (+BVTP3 × 8)
4
5 CD mechanism deck(CDM66C-30B61M)
1 two wires (flat type)(25 core : CN5,9 core : CN4)
2 connector(CN6)
MXD-D400
20
3-6. TRANSFORMER BOARD
3-7. MAIN BOARD
5 four screws (+BVTT3 × 6)
3 connector(CN652)
4 screw (+BVTT3 × 6)
6 transformer board
1 connector(CN1)
2 connector(CN2)
1 two wires (flat type)(25 core : CN5,17 core : CN9)
4 wire (flat type)(9 core) (CN4)
7 two screws (+BVTP3 × 8)
5 connector (CN6)6 two connectors
(CN1, CN2)
3 wire (flat type) (19 core) (CN11)
2 wire (flat type) (27 core) (CN10)
8 four screws (+BVTP3 × 8)
9 main board
MXD-D400
21
3-8. FRONT PANEL BLOCK SECTION
3-9. HOLDER SECTION
5 screw (+BVTP3 × 8)
0 front panel block section
7 two screws (+BVTP3 × 8)
6 three screws (+BVTP3 × 8)
4 two harnesses
3 two screws (+BVTP3 × 8)
8 claw
9 claw
1 wire (flat type)(CN11)
2 connector (CN12)
1 tension spring (holder)
2 hook
3 holder section
MXD-D400
22
3-10. OVER WRITE HEAD (HR901)
3-11. OPTICAL PICK-UP (KMS-262E)
1 screw (P 1.7 × 6)
2 over write head (HR901)
1 screw (+B 2 × 6)
3 screw (+B 2 × 6)
4 base (BU-A)
5 two screws(+KTP 2 × 6)
2 base (BU-D)
7 flexible board
8 optical pick-up (KMS-262E)
6 main shaft
MXD-D400
23
3-12. BD (MD) BOARD
3-13. LOADING MOTOR ASSY (M103), SPINDLE MOTOR ASSY (M101), SLED MOTOR ASSY (M102)
M102
M101
M103
S102
5 screw (M1.7)
6 flexible board (CN101)
8 BD (MD) board 7 connector (CN104)
3 Remove two solders (loading motor).
2 Remove two solders (spindle motor).
1 Remove two solders (sled motor).
4 Remove three solders .
1 lever (head)
2 belt (loading)
3 torsion spring (SPDL)
9 gear (sa)
4 two screws (PWH 1.7 × 2.5)
8 bushing (rivet)
0 two screws (+PWH 1.7 × 2.5)
qa sled motor assy(M102)
7 spindle motor assy(M101)
5 loading motor assy(M103)
6 three tapping screws(M1.7)
MXD-D400
24
3-14. TRAY (66)
7 tray (66)
4 hook
3 Push the switch (S151) and releace two claws.
switch (S151)
claw of lever (SW)
claw of tray (66)
6 hook
6 hook
4 hook
2
5
1 Turn the cam to the direction of arrow.
MXD-D400
25
3-15. BD (CD) BOARD
3-16. OPTICAL BLOCK SECTION
1 Remove four solders.
3 BD (CD) board2 flexible flat cable (16core) (CN101)
1 floating screw 4 optical block section
3 shaft (BU holder)
2
Rotate the cam (66) in the direction of 2 to move the shaft (BU holder) upper.
cam (66)
26
MXD-D400SECTION 4TEST MODE
Setting the Test ModeProcedure:1. Press the ?/1 button to turn the power on.2. Press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD) knob.3. Turn the [ AMS ] (CD) knob to select the menu.4. Press the [ AMS ] (CD) knob to execute the test mode.
Releasing the Test ModeProcedure 1:1. Press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD) knob.2. Press the ?/1 button to turn the power off.Procedure 2:1. Pull out the AC cord to turn the power off.
Contents of test mode
No. Display Function1 SYS Version System version display
2 BU Test CD BU test mode
3 SERVICE CD Service mode
4 MD Version MD version display
5 MD Test MD test mode*
6 Initialize MD initialize
7 FL ALL ON Fluorescent indicator tube test
8 FL ALL OFF Fluorescent indicator tube test
9 FL ITIMATSU Fluorescent indicator tube test
10 LED CHECK LED check
11 KEY CHECK Keyboard check
12 RM CHECK Remote commander check
13 Play Speed CD x4 speed
* Details of MD test mode is described on and after page 28.
System Version DisplayProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “SYS Version”, and press the [ AMS ] (CD) knob.2. The system version is displayed.3. To exit from this mode, turn the [ AMS ] (CD) knob.4. Press the ?/1 button to turn the power off.
CD Test ModeProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “BU Test”, and press the [ AMS ] (CD) knob.2. “bdt S CURVE” is displayed. This test mode is used in the Electrical Adjustment section.3. Turn the [ AMS ] (CD) knob. “bdt RAM REA”, “bdt RAM WRI”, “bdt COMOUT”, “bdt FB TUNE”, and “bdt ERR RATE”
are displayed.4. To exit from this mode, press the [MENU/NO] button and turn the [ AMS ] (CD) knob to display “bdt ERR RATE”.5. Press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD) knob.6. Press the ?/1 button to turn the power off.
CD service ModeProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “SERVICE”, and press the [ AMS ] (CD) knob.2. “SERVICE MOD” is displayed.3. Press the [SKIP] button, the “SLED OUT” is displayed and the sled moves to the outermost position.4. Press the [GROUP ON/OFF] button, the “SLED IN” is displayed and the sled moves to the innermost position.5. Press the [REC] button, the “TRV ON” is displayed.6. Press the [ AMS ] (CD) knob, then “SERVICE MOD” is displayed again.7. To exit from this mode, press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD)
knob.8. Press the ?/1 button to turn the power off.Note: Always move the pick-up to the most inside position when exiting from this mode.
MD Version DisplayProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “MD Version”, and press the [ AMS ] (CD) knob.
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27
MXD-D400
2. The MD version is displayed.3. To exit from this mode, turn the [ AMS ] (CD) knob.4. Press the ?/1 button to turn the power off.
InitializeProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “Initialize”, and press the [ AMS ] (CD) knob.2. MD is Initialised.3. To exit from this mode, press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD)
knob.4. Press the ?/1 button to turn the power off.
FL ALL ON ModeProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “FL ALL ON”, and press the [ AMS ] (CD) knob.2. All segments of fluorescent indicator tube turn on.3. To exit from this mode, press the [MENU/NO] button, then “FL ALL ON” is displayed again.4. Press the ?/1 button to turn the power off.
FL ALL OFF ModeProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “FL ALL OFF”, and press the [ AMS ] (CD) knob.2. All segments of fluorescent indicator tube turn off.3. To exit from this mode, press the [MENU/NO] button, then “FL ALL OFF” is displayed again.4. Press the ?/1 button to turn the power off.
FL ITIMATSU ModeProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “FL ITIMATSU”, and press the [ AMS ] (CD) knob.2. Checkered patterns of segments are displayed.3. To exit from this mode, press the [MENU/NO] button, then “FL ITIMATSU” is displayed again.4. Press the ?/1 button to turn the power off.
LED Check ModeProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “LED CHECK”, and press the [ AMS ] (CD) knob.2. Turn the [ AMS ] (CD) knob, the LED on front panel will repeat lighting on and off.3. To exit from this mode, press the [MENU/NO] button, then “LED CHECK” is displayed again.4. Press the ?/1 button to turn the power off.
KEY Check ModeProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “KEY CHECK”, and press the [ AMS ] (CD) knob.2. “Got 1 keys” is displayed.3. Press the buttons and knobs, and when all the buttons and knobs are pressed, “Got 27 keys” will be displayed.4. To exit from this mode, press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD)
knob.5. Press the ?/1 button to turn the power off.
Remote Commander CheckProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “RM CHECK”, and press the [ AMS ] (CD) knob.2. Press the H key on the remote commander, then “Got PlayCom” is displayed.3. To exit from this mode, press the [MENU/NO] button, then “RM CHECK” is displayed again.4. Press the ?/1 button to turn the power off.
CD Play Speed Selection ModeProcedure:1. Enter the test mode, then turn the [ AMS ] (CD) knob to display “Play Speed”, and press the [ AMS ] (CD) knob.2. “x4 Play” is displayed. If a CD is in the deck, pressing the H (CD) button executes the 4 times speed playback.3. Press the x button to stop the playback.4. To exit from this mode, press the [MENU/NO] button, then “Play Speed” is displayed again.5. Press the ?/1 button to turn the power off.
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28
MXD-D400
MD SECTION
1. PRECAUTIONS FOR USE OF TEST MODE• As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc
is stopped before setting and removing it.Even if the [EJECT] button is pressed while the disc is rotating during continuous playback, continuous recording, etc., the disc will notstop rotating.Therefore, it will be ejected while rotating.Be sure to press the [EJECT] button after pressing the [MENU/NO] button and the rotation of disc is stopped.
1-1. Recording laser emission mode and operating buttons• Continuous recording mode (CREC 2MODE) (C37)• Laser power check mode (LDPWR CHECK) (C13)• Laser power adjustment mode (LDPWR ADJUST) (C04)• Comparison with initial Iop value written in nonvolatile memory (Iop Compare) (C27)• Write current Iop value read in nonvolatile memory using microprocessor (Iop NV Save) (C06)• Traverse (MO) check (EF MO CHECK) (C14)• Traverse (MO) adjustment (EF MO ADJUST) (C07)• When pressing the [REC ] button.
2. SETTING THE TEST MODE1. Press the ?/1 button to turn the power on.2. Press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD) knob to display “SYS
version”.3. Turn the [ AMS ] (CD) knob and when “MD Test” is displayed, press the [ AMS ] (MD) knob.When the test mode is set, “[Check]” will be displayed. Turn the [ AMS ] (MD) knob switches between the following threegroups; ···Tt [Check] Tt [Service] Tt [Develop] Tt ···.
Note: Do not use the test mode in the [Develop] group.If used, the unit may not operate normally.If the [Develop] group is set accidentally, press the [MENU/NO] button immediately to exit the [Develop] group.
3. RELEASING THE TEST MODEProcedure 1:Press the [ AMS ] (CD) knob and [INPUT] button at the same time, press the [ AMS ] (MD) knob, press the ?/1 buttonto turn the power off.Procedure 2:Pull out the AC cord to return the power off.
4. BASIC OPERATIONS OF THE TEST MODEAll operations are performed using the [ AMS ] (MD) knob, [YES] button, and [MENU/NO] button.The functions of these buttons are as follows.
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Function name Function
[ AMS ] (MD) knob (turn) Select.
[ AMS ] (MD) knob (push) Set Sub menu.
[YES] button Proceeds onto the next step. Finalizes input.
[MENU/NO] button Returns to previous step. Stops operations.
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29
MXD-D400
5. SELECTING THE TEST MODEThere are 26 types of test modes as shown below. The groups can be switched by turning the [ AMS ] (MD) knob. After selectingthe group to be used, press the [YES] button. After setting a certain group, turn the [ AMS ] (MD) knob switches between thesemodes.Refer to “Group” in the table for details can be selected.All items used for servicing can be treated using group [Service]. So be carefully not to enter other groups by mistake.Note: Do not use the test mode in the [Develop] group.
If used, the unit may not operate normally.If the [Develop] group is set accidentally, press the [MENU/NO] button immediately to exit the [Develop] group.
• For details of each adjustment mode, refer to “SECTION 5. Electrical Adjustments”.For details of “Err Display” (C02), refer to “Self-Diagnosis Function” on page 2.
• If a different mode has been selected by mistake, press the [MENU/NO] button to release that mode.• Modes with (×) in the Mark column are not used for servicing and therefore are not described in detail. If these modes are set acciden-
tally, press the [MENU/NO] button to release the mode immediately.
Display
AUTO CHECK
Err Display
TEMP ADJUS
LDPWR ADJUS
Iop Write
Iop NV Save
EF MO ADJUS
EF CD ADJUS
FBIAS ADJUS
AG Set (MO)
AG Set (CD)
TEMP CHECK
LDPWR CHECK
EF MO CHECK
EF CD CHECK
FBIAS CHECK
ScurveCHECK
VERIFYMODE
DETRK CHECK
0920 CHECK
Iop Read
Iop Compare
ADJ CLEAR
INFORMATION
CPLAY 2MODE
CREC 2MODE
Details
Automatic self-diagnosis
Error history display, clear
Temperature compensation offset adjustment
Laser power adjustment
Iop data writing
Writes current Iop value in read nonvolatile memory using microprocessor
Traverse (MO) adjustment
Traverse (CD) adjustment
Focus bias adjustment
Auto gain output level adjustment (MO)
Auto gain output level adjustment (CD)
Temperature compensation offset check
Laser power check
Traverse (MO) check
Traverse (CD) check
Focus bias check
S-curve check
Nonvolatile memory check
Detrack check
Most circumference check
Iop data display
Comparison with initial Iop value written in nonvolatile memory
Initialization of nonvolatile memory for adjustment values
Display of microprocessor version, etc.
Continuous playback mode
Continuous recording mode
No.
C01
C02
C03
C04
C05
C06
C07
C08
C09
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C25
C26
C27
C28
C31
C36
C37
MarkGroup
Check Service
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30
MXD-D400
5-1. Operating the Continuous Playback Mode1. Entering the continuous playback mode(1) Set the disc in the unit. (Whichever recordable discs or discs for playback only are available)(2) Turn the [ AMS ] (MD) knob and display “CPLAY 2MODE” (C36).(3) Press the [YES] button to change the display to “CPLAY 2MID”.(4) When access completes, the display changes to “C = AD = ”.
Note: The numbers “ ” displayed show you error rates and ADER.2. Changing the parts to be played back(1) Press the [YES] button during continuous playback to change the display as below.
When pressed another time, the parts to be played back can be moved.(2) When access completes, the display changes to “C = AD = ”.
Note: The numbers “ ” displayed show you error rates and ADER.3. Ending the continuous playback mode(1) Press the [MENU/NO] button. The display will change to “CPLAY 2MODE” (C36).(2) Press the [EJECT] button and take out the disc.
Note: The playback start addresses for IN, MID, and OUT are as follows.IN 40h clusterMID 300h clusterOUT 700h cluster
5-2. Operating the Continuous Recording Mode (Use only when performing self-recording/palyback check)1. Entering the continuous recording mode(1) Set a recordable disc in the unit.(2) Turn the [ AMS ] (MD) knob and display “CREC 2MODE” (C37).(3) Press the [YES] button to change the display to “CREC 2MID”.(4) When access completes, the display changes to “CREC 1 ( ” and “ REC ” lights up.
Note: The numbers “ ” displayed shows you the recording position addresses.2. Changing the parts to be recorded(1) When the [YES] button is pressed during continuous recording, the display changes as below.
When pressed another time, the parts to be recorded can be changed. “ REC ” goes off.(2) When access completes, the display changes to “CREC 2 ( ” and “ REC ” lights up.
Note: The numbers “ ” displayed shows you the recording position addresses.3. Ending the continuous recording mode(1) Press the [MENU/NO] button. The display changes to “CREC 2MODE” (C37) and “ REC ” goes off.(2) Press the [EJECT] button and take out the disc.
Note 1: The recording start addresses for IN, MID, and OUT are as follows.IN 40h clusterMID 300h clusterOUT 700h cluster
Note 2: The [MENU/NO] button can be used to stop recording anytime.Note 3: Do not perform continuous recording for long periods of time above 5 minutes.Note 4: During continuous recording, be careful not to apply vibration.
6. FUNCTIONS OF OTHER BUTTONS
“CPLAY 2MID” t “CPLAY 2OUT” t “CPLA Y2IN”
“CREC 2MID” t “CREC 2OUT” t “CREC 2IN”
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Sets continuous playback when pressed in the STOP state. When pressed during continuous playback,the tracking servo turns ON/OFF.
Stops continuous playback and continuous recording.
Switches between the pit and groove modes when pressed.
Switches the spindle servo mode (CLV S y CLV A).
Switches the displayed contents each time the button is pressed
Ejects the disc
Starts recording from the present position while servo is turning on.
Function
H (MD)
x (MD)
REC MODE
PLAY MODE (MD)
DISPLAY
EJECT
REC z
31
MXD-D400
7. AUTOMATIC SELF-DIAGNOSIS FUNCTIONThis test mode performs CREC and CPLAY automatically for mainly checking the characteristics of the optical pick-up.To perform this test mode, the laser power must first be checked.Perform AUTO CHECK after the laser power check and Iop check.
Procedure:1. Display “AUTO CHECK” and press the [YES] button. If “LDPWR ” is displayed, it means that the laser power check has not
been performed. In this case, perform the laser power check (C13) and Iop Compare (C27), and then repeat from step 1.2. If a disc is in the mechanical deck, it will be ejected forcibly.
“DISC IN” will be displayed in this case. Load a test disc (MDW-74/GA-1) which can be recorded.3. If a disk is loaded at step 2, the check will start automatically.4. When “XX CHECK” is displayed, the item corresponding to XX will be performed.
When “06 CHECK” completes, the disc loaded at step 2 will be ejected. “DISC IN” will be displayed. Load the check disc (MD) TDYS-1.5. When the disc is loaded in step 4, the check will automatically be resumed from “07 CHECK”.6. After completing to test item 12, check OK or NG will be displayed. If all items are OK, “CHK ALL OK” will be displayed. If any item
is NG, it will be displayed as “NG:xxxx”.
When “CHK ALL OK” is displayed, it means that the optical pick-up is normal. Check the operations of the other spindle motor, sledmotor, etc.When displayed as “NG:xxxx”, it means that the optical pick-up is faulty. In this case, replace the optical pick-up.
32
MXD-D400SECTION 5
ELECTRICAL ADJUSTMENTS
Other faults are suspected.Check the mechanism (sled motor, etc).
Start
NG
NG
NG
OK
OK
OK
Laser Power Check5-7-2.
(See page 36)
5-7-3.
(See page 36)
5-7-4.
(See page 37)
Iop Compare
Auto Check Replace optical pick-up or MDM-7S2C
MD SECTION
Note: Incorrect operations may be performed if the MD test mode is not entered properly.In this case, pull out the AC cord to turn the power off, and retry to enter the MD test mode.
5-1. PARTS REPLACEMENT AND ADJUSTMENTIf malfunctions caused by Optical pick-up such as sound skipping are suspected, follow the following check.
Check before replacement
33
MXD-D400
5-7-4. Auto Check(See page 37)
Start
YES
NO
NO
NO
NO
NO
NO
NO
NO
YES
YES
YES
YES
YES
YES
YES
Replace IC195
Replace OP or IC195
Replace IC101, IC195, or D101
5-12. Iop NV SAVE (See page 40)
Replace OP, IC933, or IC195
Replace OP, IC12, IC933, or IC195
Replace OP, IC101, IC201, or IC195
Replace OP
Replace the spindle motor
End adjustments
After turning off and then on the power, initialize the non-volatile memory (EEPROM)
• AbbreviationOP: optical pick-up
5-8. INITIAL SETTING OF ADJUSTMENT VALUE(See page 38)
5-10. TEMPERATURE COMPENSATION OFFSETADJUSTMENT (See page 39)
5-11. LASER POWER ADJUSTMENT(See page 39)
5-13. TRAVERSE ADJUSTMENT (See page 40)5-14. FOCUS BIAS ADJUSTMENT (See page 41)5-17. AUTO GAIN CONTROL OUTPUT LEVEL
ADJUSTMENT (See page 42)
OP change in Err Display modeIop write
Spindle change in Err Display mode
Adjustment flow
34
MXD-D400
5-2. PRECAUTIONS FOR CHECKING LASERDIODE EMISSION
To check the emission of the laser diode during adjustments, neverview directly from the top as this may lose your eye-sight.
5-3. PRECAUTIONS FOR USE OF OPTICALPICK-UP (KMS-262A/262E)
As the laser diode in the optical pick-up is easily damaged by staticelectricity, solder the laser tap of the flexible board when using it.Before disconnecting the connector, desolder first. Before con-necting the connector, be careful not to remove the solder. Alsotake adequate measures to prevent damage by static electricity.Handle the flexible board with care as it breaks easily.
Optical pick-up flexible board
5-4. HOW TO IDENTIFY OPTICAL PICK-UPKMS-262A/KMS-262E
This set uses optical pick-up KMS-262E in the production, but forthe repair, only the KMS-262A is supplied. As a result, two typesof optical pick-ups are used for this set, and the specified valuesfor the check and adjustment of the laser power vary depending onthe type. Therefore, in performing the check and adjustment ofthe laser power, first make sure the type of optical pick-up. Thetype of optical pick-up can be identified as follows.
pick-up flexible board
laser tap
TYPE2 VR (small) TYPE3 VR (large)
[Top view] [Side view] [Side view][Top view]
– KMS-262A – – KMS-262E –
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MXD-D400
5-8. Initial setting of adjustment value
5-9. Recording of Iop information
5-10. Temperature compensation
offset adjustment
5-11. Laser power adjustment
5-12. Iop NV Save
5-13. Traverse adjustment
5-14. Focus bias adjustment
5-17. Auto gain adjustment
5-7-4. AUTO CHECK
5-5. PRECAUTIONS FOR ADJUSTMENTS1. When replacing the following parts, perform the adjustments
and checks with in the order shown in the following table.2. Set the test mode when performing adjustments.
After completing the adjustments, exit the test mode.Perform the adjustments and checks in “group Service” of thetest mode.
3. Perform the adjustments to be needed in the order shown.4. Use the following tools and measuring devices.
• Check Disc (MD) (TDYS-1) (Parts No. 4-963-646-01)• Test Disk (MDW-74/GA-1) (Parts No. 4-229-747-01)• Laser power meter LPM-8001 (Parts No. J-2501-046-A)
orMD Laser power meter 8010S (Parts No. J-2501-145-A)*1
• Oscilloscope (Measure after performing CAL of prove.)• Digital voltmeter• Thermometer• Jig for checking BD (MD) board waveform
(Parts No. : J-2501-196-A)5. When observing several signals on the oscilloscope, etc.,
make sure that VC and ground do not connect inside the oscil-loscope.(VC and ground will become short-circuited.)
6. Using the above jig enables the waveform to be checked with-out the need to solder.(Refer to Servicing Note on page 7.)
7. As the disc used will affect the adjustment results, make surethat no dusts nor fingerprints are attached to it.
*1 Laser power meterWhen performing laser power checks and adjustment (electricaladjustment), use of the new MD laser power meter 8010S (PartNo. J-2501-145-A) instead of the conventional laser power me-ter is convenient.It sharply reduces the time and trouble to set the laser powermeter sensor onto the objective lens of optical pick-up.
OpticalPick-up
IC101 IC12 IC201 IC933 IC195 D101
Parts to be replaced
Adjustment
36
MXD-D400
5-7. CHECKS PRIOR TO REPAIRSThese checks are performed before replacing parts according to“approximate specifications” to determine the faulty locations. Fordetails, refer to “Checks Prior to Parts Replacement and Adjust-ments” (see page 13).
5-7-1. Temperature Compensation Offset CheckWhen performing adjustments, set the internal temperature androom temperature to 22 to 28ºC.
Checking Procedure:1. Rotate the l AMS L (MD) knob to display “TEMP
CHECK” (C12).2. Press the [YES] button.3. “T=@@(##) [OK” should be displayed. If “T=@@ (##) [NG]”
is displayed, it means that the results are bad.(@@ indicates the current value set, and ## indicates the valuewritten in the non-volatile memory.)
5-7-2. Laser Power CheckBefore checking, check the Iop value of the optical pick-up.(Refer to 5-9. Recording and Displaying the Iop Information (seepage 39.)
Connection:
Checking Procedure:1. Set the laser power meter on the objective lens of the optical
pick-up.Connect the digital volt meter to CN105 pin 1 (I+3V) andCN105 pin 2 (IOP).
2. Then, rotate the l AMS L (MD) knob and display“LDPWR CHECK” (C13).
3. Press the [YES] button once and display “L 0.93 mW $ ”.Check that the reading of the laser power meter becomes thespecified value.
Note: Never allow the laser emission at 8.65 mW for 1.5 seconds or longer.
Specified Value: 0.84 to 0.92 mW (KMS-262A)0.90 to 0.96 mW (KMS-262E)
4. Press the [YES] button once more and display “ L 8.65 mW $”. Check that the reading the laser power meter and digital
volt meter satisfy the specified value.
Specified Value:Laser power meter reading : 8.1 to 8.7 mW (KMS-262A)
8.4 to 8.9 mW (KMS-262E)Digital voltmeter reading : Optical pick-up displayed value ± 10%
(Optical pick-up label)
5. Press the [MENU/NO] button and display “LDPWR CHECK”(C13) and stop the laser emission.(The [MENU/NO] button is effective at all times to stop thelaser emission.)
Note: After step 4, each time the [YES] button is pressed, the displaywill be switched between “L 0.73 mW $ ”, “L 7.70 mW $ ”,and “L Wp $ ”. Nothing needs to be performed here.
Check Location: BD (MD) board (see page 43)
5-7-3. Iop CompareThe current Iop value at laser power 8.65 mW (KMS-262E) or 8.4mW (KMS-262A) output and reference Iop value (set at shipment)written in the nonvolatile memory are compared, and the rate ofincrease/decrease will be displayed in percentage.
Note: Perform this function with the optical pick-up set at roomtemperature.
Procedure:1. Rotate the l AMS L (MD) knob to display “Iop Com-
pare” (C27).2. Press the [YES] button and start measurements.3. When measurements complete, the display changes to
“±xx%yy”.xx is the percentage of increase/decrease, and OK or NG isdisplayed at yy to indicate whether the percentage of increase/decrease is within the allowable range.
4. Press the [MENU/NO] button to end this mode.
5-6. USING THE CONTINUOUSLY RECORDEDDISC
* This disc is used in focus bias adjustment and error rate check.The following describes how to create a continuous recordingdisc.
1. Insert a disc (blank disc) commercially available.2. Rotate the l AMS L (MD) knob and display “CREC
2MODE” (C37).3. Press the [YES] button again to display “CREC 2MID”.
Display “CREC 2(0300)” and start to recording.4. Complete recording within 5 minutes.5. Press the [MENU/NO] button and stop recording .6. Press the [EJECT] button and remove the disc.
The above has been how to create a continuous recorded data forthe focus bias adjustment and error rate check.Note: Be careful not to apply vibration during continuous recording.
Optical pick-upobjective lens
laserpower meter
+–
BD (MD) board
digital voltmeter
CN105 pin 1 (I +3 V)CN105 pin 2 (IOP)
KMS262E20101B0576
Iop = 57.6 mA in this caseIop (mA) = Digital voltmeter reading (mV)/1 (Ω)
(For details of the method forchecking this value, refer to “5-9.Recording and Displaying the IopInformation”.)
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MXD-D400
5-7-4. Auto CheckThis test mode performs CREC and CPLAY automatically formainly checking the characteristics of the optical pick-up. Toperform this test mode, the laser power must first be checked.Perform Auto Check after the laser power check and Iop compare.
Procedure:1. Display “AUTO CHECK” and press the [YES] button. If
“LDPWR ” is displayed, it means that the laserpower check has not been performed. In this case, perform thelaser power check and Iop compare, and then repeat from step1.
2. If a disc is in the mechanical deck, it will be ejected forcibly.“DISC IN” will be displayed in this case. Load a test disc(MDW-74/GA-1) which can be recorded.
3. If a disk is loaded at step 2, the check will start automatically.4. When “XX CHECK” is displayed, the item corresponding to
XX will be performed.When “06 CHECK” completes, the disc loaded at step 2 willbe ejected. “DISC IN” will be displayed. Load the check disc(MD) (TDYS-1).
5. When the disc is loaded in the step 4, the check will automati-cally be resumed from “07 CHECK”.
6. After completing to test item “0C check”, check OK or NGwill be displayed. If all items are OK, “CHECK ALL OK”will be displayed. If any item is NG, it will be displayed as“NG:xxxx”.
When “CHECK ALL OK” is displayed, it means that the opticalpick-up is normal. Check the operations of the other spindle motor,sled motor, etc.When displayed as “NG:xxxx”, it means that the optical pick-upis faulty. In this case, replace the optical pick-up.
5-7-5. Other ChecksAll the following checks are performed by the Auto Check mode.They therefore need not be performed in normal operation.6-6. Traverse Check6-7. Focus Bias Check6-8. C PLAY Check6-9. Self-Recording/Playback Check
5-7-6. Traverse Check
Connection:
Checking Procedure:1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105
pin 6 (VC) on the BD (MD) board.2. Load a disc (any available on the market). (Refer to Note 1)3. Turn the l AMS L (MD) knob to display “EF MO
CHECK”(C14).4. Press the [YES] button to display “EFB = MO-R”.
(Laser power READ power/Focus servo ON/tracking servoOFF/spindle (S) servo ON)
5. Observe the waveform of the oscilloscope, and check that thespecified value is satisfied. Do not turn the l AMS L (MD)knob.(Read power traverse checking)
Traverse Waveform
6. Press the [YES] button to display “EFB = MO-W”.7. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not turn the l AMS L (MD)knob.(Write power traverse checking)
Traverse Waveform
+–
oscilloscope(DC range)
V: 0.1 V/divH: 10 ms/div
BD (MD) board
CN105 pin 4 (TE)CN105 pin 6 (VC)
Note 1:Data will be erased during MO reading if a recorded disc isused in this adjustment.
Note 2: If the traverse waveform is not clear, connect the oscilloscopeas shown in the following figure so that it can be seen moreclearly.
+–
oscilloscope(DC range)
10 pF
330 k ΩCN105 pin 4 (TE)
CN105 pin 6 (VC)
BD (MD) board
A
BVC
Specified value : Below 10% offset value
Offset value (%) = X 100 IA – BI2 (A + B)
A
BVC
Specified value : Below 10% offset value
Offset value (%) = X 100 IA – BI2 (A + B)
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MXD-D400
5-7-8. C PLAY Check
MO Error Rate CheckChecking Procedure:1. Load the test disk (MDW-74/GA-1).2. Turn the l AMS L (MD) knob to display “CPLAY 2
MODE” (C36).3. Press the [YES] button to display “CPLAY 2MID”.4. The display changes to “C = AD = ”.5. If the C error rate is below 20, check that ADER is 00.6. Press the [MENU/NO] button to stop playback, then press the[EJECT] button and take out the test disc.
CD Error Rate CheckChecking Procedure:1. Load the check disc (MD) (TDYS-1).2. Turn the l AMS L (MD) knob to display “CPLAY 2
MODE” (C36).3. Press the [YES] button to display “CPLAY 2MID”.4. The display changes to “C = AD = ”.5. Check that the C error rate is below 20.6. Press the [MENU/NO] button to stop playback, then press the[EJECT] button and take out the check disc.
5-7-9. Self-Recording/playback CheckPrepare a continuous recording disc using the unit to be repairedand check the error rate.
Checking Procedure:1. Load a recordable disc (blank disc).2. Turn the l AMS L (MD) knob to display
“CREC 2MODE” (C37).3. Press the [YES] button to display “CREC 2MID”.4. When recording starts, lights up “ REC ” and display “CREC
2 @@@@” (@@@@ is the address).5. About 1 minute later, press the [MENU/NO] button to stop
continuous recording.6. Turn the l AMS L (MD) knob to display “CPLAY 2
MODE” (C36).7. Press the [YES] button to display “CPLAY 2MID”.8. “C = AD = ” will be displayed.9. Check that the C error becomes below 20 and the AD error
below 2.10. Press the [MENU/NO] button to stop playback, then press the[EJECT] button and take out the disc.
8. Press the [YES] button to display “EFB = MO-P”.Then, the optical pick-up moves to the pit area automaticallyand servo is imposed.
9. Observe the waveform of the oscilloscope, and check that thespecified value is satisfied. Do not turn the l AMS L (MD)knob.
Traverse Waveform
10. Press the [YES] button to display “EF MO CHECK (C14)”.The disc stops rotating automatically.
11. Press the [EJECT] button and take out the disc.12. Load the check disc (MD) (TDYS-1).13. Turn the l AMS L (MD) knob and display “EF CD
CHECK” (C15).14. Press the [YES] button to display “EFB = CD”. Servo is
imposed automatically.15. Observe the waveform of the oscilloscope, and check that the
specified value is satisfied. Do not turn the l AMS L (MD)knob.
Traverse Waveform
16. Press the [YES] button to display “EF CD CHECK” (C15).17. Press the [EJECT] button and take out the check disc (MD)
(TDYS-1).
Check Location: BD (MD) board (see page 43)
A
BVC
Specified value : Below 10% offset value
Offset value (%) = X 100 IA – BI2 (A + B)
A
BVC
Specified value : Below 10% offset value
Offset value (%) = X 100 IA – BI2 (A + B)
5-7-7. Focus Bias CheckChange the focus bias and check the focus tolerance amount.Checking Procedure:1. Load the test disk (MDW-74/GA-1).2. Turn the l AMS L (MD) knob to display “CPLAY 2
MODE” (C36).3. Press the [YES] button to display “CPLAY 2MID”.4. Press the [MENU/NO] button when “C = AD = ” is
displayed.5. Turn the l AMS L (MD) knob to display “FBIAS
CHECK” (C16).6. Press the [YES] button to display “ / c = ”.
The first four digits indicate the C error rate, the two digitsafter [/] indicate ADER, and the 2 digits after [c =] indicatethe focus bias value.
7. Press the [YES] button to display “ / b = ”.Check that the C error is about 220 and ADER is below 2.
8. Press the [YES] button to display “ / a = ”.Check that the C error is about 220 and ADER is below 2.
9. Press the [MENU/NO] button, then press the [EJECT] buttonand take out the test disc.
5-8. INITIAL SETTING OF ADJUSTMENTVALUE
Note:Mode which sets the adjustment results recorded in the non-volatilememory to the initial setting value. However the results of the tempera-ture compensation offset adjustment will not change to the initial settingvalue.If initial setting is performed, perform all adjustments again excluding thetemperature compensation offset adjustment.For details of the initial setting, refer to “5-5. Precautions for Adjustments”and execute the initial setting before the adjustment as required.
Setting Procedure:1. Turn the l AMS L (MD) knob to display “ADJ CLEAR”
(C28).2. Press the [YES] button. “Complete!” will be displayed mo-
mentarily and initial setting will be executed, after which “ADJCLEAR” (C28) will be displayed.
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MXD-D400
5-11. LASER POWER ADJUSTMENTCheck the Iop value of the optical pick-up before adjustments.(Refer to 5-9. Recording and Displaying Iop Information)
Connection:
Adjusting Procedure:1. Set the laser power meter on the objective lens of the optical
pick-up.Connect the digital voltmeter to CN105 pin 1 (I+3V) andCN105 pin 2 (IOP) on the BD (MD) board.
2. Turn the l AMS L (MD) knob to display “LDPWRADJUS” (C04).(Laser power : For adjustment)
3. Press the [YES] button once to display “L 0.93 mW $ ”.4. Turn the l AMS L (MD) knob so that the reading of the
laser power meter becomes the specified value. Press the [YES]button after setting the range knob of the laser power meter to10 mW, and save the adjustment results. (“L SAVE $ ” willbe displayed for a moment)
Specified Value: 0.85 to 0.91 mW (KMS-262A)0.90 to 0.95 mW (KMS-262E)
5. Then “L 8.65 mW $ ” will be displayed.6. Turn the l AMS L (MD) knob so that the reading of the
laser power meter becomes the specified value, press the [YES]button to save it.
Specified Value: 8.2 to 8.6 mW (KMS-262A)8.5 to 8.8 mW (KMS-262E)
Note: Do not perform the emission with 8.65 mW more than 15 secondscontinuously.
7. Then, turn the l AMS L (MD) knob to display “LDPWRCHECK” (C13).
8. Press the [YES] button once to display “L 0.93 mW $ ”.Check that the reading of the laser power meter becomes thespecified value.
Specified Value: 0.84 to 0.92 mW (KMS-262A)0.90 to 0.96 mW (KMS-262E)
5-9. RECORDING AND DISPLAYING THE IOPINFORMATION
The Iop data can be recorded in the non-volatile memory. The Iopvalue on the optical pick-up label and the Iop value after the ad-justment will be recorded. Recording these data eliminates the needto read the label on the optical pick-up.
Recording Procedure:1. Turn the l AMS L (MD) knob to display “Iop Write”
(C05), and press the [YES] button.2. The display becomes “Ref=@@@.@” (@ is an arbitrary num-
ber) and the numbers which can be changed will blink.3. Input the Iop value on the optical pick-up label.
To select the number : Turn the l AMS L (MD) knob.To select the digit : Press the l AMS L (MD) knob
4. When the [YES] button is pressed, the display becomes“Measu=@@@.@” (@ is an arbitrary number).
5. As the adjustment results are recorded for the 4 value. Leave itas it is and press the [YES] button.
6. “Complete!!” will be displayed momentarily. The value willbe recorded in the non-volatile memory and the display willbecome “Iop Write” (C05).
Display Procedure:1. Turn the l AMS L (MD) knob to display “Iop Read”
(C26), and press the [YES] button.2. “@@.@/##.#” is displayed and the recorded contents are dis-
played.@@.@ indicates the Iop value on the optical pick-up label.##.# indicates the Iop value after adjustment
3. To end, press the l AMS L (MD) button or [MENU/NO]button to display “Iop Read” (C26).
Optical pick-upobjective lens
laserpower meter
+–
BD (MD) board
digital voltmeter
CN105 pin 1 (I +3 V)CN105 pin 2 (IOP)
5-10. TEMPERATURE COMPENSATION OFFSETADJUSTMENT
Save the temperature data at that time in the non-volatile memoryas 25 ˚C reference data.Note:1. Usually, do not perform this adjustment.2. Perform this adjustment in an ambient temperature of 22 ˚C to 28 ˚C.
Perform it immediately after the power is turned on when the internaltemperature of the unit is the same as the ambient temperature of 22 Cto 28 ˚C.
3. When D101 has been replaced, perform this adjustment after the tem-perature of this part has become the ambient temperature.
Adjusting Procedure:1. Turn the l AMS L (MD) knob to display “TEMP
ADJUS” (C03).2. Press the [YES] button to select the “TEMP ADJUS” mode.3. “TEMP = [OK” and the current temperature data will be
displayed.4. To save the data, press the [YES] button.
When not saving the data, press the [MENU/NO] button.5. When the [YES] button is pressed, “TEMP = SAVE” will
be displayed and turned back to “TEMP ADJUS” (C03) dis-play then. When the [MENU/NO] button is pressed, “TEMPADJUS” (C03) will be displayed immediately.
Specified Value:The “TEMP = ” should be within “E0 - EF”, “F0 - FF”, “00 -0F”, “10 - 1F” and “20 - 2F”.
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MXD-D400
9. Press the [YES] button once more to display “L 8.65 mW $”. Check that the reading the laser power meter and digital
voltmeter satisfy the specified value.Note down the digital voltmeter reading value.
Specified Value:Laser power meter reading: 8.1 to 8.7 mW (KMS-262A)
8.4 to 8.9 mW (KMS-262E)Digital voltmeter reading : Value on the optical pick-up label
±10%(Optical pick-up label)
10. Press the [MENU/NO] button to display “LDPWR CHECK”(C13) and stop the laser emission.(The [MENU/NO] button is effective at all times to stop thelaser emission.)
11. Turn the l AMS L (MD) knob to display “Iop Write”(C05).
12. Press the [YES] button. When the display becomesRef=@@@.@ (@ is an arbitrary number), press the [YES]button to display “Measu=@@@.@” (@ is an arbitrary num-ber).
13. The numbers which can be changed will blink. Input the Iopvalue noted down at step 9.To select the number : Turn the l AMS L (MD) knob.To select the digit : Press the l AMS L (MD) knob.
14. When the [YES] button is pressed, “Complete!” will be dis-played momentarily. The value will be recorded in the non-volatile memory and the display will become “Iop Write”(C05).
Note: After step 9, each time the [YES] button is pressed, the displaywill be switched “L 0.73 mW $ ”, “L 7.70 mW $ ”, and “L
Wp $ ”. Nothing needs to be performed here.
Adjustment Location: BD (MD) board (see page 43)
11. Iop NV SAVEWrite the reference values in the nonvolatile memory to perform“Iop compare”. As this involves rewriting the reference values, donot perform this procedure except when adjusting the laser powerduring replacement of the optical pick-up and when replacing theIC12. Otherwise the optical pick-up check may deteriorate.Note: Perform this function with the optical pick-up set at room tempera-
ture.
Procedure:1. Rotate the l AMS L (MD) knob to display “Iop NV
Save” (C06).2. Press the [YES] button and display “Iop [stop]”.3. After the display changes to “Iop =xxsave?”, press the [YES]
button.4. After “Complete!” is displayed momentarily, the display
changes to “Iop 8.4 mW”.5. After the display changes to “Iop=yysave?”, press the [YES]
button.6. When “Complete!” is displayed, it means that Iop NV saving
has been completed.
5-13. TRAVERSE ADJUSTMENT
Connection:
Adjusting Procedure:1. Connect an oscilloscope to CN105 pin 4 (TE) and CN105
pin 6 (VC) on the BD (MD) board.2. Load a disc (any available on the market). (Refer to Note 1)3. Turn the l AMS L (MD) knob to display “EF MO
ADJUS” (C07).4. Press the [YES] button to display “EFB = MO-R”.
(Laser power READ power/Focus servo ON/tracking servoOFF/spindle (S) servo ON)
5. Turn the l AMS L (MD) knob so that the waveform ofthe oscilloscope becomes the specified value.(When the l AMS L (MD) knob is turned, the of“EFB= ” changes and the waveform changes.) In this ad-justment, waveform varies at intervals of approx. 2%. Adjustthe waveform so that the specified value is satisfied as muchas possible.(Read power traverse adjustment)
Traverse Waveform
6. Press the [YES] button and save the result of adjustment to thenon-volatile memory (“EFB = SAVE” will be displayed fora moment. Then “EFB = MO-W” will be displayed).
Note 1:Data will be erased during MO reading if a recorded disc isused in this adjustment.
Note 2:If the traverse waveform is not clear, connect the oscilloscopeas shown in the following figure so that it can be seen moreclearly.
+–
oscilloscope(DC range)
10 pF
330 k ΩCN105 pin 4 (TE)
CN105 pin 6 (VC)
BD (MD) board
+–
oscilloscope(DC range)
V: 0.1 V/divH: 10 ms/div
BD (MD) board
CN105 pin 4 (TE)CN105 pin 6 (VC)
A
BVC
Specification A = B
KMS262E20101B0576
Iop = 57.6 mA in this caseIop (mA) = Digital voltmeter reading (mV)/1 (Ω)
(For details of the method forchecking this value, refer to “5-9.Recording and Displaying the IopInformation”.)
41
MXD-D400
7. Turn the l AMS L (MD) knob so that the waveform ofthe oscilloscope becomes the specified value.(When the l AMS L (MD) knob is turned, the of“EFB= ” changes and the waveform changes.) In this ad-justment, waveform varies at intervals of approx. 2%. Adjustthe waveform so that the specified value is satisfied as muchas possible.(Write power traverse adjustment)
Traverse Waveform
8. Press the [YES] button, and save the adjustment results in thenon-volatile memory. (“EFB = SAVE” will be displayedfor a moment)
9. “EFB = MO-P” will be displayed.The optical pick-up moves to the pit area automatically andservo is imposed.
10. Turn the l AMS L (MD) knob until the waveform ofthe oscilloscope moves closer to the specified value.In this adjustment, waveform varies at intervals of approx. 2%.Adjust the waveform so that the specified value is satisfied asmuch as possible.
Traverse Waveform
11. Press the [YES] button, and save the adjustment results in thenon-volatile memory. (“EFB = SAVE” will be displayedfor a moment.)Next “EF MO ADJUS” (C07) is displayed. The disc stops ro-tating automatically.
12. Press the [EJECT] button and take out the disc.13. Load the check disc (MD) (TDYS-1).14. Turn the l AMS L (MD) knob to display “EF CD
ADJUS” (C08).15. Press the [YES] button to display “EFB = CD”. Servo is
imposed automatically.16. Turn the l AMS L (MD) knob so that the waveform of
the oscilloscope moves closer to the specified value.In this adjustment, waveform varies at intervals of approx. 2%.Adjust the waveform so that the specified value is satisfied asmuch as possible.
Traverse Waveform
17. Press the [YES] button, display “EFB = SAVE” for a mo-ment and save the adjustment results in the non-volatilememory.Next “EF CD ADJUS” (C08) will be displayed.
18. Press the [EJECT] button and take out the disc (MD) (TDYS-1).
Adjustment Location: BD (MD) board (see page 43)
5-14. FOCUS BIAS ADJUSTMENT
Adjusting Procedure:1. Load the test disc (MDW-74/GA-1).2. Turn the l AMS L (MD) knob to display “CPLAY 2
MODE” (C36).3. Press the [YES] button to display “CPLAY 2MID”.4. Press the [MENU/NO] button when “C = AD = ” is
displayed.5. Turn the l AMS L (MD) knob to display “FBIAS
ADJUS” (C09).6. Press the [YES] button to display “ / a = ”.
The first four digits indicate the C error rate, the two digitsafter “/ ” indicate ADER, and the 2 digits after “a =” indicatethe focus bias value.
7. Turn the l AMS L (MD) knob clockwise and find thefocus bias value at which the C error rate becomes about 200(refer to Note 2).
8. Press the [YES] button to display “ / b = ”.9. Turn the l AMS L (MD) knob counterclockwise and find
the focus bias value at which the C error rate becomes about200.
10. Press the [YES] button to display “ / c = ”.11. Check that the C error rate is below 20 and ADER is 00. Then
press the [YES] button.12. If the “( )” in “ - - ( )” is above 20, press the [YES]
button.If below 20, press the [MENU/NO] button and repeat the ad-justment from step 2.
13. Press the [EJECT] button and take out the disc.Note 1: The relation between the C error and focus bias is as shown in
the following figure. Find points A and B in the following figureusing the above adjustment. The focal point position C is auto-matically calculated from points A and B.
Note 2: As the C error rate changes, perform the adjustment using theaverage vale.
A
BVC
Specification A = B
A
BVC
Specification A = B
A
BVC
Specification A = B
C error
about 200
B C A
Focus bias value
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MXD-D400
5-15. ERROR RATE CHECK
5-15-1. CD Error Rate CheckChecking Procedure:1. Load the check disc (MD) (TDYS-1).2. Turn the l AMS L (MD) knob to display “CPLAY 2
MODE” (C36).3. Press the [YES] button twice and display “CPLAY 2MID”.4. The display changes to “C = AD = ”.5. Check that the C error rate is below 20.6. Press the [MENU/NO] button to stop playback, then press the[EJECT] button and take out the check disc.
5-15-2. MO Error Rate CheckChecking Procedure:1. Load the continuously-recorded disc. (Refer to “5-6. USING
THE CONTINUOUSLY RECORDED DISC”)2. Turn the l AMS L (MD) knob to display “CPLAY 2
MODE” (C36).3. Press the [YES] button to display “CPLAY 2MID”.4. The display changes to “C = AD = ”.5. If the C error rate is below 20, check that ADER is 00.6. Press the [MENU/NO] button to stop playback, then press the[EJECT] button and take out the test disc.
5-16. FOCUS BIAS CHECKChange the focus bias and check the focus tolerance amount.
Checking Procedure:1. Load the continuously-recorded disc. (Refer to “5-6. USING
THE CONTINUOUSLY RECORDED DISC”)2. Turn the l AMS L (MD) knob to display “CPLAY 2
MODE” (C36).3. Press the [YES] button twice to display “CPLAY 2MID”.4. Press the [MENU/NO] button when “C = AD = ” is
displayed.5. Turn the l AMS L (MD) knob to display “FBIAS
CHECK” (C16).6. Press the [YES] button to display “ / c = ”.
The first four digits indicate the C error rate, the two digitsafter “/ ” indicate ADER, and the 2 digits after “c =” indicatethe focus bias value.
7. Press the [YES] button and display “ / b = ”.Check that the C error is about 220 and ADER is below 2.
8. Press the [YES] button and display “ / a = ”.Check that the C error is about 220 and ADER is below 2
9. Press the [MENU/NO] button, then press the [EJECT] buttonand take out the disc.
Note: If the C error and ADER are above other than the specified valueat points a (step 8. in the above) or b (step 7. in the above), thefocus bias adjustment may not have been carried out properly.Adjust perform the beginning again.
5-17. AUTO GAIN CONTROL OUTPUT LEVELADJUSTMENT
Be sure to perform this adjustment when the optical pick-up isreplaced.If the adjustment results becomes “Adjust NG!”, the optical pick-up may be faulty or the servo system circuits may be abnormal.
5-17-1. CD Auto Gain Control Output Level AdjustmentAdjusting Procedure:1. Load the check disc (MD) (TDYS-1).2. Turn the l AMS L (MD) knob to display “AG Set (CD)”
(C11).3. When the [YES] button is pressed, the adjustment will be per-
formed automatically.“Complete!!” will then be displayed momentarily when thevalue is recorded in the non-volatile memory, after which thedisplay changes to “AG Set (CD)” (C11).
4. Press the [EJECT] button and take out the check disc.
5-17-2. MO Auto Gain Control Output Level AdjustmentAdjusting Procedure:1. Load the test disc (MDW-74/GA-1).2. Turn the l AMS L (MD) knob to display “AG Set (MO)”
(C10).3. When the [YES] button is pressed, the adjustment will be per-
formed automatically.“Complete!!” will then be displayed momentarily when thevalue is recorded in the non-volatile memory, after which thedisplay changes to “AG Set (MO)” (C10).
4. Press the [EJECT] button and take out the test disc.
43
MXD-D400
D101CN101
CN103 CN102
CN105
IC201
IC701
IC101
IC195
IC933
1 1
1
7
2717
– BD (MD) BOARD (Side A) –
– BD (MD) BOARD (Side B) –
1. I+3V2. IOP3. GND4. TE5. FE6. VC7. RF
Adjustment and checking Location:
Note: It is useful to use the jig for checking the waveform. (Refer to Ser-vicing Notes on page 11)
44
MXD-D400
CD SECTION
Note:1. CD Block is basically designed to operate without adjustment. There-
fore, check each item in order given.2. Use YEDS-18 disc (3-702-101-01) unless otherwise indicated.3. Use an oscilloscope with more than 10MΩ impedance.4. Clean the object lens by an applicator with neutral detergent when the
signal level is low than specified value with the following checks.
S Curve CheckConnection:
Procedure:1. Connect oscilloscope to test point TP (FE) and TP (VC) on
BD (CD) board.2. Turn the power on.3. Put disc (YEDS-18) in.4. Enter the test mode, select the BU Test and press
the l AMS L (CD) knob to display “bdt S CURVED”.5. Press the l AMS L (CD) knob. “LD AL” is displayed
and playback starts automatically.6. Check the oscilloscope waveform (S-curve) is symmetrical
between A and B. And confirm peak to peak level within 3.6 ±0.5 Vp-p.
7. Press the [MENU/NO] button to stop playback.8. Exit from the test mode.
(Refer to the TEST MODE Section)
S-curve waveform
Note: • Try to measure several times to make sure than the ratio of A : Bor B : A is more than 10 : 7.
• Take sweep time as long as possible and light up thebrightness to obtain best waveform.
Check Location: BD (CD) board (see page 45)
RF Level CheckConnection:
Procedure:1. Connect oscilloscope to test point TP (RFDC) and TP (VC) on
BD (CD) board.2. Turn ON the power.3. Put disc (YEDS-18) in to play the number five track.4. Confirm that oscilloscope waveform is clear and check RF sig-
nal level is correct or not.
+–
BD (CD) board
TP (FE)TP (VC)
oscilloscope(DC range)
A
B
symmetry
within 3.6 ± 0.5 Vp-p
+–
BD (CD) board
TP (RFDC)TP (VC)
oscilloscope(AC range)
Note: A clear RF signal waveform means that the shape “◊” can be clearlydistinguished at the center of the waveform.
RF signal waveform
Checking Location: BD (CD) board (see page 45)
E-F Balance (1 Track Jump) CheckConnection:
Procedure:1. Connect oscilloscope to test point TP (TE) and TP (VC) on
BD (CD) board.2. Press the ?/1 button to turn the power on.3. Put disc (YEDS-18) in to play the number five track.4. Enter the service mode, press the [INPUT] button until “TRV
ON” is displayed. (The tracking servo and the sledding servoare turned OFF)
5. Rotate RV101 on BD (CD) board to adjust A (DC voltage) ofthe center of the oscilloscope waveform becomes 0 V.
6. Enter the service mode, press the [INPUT] button until “TRVON” is displayed (The tracking servo and the sledding servoare turned OFF), confirm A (DC voltage) at that time is 0 V.
Traverse Waveform
Checking Location: BD (CD) board (see page 45)
Adjustment after CD Base Unit (BU-30BBD61B) is ReplacedPerform the “E-F Balance (1 track jump) check”.
VOLT/DIV: 200 mVTIME/DIV: 500 ns
(normal speed)
level: 1.1 ±0.3 Vp-p
+–
BD (CD) board
TP (TE)TP (VC)
oscilloscope(DC range)
0V
Center ofwaveform
B
Symmetry
A (DC voltage)
level=1.1 ±0.6Vp-p
4545
MXD-D400
TP (VC)
TP (TE)
TP (RFAC)
TP (FE)
RV101
– BD (CD) BOARD (Conductor Side) –
Checking Location:
MXD-D400
4646
SECTION 6DIAGRAMS
6-1. BLOCK DIAGRAM – CD Section –
PD1
PD2
I5-10
I1-6
LD
VC
VCC
7
5
3
1
2
4 RF+3.3V
GND
PD
IL-SW
VR
FOCUSCOIL
TRACKINGCOIL
RF AMP,FOCUS TRACKING ERROR AMP
IC103
VC
A
B
C
D
E
F
LD
PD
FOCUS/TRACKING COIL DRIVE,SLED/SPINDLE MOTOR DRIVE
IC102
(SLED)M102
M101M(SPINDLE)
F+
F-
T+
T-
CD DSPIC101
64D OUT
RFDCI
RFDC
FE
FEI
SW
TE_BAL
66PCMD
4DATA
DOUT
AOUT
33.8688MHz
6CLOK
5XLAT
77SQCK
8SCLK
15SCOR
76SQSO
2XRST
7SENS
IC6 (1/2)CD MECHANISM CONTROLLER
55INSW
OUTSW
RF AC
TE
IC104
D/A CONVERTER,MP3 DECODER
SDIO12 30TXO
67BCLK BCKIA13
65LRCK LRCKIA14
71XTAI
72XTAO XI62
XO635MIDIO
6MICK
7MIACK
39REQ
1RESET
53LOADNEG
LOADPOS
3
4
MICS
MILP
RV101
X201
OUT1IN1
OUT2IN2
LOADING MOTOR DRIVEIC10
M151(LOADING)
5
6
2
1054
S272(LOADING IN)
S271(LOADING OUT)56
OPTICAL PICK-UPBLOCK
(A-MAX.4T)
M
M
27
6
7
8
9
10
11
1
2
19
• SIGNAL PATH
: CD PLAY (ANALOG OUT)
: CD PLAY (DIGITAL OUT)
• R-ch is omitted due to same as L-ch.
AUTOMATICPOWER CONTROL
Q701
28
29
16
17
12
15
18
VO1+52
VO1-47
VO2+56
VO2-55
VO3+2
VO3-1
VO4+10
VO4-5
35IN1+
34IN1-
32IN2+
31IN2-
27IN3+
26IN3-
24IN4R
8STBY
19SW
MDP25
SRDR30
SFDR29
TRDR32
TFDR31
FRDR34
FFDR33
RFAC50
RFDC43
FE39
TE41
SE40
SSTP26
DATA35
CLK37
XLT38
SQCLK33
SCOR20
SUBQ32
SENSE34
MP3DOUT5MP3DIN6
MP3CLK
MP3CS
MP3LT
7
MP3ACK10
MP3RESET19
22
MP3REQ18
BDRST45
CTRL127
X425
23
PWM324
PWM226
PWM128
LDON47
M
A (Page 48)
DOUT TO MDB (Page 47)
C (Page 48)
OUT SW73AUTO PWRON D (Page 47)
Y2
B
Y3
A
SELECTORIC105
9 10
2
4
Y0
Y1
1
5Y3
MXD-D400
4747
6-2. BLOCK DIAGRAM – MD Section –
F
E
C
D
B
A
LASERDIODE
DETECTOR
OPTICAL PICK-UP BLOCK(KMS-262E)
LDPOWER
PD
LD
B
A
D
E
TRACKINGCOIL
FOCUSCOIL
F+
F-
T+
T-
VCC
VC
E8
F9
APC11
PD10
OUT3F12
OUT3R10
21
23
27
25
6
8
14IN3F
15IN3R
19
18
29
30
4
16PSB
TRDR102
TFDR103
FRDR105
FFDR104
MD DSPIC201
RFIN70
35ABCD
34FE
26TE
ABCD78
FE79
TE86
SE85
26D OUT
6SWDT
7SCLK
8XLAT
38XOE
37XWE
47XRAS
12XRST
46XCAS
38RF
28SE
MD MECHANISM CONTROLLERIC12
SCLK33
10SRDT
11SENS
SRDT32
16XINTJI
C
J
I
F
A4
D7
I1
J2
C6
B5
VR
PD
ILCC
HFMODULE
MOD
OUT1F
OUT1R
OUT2F
OUT2R
OUT4F
OUT4R
IN1F
IN1R
IN2F
IN2R
IN4F
3IN4R
SDA
SCL
WP
SFDR108
SRDR107
33AUX
37PEAK
36BOTM
32ADFG
16SWDT
17SCLK
18XLAT
20FCONT
12APC REF
AUX80
PEAK76
BOTM77
ADFG91
DTRF99
CLRF98
XLRF97
FCONT94
APC REF100
SPRD109
SPFR110
OVER WRITEHEAD DRIVE
IC181, Q181, 182
HR901OVER WRITE
HEADEFMO115
XT17
14DQSY
13SQSY
2MNT1
3MNT2DRAMIC152
SENS58
XINT25DQSY18SQSY20
SHOCK59XBUSY48
SWDT31
XLATCH50
DRESET52
IOP89
LD ON57
WRPWR54
MOD56
15RPWR
65LOAD LO
5 2
106
M M103(LOADING)
LOADING MOTOR DRIVEIC18
4REFERENCEVOLTAGESWITCH
Q7, 8
RESETSWITCH
Q2
+3.3V
66LOAD OUT
67LOAD IN IN1 OUT1
OUT2IN2
VZ
44PROTECT
61REFELECT
53RECSW
51PLAYSW
49OUTSW
55LIMITINS101
(LIMIT IN)
S103(OUT)
S104(PLAY)
S105(REC)
S102(REFRECT/PROTECT)
60SDA
45SCL
47EEP-WP
IC195EEPROM
5
6
7
30IIC DATA
29IIC CLK
A00
A10
3
24
25
2
.
43
45
44
42
.D0
D3
DQ2,
DQ3,
DQ4,
DQ1
A0
A10
OE
WE
RAS
CAS
22
4
5
23
..
..
9
12
15.
19
21.
8.
54
56
60.
59
55.
.
.
52.
53.
51.
49.
48.
50.
24DIN0
25DIN
CLKA
XIN
XOUT
5VCO
IC803
8
28OSC
XIN 15
XOUT 13
X804
X210MHz
136FS256
11.2896MHz
LASER ONSWITCH
Q201
HF MODULESWITCH
Q701 – 704
LD DRIVEQ202, 203
• SIGNAL PATH: MD PLAY
• R-ch is omitted due to same as L-ch.
: MD REC: CD PLAY (DIGITAL OUT)
RF AMP,FOCUS/TRACKING ERROR AMP
IC101
FOCUS/TRACKING COIL DRIVE,SPINDLE/SLED MOTOR DRIVE
IC401
M102(SLED) MM
M101(SPINDLE) MM
IC701COMPARATOR
XIN-T 10
XOUT-T 11
X332.768kHz
CODEC DOUTE (Page 48)
D OUT TO MDB (Page 46)
MD DOUTF (Page 48)
OUT SWD (Page 46)
IIC DATA, IIC CLK,LEVEL L, LEVEL R,
P DOWN, SRST, MD RESETG (Page 48)
MDRESET
IIC DATA
IIC CLK
3LEVELL
4LEVELR
LEVEL L
LEVEL R
19PDOWN
12SRST
P DOWN
SRST
MXD-D400
4848
6-3. BLOCK DIAGRAM – MAIN Section –
MUTINGCONTROL
Q3
ROTALYENCODER
S717
RELAYDRIVE
Q4
MUTINGQ5, 6
REGULATORIC7
LITHIUMBATTERY
BT1
D23
MD
RESE
T
SRST
P DO
WN
(AC IN)
POWER TRANSFORMER(MAIN)TR651
RECTD14, 15
RECTD6, 7
RECTD8, 9
RECTD10, 11AMP B–
AMP B+
RECTD16, 17
RECTD18
RY650
LINE FILTERLF651
POWER ON/OFFRELAY DRIVE
Q1
DOUTA
G
• SIGNAL PATH
: AUDIO
• R-ch is omitted due to same as L-ch.
(Page 47)
(Page 46)
AOUTC(Page 46)
J790
-1
-2
PHONES
RV790PHONE LEVEL
RY650
-2
-1
POWER TRANSFORMER(SUB)TR652
EVER+3.3V
RECTD2, 3
+3.3VREGULATOR
IC1
+8V
FL B+
LOADING +10V
+8VREGULATOR
IC4
–32V–32V
REGULATORIC3
CD +2.5V
CD +3.3V
+2.5V/+3.3VREGULATOR
IC122
RF +3.3V+3.3V
REGULATORIC9
+3.3VREGULATOR
IC933
MD +2.6V
MD +5V
ANA +5V
SYS +3.5V
BACKUP +3.3V
MD +3.3V
+2.6VREGULATOR
IC926
EVER+3.3V
RESET SIGNALGENERATOR
IC2
REMOTE CONTROLRECEIVER
IC781
SPDIFBUFFER
IC8
OPTICALRECEIVER
IC15
MD DOUTF(Page 47)
+5VREGULATOR
IC5
RELAY+5VFL B+
D28
X116MHz
HEADPHONEAMPIC17
LINE AMPIC13
10 7S.RST
13 P.DOWN
4 ANA5
5 PH5
VCC26VCC1
2AC
8 SYS3.5
11 V.BAK
A/D, D/A CONVERTERIC11
6
INT0
7
INT1
5
PDOW
N
9
CDTO
8
CDTI
10
CCLK
11
CS
42 RX1
44 RX2
2 RX3
LEVE
L R
LEVE
L L
IIC C
LKIIC
DAT
A
R
ANALOGOUTPUT
OPTICALDIGITALINPUT
OPTICALTRANSCEIVER
IC1414 TX2
OPTICALDIGITALOUTPUT
S700 –704,S720
L
R
ANALOGINPUT
L
J1
38L-IN
37R-IN
32L-OUT
33R-OUT
CODECDOUT
E(Page 47) 13 TX1
FL/LED DRIVERIC760
70DA69CP
39 COM01
SEG01
SEG35
62 COM24
SYSTEM CONTROLLERIC6 (2/2)
90
LEVE
LR
88
MDR
ESET
12
RESE
T
74
P3
73
P2
72
P1
29
IICCL
K
30
IICDA
TA
89
LEVE
LL
97 KEY0
86 MDJOG1
87 MDJOG0
66SCMS
15XIN
85LINEMUTEAMUTE
79MAINACCUT
11STB
1 DRVDAT2 DRVCLK3 DRVCS
81 DRVRST
LINE AMPIC16
75
ADAI
NT0
74
ADAI
NT1
76
ADAR
ST
72
ADAD
ATAI
70
ADAD
ATAO
49
CDM
P3SE
L
69
ADAC
LK
68
CS_A
DALA
T
IIC DATA, IIC CLK,LEVEL L, LEVEL R,P DOWN, SRST, MD RESET
: MD PLAY
: MD REC
: CD PLAY (ANALOG OUT)
: CD PLAY (DIGITAL OUT)
: OPTICAL DIGITAL IN
: OPTICAL DIGITAL OUT
S710 –716,S718, 719 95 KEY1
S706, 721, 722,S725 –729, 1701
l AMS L
(MD)
94 KEY2
13XOUT
ROTALYENCODER
S723
FLUORESCENTINDICATOR
TUBEFL750
77 CDJOG1
91 RECLEVEL
78 CDJOG0
RV780
l AMS L
(CD)
STANDBYD726
REC REVEL
4 SIRCS
3 −
37
−
COM01
COM23
−
40 −
61
GRIDDRIVEQ761
GRIDDRIVEQ762
LEDDRIVEQ726
LEDDRIVEQ772
LEDDRIVEQ775
MDLPD772
GROUPON/OFF
D775
68CS67RESET
BUFFERIC19
MXD-D400
4949
• Circuit Boards Location
MAIN board
TRANSFORMER board
BD (MD) board
HP board
DISPLAY board
CD-SW board
BD (CD) board
LOADING board
CD-EJECT board
POWER SWITCH board
Note on Schematic Diagram:• All capacitors are in µF unless otherwise noted. pF: µµF
50 WV or less are not indicated except for electrolyticsand tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specified.• f : internal component.• C : panel designation.
• A : B+ Line.• B : B– Line.• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal produc-tion tolerances.
• Waveforms are taken with a oscilloscope.Voltage variations may be noted due to normal produc-tion tolerances.
• Circled numbers refer to waveforms.• Signal path.
F : AUDIOJ : CD PLAY (ANALOG OUT)c : CD PLAY (DIGITAL OUT)p : MD PLAYl : MD RECI : OPTICAL DIGITAL OUTi : OPTICAL DIGITAL IN
Note: The components identified by mark 0 or dotted linewith mark 0 are critical for safety.Replace only with part number specified.
Note on Printed Wiring Boards:• X : parts extracted from the component side.• Y : parts extracted from the conductor side.• a : Through hole.• f : internal component.• : Pattern from the side which enables seeing.(The other layers' patterns are not indicated.)
Caution:Pattern face side: Parts on the pattern face side seen from(Conductor Side) the pattern face are indicated.Parts face side: Parts on the parts face side seen from(Component Side) the parts face are indicated.
Caution:Pattern face side: Parts on the pattern face side seen from(Side B) the pattern face are indicated.Parts face side: Parts on the parts face side seen from(Side A) the parts face are indicated.
6-4. NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
MXD-D400
5050
6-5. PRINTED WIRING BOARD – BD (CD) Section – • See page 49 for Circuit Boards Location. :Uses unleaded solder.
1
5CN151
M151(LOADING)
M
S272LOADING
IN
S271LOADING
OUT
R320
C269
IC105
C228
R302
R301
C303
C301
C302
C163
R228
C164
C169
C307
FB101
C248C263
FB161
C133
R166
R167
R168
R169
FB203
C152
C114
C119
R111
R199C1
03C1
01
C111
C108
C109
C102
C117
R123
C131
C213 C104C132
R122
C115R1
05
Q101C113
R103
R102
C118
C153
C151
R226
R225
R227
R224
R223
R309
FB202R318
C249
R308
R202
R252
R271
C215
R231
C150
FB104
C273
C254
R207
R232
R203
C226
C202
C216
R101 C205
C230 R233
C209
C227
C112
C253
R249
C259
R272
C258
C274
C256FB102
R279
C260
FB351
FB201
C231
M102
M101
C121
R312
CN105
R315
C157
CN103
R158
C159
C158
R157
C161
C165
C160
C305
IC122
R208
C277
R304
R305
C304
R229
R116
R314
C156
RV101
TP (VC)
CN101
R131
R118
L163
R113
IC103
C116
R114
R133
R115
R117
C107
R126C110 R125
R132
R120
R104
R220
R221
R155
R255
R222
R257
C310
FB103
C203R201
R218
R152
R205
IC104
IC101
R216
C270
R275
C222
R230
R313
R151
C212R204
C224
R219
R206
C211
X201
C271R260
C251
C208
C266
R250C257
R253
R276
C229
C292
C255
C250
R259
R251
FB291
IC102
R291
JR2
916
81
(COMPONENT SIDE)BD (CD) BOARD
1-687-189-
12
(12)
MAINBOARD
CN6
1-645-721-
21
(21)
LOADING BOARD
I
1 20
21
40
60 41
80
61
1 28
56 29
1 15
30 16
1-687-189-
12
(12)
BMAIN BOARD
CN5
(SLED)
(SPINDLE)
12
45
3
OPTICALPICK-UPBLOCK
(A-MAX. 4T)
AMAIN
BOARDCN4
(CONDUCTOR SIDE)BD (CD) BOARD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
A
B
C
D
E
F
G
H
I
J
TP (TE)TP (RFAC)
TP (FE)
(Page 56)
(Page 56)
(Page 57)
• SemiconductorLocation
Ref. No. Location
IC101 D-13IC102 F-12IC103 F-9IC104 C-10IC105 F-4IC122 E-10
Q101 G-6
MXD-D400
5151
6-6. SCHEMATIC DIAGRAM – BD (CD) Section – • See page 55 for Waveforms. • See page 66 for IC Block Diagrams.
The components identified by mark 0 or dottedline with mark 0 are critical for safety.Replace only with part number specified.
• Voltages and waveforms are dc with respect to groundunder no-signal conditions.no mark : CD PLAY
R118
R111
R220
R221
R226
R225
R227
R222
R224
R223
R2
01
C110
C108C111
R113
R120
C109
C119
IC103
R125
R126
C118
R117
R132
C107
RV101
R105
R104
R102
C103 C101
R103
R116 R115C102
C104
C133
C153C151
C117C115
R219
C152
C150
C273
C205
C202
R218
C132
C227
C216C215
R202
C2
24
C310
C131
C116
CN101
C208
FB202
R271 R275
R279
R255
C266
R272
R257
R276
R259
CN105
R320
R305
R304
C304 C305
C251
C253FB103
FB201
R260
R206
R205
C248
R2
04
R313
R101
R166
R168
R167
R169
IC1
02
FB203C228
R252
R253
R315
R314
R309 C222
CN103
FB101
IC101
IC104
FB291
C250
C292
R318
C255
R216
FB104
FB102
C259
R2
50
C203
C256 C2
57
R2
51
C2
70
R302
R301
C301
C213
C302
C303
R114
R199
C164C165
Q101
C161 C160
C157C156
C169
M102
M101
C112
R133
R203
C277C249
R208
C254
R249
R233
R232
R231
R230
R2
28
C1
21
C2
31
C307
C209
C114
R291
C258
R2
29
C230
X201
C229
C274C271
R131
C158 R155
R157
C113R122 R123
R152
R151
FB161
IC122
C212
TP2
TP4
TP9
TP6
TP8
TP5
TP7
IC105
C211R207R308R312
C226
C260
L1
63
R158
C159
C163
10k
150k
1k
100
100
100
100
100
100
100
33
k
0.1
0.1474V
2.4k
120k
0.1
1
CXA2647
39k
39k
1
120k
330k
33p
47k
1k
15k
15k
470p 470p
100k
33k 33k0.1
3300p
2.2
0.10.1
0.110010V
1k
0.1
220 10V
220p
0.1
0.1
1k
0.022
0.1
0.010.47
10k
1
0.1
0.068
0.1
16P
0.1
10k 10k
100
100
0.1
4.7k
100
100
100
9P
0
100k
100
2.26.3V 0.01
0.1
0.1
0
0
1k
270k
1.5k
2.2
10
k
0
0
0
0
0
0
AN
41
05
0
1
10k
220
0
0
1
25P
0
CXD3068Q
CXD9717R-008
0
0.1
0.1
0
0.1
1M
0
0
0.1
22
0
1000p
0.1
0.3
3
22
0
22
0p 51k
150k
820p
820p
2200p
0.1
390k
0
0.10.1
2SB970
0.1 0.1
1000p4700p
220 10V
0.1
2.2k
100k
00.1
150
8p
560
330
330
330
150
10
00.
1
22
01
0V
0.1
220p
1000p
0
8p
10
0
0.1
33.8688MHz
0.1
0.010.01
68k
0.01 39k
0
10010V100k 3.3
22k
10k
BA33C25FP
470p
(TE)
(FE)
(CKO)
(RFDC)
(RFAC)
(RFACI)
(VC)
TC74HC4052
0.47470k0
474V
826.3V
1k
100p
0.1
SQ
SO
DA
TA
XLA
T
CLO
K
SE
NS
XRST SC
OR
SQ
CK
SD+
SD-
SP+
SP-
PWM1
PWM2
PWM3
PWM2
SQSO
XRST
DATA
XLAT
CLOK
SENS
SQCK
SCOR
MICS
MILP
MP3RST
TD-
FD-
TD+
FD+
PWM3
PWM1
FD
+
FD
-
TD
+
TD
-
SD
-
SD
+
SP
+
SP
-
MILP
MICS
MP3RST
MIACK
MIDIO
MICK
MIDIO
MICK
MIACK
I1
I2
I3
I4
I5
I1
I2
I3
I4
I5
RFA
C
RFAC
RFD
C
SE
SE
FE
FE
TE
TE
AA
1
AA
2
AA
3
AA
4
AA
5
AA
6
AA5
AA6
AA3
AA4
AA1
AA2
REQ
REQ
SDI
SDI
BCK
BCK
LRC
LRC
RFDC
RFSW
RFSW
XTAI
XTAO
XTSL
MD2
DOUT
EMPH
WFC
K
SC
OR
SBSO
EXCK
SQCK
MU
TE
SE
NS
XR
ST
SC
LK
ATS
K
DA
TA
XL
AT
CL
OK
CO
UT
MIR
R
DFCT
FOK
MDP
LOCK
SSTP
SFDR
SRDR
TFDR
TRDR
FFDR
FRDR
VP
CO
IGEN
TE
SE
FE
VC
FIL
O
FIL
I
PC
O
CL
TV
RFA
C
BIA
S
AS
YI
AS
YO
WD
CK
LRCK
BCLK
RFD
C
AD
IO
FSTO
ASYE
XOLT
SOCK
SOUT
SCSY
DV
SS
PWMI
CE
V1
6M
VC
TL
DV
DD
0
XP
CK
GFS
C2P
O
DVDD1
DVSS1
TEST
TES1
AV
SS
0
AV
DD
0
AV
SS
1
AV
DD
1
DVDD2
PCMD
DVSS2
SQSO
T+
VC
VCC
GND
LD
PD
F+
T-
F-
DGND
DATA
CLK
SUBQ
SENS
SQCK
XLT
SCOR
RFSW
XRST
MP3RST
GND
VCC
PD2
PD1
I1-6
I5-10
LD
DGND
PG
ND
2
PG
ND
2
NC
NC
ST
BY
NC
NC
PV
CC
2
NC
NC
PV
CC
2
IN3
-
IN3+
SV
CC
SG
ND
IN2
-
IN2
+
IN1
-
IN1
+
PV
CC
1
PV
CC
1
NC
NC
NC
NC
PG
ND
1
PG
ND
1
NC
(VD
D)
NC
(BC
1)
NC
NC
(SW
)
NC
(CT
)
NC
(VP
UM
P2
)
NC
(BC
2)
NC
(VP
UM
P1
)
NC
(BC
4)
NC
(BC
3)
NC
(FB
)
OP
O3
(NC
)
OP
O2
(NC
)
OP
O1
(NC
)
VO
1-
VO
1+
DVDD
TXO
RFGND
CD-VM(+7/+8V)
CD-VM(+8V)
DOUT
RFVDD
MIMD
VD
D
ST
AN
DB
Y
VS
S
VS
SL
VR
AL
LO
VD
AL
VD
AR
RO
VR
AR
VS
SR
TE
ST
P
VSS
VSS
VS
SP
PD
O
VC
OI
XI
XO
VS
SX
MIDIO
SDO
SDI0
BCKIA
LRCKIA
TX
O
MICK
MILP
MICS
RESET
MIACK
VDDT(3.3V)
BCKO
LRCKO
SDI1
BCKIB
LR
CK
IB
PO
0
PO
1
PO2
PO3
VDDT(3.3V)
PO4
PO5
PO6
REQ
IRQ
VDDM(2.5V)
FI0
FI1
VSSM
PI0
PI1
PI2
PI3
PI4
/CL
CK
PI5
/DA
TA
VD
D(2
.5V
)
TS
TIN
/SFS
Y
FI2
/SB
SY
VD
DP
(2.5
V)
CK
O/X
RD
E
VD
DX
(2.5
V)
LD
PD
A
B
C
D
F
E
EQ_IN
AC_SUM
GND
SW
DVCC
DVC
RFACFE
FEI
TE
TE_BAL
CE
CEI
VCC
RFG
BST
VFC
RFC
VC
RFDCI
DC_OFST
RFDC
XU
GF(R
FC
K)
C4
M IN4
R
IN4
VR
EF
PV
CC
/2(N
C)
VO
3-
VO
3+
VO
4-
VO
4+
VO
2-
VO
2+
PWM3(RFDC)
PWM2(TE)
PWM1(FE)
NC
(I-O
P+
)
NC
(I-O
P-)
NC
(O-O
P)
MGND
MGND
DGND
MILP / C2PO
MICS / GFS
MP3REQ / FOK
MIDIO / PCMD
MIACK / LRCK
MICK / BCK
MP3STB / 1-4
DGND / 1-2
IL-SW
DGND
CD DSP
D/A CONVERTER,
MP3 DECODER
SELECTOR
RF AMP,
FOCUS/TRACKING
ERROR AMP
FOCUS/TRACKING COIL DRIVE,
SLED/SPINDLE MOTOR DRIVE
AUTOMATIC
POWER
CONTROL
(SLED)
(SPINDLE)
+2.5V/+3.3V
REGULATORV
CC
NC
GN
D
VO
1
VO
2
0.1µ
H
(Page 60)
(Page 60)
MXD-D400
5252
6-7. SCHEMATIC DIAGRAM – BD (MD) Board (1/2) – • See page 55 for Waveforms. • See page 66 for IC Block Diagrams.
13
12
11
(MD)
3.5
3.5 2.3
2.5
2.2
2.2
0
2.3
<∗>
<∗><∗>
<∗>
<∗>
<∗>
<∗>
<∗>
<∗>
<2.5>
<2.5>
<1.7>
<1.7>
<∗>
<2.5>
C410
TP616
TP615
TP614
TP613
TP612
TP611
TP609
TP608
TP607
TP606
TP605
TP604
TP603
TP602
TP601
R703 R705
R702
C104R106
TP204
C107
R110
R108
R104
R107
Q203
Q202
R102
R101
C111
C112
TP
20
9
TP207C109
TP
21
3
D101R111
C110
TP11
R112 C113 R113 R115
R116R114 C115
TP214
TP212
R119
R120
C117
C116
C118
C120
C119
TP216
TP217
TP218
TP219
TP163
C406
C490 C411
C407
C409
R109
C299
IC701
R118
R117
C121
C122
R713R710
C405
C101
Q201
Q701
Q702
Q703
IC181
C505C5
03
R5
53
C502C504R552
C550
TP501TP502TP503TP504
CN104
TP403
TP404
TP402
TP401
C108
R551
TP143
C103
R103
C105
R708
R709
C703 R711
R706C702
R704
TP
20
5
C106
C701
TP701 R712C704
Q704
CN101
CN105
R707
L401
L402
IC401
L701
L202
C114
R701
IC101
L201
L203
BG1
R501
C501
Q182
D501
D502
Q181
L550
L501L502
M101
HR901
L602
L601
L603
R105
TP203
TP215
1006.3V
1k 4.7k
1k
0.1100k
0.022
470k
2.2k
470k
680
UN5113-TX
2SB798-T1DK
1
2.2
0.01
0.022
0.047
1SS355TE-1710k
0.001
100k 0.0068 10k 10k
3.3k4.7k 0.1
22k
33k
0.01
4.7
0.0047
0.068
1
0.01
0.1 4.7
0.1
C4120.01
0.1
4.7k
0.1
TLV2361CDBV
2.2k
100k
0.01
0.033
10k47k
0.1
4.7
UN5113-TX
UN5214-TX
FMW1-T-148
UN5214-TX
MC74ACT08DTR2
1006.3V
0.1
47
k
0.11047k
2220V
2P
0.1
47k
0.01
4.7k
106.3V
4.7k
2.2k
0.1 10k
2.2k4.7
33k
106.3V
0.1
1000.047
2SA1576A-T106-QR
21P
7P
4.7k
BH6519FS-E2
2200p
1k
CXA2523AR
0
470p630V
2SK2788VYTR
F1J6TP
F1J6TP
2SJ518AZTR
3.3M
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
DTR
F
CK
RF
XLR
F
SP
RD
SP
FD
E
D
C
F
I
A
B
F
E
D
C
B
A
J
I
SR
DR
SFD
R
J
FFD
R
FR
DR
TR
DR
TFD
R
AA1
AA2
AA3
AA4
AA
1
AA
2
AA
3
AA
4
BB
1
BB1
BB3
BB4
BB5
BB6
BB7
BB8
BB8
BB5
BB9
DD1
DD2
DD3
DD4
DD
1
DD
2D
D3
DD
4
BB
2
A
B
C
D
E
F
PD
TEM
PI
GN
D
SW
DT
SC
LK
XL
AT
VC
C
TE
CSLED
SE
ADFM
ADIN
ADAGC
ADFG
AUX
FE
ABCD
BOTM
PEA
K
RFA
GC
RF
RFO
MO
RFI
MO
RFO
E
B
I
VCC
C
J
D
F
VC
TEM
PR
TRK+
TRK-
FCS+
FCS-
A
PD
K
ILCC
MOD
VEE
LD-GND
APCREF
VR
EF
XS
TB
Y
FO
CN
T
EQ
AD
J
3T
AD
J
WBLADJ
AG
CI
CO
MP
O
CO
MP
P
AD
DC
OP
O
OP
N
APC
I
J
VC
VR
Iop
I+3V
GND
FE
TE
VC
RF
CA
PA
-
CA
PA
+
IN2R
IN2
F
VM
2
OU
T2
F
PG
ND
2
OU
T2
R
VM
12
OU
T1
R
PG
ND
1
OU
T1
F
VM
1
IN1
F
IN1
R
VD
D
GN
D
VG
IN4R
IN4
F
VM
4
OU
T4
F
PG
ND
4
OU
T4
R
OU
T3
R
PG
ND
3
OU
T3
F
VM
3
IN3
F
IN3R
PS
B
VM
34
(1/2)
FOCUS/TRACKING
SPINDLE/SLED
MOTOR DRIVE
COMPARATOR
Q701-704
HF MODULE
SWITCH
RF AMP,
FOCUS/TRACKING
ERROR AMP
LASER ON
SWITCH
Q202,203
AUTOMATIC
POWER CONTROL
Q181,182
OVER WRITE
HEAD DRIVE
OVER WRITE
HEAD DRIVE
(FOR ADJUST)
(SLED)
(SPINDLE)
(OVER WRITE
HEAD)
COIL DRIVE,
-1 -2
(MD)
0uH
0uH
0uH
0uH
0uH 0uH
0uH
0uH
0uH
0uH
0uH
0uH
M102
TEST PIN
(Page 53)
• Voltages and waveforms are dc with respect to groundunder no-signal conditions.no mark : MD PLAY< > : MD REC
The components identified by mark 0 or dottedline with mark 0 are critical for safety.Replace only with part number specified.
: CD PLAY∗ : Impossible to measure
MXD-D400
5353
6-8. SCHEMATIC DIAGRAM – BD (MD) Board (2/2) – • See page 55 for Waveforms. • See page 66 for IC Block Diagrams.
IC195 is written in and settled EEPROM. Supply with a singlearticle has not been carried out. In case you exchange by BD(MD) board (A-4727-928-A), please put on IC195 currentlyused with the model again.
MAINBOARD
(4/4)CN10
C
MAINBOARD
(3/4)CN9
D14 15
(MD)
1.6
1.4
3.4
3.4
3.4
0 1.7
<1.7
>1
.7
0 <1.7>
TP160
TP161
TP162
TP165
TP144
C233
TP942
TP941
TP940
TP939
TP938
TP937
TP936
TP934
TP933
TP932
TP930
TP929
TP928
TP926
TP925
TP924
TP923
TP922
TP921
TP987
TP899
TP999
TP910
TP908
TP907
TP919
TP920TP927
TP931
TP935
R303 R302 R301
C175
C901
IC926
IC933
C999
C998
TP169
C9
04
C242
C220
R2
14
R2
17
C2
21
TP
14
6
R212 C219
R2
09
C215
R207
R2
08
C216 R211
R2
10
TP
15
6
R2
01
TP
11
3
TP1002
C240
R203
TP164TP145
TP125 TP101
R202
C206
C241
C903
C902
C908
C1102
C905
C255C254
R206R205
C214
TP158
R121
C251
R122
C235 C230
C2
52
C809
C211 C212
TP8
R2
18
R2
16
TP
12
R2
19
C302
C253
C194
C301C911
C907
CN102
TP149TP148
TP10
C234
R2
98
C209
S102
S101
S105
S104
S103
CN103
M103
L801
L8
L10
R299
R2
81
L899
C2
05
L122
IC201
IC152
C909
TP1001
IC195
0.1
10k 10k 10k
0.1
1006.3V
NJM2391DL1-26(TE1)
BA033FP-E2
0.1
0.1
GND
0.1
0.1
0.47
10
0k
10
k0.0
1
330k 100p
33
0
0.033
150
1k 2.2 1M
33
k33
0
0.1
100680
1006.3V
0.1
1006.3V
0.1
10
0.1
1006.3V
0.10.01
10k10k
0.01
2.2k
0.1
10k
0.1 0.1
0.1
0.1
4.7
100p 100p
00 10
0
0.1
0.1
0.1
0.1 0.01
0.01
27P
0.1
0
100p
17P
0
1k
R2
80
1k
C8030.1
R8120
IC8
03
CY
24115-2
SC
T
R80568 0uH
0uH
0uH
0uH
0.0
02
2
CXD2664R
MSM51V17400F-50TS-K
2210V
BR24C16F-E2
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
XOE
XCAS
XRAS
XWE
A00
A01
A02
A04
A05
A06
A07
A08
A09
A10
DTRF
CKRF
XLRF
MN
T1
MN
T2
SQ
SY
DQ
SY
XIN
T
DIN
0
DIN
1
DO
UT
DA
DTI
LR
CK
I
XB
CK
IDADTI
LRCKI
XBCKI
MNT1
MNT2
SWDT
SCLK
XLAT
SRDT
SQSY
DQSY
XINT
SENS
A03
XWE
XOE
D0
D1
D2
D3
A00
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
XRAS
XCAS
TRDR
TFDR
FFDR
FRDR
SRDR
SFDR
SPRD
SPFD
SW
DT
SC
LK
XLA
T
SR
DT
SE
NS
DOUT
DIN
0D
IN1
D1
D2D3
D0
BB
1
BB
2
BB
3
BB
4
BB
5
BB
6BB7
BB
8
BB9
CC1
CC2
CC3
CC4
CC5
CC6
CC1
CC2
CC3
CC4CC5
CC6
MGND
SDA
SCL
GND
M+5V
GND
H+5V
MGND
+5V
DOUT
HGND
A2
A1
A0
DADTI
LRCKI
GND
XBCKI
DIN0
DIN1
MCLK
SRDT
XLATCH
SWDT
SCLK
WRPWR
SDA
MNT1(SHCK)
DQSY
DIG-RST
SQSY
SCL
XINT
MNT2(XBUSY)
LDON
MOD
LIMIT-IN
IOP
LD-IN
LD-OUT
EEP-WP
WP
VCC
M+5V
D-GND
PLAY-SW
REC-SW
OUT-SW
SENS
D-GND
REFRECT SW
PROTECT SW
MN
T0(F
OK
)
MN
T1
(SH
CK
)
MN
T2
(XB
US
Y)
MN
T3
(SL
OC
)
VD
C0
SW
DT
SC
LK
XL
AT
VS
C0
SR
DT
SE
NS
XR
ST
SQ
SY
RP
WR
XIN
T
XT
DQ
SY
VD
IO0
OS
CI
OS
CO
OS
CN
VS
IO0
XT
SL
DIN
0
DIN
1
DO
UT
DA
TA
1
LR
CK
I
XB
CK
I
VD
C1
VSC1
ADDT
DADT
LRCK
XBCK
XWE
XOE
DRVDD0
DRVSS0
A11
D3
D2
D0
D1
XCAS
XRAS
A09
A08
A10
A07
A00
A06
A01
A05
A02
VDC2
VSC2
A04
A03
DR
VD
D1
DR
VS
S1
TE
ST
0
TE
ST
1
TE
ST
2
AV
D1
AS
YO
AS
YI
BIA
S
RFI
AV
S1
PC
O
FIL
I
FIL
O
CL
TV
PEA
K
BO
TM
AB
CDFE
AU
X1
VC
AD
IO
AD
RT
AD
RBSE
TE
AV
D2
AV
S2
DC
HG
AP
C
ADFG
VDIO1
VSIO1
F0CN
VSC3
VDC3
XLRF
CLRF
DTRF
APCR
LDDR
TRDR
TFDR
FFDR
FRDR
FS4
SRDR
SFDR
SPRD
SPFD
FGIN
TST1
TST2
TST3
EFMO
VDIO2
VSIO2
VDC4
VSC4
MDDT1
FS256
(2/2)
-1
-2
S102-1
REFLECT RATE
DETECT
DETECT
PROTECT
S102-2(LIMIT IN)
(OUT)
(PLAY)
(REC)
(LOADING)
GO I
GO I
+3.3V REGULATOR
+2.6V REGULATOR
EEPROM
MD DSP
D-RAM
(NOT SUPPLIED)
R8140
R803 0
R801
VCO
X8
04
1M
R8
10
1.5
k
C801
18
p
C802
15
p
R22310k
TP110
TP909
(MD)
0uH
CLK
A
FS0
GN
D
CLK
SEL
VC
C
XIN
FS1
XO
UT
IC803
1
2
3
4
5
6
11.2
896M
Hz
TP190
C250
C231 0.1
(Page 52)
• Voltages and waveforms are dc with respect to groundunder no-signal conditions.no mark : MD PLAY< > : MD REC
: CD PLAY∗ : Impossible to measure
(Page 61)
(Page 60)
MXD-D400
5454
6-9. PRINTED WIRING BOARD – BD (MD) Board – • See page 49 for Circuit Boards Location. :Uses unleaded solder.
(REC)
(PLAY) E
-1
-2
S102-1REFLECT
RATEDETECT
S102-2PROTECTDETECT
C MAIN BOARDCN10 D MAIN BOARD
CN9
1 17
5
8
4
1
13
2
13
2
1
12
36
25
48 37
13 24
13
54
E
130
9061
31
60
E
E
TEST PIN(FOR ADJUST)
(OUT)
12
HR901OVER WRITE
HEAD
OPTICAL PICK-UPBLOCK
(KMS-262E)
E
E
EE
E2C 1C
1B2B
1 2 3 4 5 6 7 8 9 10 11 12 13
A
B
C
D
E
F
G
H
(LIMIT IN)IC803
IC101
IC201
IC195
IC933
IC181
IC70
1
IC15
2
IC926
IC401
IC195 is written in and settled EEPROM. Supply with a singlearticle has not been carried out. In case you exchange by BD(MD) board (A-4727-928-A), please put on IC195 currentlyused with the model again.
(Page 56)(Page 56)
D101 G-5D501 C-8D502 B-8
IC101 F-9IC152 D-8IC181 B-9IC195 B-11IC201 D-10IC401 E-11IC701 E-9IC803 C-3IC926 D-12IC933 C-12
Q181 C-8Q182 C-8Q201 E-6Q202 F-8Q203 E-9Q701 E-5Q702 E-5Q703 E-5Q704 E-5
• SemiconductorLocation
Ref. No. Location
MXD-D400
5555
• Waveforms– BD (CD) Board –
1 IC103 qg (RFAC) (CD play mode)
2 IC103 qh (FE) (CD playmode)
3 IC103 qk (TE) (CD play mode)
5 IC101 us (XTAO)
4 IC103 wk (RFDC) (CD play mode)
– BD (MD) Board –
qa IC101 ek (RF) (MD play mode)
qd IC101 wh (TE) (MD play mode)
qf IC803 8 (XOUT)
qs IC101 ef (FE) (MD play mode)
qg IC803 5 (CLKA)
1.5 Vp-p
Approx.360 mVp-p
Approx.1.2 Vp-p
1.1 Vp-p
3.7 Vp-p
29.5 ns
1.4 Vp-p
Approx.460 mVp-p
Approx.620 mVp-p
3.3 Vp-p
88.6 ns
3.3 Vp-p
5.5 ns
– MAIN Board –
wa IC6 qd (XOUT)
wd IC12 qd (TE) (XOUT)
ws IC12 qa (XOUT-T)
2.5 Vp-p
62 ns
1.8 Vp-p
30.4 µs
2.8 Vp-p
100 ns
MXD-D400
5656
6-10. PRINTED WIRING BOARD – MAIN Board (Component Side) – • See page 49 for Circuit Boards Location. :Uses unleaded solder.
C94
JR101
C21
RB7
RB6
RB5
RB4
RB2
RB1
R71
C84
C87
C88
C89
C91
C92
C97
R61
R60
R40
R34
R30
C140
C142
R27
R26
R25R16
R13 R11
R8
L6
L5
L3
L2
L1
CN11
CN8
CN5
CN3
CN4
D1
D2 D3
D4
D5
D25
D27
D28
IC11
IC13
IC16
IC17
L8
L9
L10L11
Q2
Q3
Q5
Q6
R1 R2
R4
R12
C124
C109
C108
C102
R44
R45
R46
R47
R48R49
R50
R52
R55
R56
R57
R67
R68
R69
R70
R72
R73
C115
C131
R85
R86
R87
R88
C132
C74
C116
C73
R98
R99
R103
R104
C69
C56
CN9
CN10
IC8
R107R108
FB1
D30
C11
C12
R3
C146
IC19
FB2
IC2
C149
IC6
IC12
R200
1 4
8 5
5 8
4 1
111
3323
12
22
44
34
13
54
8051
130
31
50
100
81
5 8
4 1
1 7
14 8
8051
130
31
50
100
81
(COMPONENT SIDE)MAIN BOARD
1-687-908-
11
(11)
BBD (CD)BOARDCN103
(FOR CHECK)
DBD (MD)BOARDCN103
CBD (MD)BOARDCN102
(FOR CHECK)
E DISPLAY BOARDCN700
13
54
A BD (CD) BOARDCN105
K
KA
E
E
K K
A
E
E
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
I
J
K
(Page 50)
(Page 50)
(Page 54)
(Page 54)
(Page 62)
D1 D-11D2 E-11D3 E-11D4 D-11D5 E-10D25 I-12D27 F-10D28 F-10D30 I-3
IC2 E-8IC6 D-5IC8 E-3IC11 H-10IC12 I-6IC13 I-13IC16 J-13IC17 G-14IC19 I-8
Q2 E-11Q3 E-11Q5 I-14Q6 H-14
• SemiconductorLocation
Ref. No. Location
MXD-D400
5757
6-11. PRINTED WIRING BOARD – MAIN Board (Conductor Side) – • See page 49 for Circuit Boards Location. :Uses unleaded solder.
LP101
IC14 BT1
C1
C3
C7
C17C18
C23
C26
C27
C28
C31
C32
C37
C39
C40
C42
C53
C54
C55
C59
X2
X1
C70
C72
C83
C86
C90
C93
C96
C110
C111
C113
C114
C118
C119
C120
C122
C127
C128
C129
C130
C133
C134
C135
C136
C137
C138
Q8
Q7
IC18
IC10
CN1
CN2
CN12
D6 D7
D8 D9D10 D11
D13D12
D14D15
D16 D17
D18
IC15
IC1
IC3
IC4
IC5
IC7
IC9
Q1
Q4
C139C107
C106
C79
C41
C71
CN6
RY1
C121
CN7
EP1
C145
C24
R77
C25
R37
C77
D20
C4
C15C5 C6 C8C9
R7
C30
C16
C19C20
R10
C66
C22
C36
C34
R17
R66
C33
C14
R20
C47
C58C50
C141
R100
R97
R59
C143
L7
C85
C99
C104
R41
R39
C76
C75
R35
C117
R63
C123
R81
R32
R76
R31R29
C10
R23
C43
R28
R24
R19
R15
D23
R36
D26
R82
R5R6
C52
R9
C29
C38
R14
D22
C103
C126
R94
C13
R64
C98
R58
C101
C82
C95
C100
C51
D24
R62
R43
R65
R38
R75
D29
R51
R80
C80
R89
R96R93
R84
R92
R91
C35
R33
C65
C64
C63
R95
R90
R54
C2
D21
C48
R18
C49
R21
R22
R111 R112
R110
C147
R113
X3
1 4
1 5
1-687-908-
11
(11)
(CONDUCTOR SIDE)MAIN BOARD
(CHASSIS)
3
1
3
1
DIGITALOPTICALOUTPUT
DIGITALOPTICAL
INPUT
J1
LANALOGINPUT
R
LANALOGOUTPUT
R
1 3
H HP BOARDCN790
E
-2
-1
K
A A
E
A A
K
12
(SHORT SOCKET)
3
1
1
3
3
1
3
1
131
1 9
GTRANSFORMER
BOARDCN651
FTRANSFORMER
BOARDCN650
10 1
I LOADING BOARDCN151
10
1
E
E
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A
B
C
D
E
F
G
H
I
J
K
(Page 64) (Page 64)
(Page 62) (Page 50)
D6 C-3D7 C-4D8 D-3D9 D-3D10 D-2D11 D-2D12 B-7D13 B-8D14 C-4D15 C-3D16 B-7D17 B-7D18 I-10D20 G-10D21 F-8D22 G-8D23 G-8D24 F-13D26 H-6D29 J-7
IC1 E-9IC3 J-10IC4 B-9IC5 C-8IC7 E-5IC9 D-9IC10 F-13IC14 F-2IC15 G-2IC18 I-16
Q1 F-8Q4 J-6Q7 J-15Q8 H-16
• SemiconductorLocation
Ref. No. Location
MXD-D400
5858
R1 R2
IC1
C4 C7C2D4D1
D3
D2
C11 R3
C1
C14
C5
C6
C8
C9
C1
0
C1
5
C1
6
D6
D9
C12
D15
D14D11
D10
C19C17
C18 C20
R7
R6
C2
3
C2
6 C3
2
C3
3
C4
2
C4
7
C50
C5
2
C58
C59
R12
R111R9
R112
R10
R17
C35
C54
C5
3
D8
R36
D7
CN1
R4
D23
C29C27 C36 C39
D17
D16
C28 C30 C34 C37
JR101
D18
IC4
C31 R14 C40
D20R15 C38
R20
C66 C72
C3
D5
IC5 IC9
C13
R5
D21
C70
CN2
IC2
Q1
IC3
EP1
IC7
Q2
D22
CL103
CL1
CL2
CL104
CL
10
0
CL99
CL8
CL7
CL9
CL30
CL28
CL29
CL101
CL102
CL4
CL3
CL10
BT1
D12 D13
CN7
1k 1k
0.1 47010V0.1RB411D-
T146RB411D-
T146
RB411D-T146
RB411D-T146
0.1 47k
330016V
0.1
0.1
0.1
0.1
0.1 0.1
0.1
0.1
10EDB40-TB3
10EDB40-TB3
0.01
10EDB40-TB3
10EDB40-TB310EDB40-TB3
10EDB40-TB3
0.147025V
47025V 0.1
47k
10k
22
00
01
6V
47
16
V
4.7
50
V
0.1
47
01
0V
0.1
0.1
0.1
0.1
10
00
6.3
V
2.2k
150470
330
100
100k
0.1
4.750V
22
01
0V
10EDB40-TB3
220
10EDB40-TB3
4P
100
RB495-T146
0.11000016V 0.1 1000
10V
10EDB40-TB3
10EDB40-TB3
100035V 0.1 0.1 220
25V
0
10EDB40-TB3
NJM7808FA
10063V 3.3k 33
50V
MA8100-L-TX27k 0.1
100k
0.1 10016V
10016V
MA8033-L-TX
0.1
100k
1SS355-TE17
10016V
9P
S-80929CNMC-G8Z-T2
2SD2144S-TP-W
M5293L
LA5643
UN2211-TX
1SS355TE-17
(-32V)
(8V)
(GND(8V))
(GND(-32V))
(GN
D(3
.3V
EV
ER
))
(3.3V(EVER))
(ANA5)
(PH5)
(GND(3.3V))
(3.3VMDSYS)
(3.3VMDB)
(3.3V(RF))
(GND(3.3VRF))
(GND(5V))
(5V)
(GND(PH5))
10EDB40-TB3
10EDB40-TB3
2P
A1
A2
A3
A4
A5
A6
A7
A8
B1
B2
B3
B4
B5
B6
B7
B8
B9
B1
0
B1
1
C1
C2
C7
C6
C5
C4
C3
RESET
GND
RELAY
IN GN
D
-32V
ST
B
VR
EF
IN OUT
COM
AC3.3V
AC3.3V
3.3V
AC16.0V
AC16.0V
AC11.6V
AC11.6V
AC35.6V
AC35.6V
AC5.2V
AC5.2V
OU
T
VD
D
VS
S
NC CD
IN OUT
GND
IN OUT
GND
COM
OUTIN
(1/4)
RESET
SWITCH
+3.3V REGULATOR
RESET SIGNAL
GENERATOR
POWER ON/OFF
RELAY DRIVE
+5V REGULATOR +3.3V REGULATOR
+8V REGULATOR
-32V REGULATOR
(CHASSIS)
(SHORT SOCKET)
(LITHIUM BATTERY)
REGULATOR
(GND(ANA5))
µPC2933HFµPC7805AHF
µPC2933HF
6-12. SCHEMATIC DIAGRAM – MAIN Board (1/4) – • See page 66 for IC Block Diagrams.
• Voltages and waveforms are dc with respect to groundunder no-signal conditions.no mark : CD PLAY
(Page 59)(Page 65)
(Page 65)
(Page 60)
(Page 61)
MXD-D400
5959
6-13. SCHEMATIC DIAGRAM – MAIN Board (2/4) – • See page 66 for IC Block Diagrams.
• Voltages and waveforms are dc with respect to groundunder no-signal conditions.no mark : CD PLAY
R84
C83
R52
C85
R55
R113
D26
D25
C117
C120L9
C91C93
C134 C137C130C129
R96R89 R90
C123
R95R91
C133 C138
R92 R93
R72
R73
R76
R75
Q5
R85
C119C116
C115 C118R69
R70
R67
R68
R62
R63
C111
C110
R87
C95 C96
R57
C149
R45
R46
R47
R48
R49
R50
R51
R44
IC17(2/2)
C142
C140
IC17(1/2)
R99
CN12
C143
R104
R103
R86Q6
R88
C131
C132 C136
C135
D29
IC16(2/2)
RY1
C114C113
R82
R80
D27
C86 C87
C146
L11
IC15IC14
C145
C122
J1
C121
Q3
FB1
IC19
IC11
L7
IC13(1/2)
Q4
R66
D28
C90C89
R65
FB2
R54
IC13(2/2)
L10
IC16(1/2)
R81
C82
C127
C128
C147
R98
470
10016V
0
0.1
12k
0
1SS184
1SS181
0.1
4.750V
0.110016V
470p 470p470p470p
33k470 33k
0.1
22k22k
2225V
2225V
220k 220k
470
470
100k
100k
2SD1938
1k
10016V0.1
0.1 10016V10k
10k
10k
10k
100k
100k
2225V
2225V
150k
0.1 10016V
10k
1000p
100
100
100
100
100
100
0
0
NJM4565V
0.1
0.1
NJM4565V
47
3P
0.1
47
47
1k2SD1938
100k
0.1
0.1 10016V
10016V
1SS355
NJM4558V
2225V
2225V
2.2k
47k
1SS355
10016V 0.1
0.1
0
GP1FA551RZGP1FA551TZ
0.1
4725V
4P
4725V
UN5111
TC7SH08FU
AK4584VQ
0
NJM4558V
2SD2144S-TP-UVW
47
1SS181
10016V
0.1
47
0
NJM4558V
0
NJM4558V
470
0.1
2225V
2225V
0.1
47
A1
A2
A3
A4
A5
A6
A7
A8
E1
E2
E3
E4
RST
CDDOUT
MD
DO
UT
CO
DEC
DO
UT_TO
MD
INT0
INT1
DTI
DTO
CLK
CS
HP-L
HP-R
HP-GND
(2/4)
VC
C
GN
D
VC
C
GN
D
OU
T
IN
VC
CGN
D
RX3
CDTI
CCLK
CDTO
RX4
INT0
INT1
TST2
PDOWN
CS
NC
TV
DD
DV
DD
DV
SS
TX
3
TX
2
TX
1
DMCKXT
I
XT
O
X-E
NA
BL
E
TST3
VCOM
L-OUT
R-OUT
MCKO1
LRCK
BCK
SDTO
SDTI
M/S
DZF
MCKO2
R-I
N
L-I
N
VR
EF AVSS
AV
DDRX2
RX
1 R
PV
DD
PV
SS
TS
T1
HEADPHONE AMP
RECEIVER
OPTICALOPTICAL
TRANSCEIVER
OPTICAL
DIGITAL
OUTPUT
OPTICAL
DIGITAL
INPUT
LR
ANALOG
OUTPUT
LR
ANALOG
INPUT
MUTING
MUTING
LINE AMP
MUTING
CONTROL
-1
-2
RELAY DRIVE
LINE AMP
A/D,D/A CONVERTER
BUFFER
31
8
2
45
67
6
5
7
8
3
21
4
1
4
3
2
8
76
5
10µH
(Page 58)
(Page 63)
(Page 60)
MXD-D400
6060
6-14. SCHEMATIC DIAGRAM – MAIN(3/4)/LOADING Boards – • See page 55 for Waveform. • See page 66 for IC Block Diagram.
• Voltages and waveforms are dc with respect to groundunder no-signal (detuned) conditions.no mark : CD PLAY[ ] : MP3 PLAY
∗ : Impossible to measure
CN4
CN9
CN5
CN3
C22
R8
R11
R13
R56
C84
CN6
C88
C80
C75
C79
R32R31
R25
R26
R27
R19
R21
R24
C51
C41
C49C48
R22
R28
R29
R16
C4
3
R23
R18
C56
R35R33
RB2
C63
C6
4
C65
C74
R40
C73
C69 C71
IC8
R41
C97
RB5
D2
4
R43
C76
C24
C21
L8
C25
L3
L2
L1
X1
R1
10
R3
0
IC6
L6
L5
IC10
CN151
M151
S271
S272
CL5
RB1
CL107
CL108
CL109
CL110
CL111
CL105
CL106
CL113
CL112
CL114
CL115
CL116
RB4
C92
C94
R34
R108
R107
R38R37 R39
C55
9P
17P
25P
8P
0.1
100
100
100
100
0.1
5P
0.1
10000p
0.01
10016V
10k10k
2.7k
150k
68k
4.7k
10k
10k
0.1
10010V
100p100p
10k
10k
10k
4.7k
0.1
100k
4.7k
0.1
100k10k
3.3k 0.1
10
00
p
10
00
p
0.1
10k
0.1
0.1 10016V
SN74LV00ANSR
10k
0.1
10k
MA
8043-M
(TX
)4.3
B
100k
0.1
0.1
0.1
0.1
16MHz
10
k
10
0
M30624MGN-B20FP
0
0
LB1641
5P
(CD RST)
10k
(MP3REQ)
(MP3RST)
(MIDIO)
(MIACK)
(MICK)
(MILP)
(MICS)
(DATA)
(XRST)
(XLT)
(CLK)
(LDON)
10k
0.1
0.1
100
10k
10k
10k10k 10k
10010V
B1
B2
B3
B4
B5
B6
B7
B8
B9
B1
0
B1
1
E1
E2
E3
E4
F1
F2
F3
F4
F5
F6
F7
LO
DP
LO
DN
SC
LK
SE
NS
DA
TA
CLK
BD
RS
T
LD
ON
OUTSW
INSW
LODP
LODN
SQ
SO
RM
FLCS
FLCLK
FLDT
KE
Y0
KEY
1
KEY
2
M0
M1
FLRST
LE
VE
LL
LE
VE
LR
IICCLK
IICDATA
RE
CL
EV
EL
RESET
CNVSS
RXD1
CLK1
RTS1
TXD1
CNVSS
RESET
RX
D1
TX
D1
CLK
1
RTS
1
RST
INT0
INT1
CLK
CS
DTI
DTO
XLT
MIDIO
MICK
MIACK
MP3REQ
MP3RST
MICS
MILP
SCOR
PWM3
1-4
PWM2
1-2
PWM1
INSW
OUTSW
CODECDOUT_TOMD
MDDOUT
CDDOUT
MICS
MP3REQ
MP3RST
MIDIO
MIACK
MICK
1-4
1-2
PWM3
PWM2
PWM1
BDRST
DATA
XLT
CLK
LDON
SQSO
SENS
SCLK
SCOR
MILP
CD0
CD1
GND
RESET
CNVSS
RXD1
CLK1
RTS1
TXD1
MGND
M+5V
H+5V
MGND
+5V
DOUT
HGND
DADTI
LRCKI
XBCKI
DIN0
DIN1
MCLK
M+5V
D-GND
GND
+3.3V
CO
DE
C
CDMCDM
CDMCDM
PA
NE
L
PANEL
PA
NE
L
GND(+5V)
GND(+5V)
MP3
CDM
MP3
MP3
MP3
SCOR
SENS
DATA
CLK
XLT
XRST
PWM1
PWM2
PWM3
LMUTE/MILP
RMUTE/MICS
MP3REQ
MP3RST
SDA/MIDIO
AMUTE/MIACK
SCL/MICK
SUBQ
SQCK
DVDD
DGND2
DGND
RFGND
LDON/RFSW
MP3STB/1-4
RFVDD(3.3V)
MGND(7/8V)
MGND(7/8V)
CD-VM(7/8V)
CD-VM(8V)
TXO
GND/1-2
DOUT
DGND
DGND(EMPTY)
VD
D
GN
D
GN
D
IN1
P1
OU
T1
VC
C2
OU
T2
P2
VC
C1
VZ
IN2
MD
JO
G1
_I
MD
JO
G0
_I
MD
RE
SE
T_
O
LE
VE
LL
_I
LE
VE
LR
_I
RE
CL
EV
EL
_I
SE
LE
CT
0_
I
KEY
3_I
KEY
2_I
KE
Y1
_I
AV
SS
VR
EF
AV
CC
OP
EN
OP
EN
OP
EN
KEY
0_I
LIN
EM
UT
E_
AM
UT
E_
O
_O
DR
VR
ST
AD
J_
I_O
CH
EC
K3
PDOWN_MAINACCUT_I
VCC
VSS
OPEN
OPEN
OPEN
OPEN
CHECK1_O
CDJOG1_I
CDJOG0_I
INSW_I
OUTSW_I
LOADPOS_O
LOADNEG_O
PULLUP
ADADATAI_I
ADADATAO_O
ADADZF_I
ADACLK_O
ADARST_O
ADAINT0_I
ADAINT1_I
CS_ADALAT_O
SCMS
OPEN
OPEN
OPEN
OPEN
AUTOPWRON_I
DA
TA
_O
OP
EN
CL
K
OP
EN
OP
EN
XL
T_
O
BD
RS
T_
O
LD
ON
_IO
OP
EN
OP
EN
OP
EN
OP
EN
BD
PW
R_
O
SE
NS
E_
I/R
TS
1
SQ
CL
K_
O/C
LK
1
SU
BQ
_I/
RX
D1
PU
LL
DO
WN
PU
LL
UP
CD
MP
3S
EL
IICDATA
IICCLK
OP
EN
/TX
D1
VSS
VCC
BYTE
DRVDAT_O
DRVCLK_O
DRVCS_O
SIRCS_I
MP3DOUT_O
MP3DIN_I
MP3CLK_O
STB_O
XOUT
XIN
SCOR_I
PWM3_O
X4_O
PWM2_O
CTRL1_O
PWM1_O
MP3ACK_I
MP3REQ_I
MP3RESET_O
MP3SEL_O
MP3CS_O
MP3LT_O
NMI
CNVSS
RESET
(3/4)
(FOR CHECK)
LOAD-
LOAD+
OUT_SW
IN_SW
SYSTEM CONTROLLER,
CD MECHANISM CONTROLLER
SPDIF BUFFER
MOTOR DRIVE
LOADING
GND
LOAD-
LOAD+
OUT_SW
IN_SW
(LOADING)
(LOADING OUT)
(LOADING IN)
t
t
T
T
13
(Page 51)
(Page 51)
(Page 53)
(Page 58)
(Page 59)
(Page 61)
MXD-D400
6161
6-15. SCHEMATIC DIAGRAM – MAIN Board (4/4) – • See page 55 for Waveforms. • See page 66 for IC Block Diagram.
• Voltages and waveforms are dc with respect to groundunder no-signal (detuned) conditions.no mark : CD PLAY( ) : MD PLAY⟨⟨ ⟩⟩ : MD REC
CN11
CN10
D30
C141
C139R94
R100
R97
C124
C126
Q7
Q8
CN8RB7
R64 RB6
R6
0
R6
1 R71
C104
R58
C101
C103
C98
C100
C99
C102
R59
C109 C108 C106 C107
R77
IC12
X2
X3
IC18
CL121
CL122
CL123
CL120
CL119
CL118
CL117
CL124
CL125
CL126
CL127
19P
27P
1SS355
0.01
10016V150k
10k
15k
0.1
100p
UN4211-TA
2SA1115TP-EF
8P10k
10k 10k
0 0
0
0.1
10k
0.1
100p
100p
18p
18p
1000p
4.7k
0.1 0.1 10010V
1016V
10k
M30624MGN-A23FP
10MHz
32.768KHz
LB1641
(XLATCH)
(SCLK)
(SWDT)
(SRDT)
(DIG-RST)
(WRPWR)
(LDON)
(FL-LED-CLK)
(FL-LED-DATA)
(RESET)
(FLCS)
C1
C2
C7
C6
C5
C4
C3
F1
F2
F3
F4
F5
F6
F7
REFRECT
SDA
SHOCK
WRPWR
MOD
SENS
XINT
SQSY
DQSY
IOP
LDON
EE
PW
P
XB
US
Y
SW
DT
SWDT
SC
LK
SCLK
SR
DT
SRDT
RTS
1
RTS1
CNVSS
CNVSS
IICCLK
IICDATA
LEVELR
LEVELL
CD1
CD0
RM
PR
OT
EC
T
SC
L
OU
T-S
W
XLA
TC
H
FLCS
FLCLK
FLDT
KEY0
KEY1
KEY2
M0
M1
FLRST
SRST
SRST
LIMIT_IN
RECSW
PLAYSW
DRESET
RECLEVEL
MOD
IOP
LIMIT_IN
XINT
DQSY
RECSW
SQSY
SENS
PLAYSW
XBUSY
SHOCK
EEPWP
SDA
SCL
REFRECT
PROTECT
OUT-SW
LDON
WRPWR
DRESET
SRDT
XLATCH
SCLK
SWDT
SRDT
XLATCH
SWDT
SCLK
WRPWR
SDA
MNT1(SHCK)
DQSY
DIG-RST
SQSY
SCL
XINT
MNT2(XBUSY)
LDON
MOD
LIMIT-IN
IOP
LD-IN
LD-OUT
EEP-WP
PLAY-SW
REC-SW
OUT-SW
SENS
D-GND
REFRECT SW
PROTECT SW
XOUT-T
XIN-T
XIN
XOUT
AV
SS
CNVSS
BYTE
VR
EF
VCC
VCC
AV
CC
J/
GND
RESET
CNVSS
RXD1
CLK1
RTS1
TXD1
J/
+3.3V
KEY-2
RM
CD-JOG-0
CD-JOG-1
AC
AC
-36V
FL-CS
KEY-1
KEY-0
FL-LED-DATA
FL-LED-CLK
RESET
GND
FL.GND
M-JOG-1
M-JOG-0
VSS
SRST_I
NMI
DQSY_I
PDOWN_I
SQSY_I
XINT_I
IICCLK_IO
SW
DT
_O
SR
DT
_I
SC
LK
_O
EP
M_I
OP
EN
PR
OT
EC
T_
I
SC
L(E
EP
)_O
CE
_I
EEP
-WP
_O
XB
US
Y(M
NT
2)_
I
PLAYSW_I
DRESET_O
RECSW_I
WRPWR_O
LIMITIN_I
MOD_O
LDON_O
SENS_I
SHOCK(MNT1)_I
SDA(EEP)_IO
REFRECT_I
OPEN
VSS
LOAD LO_O
LOAD OUT_O
LOAD IN_O
OTHER(SEL0)_I
OTHER(SEL1)_I
OPEN
OPEN
OPENDA_RESET_O
SPDIF_LOCK_I
OP
EN
OP
EN
TP
2_
O
TP
1_
O
TP
3_
O
TO
UN
LO
CK
(TP
4)_
O
IOP
_I
OP
EN
OP
EN
OP
EN
OP
EN
OP
EN
OP
EN
OP
EN
OP
EN
OPEN
OPEN
OPEN
RECLEVEL
OPEN
OPEN
OPEN
OPEN
OP
EN
OP
EN
OP
EN
OP
EN
OPEN
OPEN
OPEN
PULLDOWN
OP
EN
OP
EN
OP
EN
3.3V
GND
IN1
P1
OUT1
VCC2
OUT2
P2
VCC1
VZ
IN2
XL
AT
CH
_O
OU
TS
W_
I
IICDATA_IO
(4/4)
(FOR CHECK)
LOADING MOTOR DRIVE
Q7,8
REFERENCE
VOLTAGE SWITCH
MD MECHANISM CONTROLLER
LINEMUTE_O
DACMUTE_O
AD
PD
OW
N_
O
OP
TS
EL
_O
SLICER_SEL_O
SPDIF_CUT_O
MODEL1_I
MODEL0_I
FLDT_O
FLCK_O
LEVELL_O(BLER)
LEVELR_O(ADER)
KBCLK_O
KBDATA_O
IICBUSY_O
A1OUT_O
BEEP
XELT
IICPOWER
KB
CL
KC
TL
_O
AD
AR
ST
_O
AD
AL
AT
CH
_O
OC
LIP
SE
L_
O
L3
DA
TA
O_
O
L3
MO
DE
_O
L3
DA
TA
I_I
L3
CL
K_
O
C
12
(Page 53)
(Page 58)
(Page 60)
(Page 63)
MXD-D400
6262
6-16. PRINTED WIRING BOARDS – PANEL Section – • See page 49 for Circuit Boards Location. :Uses unleaded solder.
EP780
JW70
3
JW70
4
JW70
5JW70
6
JW70
7
JW70
8
JW709
JW71
1
JW71
2
JW71
3JW
714
JW71
5
JW71
6
JW71
7
JW71
8
JW71
9
JW72
0
JW72
1JW
722
JW72
3
JW72
4JW725
JW72
6
JW72
7
JW72
8
JW72
9JW
730
JW73
2
JW73
3
JW73
5
JW73
6
JW73
7
JW73
8
JW73
9
JW74
0
JW74
1
JW742JW743
JW744
JW74
5
JW74
6
R723
R722
R764
C767
R770
C760
C766
C768
C769
C770
R766
C764
C780
FL750C751
R713
R714
R717
R721
R716
C742
R701
Q762
Q761
R741
R718
C753
R715
R703
R762
R724
R704
Q775
R702
R742
S724
S722
S721
S719
S716S718
S715S714S713
S703
S700
S702
S701
S704
S710
S711
S712
S720
IC781
C765
R775
CN720
RV780
C762 R7
61
R711
D775
R767
C763
R719
R763
R769
R712
Q772
Q726
D772
R768
R705
JW750
C761
C750
C743
R709
CN700
JW734
JW747
IC760
S725
S726
S729S728
S727
R729
CN725
R708
C720
R726
R727
R728
R725
CN701
L790
CN790
L701L1
790
L702
R791
R796
C791
C796
J790
RV79
0 L799
JW701
S1701 JW702
R706
D726
R707
S706CN702
DISPLAY BOARD
1-687-902- 11
(11)
CD-SW BOARD
1-68
7-90
3-
11
(11)
HP BOARD
1-687-904-
11
(11)
CD-EJECT BOARD
1-687-905-
11
(11)
PLAY MODES725
(CD)
TIMES726
(CD)
3
1
3
1
STANDBY
13
1-687-906-
11
(11)
POWER SWITCH BOARD
OPEN/CLOSE
(CD)
(CD)
(CD)
31
E
1 3
ALBUM
1 3
AMS(CD)
S723(ROTARY ENCODER)
4 5
71
722
1
41 40
60
61
21
20
80 1
FLUORESCENT INDICATOR TUBE
CD SYNCRO NORMAL
CD SYNCRO HIGH
MENU/NOS718
CLEAR
EE
1 3
AMS(MD)
S717(ROTARY ENCODER)
4 5
YES
DISPLAYTIME (MD)PLAY MODE(MD)
(MD)
(MD)
(MD)
REC
REC MODE
EINPUT
GROUP SKIP
GROUP ON/OFFD775, Q704
MDLP
EJECT
E
MAIN BOARDCN1
E
S700 − 704, 706, 710 − 716,S718 − 722, 724 − 728, 17011
3MAIN BOARD
CN12
H-1
-2
PHONE LEVELRV790
PHONESJ790
A
B
C
D
E
F
1 2 3 4 5 6 7 8 9 10 11 12 13 14
REC LEVEL
(Page 56)
(Page 57)
D726 A-11D772 D-2D775 C-2
IC760 E-9IC781 E-13
Q726 E-13Q761 F-6Q762 F-6Q772 D-2Q775 E-3
• SemiconductorLocation
Ref. No. Location
MXD-D400
6363
Q726
FL750
C780
C753
C750 C751
R742
C742C743
IC781
IC760
R761
C765C764
C762
S718
R770
R769
R768
R767
R763 R764
C770C768
C769R766
C766
R719
R717 R716 R715 R714 R713 R712 R711
S716 S715 S714 S713 S712 S711 S710
C760 C763
S704 S703
R704R721
S701S702
R701R702R703
S700
CN700
R718
R762
S722
R724
C720
R708 R729 R728 R727 R726 R725
S725S726S727S728S729
R709
R722R723
CN725 CN720
D726
R707
CN790
R796
R791
TP701
C796
C791
D775
R775
D772
R705
CN701CN702
JW701
JW702
S1701S706
L702
L799
L701
L790
L1790
RV790
J790
C767
Q761 Q762
S719
S720
Q775Q772
S717
S724
S723
S721
C761
R741
R706
RV780
2SC2458TP-YGR
0.1
1050V
0.1 1050V
47
10010V0.1
NJL73H400A
MSM9201-04GS
100
0.110 50V
0.001
100
100
100
100
100k 100k
470p470p
470p3.3k
47p
10k
2.2k 1.5k 1k 680 470 330 220
1050V 0.1
6801k 220330470
19P
4.7k
100
470
0.1
10k 4.7k 2.2k 1.5k 1k 680
100
220330
3P 3P
SEL5221S-TP15
33k
3P
10
10
470p
470p
SEL5821A-TP15
100
SEL5823A-TP15
100
3P3P
20k/20k
0.1
2SC2603TP 2SC2603TP
UN4211UN4211
0.001
100
100
1k
S19
S20
S21
S22
S23
S24
S25
S26
S27
S28
S29
S30
S31
S32
S33
S34
S35
S1
8
S17
S1
6
S1
5
S14
S1
3
S12
S11
S1
0
FLDT
FLCK
FLCS
PDOWN
FLDT
FLCK
FLCS
PDOWN
2G
3G
4G
5G
6G
7G
8G
9G
10G
11G
12
G
13G
14
G
15G
16G
17G
18G
19G
20
G
21
G
22
G
23G
2G
3G
4G
5G
6G
7G
8G
9G
10G
11G
12
G
13G
14
G
15G
16G
17G
18G
19G
20
G
21
G
22
G
23
G
S1
S2
S3
S4
S5
S6
S7
S8
S9
S1
S2
S3
S4
S5
S6
S7
S8
S9
S1
0
S11
S12
S1
3
S14
S1
5
S1
6
S17
S1
8
S1
9
S2
0
S2
1
S2
2
S2
3
S2
4
S2
5
S2
6
S2
7
S2
8
S2
9
S3
0
S3
1
S3
2
S3
3
S3
4
S3
5
HP(L)
GND
HP(R)
KEY-2
RM
CD-JOG-0
CD-JOG-1
AC
AC
-36V
FL-DT
FL-CLK
FL-CS
P.DOWN
R-JOG-0
R-JOG-1
KEY-1
KEY-0
VOL
GND
KEY-2KEY-2
GND
GND
FL.GND
3.3V
KEY-2
GNDGND
KEY-2
SW
GND
A
GND
B
P1
P2
P3
P4
P5
P6
P7
P8
P9
P1
0
P1
1
P12
P1
3
P14
P1
5
P1
6
P1
7
P1
8
P1
9
P20
P21
P22
P23
P24
P25
P26
P27
P28
P29
P30
P31
P32
P33
P34
P35
1G
2G
3G
4G
5G
6G
7G 8G
9G
10G
11
G
12G
13G
14
G
15G
16
G
17
G
18G
19
G
20G
21
G
22G
23G
24
G
FLUORESCENT INDICATOR TUBE
SW
GND
A
GND
B
GN
D
VC
C
OU
T
EMITTOREMITTER
EMITTOREMITTOROPEN/CLOSE
STANDBY
SEG18
SE
G1
7
SE
G1
6
SE
G1
5
SEG
14
SE
G1
3
SEG
12
SE
G1
1
SE
G1
0
SEG
09
SEG
08
SEG
07
SEG
06
SEG
05
SEG
04
SEG
03
SEG
02
SEG
01
AD
4
AD
3
AD2
AD1
VDISP2
NC
VFL2
P4
P3
P2
P1
VDD
DA
CP
CS
RESET
OSCO
OSCI
GND
VFL1
COM24
COM23
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
SEG34
SEG35
VDISP1
COM01
COM02
COM03 CO
M0
4
CO
M05
CO
M06
CO
M0
7
CO
M08
CO
M09
CO
M1
0
CO
M1
1
CO
M1
2
CO
M1
3
CO
M1
4
CO
M1
5
CO
M1
6
CO
M1
7
CO
M1
8
CO
M1
9
CO
M2
0
CO
M2
1
COM22
(CD) (CD) (CD) TIME (CD) (CD)PLAYMODE
PHONE LEVEL
-1
-2
PHONES
FL/LED DRIVER
REMOTE CONTROL
RECEIVER
GRID DRIVE GRID DRIVE
CLEAR
MENU/NO
DISPLAYYES TIME PLAYMODE(MD) (MD) (MD) (MD) (MD)
RECINPUTREC MODEGROUP
SKIPGROUP
D775,S704
ON/OFF
EJECT
LED DRIVELED DRIVE
MDLP
(MD)
ROTARY ENCODER
LED DRIVE
ALBUM
ROTARY ENCODER
(CD)
CD SYNCRO HIGH
CD SYNCRO
NORMAL
AMS
AMS
REC LEVEL
6-17. SCHEMATIC DIAGRAM – PANEL Section –
• Voltages and waveforms are dc with respect to groundunder no-signal conditions.no mark : CD PLAY
(Page 59)
(Page 61)
MXD-D400
6464
6-18. PRINTED WIRING BOARD – TRANSFORMER Board – • See page 49 for Circuit Boards Location. :Uses unleaded solder.
LF651
D651
CN652
C651
CN650
C653
RY650
CN651
C652
1-687-901-
11
(11)
TRANSFORMER BOARD
15
MAIN BOARDCN1G
8 6
1 3 4
TR652POWER TRANSFORMER
(SUB)
TR651POWER TRANSFORMER
(MAIN)
1 9
MAIN BOARDCN2F
12
12
(AC IN) (Page 57)
(Page 57)
MXD-D400
6565
6-19. SCHEMATIC DIAGRAM – TRANSFORMER Board –
The components identified by mark 0 or dottedline with mark 0 are critical for safety.Replace only with part number specified.
C651
LF651
D651
RY650
CN652
CN650
CN651
TR651
TR652
C652 C6530.0022250V
10EDB40-TA2B5
2P
9P
4P
0.01250V
0.01250V
GND
RELAY
AC3.3V
AC3.3V
3.3V
AC5.2V
AC5.2V
AC35.6V
AC35.6V
AC11.6V
AC11.6V
AC16.0V
AC16.0V
(AC IN)
POWER TRANSFORMER
POWER TRANSFORMER
(MAIN)
(SUB)
(Page 58)
(Page 58)
MXD-D400
6666
• IC Block Diagrams
– BD (CD) Board –
IC101 CXD3068Q IC102 AN41050
DOUT
LRCKPCMD
BCK
DVDD2ASYEMD2
EMPHXTSL
DVSS2XTAI
XTAO
SQSOSQCKSCSYSBSOEXCK
SOUTSOCKXOLT
SETEVCTES1TEST1DVSS1FRDR
FFDR
TRDR
TFDR
SRDR
SFDR
DVDD1FSTOSSTP
MDPLOCKPWMI
FOKDFCT
DIGITALCLV
PROCESSOR
OSC
DIGITALOUT
EFMDEMODULATOR
32KRAM
ERRORCORRECTOR
D/A DIGITALINTERFACE
MIRR, DFCT,FOK
DETECTORCPU
INTERFACE
SUBCODEPROCESSOR
SERVOAUTO
SEQUENCER
SERVO INTERFACE
DVDD
0
XRST
MUT
E
DATA
XLAT
CLOK
SENS
SCLK
ATSK
WFC
KXU
GFXP
CK GFS
C2PO
SCOR C4M
WDC
KDV
SS0
COUT
MIR
R
AVDD
0IG
ENAV
SS0
ADIO
RFDC
CE TEAVSS
1RF
ACAS
YIAS
YO
BIAS
AVDD
1PC
OFI
LIFI
LOCL
TV
V16M
VCTL
VPCO
59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
2122
232425
262728
29
30
31
32
33
34353637383940
8079787776
757473
7271706968
676665
64
636261
OPER
ATIO
NAL
AMPL
IFIE
R &
ANAL
OG S
WIT
CH
A/D
CONV
ERTE
R
FOCUSPWM
GENERATORTRACKING
PWMGENERATOR
SLEDPWM
GENERATOR
FOCUSSERVO
DSPTRACKING
SERVODSPSLED
SERVODSP
ASYMMETRYCORRECTOR
DIGITALPLL
CLOCKGENERATOR
60
1 2 3 4 5 6 7 98 21 22 23 24 25 26 27 28
29303132333435363738394041424344454647484950515253545556
16 17 18 19 20151413121110
PGND
1
PGND
1
DIRECTIONDETECTION
DIRECTIONDETECTION
RESET CIRCUIT .STANDBY .BAND-GAP .SVCC
DIRECTIONDETECTION
DIRECTIONDETECTION
PVCC/2
PVCC/2
PVCC
/2
PVCC
1
PVCC
1
VO2+
VO1+
VO1-
IN1+
IN1-
OPO1
OPO2
SGND
IN2+
IN2-
NC NC NC NC NC NC NC NC NC NC NC NCVO2-
PGND
2
PGND
2
STAN
DBY
PVCC
2
PVCC
2
VO3-
VO4-
VO4+
VREF IN4
IN4R
IN3+
SVCC
OPO3 IN3-NC NC NC NC NC NC NC NC NC NC NC NC
VO3+
67
MXD-D400
IC103 CXA2647N-T4
ROM/RW
ROM/RW
RF OFF AT VCC
VOFST
VOFSTDVC
VC
VC
VC
ROM/RW
VC
VC
3029
28+–+
–
VCVCC
DVC
27
262524
ROM/RW
EQ
23
22
21
20
19
RFACVCA
VCC
+–
DVC
+–
+–
ROM/RW
VC
ROM/RW
DVC
+–
3
A
B
C
D
BC
A
A
A
BCD
B C D D
+–
1
2 APC AMP
5
6789
4RFAC
SUMMINGAMP
ROM/RW
DVC OR Hi-ZSLEEP, APC OFF
VOFST
VC
ROM/RW
+–
10
18
17
16
B
D
A
C
13
14
15
12
EQ IN
LD
PD
GND
ABCD
AC SUM
E
DVCC
DVC
RFAC
SW
DC OFSTRFDCI
RFDC
VC
RFCVFCBST
RFG
VCC
CEI
CE
TE BAL
TE
FEI
FE
VC
+–
VC
+–
11 GMF
GM
ROM/RW(L/H)
VOFST
68
MXD-D400
IC104 CXD9717R-008
33
34
35
36
37
38
39
40
41
42
1
8
43
61626364 60 59 56 52 50
47
46
45
44
48
49
25 26 27 28 29 30 31 3217 18 19 20 21 22 23 24
9
10
11
2
3
4
5
6
7
58 57 55 53 51
12
13
14
15
16
54
PO2
PO3
VDDT
PO
1
PO
0
TX
O
TE
ST
P
VS
SR
DITDACDAC
BusSwitch
PO4
PO5
PO6
MP3REQ
Gen
eral
Out
put P
ort
Add
ress
Cal
c.2s
ets
Y-P
oint
erre
gist
erC
-Poi
nter
regi
ster
X-P
oint
erre
gist
er
VSS
IRQ
VDDM
FI0
FI1
Fla
g
ER
AM
2k w
ord
CR
OM
4k w
ord
YR
AM
4k w
ord
XR
AM
4k w
ord
Tim
erIn
terr
upt
Con
trol
DR
AM
I/F
I-B
us
SR
AM
I/F
1Mbi
tS
RA
MX
-Bus
Y-B
us
PI0
PI1
VSS
VSSM
GeneralInput Port
SubQI/F
VC0Timing
Generator
PR
AM
256
wor
d
PR
OM
1k
=12
k w
ord
10bi
t
Inst
ruct
ion
Dec
oder
Pro
gram
Con
trol
Mic
roco
m. I
/F
regi
ster
XO
• X
1 •
X2
Y0
• Y1
• Y2
MX
MY
MZ
MA
C
A0
A1
AX
AY
ALU
A2
A3
roun
d &
lim
itro
und
& li
mit
Aud
io I/
F
BCKIB
SDI1
LRCKIA
BCKIA
SDIO
LRCKO
BCKO
SDO
VDDT
/MIACK
/MICK
MIDIO
/MILP
/MICS
MIMD
/RESET
PI2
PI3
PI4
/CLC
K
VD
D
PI5
/DAT
A
TS
TIN
/SF
SY
FI2
/SB
SY
VS
SP
PD
O
VC
OI
VD
DX
VS
SX
CK
O
VD
DP
XI
XO
VR
AR
RO
VD
AR
VD
AL
LO
VR
AL
VS
SL
VS
S
STA
ND
BY
VD
D
LRC
KIB
69
MXD-D400
IC105 TC74HC4052AFT (EL)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
2X0
X2
VDD
X1
XCOM
X0
X3
A
BVSS
VEE
INH
2X1
2X3
2XCOM
2X2
IC122 BA33C25FP-E2
31
+–
VCC
CURRENTLIMIT
SAT.PREVENTION
THERMALSHUT DOWN
REFERENCEVOLTAGE
GND
2
NCVCC
VCC
+–
VCC
CURRENTLIMIT
SAT.PREVENTION
VCC
4
VO1
+3.3
V
+2.5
V
5
VO2
70
MXD-D400
– BD (MD) Board –
IC101 CXA2523AR
–1
–2
+–IVR BB
+–IVR AA
+–IVR CC
+–IVR DD
+–IVR
+–
EE EE'
EFB TESW
PTGR
48
MOR
FO
47M
ORFI
46
RFO
45
OPN
44
OPO
43
ADDC
42
COM
PP
41
COM
PO
40
AGCI
39
RF A
GC
38
RF
37
PEAK
36 BOTM
35 ABCD
34 FE
33 AUX
32 ADFG
31 ADAGC
30 ADIN
29 ADFM
28 SE
27 CSLED
26 TE
25 WBLADJ
24
VCC
23
3TAD
J
22
EQAD
J
21
VREF
20
F0CN
T
19
XSTB
Y
18
XLAT
17
SCLK
16
SWDT
15
TEM
PR
14
TEM
PI
13
GND
12APCREF
11APC
10PD
9F
8E
7D
6C
5B
4A
3VC
VI CONV
BGR
VREFSCRI - PARA
DECODE
+ –
–+AUXSW
COMMAND
+–IVR
GSW
+–
FF
FBAL
FF'
TG
SEA–+–+
–1
–2
TG
TEA
WBL
3T
EQ
––++
++––
––––
DET
ADIPAGCWBL
BPF22
BPFCABCDA
FEA
WBL
ATA
–+CVB
+ –RFA1
––––
1
2
–––
12
GRVA
OFST
RFA2
GRV
HLPT
PTGR
–2
–1
–1
–2
BOTTOM
PEAK
RF AGC EQ
EQDET
P-P
WBL
3T WBLTEMP
PBH
–+
USROP
+– USRC
3T
BPF3T
PEAK3T1I
2J
RFA3
PBSW
AUXSW
IV
ESWEBAL
71
MXD-D400
115 114 113 112 111 110 109
EFM
O
116VD
IO2
117VS
IO2
118
VDC4
119
VSC4
120
MDD
T1
TST3
TST2
TST1
FGIN
SPFD
SPRD
108
SFDR
107
SRDR
106
FS4
105
FRDR
104
FFDR
103
TFDR
102
TRDR
101
LDDR
100
APCR
99
DTRF
98
CKRF
97
XLRF
94
F0CN
95
VDC3
96
VSC3
91
ADFG
93
VSIO
1
92
VDIO
1
8687888990
TE
85 SE
AVS2
AVD2
APCDCHG
84 ADRB
83 ADRT
82 ADIO
75 CLTV
74 FILO
73 FILI
72 PCO
70 RFI
71 AVS1
69 BIAS
68 ASYI
67 ASYO
66 AVD1
65 TEST2
64 TEST1
63 TEST0
62 DRVSS1
61 DRVDD1
81 VC
80 AUX1
79 FE
78 ABCD
77 BOTM
76 PEAK
60
A03
59
A04
58
VSC2
57
VDC2
56
A02
55
A05
54
A01
53
A06
52
A00
51
A07
50
A10
49
A08
48
A09
47
XRAS
46
XCAS
45
D1
44
D2
43
D0
42
D3
41
A11
37
XWE
XOE
39
DRVD
D0
40
DRVS
S0
3835
XBCK
36
FS25
6
33
DADT
34
LRCK
31
VSC1
32
ADDT
29XBCKI
30VDC1
28LRCKI
27DATAI
26DOUT
25DIN1
24DIN0
23XTSL
20OSCO21OSCN22VSIO0
19OSCI18VDIO0
17TX
16XINT
15RPWR
14DQSY
13SQSY
12XRST11SENS
10SRDT
9VSC08XLAT
7SCLK
6SWDT
4MNT3 (SLOC)
5VDC0
3MNT2 (XBUSY)
2MNT1 (SHCK)
1MNT0 (FOK)
PWMGENERATOR
AUTO
SEQU
ENCE
R
SERVODSP
CPU I/F
MONITORCONTROL
SPINDLESERVO
EACHBLOCK
EACHBLOCK
DIGITALAUDIO
I/F
SAMPLINGRATE
CONVERTER
CLOCKGENERATOR
SUBCODEPROCESSOR
EACHBLOCK
A/DCONVERTER
ANALOGMUX
EFM
/ACI
RCEN
CODE
R/DE
CODE
R
PLL
SHOCK RESISTANTMEMORY CONTROLLER
ATRAC/ATRAC3ENCODER/DECODER
ADIPDEMODULATOR/
DECODER
COMP
ADDRESS/DATA BUS A00 - A11, D0 - D3
IC201 CXD2664R
72
MXD-D400
IC401 BH6519FS-E2
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
GND VG
IN4R
IN4F
VM4
OUT4
F
PGND
4
OUT4
R
VM34
OUT3
R
PGND
3
OUT3
F
VM3
IN3F
IN3R PS
B
CAPA
–
CAPA
+
IN2R
IN2F
VM2
OUT2
F
PGND
2
OUT2
R
VM12
OUT1
R
PGND
1
OUT1
F
VM1
IN1F
IN1R
V DD
CHARGEPUMP.
OSC
INTERFACE AMP
INTERFACE AMP
AMP INTERFACE
PREDRIVEPREDRIVE
PREDRIVEPREDRIVE
AMP
INTERFACEAMPAMPAMP
VDD
PSB
AMP
IC803 CY24115-2SCT
1
2
3
4
8
7
6
5
XOUT
FS1
FS0
CLKA
XIN
VCC
CLKSEL
GND
OSC
Q
P
Φ OUTPUTDIVIDERS
FREQUENCYTABLE
VCO
PLL
– MAIN Board –
IC3 M5293L
2
5
5k
+
–
27k
OVERCURRENTLIMITTER
OVERHEATPROTECTION
REFERENCEVOLTAGE
GND
ON/OFF
IN
REFERENCEVOLTAGE
OUT3
4
1
73
MXD-D400
IC7 LA5643
1
–
+
12DELAY
CIRCUITVREF
DELAYCIRCUIT
3.3V
PH5
STBY
VCC
ANA5
SYS3.3
B.BAK
AC
CD1
P. DOWN
GND
CD2
S. RESET
–
+
–+
–+
–+
–
+
2
3
4
5
6
7
8
9
10
11
IC10, 18 LB1641
1 2 3 4 5 6 7 8 9 10
GND
MOT
ORDR
IVE
NOIS
EFI
LTER
CLAM
P
FWD.
IN
REV.
IN
VCC
1
VCC
2
NOIS
EFI
LTER
MOT
ORDR
IVE
MOTORDRIVE
MOTORDRIVE
T.S.D O.C.P
FWD/REV/STOPCONTROL LOGIC
2324
21
CONT
ROL
REGI
STER
A/D
CONV
ERTE
R
D/A
CONV
ERTE
R
RX3TEST2
43
RX4NC
98
CDTOCDTI
1110
CSNCCLK
5PDN
76
INT1INT0
MCKO1MCKO2
4244
RX1
RX2
43
TEST
1
3941
PVDD
PVSS
40
R
DIR DIT
13 14
TX1
12
TEST
3
TX2
15
XTAL
E
16
TX3
AUDIOINTERFACE
37
RIN
38
LIN
3436
AVSS
VREF
35
AVDD
IPGADATTH.P.F.
DATTSMUTE
17
DVDD
18
DVSS
19
TVDD
22
DMCK
20
XTO
21
XTI
X’TALOSC
MCLKSELECTOR DIVIDER
2526
SDTOSDTI
2728
BICKLRCK
29
30
M/S
DZF
31 VCOM
32 LOUT
33 ROUT
IC11 CXD9692R
74
MXD-D400
6-20. IC PIN FUNCTION DESCRIPTION• BD (CD) BOARD IC101 CXD3068Q (CD DSP)
Pin No. Pin Name I/O Description
1 DVDD0 — Power supply terminal (+3.3V) (digital system)
2 XRST I Reset signal input from the CD mechanism controller “L”: reset
3 MUTE I Muting on/off control signal input terminal “H”: muting on Not used
4 DATA I Serial data input from the CD mechanism controller
5 XLAT I Serial data latch pulse signal input from the CD mechanism controller
6 CLOK I Serial data transfer clock signal input from the CD mechanism controller
7 SENS O Internal status (SENSE) signal output to the CD mechanism controller
8 SCLK I SENSE serial data reading clock signal input from the CD mechanism controller
9 ATSK I/O Input/output terminal for anti-shock Not used
10 WFCK O Write frame clock signal output terminal Not used
11 RFCK O RFCK signal output terminal Not used
12 XPCK O XPCK signal output terminal Not used
13 GFS O Guard frame sync signal output terminal Not used
14 C2PO O C2 pointer signal output terminal Not used
15 SCOR O Subcode sync (S0+S1) detection signal output to the CD mechanism controller
16 C4M O 4.2336 MHz clock signal output terminal Not used
17 WDCK O Guard subcode sync (S0+S1) detection signal output terminal Not used
18 DVSS0 — Ground terminal (digital system)
19 COUT O Numbers of track counted signal output terminal Not used
20 MIRR O Mirror signal output terminal Not used
21 DFCT I/O Defect signal input/output terminal Not used
22 FOK O Focus OK signal output terminal Not used
23 PWMI I Spindle motor external control signal input terminal Not used
24 LOCK O GFS is sampled by 460 Hz “H” output when GFS is “H” Not used
25 MDP O Spindle motor servo drive signal output to the motor/coil drive
26 SSTP I Detection signal input from limit in switch The optical pick-up is inner position when “H”
27 FSTO O 2/3 divider output terminal Not used
28 DVDD1 — Power supply terminal (+3.3V) (digital system)
29 SFDR O Sled servo drive PWM signal (+) output terminal
30 SRDR O Sled servo drive PWM signal (–) output terminal
31 TFDR O Tracking servo drive PWM signal (+) output terminal
32 TRDR O Tracking servo drive PWM signal (–) output terminal
33 FFDR O Focus servo drive PWM signal (+) output terminal
34 FRDR O Focus servo drive PWM signal (–) output terminal
35 DVSS1 — Ground terminal (digital system)
36 TEST I Input terminal for the test
37 TES1 I Input terminal for the test
38 VC I Middle point voltage (+1.65V) input terminal
39 FE I Focus error signal input from the RF amplifier
40 SE I Sled error signal input from the RF amplifier
41 TE I Tracking error signal input from the RF amplifier
42 CE I Middle point servo analog signal input
43 RFDC I RF signal input from the RF amplifier
44 ADIO O Output terminal for the test Not used
45 AVSS0 — Ground terminal (analog system)
46 IGEN I Stabilized current input for operational amplifiers
75
MXD-D400
Pin No. Pin Name I/O Description
47 AVDD0 — Power supply terminal (+3.3V) (analog system)
48 ASYO O EFM full-swing output terminal
49 ASYI I Asymmetry comparator voltage input terminal
50 RFAC I EFM signal input from the RF amplifier
51 AVSS1 — Ground terminal (analog system)
52 CLTV I Internal VCO control voltage input terminal
53 FILO O Filter output for master PLL
54 FILI I Filter input for master PLL
55 PCO O Charge pump output for master PLL
56 AVDD1 — Power supply terminal (+3.3V) (analog system)
57 BIAS I Asymmetry circuit constant current input terminal
58 VCTL I VCO control voltage input terminal for the wideband EFM PLL Not used
59 V16M O VCO oscillation output terminal for the wideband EFM PLL Not used
60 VPCO O Charge pump output terminal for the wideband EFM PLL Not used
61 DVDD2 — Power supply terminal (+3.3V) (digital system)
62 ASYE I Asymmetry circuit on/off control signal input terminal “L”: off, “H”: on Not used
63 MD2 IDigital out on/off control signal input terminal“L”: digital out off, “H”: digital out on Fixed at “H” in this set
64 DOUT O Digital audio signal output terminal
65 LRCK O L/R sampling clock signal (44.1 kHz) output to the MP3 decoder
66 PCMD O Serial data output to the MP3 decoder
67 BCLK O Bit clock signal (2.8224 MHz) output to the MP3 decoder
68 EMPH O“L” is output when playback disc is emphasis off“H” is output when playback disc is emphasis on Not used
69 XTSL IInput terminal for the system clock frequency setting“L”: 16.9344 MHz, “H”: 33.8688MHz Fixed at “H” in this set
70 DVSS2 — Ground terminal (digital system)
71 XTAI I System clock input terminal (33.8688 MHz)
72 XTAO O System clock output terminal (33.8688 MHz) Not used
73 SOUT O Serial data output terminal Not used
74 SOCK O Serial data reading clock signal output terminal Not used
75 XOLT O Serial data latch pulse signal output terminal Not used
76 SQSO O Subcode Q data output to the CD mechanism controller
77 SQCK I Subcode Q data reading clock signal input from the CD mechanism controller
78 SCSY I Input terminal for resynchronism of guard subcode sync (S0+S1) Not used
79 SBSO O Subcode serial data output terminal Not used
80 EXCK I Subcode serial data reading clock signal input terminal Not used
76
MXD-D400
• BD (MD) BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP)
Pin No. Pin Name I/O Description
1 I I I-V converted RF signal I input from the optical pick-up block detector
2 J I I-V converted RF signal J input from the optical pick-up block detector
3 VC O Middle point voltage (+1.65V) generation output terminal
4 to 9 A to F I Signal input from the optical pick-up detector
10 PD I Light amount monitor input from the optical pick-up block laser diode
11 APC O Laser amplifier output terminal to the automatic power control circuit
12 APCREF I Reference voltage input terminal for setting laser power
13 GND — Ground terminal
14 TEMPI I Connected to the temperature sensor Not used
15 TEMPR O Output terminal for a temperature sensor reference voltage Not used
16 SWDT I Writing serial data input from the MD DSP
17 SCLK I Serial data transfer clock signal input from the MD DSP
18 XLAT I Serial data latch pulse signal input from the MD DSP
19 XSTBY I Standby signal input terminal “L”: standby (fixed at “H” in this set)
20 F0CNT ICenter frequency control voltage input terminal of internal circuit (BPF22, BPF3T, EQ) input terminal
21 VREF O Reference voltage output terminal Not used
22 EQADJ I Center frequency setting terminal for the internal circuit (EQ)
23 3TADJ I Center frequency setting terminal for the internal circuit (BPF3T)
24 VCC — Power supply terminal (+3.3V)
25 WBLADJ I Center frequency setting terminal for the internal circuit (BPF22)
26 TE O Tracking error signal output to the MD DSP
27 CSLED I Connected to the external capacitor for low-pass filter of the sled error signal
28 SE O Sled error signal output to the MD DSP
29 ADFM O FM signal output of the ADIP
30 ADIN I Receives a ADIP FM signal in AC coupling
31 ADAGC I Connected to the external capacitor for ADIP AGC
32 ADFG O ADIP duplex signal (22.05 kHz ± 1 kHz) output to the MD DSP
33 AUX O Auxiliary signal (I3 signal/temperature signal) output to the MD DSP
34 FE O Focus error signal output to the MD DSP
35 ABCD O Light amount signal (ABCD) output to the MD DSP
36 BOTM O Light amount signal (RF/ABCD) bottom hold output to the MD DSP
37 PEAK O Light amount signal (RF/ABCD) peak hold output to the MD DSP
38 RF O Playback EFM RF signal output to the MD DSP
39 RFAGC I Connected to the external capacitor for RF auto gain control circuit
40 AGCI I Receives a RF signal in AC coupling
41 COMPO O User comparator output terminal Not used
42 COMPP I User comparator input terminal Not used
43 ADDC I Connected to the external capacitor for cutting the low band of the ADIP amplifier
44 OPO O User operational amplifier output terminal Not used
45 OPN I User operational amplifier inversion input terminal Not used
46 RFO O RF signal output terminal
47 MORFI I Receives a MO RF signal in AC coupling
48 MORFO O MO RF signal output terminal
77
MXD-D400
• MAIN BOARD IC6 M30624MGA-B20FP (SYSTEM CONTROLLER, CD MECHANISM CONTROLLER)
Pin No. Pin Name I/O Description
1 DRVDAT O Command data output to the FL/LED driver
2 DRVCLK O Command data transfer clock signal output to the FL/LED driver
3 DRVCS O Command data transfer request signal output to the FL/LED driver
4 SIRCS I Remote control signal input from the remote control receiver
5 MP3DOUT O Command data output to the MP3 decoder
6 MP3DIN I Command data input from the MP3 decoder
7 MP3CLK O Command data transfer clock signal output to the MP3 decoder
8 BYTE IExternal data bus line byte selection signal input terminal“L”: 16 bit, “H”: 8 bit (fixed at “L”)
9 CNVSS — Ground terminal
10 MP3ACK O Acknowledge signal output to the MP3 decoder
11 STB O Power on/off relay drive signal output terminal “L”: standby, “H”: power on
12 RESET ISystem reset signal input from the reset signal generator “L”: resetFor several hundreds msec. after the power supply rises, “L” is input, then it changes to “H”
13 X-OUT O System clock output terminal (16 MHz)
14 VSS — Ground terminal
15 X-IN I System clock input terminal (16 MHz)
16 VCC — Power supply terminal (+5V)
17 NMI I Non-maskable interrupt input terminal “L” active (fixed at “H” in this set)
18 MP3REQ I Command data request signal input from the MP3 decoder
19 MP3RESET O System reset signal output to the MP3 decoder
20 SCOR I Subcode sync (S0+S1) detection signal input from the CD DSP “H”: active
21 MP3SEL I Command selection signal output terminal Not used
22 MP3CS O Chip enable signal output to the MP3 decoder
23 MP3LP O Latch pulse signal output to the MP3 decoder
24 PWM3 O PWM signal output for RF offset adjustment
25 X4 O Disc speed selection (normal/4 speed) signal output to the selector IC
26 PWM2 O PWM signal output for tracking offset adjustment
27 CTRL1 O Disc speed selection (normal/2 speed) signal output to the selector IC
28 PWM1 O PWM signal output for focus offset adjustment
29 IICCLK I/O IIC data transfer clock signal output to the MD mechanism controller
30 IICDATA I/O IIC data bus with the MD mechanism controller
31 TXD1 O Not used
32 SUBQ I Subcode Q data input from the CD DSP
33 SQCLK O Subcode Q data reading clock signal output to the CD block “L”: active
34 SENSE I Internal status (SENSE) input from the CD DSP
35 DATA O Command serial data output to the CD DSP
36 OPEN — Not used
37 CLK O Command serial data transfer clock signal output to the CD DSP
38 XLT O Command latch pulse output to the CD DSP
39, 40 OPEN — Not used
41 PULLDOWN I Fixed at “L” in this set
42, 43 OPEN — Not used
44 BDPWR O power control signal output terminal Not used
45 BDRST O System reset signal output to the RF amplifier and CD DSP
46 PULLUP I Fixed at “H” in this set
78
MXD-D400
Pin No. Pin Name I/O Description
47 LDON O Laser diode on/off control signal output to the automatic power control circuit “H”: laser on
48 OPEN — Not used
49 CDMP3SEL O CD/MP3 select signal output terminal
50 OPEN — Not used
51 PULLUP I Fixed at “H” in this set
52 OPEN — Not used
53 LOAD_NEG O CD loading motor drive signal output (load-in direction)
54 LOAD_POS O CD loading motor drive signal output (load-out direction)
55 IN_SW IDetection input from the tray open/close detect switch on the CD mechanism block“L”: when tray is close, “H”: when tray is open
56 OUT_SW IDetection input from the tray open/close detect switch on the CD mechanism block“L”: when tray is open, “H”: when tray is close
57 to 61 OPEN — Not used
62 VCC — Power supply terminal (+5V)
63 OPEN — Not used
64 VSS — Ground terminal
65 OPEN — Not used
66 SCMS O Relay drive signal output terminal
67 ADADZF I Audio line muting on/off control signal input terminal Not used
68 CS_ADALAT O Chip enable signal output to the A/D, D/A converter
69 ADACLK O Command data transfer clock signal output to the A/D, D/A converter
70 ADADATAO O Command data output to the A/D, D/A converter
71 CHECK1 O Not used
72 ADADATAI I Command data input from the MP3 decoder
73 AUTOPWRON I Power on/off control signal input terminal. The signal input, when disc tray is open/close
74, 75ADAINT1,ADAINT0
I Interrupt status input from the A/D, D/A converter
76 ADARST O System reset signal output to the A/D, D/A converter
77, 78CDJOG1,CDJOG0
I Jog dial pulse input from the rotary encoder (for CD)
79PDOWN_
MAINACCUTI Power down detection signal input “L”: power down, normally: “H”
80 ADJ — Not used
81 DRVRST O System reset signal output to the FL/LED driver
82 OPEN — Not used
83 CHECK1 O Not used
84 OPEN — Not used
85LINEMUTE_
AMUTEO Audio line muting on/off control signal output “L”: line muting on
86, 87MDJOG1,MDJOG0
I Jog dial pulse input from the rotary encoder (for MD)
88 MDRESET O System reset signal output to the MD mechanism controller
89 LEVEL_L I L-ch level input from the MD mechanism controller
90 LEVEL_R I R-ch level input from the MD mechanism controller
91 RECLEVEL I Rec level detection signal input terminal
92 SELECT0 I For destination setting terminal
93 KEY3 I Key input terminal Not used
94, 95 KEY2, KEY1 I Key input terminal (A/D input)
96 AVSS — Ground terminal
79
MXD-D400
Pin No. Pin Name I/O Description
97 KEY0 I Key input terminal (A/D input)
98 VREF I Reference voltage (+5V) input terminal
99 AVCC — Power supply terminal (+5V) (for analog system )
100 OPEN — Not used
80
MXD-D400
• MAIN BOARD IC12 M30624MGN-A23FP (MD MECHANISM CONTROLLER)
Pin No. Pin Name I/O Description
1 FLDT O Display serial data output terminal Not used
2 FLCK O Display serial data transfer clock signal output terminal Not used
3 LEVEL-L O L-channel level output to the system controller
4 LEVEL-R O R-channel level output to the system controller
5 to 7 OPEN — Not used
8 BYTE I External data bus line byte selection signal input “L”: 16 bit, “H”: 8 bit (fixed at “L”)
9 CNVSS — Ground terminal
10 XIN-T I Sub system clock input terminal (32.768 kHz)
11 XOUT-T O Sub system clock output terminal (32.768 kHz)
12 SRST ISystem reset signal input from the system controller and regulator “L”: resetFor several hundreds msec. after the power supply rises, “L” is input, then it changes to “H”
13 XOUT O Main system clock output terminal (10 MHz)
14 GND — Ground terminal
15 XIN I Main system clock input terminal (10 MHz)
16 VCC — Power supply terminal (+3.3V)
17 NMI I Non-maskable interrupt input terminal (fixed at “H” in this set)
18 DQSY IDigital In U-bit CD format subcode Q sync (SCOR) input from the MD DSP“L” is input every 13.3 msec Almost all, “H” is input
19 PDOWN I Power down detection signal input terminal “L”: power down, normally: “H”
20 SQSY ISubcode Q sync (SCOR) input from the MD DSP“L” is input every 13.3 msec Almost all, “H” is input
21 KBCLK O Not used
22 KBDATA O Not used
23 IICBUSY O Busy signal output for the I2C bus “L” active Not used
24 A1OUT — Not used
25 XINT I Interrupt status input from the MD DSP
26 BEEP O Beep sound drive signal output terminal Not used
27 XELT O Not used
28 IICPOWER O Not used
29 IICCLK I IIC data transfer clock signal input from the system controller
30 IICDATA I/O IIC data bus with the system controller
31 SWDT O Writing data output to the MD DSP
32 SRDT I Reading data input from the MD DSP
33 SCLK O Serial clock signal output to the MD DSP
34 KBCLKCTL O Not used
35 L3DATAO O L3 bus data output terminal Not used
36 L3DATAI I L3 bus data input terminal Not used
37 L3CLK O L3 bus data transfer clock signal output terminal Not used
38 L3MODE O L3 bus mode control signal output terminal Not used
39 ADARST O System reset signal output terminal Not used
40 ADALATCH O Serial data latch pulse output terminal Not used
41 EPM I Not used
42 OCLIPSEL O Not used
43 OPEN — Not used
44 PROTECT IDetection input from the disc reflection rate detect switch“L”: high reflection rate disc, “H”: low reflection rate disc
45 SCL (EEP) O Serial clock signal output to the EEPROM
81
MXD-D400
Pin No. Pin Name I/O Description
46 CE I Command chip enable signal input terminal Not used
47 EEP-WP O Write protect signal output to the EEPROM
48 XBUSY (MNT2) I Busy signal input from the MD DSP
49 OUTSW IDetection input from the loading-out detect switch“L” at a load-out position, others: “H”
50 XLATCH O Serial data latch pulse signal output to the MD DSP
51 PLAYSW I Detection input from the playback position detect switch “L” active
52 DRESET O Reset signal output to the MD DSP and motor/coil drive “L”: reset
53 RECSW I Detection input from the recording position detect switch “L” active
54 WRPWR OLaser power select signal output to the MD DSP and HF module switch circuit“L”: playback mode, “H”: recording mode
55 LIMITIN IDetection input from the sled limit-in detect switchThe optical pick-up is inner position when “L”
Laser modulation select signal output to the HF module switch circuit
Playback power: “H”, Stop: “L”,
Recording power:
56 MOD O
57 LDON O Laser diode on/off control signal output to the automatic power control circuit “H”: laser on
58 SENS I Internal status (SENSE) input from the MD DSP
59 SHOCK (MNT1) I Track jump detection signal input from the MD DSP
60 SDA (EEP) I/O Two-way data bus with the EEPROM
61 REFLECT IDetection input from the disc reflection rate detect switch“L”: high reflection rate disc, “H”: low reflection rate disc
62 VCC — Power supply terminal (+3.3V)
63 OPEN — Not used
64 VSS — Ground terminal
65 LOAD LO O Loading motor drive voltage control signal output for the loading motor driver “H” active
66 LOAD IN O MD loading motor drive signal output (load-in direction)
67 LOAD OUT O MD loading motor drive signal output (load-out direction)
68, 69MODEL0,MODEL1
I For model setting terminal Not used
70, 71 J/OTHER (SEL0),J/OTHER (SEL1)
I For destination setting terminal
72 SPDIF_CUT O Not used
73 to 76 OPEN — Not used
77 LINEMUTE O Audio line muting on/off control signal output terminal Not used
78 DA_RESET O Not used
79 OPEN — Not used
80 SPDIF_LOCK I Lock signal input terminal Not used
81 OPTSEL O Not used
82 ADPDOWN O Not used
83, 84 OPEN — Not used
85 to 87 TP1 to TP3 O Not used
88 TOUNLOCK (TP4) O Not used
2 sec
0.5 sec
82
MXD-D400
Pin No. Pin Name I/O Description
89 IOP I Optical pick-up voltage input from the automatic power control circuit
90 to 95 OPEN — Not used
96 AVSS — Ground terminal (for A/D converter)
97 OPEN — Not used
98 VREF I Reference voltage (+3.3V) input terminal (for A/D converter)
99 AVCC — Power supply terminal (+3.3V) (for A/D converter)
100 OPEN — Not used
83
MXD-D400
7-1. OVERALL SECTION
SECTION 7EXPLODED VIEWS
The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.
• Items marked “*” are not stocked since theyare seldom required for routine service. Somedelay should be anticipated when orderingthese items.
• Accessories and packing materials are givenin the last of the electrical parts list.
NOTE:• -XX and -X mean standardized parts, so they
may have some difference from the originalone.
• Color Indication of Appearance PartsExample:KNOB, BALANCE (WHITE) . . . (RED)
↑ ↑Parts Color Cabinet's Color
1
2
3
4
4
4
5
6
7
11
8
89
9
10
12
#1
#1
not supplied
#1
#1
#1
MD mechanism deck sectionnot
supplied
not supplied
chassis section
CD mechanism deck section
#1 #1
#2
#2
front panel block section
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
1 4-245-456-01 PANEL (CD), LOADING2 1-782-279-11 WIRE (FLAT TYPE) (25 CORE)3 1-782-243-11 WIRE (FLAT TYPE) (9 CORE)4 4-210-291-01 SCREW (CASE 3 TP2)5 4-231-686-11 CASE (409538)
6 1-782-109-11 WIRE (FLAT TYPE) (17 CORE)7 1-782-244-11 WIRE (FLAT TYPE) (27 CORE)
8 4-228-643-11 SCREW (+BVTTWH M3), STEP9 4-228-689-01 INSULATOR10 X-4953-448-1 FOOT ASSY11 4-232-237-01 FOOT (DIA. 30)12 4-977-358-01 CUSHION
#1 7-685-646-79 SCREW +BVTP 3X8 TYPE2 IT-3#2 7-685-850-04 SCREW +BVTT 2X3 (S)
84
MXD-D400
7-2. FRONT PANEL SECTION
51
66
66
5253
5455
55
55
55
55
5555
55
55
55
55
56
57
5859
60
6162
6364
65
not supplied
supplied with RV790
not supplied
not supplied
not supplied
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
51 4-238-396-01 KNOB (AMS)52 X-4955-450-1 PANEL ASSY, FRONT53 3-931-378-51 KNOB (F10)54 1-687-904-11 HP BOARD55 4-951-620-01 SCREW (2.6X8), +BVTP
56 1-687-905-11 POWER SWITCH BOARD57 1-687-906-11 CD-EJECT BOARD58 1-687-903-11 CD-SW BOARD
59 1-777-556-11 WIRE (FLAT TYPE) (19 CORE)60 A-4732-471-A DISPLAY BOARD, COMPLETE61 4-228-761-02 LID (CARTRIDGE)62 4-230-410-12 SPRING (LID), TENSION63 4-977-358-01 CUSHION
64 4-238-396-11 KNOB (AMS)65 4-238-386-21 BUTTON (OPEN/CLOSE)66 3-354-981-11 SPRING (SUS), RING
85
MXD-D400
7-3. CHASSIS SECTION
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
101 1-687-901-11 TRANSFORMER BOARD* 102 3-703-244-00 BUSHING (2104), CORD0103 1-783-531-11 CORD, POWER
104 A-4732-635-A MAIN BOARD, COMPLETE
0TR651 1-439-732-11 TRANSFORMER, POWER#1 7-685-646-79 SCREW +BVTP 3X8 TYPE2 IT-3#3 7-685-871-01 SCREW +BVTT 3X6 (S)
101
102
103
104#3
#1
#3#3
#1
not supplied
TR651
The components identified by mark 0 or dottedline with mark 0 are critical for safety.Replace only with part number specified.
86
MXD-D400
7-4. MD MECHANISM DECK SECTION-1 (MDM-7S2C)
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
* 301 4-996-267-01 BASE (BU-D)302 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI303 4-226-994-01 GUIDE (L)304 A-4735-075-B HOLDER ASSY305 X-4952-665-1 SPRING (SHT) ASSY, LEAF
306 4-227-002-01 GEAR, PULLEY308 4-227-025-01 BELT (LOADING)310 4-229-533-01 SPRING (STOPPER), TORSION311 4-227-012-02 SPRING (HOLDER), TENSION312 A-4680-638-B RETAINER COMPLETE ASSY
313 4-226-995-01 SLIDER (EJ)314 4-227-013-01 SPRING (EJ), TENSION315 4-226-996-01 LIMITTER (EJ)316 4-226-997-04 SLIDER317 4-226-998-01 LEVER (CHG)
318 4-227-007-01 GEAR (SB)319 4-227-006-01 GEAR (SA)320 4-226-999-01 LEVER (HEAD)#2 7-685-850-04 SCREW +BVTT 2X3 (S)
308
306302
301
320
302
311
312
310
313
314
315
316
319318
317
305
303
304 not supplied
not supplied
not suppliednot supplied
#2
not supplied
MD mechanism deck section-2(MDM-7S2C)
87
MXD-D400
7-5. MD MECHANISM DECK SECTION-2 (MDM-7S2C)
361
360
359
358
357
363
362
361 356
351
352
353 354
352
368
367
351
352
356
HR901
S102
M101
M103
not supplied
M102
#4#4
352
not supplied
355
364 365
366
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
351 4-231-319-01 SCREW (2X6) CZN, +B (P) TRI352 3-372-761-01 SCREW (M1.7), TAPPING353 4-227-008-01 GEAR (SC)354 4-227-009-01 GEAR (SD)355 4-231-372-01 CHASSIS
356 4-232-270-01 SCREW (1.7X3.5), +PWH357 4-226-993-01 RACK358 4-227-014-01 SPRING (RACK), COMPRESSION359 1-678-514-11 FLEXIBLE BOARD
0360 A-4672-976-A OPTICAL PICK-UP (KMS-262)
361 4-988-560-01 SCREW (+P 1.7X6)362 4-996-265-01 SHAFT, MAIN
363 4-226-992-01 BASE, SL364 4-230-716-01 SPRING (SPDL), TORSION365 4-227-004-01 GEAR (LC)366 4-227-005-01 GEAR (LD)367 4-226-990-04 BASE (BU-A)
368 A-4727-928-A BD (MD) BOARD, COMPLETEHR901 1-500-670-22 HEAD, OVER WRIGHTM101 A-4735-757-A MOTOR ASSY, SPINDLEM102 A-4672-900-A MOTOR ASSY, SLEDM103 A-4672-975-A MOTOR ASSY, LOADING
S102 1-771-957-11 SWITCH, PUSH (2 KEY) (REFRECT/PROTECT)#4 7-685-204-19 SCREW +KTP 2X6 TYPE2 NON-SLIT
The components identified by mark 0 or dottedline with mark 0 are critical for safety.Replace only with part number specified.
88
MXD-D400
7-6. CD MECHANISM DECK SECTION (CDM66C-30B61M)
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
501 4-238-370-02 LEVER (SW)502 4-238-371-01 LEVER (STP)503 4-231-530-05 TRAY (66)504 4-232-711-01 GEAR (LD)505 4-232-710-01 PULLEY (LD)
506 4-232-713-01 BELT (LD)507 4-238-368-01 PULLEY (B), CHUCKING508 4-232-712-01 CAM (66)509 4-231-529-04 CHASSIS (66)510 4-232-682-01 CUSHION (66)
511 4-228-414-01 BRACKET (YOKE)
512 X-4954-474-1 PULLEY ASSY, CHUCKING514 1-645-721-11 LOADING BOARD515 4-227-899-01 SCREW (DIA. 12), FLOATING516 4-238-369-02 HOLDER (BU)517 4-240-820-01 INSULATOR (B) (BU-30B)
518 4-238-372-01 SPRING (INSULATOR),COMPRESSION519 4-985-672-01 SCREW (+PTPWH M2.6), FLOATINGM151 A-4604-363-A MOTOR (L) ASSY (LOADING)#5 7-621-775-10 SCREW +B 2.6X4#6 7-685-133-19 SCREW +P 2.6X6 TYPE2 NON-SLIT
#6
M151
base unit section(BU-30BBD61B)
#6
#5
501
502
503
504 507
509
508
510
510511
512 514
515 516
517
518
519
518
518
519
519
517
517
517
505506
89
MXD-D400
7-7. BASE UNIT SECTION (BU-30BD61M)
551
552
553
554
555
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
551 A-4732-100-A BD (CD) BOARD, COMPLETE552 1-782-817-11 WIRE (FLAT TYPE) (16 CORE)
0553 A-4735-885-A BU-30B ASSY
554 4-236-304-02 SPRING (SLED), LEAF555 3-372-761-01 SCREW (M1.7), TAPPING
The components identified by mark 0 or dottedline with mark 0 are critical for safety.Replace only with part number specified.
90
MXD-D400SECTION 8
ELECTRICAL PARTS LISTBD (CD)
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
NOTE:• Due to standardization, replacements in the
parts list may be different from the parts speci-fied in the diagrams or the components usedon the set.
• -XX and -X mean standardized parts, so theymay have some difference from the originalone.
• RESISTORSAll resistors are in ohms.METAL: Metal-film resistor.METAL OXIDE: Metal oxide-film resistor.F: nonflammable
• Items marked “*” are not stocked since theyare seldom required for routine service.Some delay should be anticipated when order-ing these items.
• SEMICONDUCTORSIn each case, u: µ, for example:uA. . : µA. . uPA. . : µPA. .uPB. . : µPB. . uPC. . : µPC. .uPD. . : µPD. .
• CAPACITORSuF: µF
• COILSuH: µH
A-4732-100-A BD (CD) BOARD, COMPLETE*************
< CAPACITOR >
C101 1-164-315-11 CERAMIC CHIP 470PF 5% 50VC102 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC103 1-164-315-11 CERAMIC CHIP 470PF 5% 50VC104 1-162-967-11 CERAMIC CHIP 0.0033uF 10% 50VC107 1-162-921-11 CERAMIC CHIP 33PF 5% 50V
C108 1-164-360-11 CERAMIC CHIP 0.1uF 16VC109 1-164-360-11 CERAMIC CHIP 0.1uF 16VC110 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC111 1-126-607-11 ELECT CHIP 47uF 20% 4VC112 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C113 1-128-995-21 ELECT CHIP 100uF 20% 10VC114 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50VC115 1-128-995-21 ELECT CHIP 100uF 20% 10VC116 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC117 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C118 1-115-156-11 CERAMIC CHIP 1uF 10VC119 1-115-156-11 CERAMIC CHIP 1uF 10VC121 1-164-360-11 CERAMIC CHIP 0.1uF 16VC131 1-110-563-11 CERAMIC CHIP 0.068uF 10% 16VC132 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25V
C133 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3VC150 1-128-394-11 ELECT CHIP 220uF 20% 10VC151 1-164-360-11 CERAMIC CHIP 0.1uF 16VC152 1-164-360-11 CERAMIC CHIP 0.1uF 16VC153 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C156 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50VC157 1-115-416-11 CERAMIC CHIP 0.001uF 5% 25VC158 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC159 1-162-927-11 CERAMIC CHIP 100PF 5% 50VC160 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C161 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC163 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC164 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC165 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16VC169 1-128-394-11 ELECT CHIP 220uF 20% 10V
C202 1-164-360-11 CERAMIC CHIP 0.1uF 16VC203 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50VC205 1-164-360-11 CERAMIC CHIP 0.1uF 16VC208 1-164-360-11 CERAMIC CHIP 0.1uF 16VC209 1-164-230-11 CERAMIC CHIP 220PF 5% 50V
The components identified bymark 0 or dotted line with mark0 are critical for safety.Replace only with part numberspecified.
When indicating parts by referencenumber, please include the board.
C211 1-117-863-11 CERAMIC CHIP 0.47uF 10% 6.3VC212 1-164-315-11 CERAMIC CHIP 470PF 5% 50VC213 1-115-414-11 CERAMIC CHIP 820PF 5% 25VC215 1-117-863-11 CERAMIC CHIP 0.47uF 10% 6.3VC216 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C222 1-115-156-11 CERAMIC CHIP 1uF 10VC224 1-115-156-11 CERAMIC CHIP 1uF 10VC226 1-126-607-11 ELECT CHIP 47uF 20% 4VC227 1-164-360-11 CERAMIC CHIP 0.1uF 16VC228 1-115-156-11 CERAMIC CHIP 1uF 10V
C229 1-164-360-11 CERAMIC CHIP 0.1uF 16VC230 1-164-360-11 CERAMIC CHIP 0.1uF 16VC231 1-128-394-11 ELECT CHIP 220uF 20% 10VC248 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3VC249 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C250 1-164-360-11 CERAMIC CHIP 0.1uF 16VC251 1-164-360-11 CERAMIC CHIP 0.1uF 16VC253 1-164-360-11 CERAMIC CHIP 0.1uF 16VC254 1-162-913-11 CERAMIC CHIP 8PF 0.5PF 50VC255 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C256 1-164-360-11 CERAMIC CHIP 0.1uF 16VC257 1-128-934-11 CERAMIC CHIP 0.33uF 20% 10VC258 1-162-913-11 CERAMIC CHIP 8PF 0.5PF 50VC259 1-164-360-11 CERAMIC CHIP 0.1uF 16VC260 1-131-998-21 ELECT CHIP 82uF 20% 6.3V
C266 1-164-360-11 CERAMIC CHIP 0.1uF 16VC270 1-162-960-11 CERAMIC CHIP 220PF 10% 50VC271 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC273 1-162-960-11 CERAMIC CHIP 220PF 10% 50VC274 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C277 1-216-864-11 SHORT CHIP 0C292 1-164-360-11 CERAMIC CHIP 0.1uF 16VC301 1-115-414-11 CERAMIC CHIP 820PF 5% 25VC302 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50VC303 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C304 1-125-838-11 CERAMIC CHIP 2.2uF 10% 6.3VC305 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC307 1-164-360-11 CERAMIC CHIP 0.1uF 16VC310 1-164-360-11 CERAMIC CHIP 0.1uF 16V
< CONNECTOR >
CN101 1-794-424-11 CONNECTOR, FCC/FPC 16PCN103 1-784-875-21 CONNECTOR, FFC (LIF (NON-ZIF)) 25P
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
91
MXD-D400
BD (CD)
CN105 1-784-861-21 CONNECTOR, FFC (LIF (NON-ZIF)) 9P
< SHORT/FERRITE BEAD >
FB101 1-216-295-00 SHORT CHIP 0FB102 1-216-864-11 SHORT CHIP 0FB103 1-216-864-11 SHORT CHIP 0FB104 1-216-864-11 SHORT CHIP 0
* FB161 1-469-670-21 FERRITE 0uH
FB201 1-216-295-00 SHORT CHIP 0* FB202 1-469-670-21 FERRITE 0uH
FB203 1-500-283-11 FERRITE 0uHFB291 1-216-864-11 SHORT CHIP 0FB351 1-216-864-11 SHORT CHIP 0
< IC >
IC101 8-752-408-73 IC CXD3068QIC102 8-759-713-71 IC AN41050IC103 8-752-106-21 IC CXA2647N-T4IC104 6-704-150-01 IC CXD9717R-008IC105 8-759-833-99 IC TC74HC4052AFT (EL)
IC122 6-701-808-01 IC BA33C25FP-E2
< SHORT >
JR2 1-216-864-11 SHORT CHIP 0
< COIL >
L163 1-412-967-31 INDUCTOR 0.1uH
< TRANSISTOR >
Q101 8-729-046-90 TRANSISTOR 2SB970-(TX).S0
< RESISTOR >
R101 1-216-864-11 SHORT CHIP 0R102 1-216-835-11 METAL CHIP 15K 5% 1/10WR103 1-216-845-11 METAL CHIP 100K 5% 1/10WR104 1-216-835-11 METAL CHIP 15K 5% 1/10WR105 1-216-821-11 METAL CHIP 1K 5% 1/10W
R111 1-216-847-11 METAL CHIP 150K 5% 1/10WR113 1-218-701-11 METAL CHIP 2.4K 5% 1/10WR114 1-216-852-11 METAL CHIP 390K 5% 1/10WR115 1-216-839-11 METAL CHIP 33K 5% 1/10WR116 1-216-839-11 METAL CHIP 33K 5% 1/10W
R117 1-216-846-11 METAL CHIP 120K 5% 1/10WR118 1-216-833-11 METAL CHIP 10K 5% 1/10WR120 1-216-846-11 METAL CHIP 120K 5% 1/10WR122 1-216-845-11 METAL CHIP 100K 5% 1/10WR123 1-216-791-11 METAL CHIP 3.3 5% 1/10W
R125 1-216-840-11 METAL CHIP 39K 5% 1/10WR126 1-216-840-11 METAL CHIP 39K 5% 1/10WR131 1-216-843-11 METAL CHIP 68K 5% 1/10WR132 1-216-851-11 METAL CHIP 330K 5% 1/10WR133 1-216-825-11 METAL CHIP 2.2K 5% 1/10W
R151 1-216-833-11 METAL CHIP 10K 5% 1/10WR152 1-216-837-11 METAL CHIP 22K 5% 1/10WR155 1-216-840-11 METAL CHIP 39K 5% 1/10WR157 1-216-864-11 SHORT CHIP 0R158 1-216-821-11 METAL CHIP 1K 5% 1/10W
R166 1-216-864-11 SHORT CHIP 0R167 1-216-864-11 SHORT CHIP 0R168 1-216-864-11 SHORT CHIP 0R169 1-216-864-11 SHORT CHIP 0R199 1-216-864-11 SHORT CHIP 0
R201 1-216-839-11 METAL CHIP 33K 5% 1/10WR202 1-216-833-11 METAL CHIP 10K 5% 1/10WR203 1-216-845-11 METAL CHIP 100K 5% 1/10WR204 1-216-833-11 METAL CHIP 10K 5% 1/10WR205 1-216-823-11 METAL CHIP 1.5K 5% 1/10W
R206 1-216-850-11 METAL CHIP 270K 5% 1/10WR207 1-216-853-11 METAL CHIP 470K 5% 1/10WR208 1-216-811-11 METAL CHIP 150 5% 1/10WR216 1-216-857-11 METAL CHIP 1M 5% 1/10WR218 1-216-821-11 METAL CHIP 1K 5% 1/10W
R219 1-216-821-11 METAL CHIP 1K 5% 1/10WR220 1-216-821-11 METAL CHIP 1K 5% 1/10WR221 1-216-809-11 METAL CHIP 100 5% 1/10WR222 1-216-809-11 METAL CHIP 100 5% 1/10WR223 1-216-809-11 METAL CHIP 100 5% 1/10W
R224 1-216-809-11 METAL CHIP 100 5% 1/10WR225 1-216-809-11 METAL CHIP 100 5% 1/10WR226 1-216-809-11 METAL CHIP 100 5% 1/10WR227 1-216-809-11 METAL CHIP 100 5% 1/10WR228 1-216-809-11 METAL CHIP 100 5% 1/10W
R229 1-216-809-11 METAL CHIP 100 5% 1/10WR230 1-216-811-11 METAL CHIP 150 5% 1/10WR231 1-216-815-11 METAL CHIP 330 5% 1/10WR232 1-216-815-11 METAL CHIP 330 5% 1/10WR233 1-216-815-11 METAL CHIP 330 5% 1/10W
R249 1-216-818-11 METAL CHIP 560 5% 1/10WR250 1-216-813-11 METAL CHIP 220 5% 1/10WR251 1-216-813-11 METAL CHIP 220 5% 1/10WR252 1-216-833-11 METAL CHIP 10K 5% 1/10WR253 1-216-813-11 METAL CHIP 220 5% 1/10W
R255 1-216-809-11 METAL CHIP 100 5% 1/10WR257 1-216-809-11 METAL CHIP 100 5% 1/10WR259 1-216-809-11 METAL CHIP 100 5% 1/10WR260 1-216-821-11 METAL CHIP 1K 5% 1/10WR271 1-216-833-11 METAL CHIP 10K 5% 1/10W
R272 1-216-829-11 METAL CHIP 4.7K 5% 1/10WR275 1-216-833-11 METAL CHIP 10K 5% 1/10WR276 1-216-809-11 METAL CHIP 100 5% 1/10WR279 1-216-809-11 METAL CHIP 100 5% 1/10WR291 1-216-864-11 SHORT CHIP 0
R301 1-216-847-11 METAL CHIP 150K 5% 1/10WR302 1-216-842-11 METAL CHIP 56K 5% 1/10WR304 1-216-809-11 METAL CHIP 100 5% 1/10WR305 1-216-845-11 METAL CHIP 100K 5% 1/10WR308 1-500-283-11 FERRITE 0uH
R309 1-500-283-11 FERRITE 0uHR312 1-216-864-11 SHORT CHIP 0R313 1-216-864-11 SHORT CHIP 0R314 1-216-864-11 SHORT CHIP 0R315 1-216-864-11 SHORT CHIP 0
R318 1-216-864-11 SHORT CHIP 0R320 1-216-864-11 SHORT CHIP 0
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
92
MXD-D400
BD (CD) BD (MD)
< VARIABLE RESISTOR >
RV101 1-223-997-21 RES, CARBON ADJ VAR 47K
< VIBRATOR >
X201 1-767-518-11 VIBRATOR, CRYSTAL (33.8688MHz)**************************************************************
A-4727-928-A BD (MD) BOARD, COMPLETE**************
< CAPACITOR >
C101 1-117-720-11 CERAMIC CHIP 4.7uF 10VC103 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC104 1-164-156-11 CERAMIC CHIP 0.1uF 25VC105 1-135-259-11 TANTALUM CHIP 10uF 20% 6.3VC106 1-135-259-11 TANTALUM CHIP 10uF 20% 6.3V
C107 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25VC108 1-164-156-11 CERAMIC CHIP 0.1uF 25VC109 1-165-176-11 CERAMIC CHIP 0.047uF 10% 16VC110 1-115-416-11 CERAMIC CHIP 0.001uF 5% 25VC111 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C112 1-164-227-11 CERAMIC CHIP 0.022uF 10% 25VC113 1-162-969-11 CERAMIC CHIP 0.0068uF 10% 25VC114 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50VC115 1-164-156-11 CERAMIC CHIP 0.1uF 25VC116 1-117-720-11 CERAMIC CHIP 4.7uF 10V
C117 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC118 1-162-968-11 CERAMIC CHIP 0.0047uF 10% 50VC119 1-125-837-11 CERAMIC CHIP 1uF 10% 6.3VC120 1-110-563-11 CERAMIC CHIP 0.068uF 10% 16VC121 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C122 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16VC175 1-164-156-11 CERAMIC CHIP 0.1uF 25VC194 1-164-156-11 CERAMIC CHIP 0.1uF 25VC205 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50VC206 1-126-206-11 ELECT CHIP 100uF 20% 6.3V
C209 1-162-927-11 CERAMIC CHIP 100PF 5% 50VC211 1-162-927-11 CERAMIC CHIP 100PF 5% 50VC212 1-162-927-11 CERAMIC CHIP 100PF 5% 50VC214 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC215 1-164-677-11 CERAMIC CHIP 0.033uF 10% 16V
C216 1-125-889-11 CERAMIC CHIP 2.2uF 10% 10VC219 1-162-927-11 CERAMIC CHIP 100PF 5% 50VC220 1-125-891-11 CERAMIC CHIP 0.47uF 10% 10VC221 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC230 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C231 1-164-156-11 CERAMIC CHIP 0.1uF 25VC233 1-164-156-11 CERAMIC CHIP 0.1uF 25VC234 1-164-156-11 CERAMIC CHIP 0.1uF 25VC235 1-164-156-11 CERAMIC CHIP 0.1uF 25VC240 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C241 1-164-156-11 CERAMIC CHIP 0.1uF 25VC242 1-164-156-11 CERAMIC CHIP 0.1uF 25VC250 1-164-156-11 CERAMIC CHIP 0.1uF 25VC251 1-164-156-11 CERAMIC CHIP 0.1uF 25VC252 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C253 1-164-156-11 CERAMIC CHIP 0.1uF 25VC254 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC255 1-164-156-11 CERAMIC CHIP 0.1uF 25VC299 1-164-156-11 CERAMIC CHIP 0.1uF 25VC301 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C302 1-164-156-11 CERAMIC CHIP 0.1uF 25VC405 1-164-156-11 CERAMIC CHIP 0.1uF 25VC406 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC407 1-164-156-11 CERAMIC CHIP 0.1uF 25VC409 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C410 1-126-206-11 ELECT CHIP 100uF 20% 6.3VC411 1-117-720-11 CERAMIC CHIP 4.7uF 10VC412 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50VC490 1-164-156-11 CERAMIC CHIP 0.1uF 25VC501 1-128-795-11 ELECT CHIP 470PF 10% 630V
C502 1-164-156-11 CERAMIC CHIP 0.1uF 25VC503 1-164-156-11 CERAMIC CHIP 0.1uF 25VC504 1-117-370-11 CERAMIC CHIP 10uF 10VC505 1-126-206-11 ELECT CHIP 100uF 20% 6.3VC550 1-135-349-21 ELECT CHIP 22uF 20% 20V
C701 1-164-156-11 CERAMIC CHIP 0.1uF 25VC702 1-117-720-11 CERAMIC CHIP 4.7uF 10VC703 1-164-156-11 CERAMIC CHIP 0.1uF 25VC704 1-165-176-11 CERAMIC CHIP 0.047uF 10% 16VC801 1-162-918-11 CERAMIC CHIP 18PF 5% 50V
C802 1-162-917-11 CERAMIC CHIP 15PF 5% 50VC803 1-164-156-11 CERAMIC CHIP 0.1uF 25VC809 1-117-720-11 CERAMIC CHIP 4.7uF 10VC901 1-126-206-11 ELECT CHIP 100uF 20% 6.3VC902 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C903 1-126-206-11 ELECT CHIP 100uF 20% 6.3VC904 1-164-156-11 CERAMIC CHIP 0.1uF 25VC905 1-126-206-11 ELECT CHIP 100uF 20% 6.3VC907 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC908 1-117-370-11 CERAMIC CHIP 10uF 10V
C909 1-104-852-11 TANTALUM CHIP 22uF 20% 10VC911 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25VC998 1-164-156-11 CERAMIC CHIP 0.1uF 25VC999 1-164-156-11 CERAMIC CHIP 0.1uF 25VC1102 1-164-156-11 CERAMIC CHIP 0.1uF 25V
< CONNECTOR >
CN101 1-766-833-21 CONNECTOR, FFC/FPC (ZIF) 21PCN102 1-784-835-21 CONNECTOR, FFC (LIF (NON-ZIF)) 27PCN103 1-784-869-21 CONNECTOR, FFC (LIF (NON-ZIF)) 17P
* CN104 1-580-055-21 PIN, CONNECTOR (SMD) 2PCN105 1-784-859-21 CONNECTOR, FFC (LIF (NON-ZIF)) 7P
< DIODE >
D101 8-719-988-61 DIODE 1SS355TE-17D501 8-719-046-86 DIODE F1J6TPD502 8-719-046-86 DIODE F1J6TP
< IC >
IC101 8-752-080-95 IC CXA2523ARIC152 6-700-052-01 IC MSM51V17400F-50TS-KIC181 8-759-481-17 IC MC74ACT08DTR2
IC195 IC BR24C16F-E2IC201 8-752-414-89 IC CXD2664R
IC195 is written in and settled EEPROM. Supply with a singlearticle has not been carried out. In case you exchange by BD(MD) board (A-4727-928-A), please put on IC195 currentlyused with the model again.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
93
MXD-D400
BD (MD)
IC401 8-759-836-79 IC BH6519FS-E2IC701 8-759-473-51 IC TLV2361CDBVIC803 6-701-793-01 IC CY24115-2SCTIC926 8-759-835-63 IC NJM2391DL1-26 (TE1)IC933 8-759-460-72 IC BA033FP-E2
< FERRITE BEAD >
L8 1-414-760-21 FERRITE 0uHL10 1-469-981-21 FERRITE 0uHL122 1-414-760-21 FERRITE 0uHL201 1-414-760-21 FERRITE 0uHL202 1-469-981-21 FERRITE 0uH
L203 1-414-760-21 FERRITE 0uHL401 1-400-050-11 FERRITE 0uHL402 1-400-050-11 FERRITE 0uHL501 1-400-050-11 FERRITE 0uHL502 1-400-050-11 FERRITE 0uH
L550 1-414-760-21 FERRITE 0uHL601 1-469-981-21 FERRITE 0uHL602 1-469-981-21 FERRITE 0uHL603 1-414-760-21 FERRITE 0uHL701 1-414-760-21 FERRITE 0uH
L801 1-414-760-21 FERRITE 0uH* L899 1-500-282-11 FERRITE 0uH
< TRANSISTOR >
Q181 8-729-048-87 FET 2SJ518AZTRQ182 8-729-048-88 FET 2SK2788VYTRQ201 8-729-403-35 TRANSISTOR UN5113-TXQ202 8-729-101-07 TRANSISTOR 2SB798-T1DKQ203 8-729-403-35 TRANSISTOR UN5113-TX
Q701 8-729-402-93 TRANSISTOR UN5214-TXQ702 8-729-903-10 TRANSISTOR FMW1-T-148Q703 8-729-402-93 TRANSISTOR UN5214-TXQ704 8-729-026-53 TRANSISTOR 2SA1576A-T106-QR
< RESISTOR >
R101 1-216-298-00 METAL CHIP 2.2 5% 1/10WR102 1-219-724-11 METAL CHIP 1 1% 1/4WR103 1-216-829-11 METAL CHIP 4.7K 5% 1/10WR104 1-216-853-11 METAL CHIP 470K 5% 1/10WR105 1-216-863-11 METAL CHIP 3.3M 5% 1/10W
R106 1-216-845-11 METAL CHIP 100K 5% 1/10WR107 1-216-819-11 METAL CHIP 680 5% 1/10WR108 1-216-825-11 METAL CHIP 2.2K 5% 1/10WR109 1-216-829-11 METAL CHIP 4.7K 5% 1/10WR110 1-216-853-11 METAL CHIP 470K 5% 1/10W
R111 1-216-833-11 METAL CHIP 10K 5% 1/10WR112 1-216-845-11 METAL CHIP 100K 5% 1/10WR113 1-216-833-11 METAL CHIP 10K 5% 1/10WR114 1-216-829-11 METAL CHIP 4.7K 5% 1/10WR115 1-216-833-11 METAL CHIP 10K 5% 1/10W
R116 1-216-827-11 METAL CHIP 3.3K 5% 1/10WR117 1-216-845-11 METAL CHIP 100K 5% 1/10WR118 1-216-825-11 METAL CHIP 2.2K 5% 1/10WR119 1-216-837-11 METAL CHIP 22K 5% 1/10WR120 1-216-839-11 METAL CHIP 33K 5% 1/10W
R121 1-216-825-11 METAL CHIP 2.2K 5% 1/10WR122 1-216-833-11 METAL CHIP 10K 5% 1/10WR201 1-216-815-11 METAL CHIP 330 5% 1/10WR202 1-216-819-11 METAL CHIP 680 5% 1/10WR203 1-216-809-11 METAL CHIP 100 5% 1/10W
R205 1-216-833-11 METAL CHIP 10K 5% 1/10WR206 1-216-833-11 METAL CHIP 10K 5% 1/10WR207 1-216-811-11 METAL CHIP 150 5% 1/10WR208 1-216-821-11 METAL CHIP 1K 5% 1/10WR209 1-216-815-11 METAL CHIP 330 5% 1/10W
R210 1-216-839-11 METAL CHIP 33K 5% 1/10WR211 1-216-857-11 METAL CHIP 1M 5% 1/10WR212 1-216-851-11 METAL CHIP 330K 5% 1/10WR214 1-216-845-11 METAL CHIP 100K 5% 1/10WR216 1-216-864-11 SHORT CHIP 0
R217 1-216-833-11 METAL CHIP 10K 5% 1/10WR218 1-216-864-11 SHORT CHIP 0R219 1-216-809-11 METAL CHIP 100 5% 1/10WR223 1-216-833-11 METAL CHIP 10K 5% 1/10WR280 1-216-821-11 METAL CHIP 1K 5% 1/10W
R298 1-216-809-11 METAL CHIP 100 5% 1/10WR299 1-216-864-11 SHORT CHIP 0R301 1-216-833-11 METAL CHIP 10K 5% 1/10WR302 1-216-833-11 METAL CHIP 10K 5% 1/10WR303 1-216-833-11 METAL CHIP 10K 5% 1/10W
R501 1-216-295-00 SHORT CHIP 0R551 1-216-841-11 METAL CHIP 47K 5% 1/10WR552 1-216-841-11 METAL CHIP 47K 5% 1/10WR553 1-216-841-11 METAL CHIP 47K 5% 1/10WR701 1-216-821-11 METAL CHIP 1K 5% 1/10W
R702 1-216-821-11 METAL CHIP 1K 5% 1/10WR703 1-216-821-11 METAL CHIP 1K 5% 1/10WR704 1-216-839-11 METAL CHIP 33K 5% 1/10WR705 1-216-829-11 METAL CHIP 4.7K 5% 1/10WR706 1-218-855-11 METAL CHIP 2.2K 0.5% 1/10W
R707 1-218-863-11 METAL CHIP 4.7K 0.5% 1/10WR708 1-218-863-11 METAL CHIP 4.7K 0.5% 1/10WR709 1-218-855-11 METAL CHIP 2.2K 0.5% 1/10WR710 1-218-887-11 METAL CHIP 47K 0.5% 1/10WR711 1-216-833-11 METAL CHIP 10K 5% 1/10W
R712 1-216-809-11 METAL CHIP 100 5% 1/10WR713 1-216-833-11 METAL CHIP 10K 5% 1/10WR801 1-216-857-11 METAL CHIP 1M 5% 1/10WR803 1-216-864-11 SHORT CHIP 0R805 1-216-807-11 METAL CHIP 68 5% 1/10W
R810 1-216-823-11 METAL CHIP 1.5K 5% 1/10WR812 1-216-864-11 SHORT CHIP 0R814 1-216-864-11 SHORT CHIP 0R999 1-216-864-11 SHORT CHIP 0
< SWITCH >
S101 1-762-596-21 SWITCH, PUSH (1 KEY) (LIMIT IN)
S103 1-771-956-21 SWITCH, PUSH (1 KEY) (OUT)
S104 1-771-955-21 SWITCH, PUSH (1 KEY) (PLAY)S105 1-771-955-21 SWITCH, PUSH (1 KEY) (REC)
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
94
MXD-D400
< VIBRATOR >
X804 1-795-535-21 VIBRATOR, CRYSTAL (11.2896MHz)**************************************************************
1-687-906-11 CD-EJECT BOARD***************
< SWITCH >
S1701 1-762-875-21 SWITCH, KEYBOARD (OPEN/CLOSE)**************************************************************
1-687-903-11 CD-SW BOARD*************
< CAPACITOR >
C720 1-164-159-11 CERAMIC 0.1uF 50V
< RESISTOR >
R708 1-249-429-11 CARBON 10K 5% 1/4WR725 1-249-415-11 CARBON 680 5% 1/4WR726 1-249-417-11 CARBON 1K 5% 1/4WR727 1-249-419-11 CARBON 1.5K 5% 1/4WR728 1-249-421-11 CARBON 2.2K 5% 1/4W
R729 1-249-425-11 CARBON 4.7K 5% 1/4W
< SWITCH >
S725 1-762-875-21 SWITCH, KEYBOARD (PLAY MODE (CD))
S726 1-762-875-21 SWITCH, KEYBOARD (TIME (CD))S727 1-762-875-21 SWITCH, KEYBOARD (x (CD))S728 1-762-875-21 SWITCH, KEYBOARD (X (CD))S729 1-762-875-21 SWITCH, KEYBOARD (H (CD))
**************************************************************
A-4732-471-A DISPLAY BOARD, COMPLETE**************
4-949-935-41 CUSHION (FL)* 4-996-686-03 HOLDER (FL)
< CAPACITOR >
C742 1-124-584-00 ELECT 100uF 20% 10VC743 1-164-159-11 CERAMIC 0.1uF 50VC750 1-164-159-11 CERAMIC 0.1uF 50VC751 1-124-261-00 ELECT 10uF 20% 50VC753 1-124-261-00 ELECT 10uF 20% 50V
C760 1-124-261-00 ELECT 10uF 20% 50VC761 1-162-294-31 CERAMIC 0.001uF 10% 50VC762 1-162-294-31 CERAMIC 0.001uF 10% 50VC763 1-164-159-11 CERAMIC 0.1uF 50VC764 1-124-261-00 ELECT 10uF 20% 50V
C765 1-164-159-11 CERAMIC 0.1uF 50VC766 1-162-215-31 CERAMIC 47PF 5% 50VC767 1-164-159-11 CERAMIC 0.1uF 50VC768 1-162-290-31 CERAMIC 470PF 10% 50VC769 1-162-290-31 CERAMIC 470PF 10% 50V
C770 1-162-290-31 CERAMIC 470PF 10% 50VC780 1-164-159-11 CERAMIC 0.1uF 50V
< CONNECTOR >
CN700 1-779-287-11 CONNECTOR, FFC (LIF (NON-ZIF)) 19P
< LED >
D772 8-719-058-64 LED SEL5823A-TP15 (MDLP)D775 8-719-046-39 LED SEL5821A-TP15 (GROUP ON/OFF)
< FLUORESCENT INDICATOR TUBE >
FL750 1-518-892-11 INDICATOR TUBE, FLUORESCENT
< IC >
IC760 8-759-680-17 IC MSM9201-04GS-KIC781 8-759-826-33 IC NJL73H400A
< TRANSISTOR >
Q726 8-729-230-45 TRANSISTOR 2SC2458TP-YGRQ761 8-729-620-05 TRANSISTOR 2SC2603TP-EFQ762 8-729-620-05 TRANSISTOR 2SC2603TP-EFQ772 8-729-900-80 TRANSISTOR UN4211-TAQ775 8-729-900-80 TRANSISTOR UN4211-TA
< RESISTOR >
R701 1-249-409-11 CARBON 220 5% 1/4WR702 1-249-411-11 CARBON 330 5% 1/4WR703 1-249-413-11 CARBON 470 5% 1/4WR704 1-249-415-11 CARBON 680 5% 1/4WR705 1-247-807-31 CARBON 100 5% 1/4W
R709 1-247-807-31 CARBON 100 5% 1/4WR711 1-249-409-11 CARBON 220 5% 1/4WR712 1-249-411-11 CARBON 330 5% 1/4WR713 1-249-413-11 CARBON 470 5% 1/4WR714 1-249-415-11 CARBON 680 5% 1/4W
R715 1-249-417-11 CARBON 1K 5% 1/4WR716 1-249-419-11 CARBON 1.5K 5% 1/4WR717 1-249-421-11 CARBON 2.2K 5% 1/4WR718 1-249-425-11 CARBON 4.7K 5% 1/4WR719 1-249-429-11 CARBON 10K 5% 1/4W
R721 1-249-417-11 CARBON 1K 5% 1/4WR722 1-249-409-11 CARBON 220 5% 1/4WR723 1-249-411-11 CARBON 330 5% 1/4WR724 1-249-413-11 CARBON 470 5% 1/4WR741 1-247-807-31 CARBON 100 5% 1/4W
R742 1-249-401-11 CARBON 47 5% 1/4WR761 1-247-807-31 CARBON 100 5% 1/4WR762 1-247-807-31 CARBON 100 5% 1/4WR763 1-249-441-11 CARBON 100K 5% 1/4WR764 1-249-441-11 CARBON 100K 5% 1/4W
R766 1-247-843-11 CARBON 3.3K 5% 1/4WR767 1-247-807-31 CARBON 100 5% 1/4WR768 1-247-807-31 CARBON 100 5% 1/4WR769 1-247-807-31 CARBON 100 5% 1/4WR770 1-247-807-31 CARBON 100 5% 1/4W
R775 1-247-807-31 CARBON 100 5% 1/4W
< VARIABLE RESISTOR >
RV780 1-223-673-11 RES, VAR, CARBON 10K (REC LEVEL)
BD (MD) CD-EJECT CD-SW DISPLAY
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
95
MXD-D400
< SWITCH/ROTARY ENCODER >
S700 1-762-875-21 SWITCH, KEYBOARD (REC z)S701 1-762-875-21 SWITCH, KEYBOARD (INPUT)S702 1-762-875-21 SWITCH, KEYBOARD (REC MODE)S703 1-762-875-21 SWITCH, KEYBOARD (GROUP SKIP)S704 1-762-875-21 SWITCH, KEYBOARD (GROUP ON/OFF)
S710 1-762-875-21 SWITCH, KEYBOARD (H (MD))S711 1-762-875-21 SWITCH, KEYBOARD (X (MD))S712 1-762-875-21 SWITCH, KEYBOARD (x (MD))S713 1-762-875-21 SWITCH, KEYBOARD (PLAY MODE (MD))S714 1-762-875-21 SWITCH, KEYBOARD (TIME (MD))
S715 1-762-875-21 SWITCH, KEYBOARD (DISPLAY)S716 1-762-875-21 SWITCH, KEYBOARD (YES)S717 1-475-235-21 ENCODER, ROTARY (l AMS L (MD))S718 1-762-875-21 SWITCH, KEYBOARD (MENU/NO)S719 1-762-875-21 SWITCH, KEYBOARD (CLEAR)
S720 1-762-875-21 SWITCH, KEYBOARD (EJECT)S721 1-762-875-21 SWITCH, KEYBOARD (CD SYNCRO NORMAL)S722 1-762-875-21 SWITCH, KEYBOARD (CD SYNCRO HIGH)S723 1-475-235-21 ENCODER, ROTARY (l AMS L (CD))S724 1-762-875-21 SWITCH, KEYBOARD (ALBUM)
**************************************************************
1-687-904-11 HP BOARD*********
< CAPACITOR >
C791 1-162-290-31 CERAMIC 470PF 10% 50VC796 1-162-290-31 CERAMIC 470PF 10% 50V
< JACK >
J790 1-770-307-11 JACK (LARGE TYPE) (PHONES)
< COIL >
L790 1-412-473-21 INDUCTOR 0uHL1790 1-412-473-21 INDUCTOR 0uH
< RESISTOR >
R791 1-249-393-11 CARBON 10 5% 1/4WR796 1-249-393-11 CARBON 10 5% 1/4W
< VARIABLE RESISTOR >
RV790 1-225-741-11 RES, VAR, CARBON 20K/20K (PHONE LEVEL)**************************************************************
1-645-721-11 LOADING BOARD****************
< CONNECTOR >
* CN151 1-568-943-11 PIN, CONNECTOR 5P
< SWITCH >
S271 1-572-086-11 SWITCH, LEAF (LOADING OUT)S272 1-572-086-11 SWITCH, LEAF (LOADING IN)
**************************************************************
A-4732-635-A MAIN BOARD, COMPLETE************
1-766-806-11 HOUSING, CONNECTOR 3P7-685-871-01 SCREW +BVTT 3X6 (S)
< BATTERY >
BT1 1-756-121-11 BATTERY, LITHIUM SECONDARY
< CAPACITOR >
C1 1-126-936-11 ELECT 3300uF 20% 16VC2 1-164-156-11 CERAMIC CHIP 0.1uF 25VC3 1-126-933-11 ELECT 100uF 20% 16VC4 1-164-156-11 CERAMIC CHIP 0.1uF 25VC5 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C6 1-164-156-11 CERAMIC CHIP 0.1uF 25VC7 1-126-935-11 ELECT 470uF 20% 10VC8 1-164-156-11 CERAMIC CHIP 0.1uF 25VC9 1-164-156-11 CERAMIC CHIP 0.1uF 25VC10 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C11 1-164-156-11 CERAMIC CHIP 0.1uF 25VC12 1-162-974-11 CERAMIC CHIP 0.01uF 50VC13 1-164-156-11 CERAMIC CHIP 0.1uF 25VC14 1-164-156-11 CERAMIC CHIP 0.1uF 25VC15 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C16 1-164-156-11 CERAMIC CHIP 0.1uF 25VC17 1-126-941-11 ELECT 470uF 20% 25VC18 1-126-941-11 ELECT 470uF 20% 25VC19 1-164-156-11 CERAMIC CHIP 0.1uF 25VC20 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C21 1-164-156-11 CERAMIC CHIP 0.1uF 25VC22 1-164-156-11 CERAMIC CHIP 0.1uF 25VC23 1-115-364-11 ELECT 22000uF 20% 16VC24 1-164-156-11 CERAMIC CHIP 0.1uF 25VC25 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C26 1-126-947-11 ELECT 47uF 20% 16VC27 1-126-939-11 ELECT 10000uF 20% 16VC28 1-126-952-11 ELECT 1000uF 20% 35VC29 1-164-156-11 CERAMIC CHIP 0.1uF 25VC30 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C31 1-128-576-11 ELECT 100uF 20% 63VC32 1-126-963-11 ELECT 4.7uF 20% 50VC33 1-164-156-11 CERAMIC CHIP 0.1uF 25VC34 1-164-156-11 CERAMIC CHIP 0.1uF 25VC35 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C36 1-164-156-11 CERAMIC CHIP 0.1uF 25VC37 1-104-666-11 ELECT 220uF 20% 25VC38 1-165-319-11 CERAMIC CHIP 0.1uF 50VC39 1-126-926-11 ELECT 1000uF 20% 10VC40 1-126-966-11 ELECT 33uF 20% 50V
C41 1-104-665-11 ELECT 100uF 20% 10VC42 1-126-935-11 ELECT 470uF 20% 10VC43 1-164-156-11 CERAMIC CHIP 0.1uF 25VC47 1-164-156-11 CERAMIC CHIP 0.1uF 25VC48 1-162-927-11 CERAMIC CHIP 100PF 5% 50V
C49 1-162-927-11 CERAMIC CHIP 100PF 5% 50VC50 1-164-156-11 CERAMIC CHIP 0.1uF 25VC51 1-164-156-11 CERAMIC CHIP 0.1uF 25V
DISPLAY HP LOADING MAIN
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
96
MXD-D400
C52 1-164-156-11 CERAMIC CHIP 0.1uF 25VC53 1-126-934-11 ELECT 220uF 20% 10V
C54 1-126-963-11 ELECT 4.7uF 20% 50VC55 1-104-665-11 ELECT 100uF 20% 10VC56 1-164-156-11 CERAMIC CHIP 0.1uF 25VC58 1-164-156-11 CERAMIC CHIP 0.1uF 25VC59 1-126-916-11 ELECT 1000uF 20% 6.3V
C63 1-164-156-11 CERAMIC CHIP 0.1uF 25VC64 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50VC65 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50VC66 1-164-156-11 CERAMIC CHIP 0.1uF 25VC69 1-164-360-11 CERAMIC CHIP 0.1uF 16V
C70 1-126-933-11 ELECT 100uF 20% 16VC71 1-126-933-11 ELECT 100uF 20% 16VC72 1-126-933-11 ELECT 100uF 20% 16VC73 1-164-360-11 CERAMIC CHIP 0.1uF 16VC74 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C75 1-162-974-11 CERAMIC CHIP 0.01uF 50VC76 1-164-156-11 CERAMIC CHIP 0.1uF 25VC79 1-126-933-11 ELECT 100uF 20% 16VC80 1-162-974-11 CERAMIC CHIP 0.01uF 50VC82 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C83 1-126-933-11 ELECT 100uF 20% 16VC84 1-164-156-11 CERAMIC CHIP 0.1uF 25VC85 1-164-156-11 CERAMIC CHIP 0.1uF 25VC86 1-126-933-11 ELECT 100uF 20% 16VC87 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C88 1-164-156-11 CERAMIC CHIP 0.1uF 25VC89 1-164-156-11 CERAMIC CHIP 0.1uF 25VC90 1-126-933-11 ELECT 100uF 20% 16VC91 1-164-156-11 CERAMIC CHIP 0.1uF 25VC92 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C93 1-126-933-11 ELECT 100uF 20% 16VC94 1-164-156-11 CERAMIC CHIP 0.1uF 25VC95 1-164-156-11 CERAMIC CHIP 0.1uF 25VC96 1-126-933-11 ELECT 100uF 20% 16VC97 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C98 1-162-927-11 CERAMIC CHIP 100PF 5% 50VC99 1-163-233-91 CERAMIC CHIP 18PF 5% 50VC100 1-163-233-91 CERAMIC CHIP 18PF 5% 50VC101 1-165-319-11 CERAMIC CHIP 0.1uF 50VC102 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C103 1-162-927-11 CERAMIC CHIP 100PF 5% 50VC104 1-164-156-11 CERAMIC CHIP 0.1uF 25VC106 1-104-665-11 ELECT 100uF 20% 10VC107 1-126-791-11 ELECT 10uF 20% 16VC108 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C109 1-164-156-11 CERAMIC CHIP 0.1uF 25VC110 1-128-551-11 ELECT 22uF 20% 25VC111 1-128-551-11 ELECT 22uF 20% 25VC113 1-128-551-11 ELECT 22uF 20% 25VC114 1-128-551-11 ELECT 22uF 20% 25V
C115 1-164-156-11 CERAMIC CHIP 0.1uF 25VC116 1-164-156-11 CERAMIC CHIP 0.1uF 25VC117 1-164-156-11 CERAMIC CHIP 0.1uF 25VC118 1-126-933-11 ELECT 100uF 20% 16VC119 1-126-933-11 ELECT 100uF 20% 16V
C120 1-126-963-11 ELECT 4.7uF 20% 50VC121 1-126-947-11 ELECT 47uF 20% 25VC122 1-126-947-11 ELECT 47uF 20% 25VC123 1-164-156-11 CERAMIC CHIP 0.1uF 25VC124 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C126 1-162-927-11 CERAMIC CHIP 100PF 5% 50VC127 1-128-551-11 ELECT 22uF 20% 25VC128 1-128-551-11 ELECT 22uF 20% 25VC129 1-136-356-11 MYLAR 470PF 5% 50VC130 1-136-356-11 MYLAR 470PF 5% 50V
C131 1-164-156-11 CERAMIC CHIP 0.1uF 25VC132 1-164-156-11 CERAMIC CHIP 0.1uF 25VC133 1-128-551-11 ELECT 22uF 20% 25VC134 1-136-356-11 MYLAR 470PF 5% 50VC135 1-126-933-11 ELECT 100uF 20% 16V
C136 1-126-933-11 ELECT 100uF 20% 16VC137 1-136-356-11 MYLAR 470PF 5% 50VC138 1-128-551-11 ELECT 22uF 20% 25VC139 1-126-933-11 ELECT 100uF 20% 16VC140 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C141 1-162-974-11 CERAMIC CHIP 0.01uF 50VC142 1-164-156-11 CERAMIC CHIP 0.1uF 25VC143 1-164-156-11 CERAMIC CHIP 0.1uF 25VC145 1-164-156-11 CERAMIC CHIP 0.1uF 25VC146 1-164-156-11 CERAMIC CHIP 0.1uF 25V
C147 1-164-156-11 CERAMIC CHIP 0.1uF 25VC149 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
< CONNECTOR >
CN1 1-506-469-11 PIN, CONNECTOR 4PCN2 1-691-771-11 PLUG (MICRO CONNECTOR) 9P
CN3 1-784-367-11 CONNECTOR, FFC/FPC 8PCN4 1-784-368-11 CONNECTOR, FFC/FPC 9PCN5 1-784-382-21 CONNECTOR, FFC/FPC 25P
* CN6 1-568-954-11 PIN, CONNECTOR 5PCN7 1-568-683-11 PIN, CONNECTOR (PC BAORD) 2PCN8 1-784-367-11 CONNECTOR, FFC/FPC 8PCN9 1-784-376-11 CONNECTOR, FFC/FPC 17PCN10 1-784-384-11 CONNECTOR, FFC/FPC 27P
CN11 1-778-691-11 CONNECTOR, FFC/FPC 19PCN12 1-506-468-11 PIN, CONNECTOR 3P
< DIODE >
D1 8-719-975-40 DIODE RB411D-T146D2 8-719-975-40 DIODE RB411D-T146D3 8-719-975-40 DIODE RB411D-T146D4 8-719-975-40 DIODE RB411D-T146D5 8-719-421-18 DIODE MA8033-L-TX
D6 6-500-522-21 DIODE 10EDB40-TB3D7 6-500-522-21 DIODE 10EDB40-TB3D8 6-500-522-21 DIODE 10EDB40-TB3D9 6-500-522-21 DIODE 10EDB40-TB3D10 6-500-522-21 DIODE 10EDB40-TB3
D11 6-500-522-21 DIODE 10EDB40-TB3D12 6-500-522-21 DIODE 10EDB40-TB3D13 6-500-522-21 DIODE 10EDB40-TB3D14 6-500-522-21 DIODE 10EDB40-TB3
MAIN
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
97
MXD-D400
D15 6-500-522-21 DIODE 10EDB40-TB3
D16 6-500-522-21 DIODE 10EDB40-TB3D17 6-500-522-21 DIODE 10EDB40-TB3D18 6-500-522-21 DIODE 10EDB40-TB3D20 8-719-423-07 DIODE MA8100-L-TXD21 8-719-988-61 DIODE 1SS355TE-17
D22 8-719-988-61 DIODE 1SS355TE-17D23 8-719-074-34 DIODE RB495D-T146D24 8-719-421-82 DIODE MA8043-M (TX)D25 8-719-820-05 DIODE 1SS181-TE85LD26 8-719-801-78 DIODE 1SS184-TE85L
D27 8-719-988-61 DIODE 1SS355TE-17D28 8-719-820-05 DIODE 1SS181-TE85LD29 8-719-988-61 DIODE 1SS355TE-17D30 8-719-988-61 DIODE 1SS355TE-17
< FERRITE BEAD >
FB1 1-469-324-21 FERRITE 0uHFB2 1-469-324-21 FERRITE 0uH
< IC >
IC1 8-759-647-10 IC uPC2933HFIC2 6-702-913-01 IC S-80929CNMC-G8Z-T2IC3 8-759-633-42 IC M5293LIC4 8-759-982-07 IC NJM7808FAIC5 8-759-039-69 IC uPC7805AHF
IC6 6-803-005-01 IC M30624MGN-B20FPIC7 8-759-678-77 IC LA5643IC8 8-759-548-57 IC SN74LV00ANSRIC9 8-759-647-10 IC uPC2933HFIC10 8-759-822-09 IC LB1641
IC11 6-701-843-01 IC AK4584VQIC12 6-803-006-01 IC M30624MGN-A23FPIC13 8-759-278-58 IC NJM4558V-TE2IC14 8-749-017-80 IC GP1FA551TZ (DIGITAL OPTICAL OUTPUT)IC15 6-600-006-01 IC GP1FA551RZ (DIGITAL OPTICAL INPUT)
IC16 8-759-278-58 IC NJM4558V-TE2IC17 8-759-697-21 IC NJM4565V (TE2)IC18 8-759-822-09 IC LB1641IC19 8-759-196-96 IC TC7SH08FU-TE85R
< JACK >
J1 1-784-429-11 JACK, PIN 4P (ANALOG INPUT/OUTPUT)
< SHORT >
JR101 1-216-296-00 SHORT CHIP 0
< COIL/SHORT >
L1 1-414-234-22 FERRITE 0uHL2 1-414-234-22 FERRITE 0uHL3 1-414-234-22 FERRITE 0uHL5 1-216-864-11 SHORT CHIP 0L6 1-216-864-11 SHORT CHIP 0
L7 1-216-296-00 SHORT CHIP 0L8 1-414-234-22 FERRITE 0uHL9 1-414-267-21 INDUCTOR 10uHL10 1-216-295-00 SHORT CHIP 0
L11 1-216-295-00 SHORT CHIP 0
< TRANSISTOR >
Q1 8-729-230-91 TRANSISTOR 2SD2144S-TP-WQ2 8-729-421-22 TRANSISTOR UN2211-TXQ3 8-729-015-74 TRANSISTOR UN5111-TXQ4 8-729-922-37 TRANSISTOR 2SD2144S-TP-UVWQ5 8-729-046-97 TRANSISTOR 2SD1938 (F) -T (TX).SO
Q6 8-729-046-97 TRANSISTOR 2SD1938 (F) -T (TX).SOQ7 8-729-900-80 TRANSISTOR UN4211-TAQ8 8-729-119-76 TRANSISTOR 2SA1115TP-EF
< RESISTOR >
R1 1-216-821-11 METAL CHIP 1K 5% 1/10WR2 1-216-821-11 METAL CHIP 1K 5% 1/10WR3 1-216-841-11 METAL CHIP 47K 5% 1/10WR4 1-216-809-11 METAL CHIP 100 5% 1/10WR5 1-216-845-11 METAL CHIP 100K 5% 1/10W
R6 1-216-833-11 METAL CHIP 10K 5% 1/10WR7 1-216-841-11 METAL CHIP 47K 5% 1/10WR8 1-216-809-11 METAL CHIP 100 5% 1/10WR9 1-216-817-11 METAL CHIP 470 5% 1/10WR10 1-216-809-11 METAL CHIP 100 5% 1/10W
R11 1-216-809-11 METAL CHIP 100 5% 1/10WR12 1-216-825-11 METAL CHIP 2.2K 5% 1/10WR13 1-216-809-11 METAL CHIP 100 5% 1/10WR14 1-216-827-11 METAL CHIP 3.3K 5% 1/10WR15 1-216-838-11 METAL CHIP 27K 5% 1/10W
R16 1-216-829-11 METAL CHIP 4.7K 5% 1/10WR17 1-216-845-11 METAL CHIP 100K 5% 1/10WR18 1-216-829-11 METAL CHIP 4.7K 5% 1/10WR19 1-216-829-11 METAL CHIP 4.7K 5% 1/10WR20 1-216-845-11 METAL CHIP 100K 5% 1/10W
R21 1-216-833-11 METAL CHIP 10K 5% 1/10WR22 1-216-833-11 METAL CHIP 10K 5% 1/10WR23 1-216-845-11 METAL CHIP 100K 5% 1/10WR24 1-216-833-11 METAL CHIP 10K 5% 1/10WR25 1-216-826-11 METAL CHIP 2.7K 5% 1/10W
R26 1-216-847-11 METAL CHIP 150K 5% 1/10WR27 1-216-843-11 METAL CHIP 68K 5% 1/10WR28 1-216-833-11 METAL CHIP 10K 5% 1/10WR29 1-216-833-11 METAL CHIP 10K 5% 1/10WR30 1-216-809-11 METAL CHIP 100 5% 1/10W
R31 1-216-833-11 METAL CHIP 10K 5% 1/10WR32 1-216-833-11 METAL CHIP 10K 5% 1/10WR33 1-216-833-11 METAL CHIP 10K 5% 1/10WR34 1-216-809-11 METAL CHIP 100 5% 1/10WR35 1-216-845-11 METAL CHIP 100K 5% 1/10W
R36 1-216-813-11 METAL CHIP 220 5% 1/10WR37 1-216-833-11 METAL CHIP 10K 5% 1/10WR38 1-216-833-11 METAL CHIP 10K 5% 1/10WR39 1-216-833-11 METAL CHIP 10K 5% 1/10WR40 1-216-833-11 METAL CHIP 10K 5% 1/10W
R41 1-216-833-11 METAL CHIP 10K 5% 1/10WR43 1-216-845-11 METAL CHIP 100K 5% 1/10WR44 1-216-864-11 SHORT CHIP 0R45 1-216-809-11 METAL CHIP 100 5% 1/10WR46 1-216-809-11 METAL CHIP 100 5% 1/10W
MAIN
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
98
MXD-D400
R47 1-216-809-11 METAL CHIP 100 5% 1/10WR48 1-216-809-11 METAL CHIP 100 5% 1/10WR49 1-216-809-11 METAL CHIP 100 5% 1/10WR50 1-216-809-11 METAL CHIP 100 5% 1/10WR51 1-216-864-11 SHORT CHIP 0
R52 1-216-864-11 SHORT CHIP 0R54 1-216-864-11 SHORT CHIP 0R55 1-216-834-11 METAL CHIP 12K 5% 1/10WR56 1-216-809-11 METAL CHIP 100 5% 1/10WR57 1-216-833-11 METAL CHIP 10K 5% 1/10W
R58 1-216-833-11 METAL CHIP 10K 5% 1/10WR59 1-216-829-11 METAL CHIP 4.7K 5% 1/10WR60 1-216-864-11 SHORT CHIP 0R61 1-216-864-11 SHORT CHIP 0R62 1-216-845-11 METAL CHIP 100K 5% 1/10W
R63 1-216-845-11 METAL CHIP 100K 5% 1/10WR64 1-216-833-11 METAL CHIP 10K 5% 1/10WR65 1-216-805-11 METAL CHIP 47 5% 1/10WR66 1-216-805-11 METAL CHIP 47 5% 1/10WR67 1-216-833-11 METAL CHIP 10K 5% 1/10W
R68 1-216-833-11 METAL CHIP 10K 5% 1/10WR69 1-216-833-11 METAL CHIP 10K 5% 1/10WR70 1-216-833-11 METAL CHIP 10K 5% 1/10WR71 1-216-864-11 SHORT CHIP 0R72 1-216-817-11 METAL CHIP 470 5% 1/10W
R73 1-216-817-11 METAL CHIP 470 5% 1/10WR75 1-216-845-11 METAL CHIP 100K 5% 1/10WR76 1-216-845-11 METAL CHIP 100K 5% 1/10WR77 1-216-833-11 METAL CHIP 10K 5% 1/10WR80 1-216-841-11 METAL CHIP 47K 5% 1/10W
R81 1-216-817-11 METAL CHIP 470 5% 1/10WR82 1-216-825-11 METAL CHIP 2.2K 5% 1/10WR84 1-216-817-11 METAL CHIP 470 5% 1/10WR85 1-216-821-11 METAL CHIP 1K 5% 1/10WR86 1-216-821-11 METAL CHIP 1K 5% 1/10W
R87 1-216-847-11 METAL CHIP 150K 5% 1/10WR88 1-216-845-11 METAL CHIP 100K 5% 1/10WR89 1-216-817-11 METAL CHIP 470 5% 1/10WR90 1-216-839-11 METAL CHIP 33K 5% 1/10WR91 1-216-837-11 METAL CHIP 22K 5% 1/10W
R92 1-216-849-11 METAL CHIP 220K 5% 1/10WR93 1-216-849-11 METAL CHIP 220K 5% 1/10WR94 1-216-847-11 METAL CHIP 150K 5% 1/10WR95 1-216-837-11 METAL CHIP 22K 5% 1/10WR96 1-216-839-11 METAL CHIP 33K 5% 1/10W
R97 1-216-835-11 METAL CHIP 15K 5% 1/10WR98 1-216-805-11 METAL CHIP 47 5% 1/10WR99 1-216-805-11 METAL CHIP 47 5% 1/10WR100 1-216-833-11 METAL CHIP 10K 5% 1/10WR103 1-216-805-11 METAL CHIP 47 5% 1/10W
R104 1-216-805-11 METAL CHIP 47 5% 1/10WR107 1-216-833-11 METAL CHIP 10K 5% 1/10WR108 1-216-833-11 METAL CHIP 10K 5% 1/10WR110 1-216-833-11 METAL CHIP 10K 5% 1/10WR111 1-216-811-11 METAL CHIP 150 5% 1/10W
R112 1-216-815-11 METAL CHIP 330 5% 1/10WR113 1-216-864-11 SHORT CHIP 0
R200 1-216-864-11 SHORT CHIP 0
< COMPOSITION CIRCUIT BLOCK >
RB1 1-236-908-11 NETWORK RESISTOR (CHIP) 10KRB2 1-233-418-11 RES, CHIP NETWORK 3.3K (3216)RB4 1-236-908-11 NETWORK RESISTOR (CHIP) 10KRB5 1-236-908-11 NETWORK RESISTOR (CHIP) 10KRB6 1-236-908-11 NETWORK RESISTOR (CHIP) 10K
RB7 1-236-908-11 NETWORK RESISTOR (CHIP) 10K
< RELAY >
RY1 1-515-622-11 RELAY
< VIBRATOR >
X1 1-795-482-11 VIBRATOR, CERAMIC (16MHz)X2 1-795-004-21 VIBRATOR, CERAMIC (10MHz)X3 1-567-098-41 VIBRATOR, CRYSTAL (32.768kHz)
**************************************************************
1-687-905-11 POWER SWITCH BOARD********************
< LED >
D726 8-719-046-44 LED SEL5221S-TP15 (STANDBY)
< RESISTOR >
R706 1-247-807-31 CARBON 100 5% 1/4WR707 1-249-435-11 CARBON 33K 5% 1/4W
< SWITCH >
S706 1-762-875-21 SWITCH, KEYBOARD ('/1)**************************************************************
1-687-901-11 TRANSFORMER BOARD********************
< CAPACITOR >
0C651 1-113-920-11 CERAMIC 0.0022uF 20% 250V0C652 1-113-925-11 CERAMIC 0.01uF 20% 250V0C653 1-113-925-11 CERAMIC 0.01uF 20% 250V
< CONNECTOR >
CN652 1-564-321-00 PIN, CONNECTOR (3.96MM PITCH) 2P
< DIODE >
D651 6-500-522-11 DIODE 10EDB40-TA2B5
< LINE FILTER >
0LF651 1-411-547-11 FILTER, LINE
< RELAY >
0RY650 1-755-356-11 RELAY
< TRANSFORMER >
MAIN POWER SWITCH TRANSFORMER
The components identified by mark 0 or dottedline with mark 0 are critical for safety.Replace only with part number specified.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
99
MXD-D400
0TR651 1-439-732-11 TRANSFORMER, POWER0TR652 1-437-335-11 TRANSFORMER, POWER**************************************************************
MISCELLANEOUS**************
2 1-782-279-11 WIRE (FLAT TYPE) (25 CORE)3 1-782-243-11 WIRE (FLAT TYPE) (9 CORE)6 1-782-109-11 WIRE (FLAT TYPE) (17 CORE)7 1-782-244-11 WIRE (FLAT TYPE) (27 CORE)59 1-777-556-11 WIRE (FLAT TYPE) (19 CORE)
0103 1-783-531-11 CORD, POWER359 1-678-514-11 FLEXIBLE BOARD
0360 A-4672-976-A OPTICAL PICK-UP (KMS-262)552 1-782-817-11 WIRE (FLAT TYPE) (16 CORE)
0553 A-4735-885-A BU-30B ASSY
HR901 1-500-670-22 HEAD, OVER LIGHTM101 A-4735-757-A MOTOR ASSY, SPINDLEM102 A-4672-900-A MOTOR ASSY, SLEDM103 A-4672-975-A MOTOR ASSY, LOADINGM151 A-4604-363-A MOTOR (L) ASSY (LOADING)
S102 1-771-957-11 SWITCH, PUSH (2 KEY) (REFRECT/PROTECT)**************************************************************
ACCESSORIES************
1-477-841-11 COMMANDER, STANDARD (RM-D54M)1-790-735-12 CORD, CONNECTION
(AUDIO CONNECTION CORD)4-228-696-01 BATTERY COVER (for RM-D54M)4-245-486-11 MANUAL, INSTRUCTION (ENGLISH)
TRANSFORMER
The components identified by mark 0 or dottedline with mark 0 are critical for safety.Replace only with part number specified.
MXD-D400
REVISION HISTORY
Clicking the version allows you to jump to the revised page.Also, clicking the version at the upper right on the revised page allows you to jump to the next revisedpage.
Ver. Date Description of Revision
1.0 2003.05 New